CN116476253A - Silicon rod cutting device - Google Patents

Silicon rod cutting device Download PDF

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Publication number
CN116476253A
CN116476253A CN202310623675.0A CN202310623675A CN116476253A CN 116476253 A CN116476253 A CN 116476253A CN 202310623675 A CN202310623675 A CN 202310623675A CN 116476253 A CN116476253 A CN 116476253A
Authority
CN
China
Prior art keywords
silicon rod
jaw
cylinder
sucker
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310623675.0A
Other languages
Chinese (zh)
Inventor
魏聪颖
杨华英
何德镜
郑志伟
李欣
高士雄
林周琛
范舒彬
刘铭焕
李海威
李波
薛健忠
谢丹云
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhou Tianrui Scroll Saw Technology Co Ltd
Original Assignee
Fuzhou Tianrui Scroll Saw Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhou Tianrui Scroll Saw Technology Co Ltd filed Critical Fuzhou Tianrui Scroll Saw Technology Co Ltd
Priority to CN202310623675.0A priority Critical patent/CN116476253A/en
Publication of CN116476253A publication Critical patent/CN116476253A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The invention relates to a silicon rod cutting device, which comprises a cutting tool and a conveying platform positioned below the cutting tool, wherein a positioning clamping jaw for clamping a silicon rod is arranged on the conveying platform; the invention can realize the automation of the silicon rod slicing of the silicon rod excess material cutting machine, and satisfies the automatic transfer of materials, and has the advantages of high overall efficiency, easy operation and good safety.

Description

Silicon rod cutting device
Technical Field
The invention relates to the technical field of cutter equipment, in particular to a silicon rod cutting device.
Background
The monocrystalline silicon rod body is output after the thickness to be processed is formed by cutting through cutting equipment, the material heads at the head end and the tail end of the silicon rod are required to be cut in advance before a silicon wafer is formed, then the silicon rod is cut into a sheet shape through a cutting mechanism, and the cut sheet-shaped silicon wafer is transferred into a box body for collecting the silicon wafer through a sucking disc and a mechanical arm or is directly removed from the silicon wafer through manual operation.
The existing design is as in patent number CN201610037191.8, and the patent name is a monocrystalline silicon cutting machine which comprises a base, winding chambers at the left side and the right side of the base, a cutting chamber and a cooling spray device arranged on a bottom control cabinet, so that the requirement that one silicon rod is cut into multiple sections simultaneously can be met, and the requirement of cutting longer monocrystalline silicon rods by about 4.5 meters can be met.
For another example, patent number CN216914422U, entitled "a cutter lifting and sheet taking mechanism", designs a crystal support device for a monocrystalline silicon cutter, and the end of the remainder of the head at the front and the tail ends of the cut silicon rod is a combination of cone shape and cylinder shape, so that the end head of the silicon rod cannot be stably clamped by adopting the crystal support device.
The equipment can only complete a single cut-off length process or transport cut materials, can not realize cut-off and slicing automatic production of the silicon rod, and in the process of obtaining the materials, the silicon rod residual materials fall from a high place to easily cause damage to the surface of the residual materials or a receiving box, and on the other hand, personnel need to enter a cutting area or a parallel area of the cutting area in the process of transporting silicon wafer products to have safety risks.
Disclosure of Invention
In order to solve the problem that the existing silicon rod cutting can only realize single cutting, manual auxiliary material taking and transferring are needed, the working efficiency is low, and safety risks are easy to occur.
The technical scheme of the invention is as follows: a silicon rod cutting device comprises a cutting tool and a conveying platform positioned below the cutting tool, wherein a positioning clamping jaw for clamping a silicon rod is arranged on the conveying platform; the conveying platform is further provided with a floating supporting structure, the floating supporting structure comprises a lifting mechanism and a receiving box which is arranged above the lifting mechanism and used for receiving the head and the tail materials and is arranged on the conveying platform, and the conveying platform is further provided with a sucking disc component for sucking the sheet materials.
Preferably, the conveying platform side is provided with the transportation platform, and grabbing device can the centre gripping connect the magazine to place between transportation platform and conveying platform, conveying platform is provided with grabbing device with the top of transporting the platform, grabbing device includes the support frame and is located the tongs clamping jaw of support frame below, tongs clamping jaw is by clamping jaw actuating mechanism drive lift and lateral shifting.
Preferably, the sucker assembly comprises a sucker capable of generating negative pressure and a telescopic mechanism for driving the sucker to stretch towards the silicon wafer; the sucker assembly is arranged on the sucker frame, the sucker assembly or the sucker frame is provided with a first sensor for sensing the telescopic length of the sucker, and the sucker frame or the sucker assembly is provided with a second sensor for sensing the distance between the sucker and the silicon rod.
Preferably, the middle part of the receiving box is provided with an opening for the upper end of the lifting mechanism to pass through, the upper end of the lifting mechanism is provided with a supporting table, and the upper surface of the supporting table is provided with a lifting surface which is downwards deflected from two sides to the center.
Preferably, the transfer platform is further provided with a moving trolley capable of moving along the transfer platform, more than two silicon rod feeding plates are fixed on the moving trolley, a concave receiving groove is formed in the middle of each silicon rod feeding plate, the moving trolley is further provided with a sheet receiving box for receiving sheet silicon wafers, the sheet receiving box comprises an outer box body, partition plates are fixed in the outer box body, and a receiving area is formed between every two adjacent partition plates.
Preferably, the positioning clamping jaw comprises a bracket and a pair of clamps positioned on the bracket and driven to open and close by a driving mechanism, the middle part of each clamp is concave, the lower part of each clamp is fixed on a clamp sliding block, the clamp sliding blocks are in sliding fit with the bracket, and the clamping silicon rod is driven by an air cylinder, a hydraulic cylinder or an electric cylinder.
Preferably, the gripper clamping jaw comprises a pair of clamping plates, the clamping plates are respectively fixed on a clamping jaw sliding block, the middle part of the clamping jaw sliding block is in sliding fit with a clamping jaw guide rail, the clamping jaw sliding block is driven by an air cylinder or a screw nut mechanism to move along the clamping jaw guide rail so as to drive the clamping plates to move oppositely or back to clamp a butt joint material box or a silicon rod, the clamping jaw driving mechanism comprises a translation electric cylinder fixed on the upper part of the supporting frame and a gripper lifting electric cylinder fixedly connected with the movable end of the translation electric cylinder, and the movable end of the gripper lifting electric cylinder is fixed with the gripper clamping jaw.
Preferably, the side of the gripper clamping jaw is also provided with a finger cylinder for clamping the silicon wafer, the finger cylinder is connected with the telescopic end of the silicon wafer clamping lifting cylinder to drive lifting, and the silicon wafer clamping lifting cylinder is driven by the clamping jaw driving mechanism to transversely move.
Preferably, the bottom of location clamping jaw, unsteady bearing structure and sucking disc frame all is fixed with the removal subassembly in order to drive location clamping jaw, unsteady support and sucking disc subassembly and remove along conveying platform length direction, the removal subassembly includes the movable plate, the movable plate lower part is fixed with the movable motor, the output of movable motor is fixed with the gear, conveying platform be fixed with gear engagement's rack.
Preferably, a flange for preventing cut materials from falling is fixed on one side of the outer portion of the material receiving box, and a groove for avoiding the cut materials is formed in one side of the material receiving box.
Compared with the prior art, the invention has the following beneficial effects:
(1) The invention can realize the automation of the silicon rod slicing of the silicon rod excess material cutting machine, and can meet the automatic transfer of materials, and has the advantages of high overall efficiency, easy operation and good safety.
(2) The invention can avoid damage caused by direct falling of the residual materials of the cut silicon rod from a high place by utilizing the material receiving box and the floating supporting mechanism, and stably realizes the receiving and blanking of the residual materials of the silicon rod.
(3) In the embodiment of the invention, the receiving box and the supporting mechanism are in a detachable form and are provided with the opening for the supporting platform to pass through, so that the separation and combination of the receiving box and the supporting structure can be met, the receiving box is easy to accurately transport materials, and the structure is improved to be compact.
(4) In the embodiment of the invention, the movable trolley is also designed, and finished products and residual materials can be conveniently taken away from a cutting working area after the movable trolley moves, and the silicon rod can be fed, so that the efficiency and safety of article transfer are improved.
(5) In the embodiment of the invention, the floating support structure adopts the sliding rail to drive the supporting platform to lift, and the linear guide rail pair formed by the sliding rail and the sliding block is utilized to drive the supporting platform to move up and down, so that an anti-rotation structure is not required to be designed;
(6) Utilize grabbing device can carry out the transfer of horizontal receiving box and silicon rod, promote silicon rod cutting efficiency.
(7) The invention realizes that the sucker has no overload pressure in the process of contacting with the silicon wafer by utilizing the sensor and the control of the air pressure with the telescopic device, thereby avoiding the silicon wafer from being pressed by the sucker to cause cracking.
Drawings
FIG. 1 is a schematic overall view of an embodiment of the present invention;
FIG. 2 is a schematic view of a positioning jaw according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a clamp structure;
FIG. 4 is a schematic view of the cooperation of the receiving box and the floating support structure;
FIG. 5 is a schematic view of the structure of the receiving carriage on the travelling car;
FIG. 6 is a schematic perspective view of a positioning jaw according to the present invention;
FIG. 7 is a schematic view of the interior of a floating support structure;
FIG. 8 is a schematic view of a gripping device;
FIG. 9 is a schematic view of the overall structure of the gripping device;
FIG. 10 is a schematic diagram of a finger cylinder position configuration;
FIG. 11 is a schematic diagram of the position structure of a finger cylinder and a silicon wafer clamping lifting cylinder;
FIG. 12 is a schematic view of a chuck assembly;
FIG. 13 is an enlarged schematic view of a portion of the chuck assembly;
figure 14 is a side view of the suction cup assembly;
FIG. 15 is a schematic view of the overall structure of a silicon rod cutting apparatus;
fig. 16 is a schematic side view of a silicon rod cutting apparatus.
In the figure: 100-conveying platform, 101-silicon rod, 102-cutting tool, 10-positioning clamping jaw, 110-support, 120-clamp, 130-clamp slide block, 20-floating supporting structure, 210-lifting cylinder, 211-slide rail, 220-supporting platform, 30-receiving box, 310-opening, 320-groove, 330-flange, 40-grabbing device, 410-support frame, 411-translation cylinder, 412-lifting clamping jaw cylinder, 420-clamping jaw, 421-clamping plate, 422-clamping jaw slide block, 423-clamping jaw guide rail, 430-finger cylinder, 440-silicon chip clamping lifting cylinder, 50-moving assembly, 510-moving plate, 520-moving motor, 530-gear, 540-rack, 60-moving trolley, 610-silicon rod feeding plate, 620-sheet material receiving box, 621-baffle, 70-sucking disc assembly, 710-sucking disc frame, 720-sucking disc, 740-first sensor, 730-second sensor, 750-locking cylinder, 760-sensing slide block.
Detailed Description
The invention will now be described in detail with reference to the drawings and to specific embodiments.
Referring to fig. 1-3, a silicon rod cutting apparatus includes a cutting tool and a conveying platform 100 below the cutting tool, the conveying platform having a positioning jaw 10 thereon for clamping a silicon rod; the conveying platform is further provided with a floating supporting structure 20, the floating supporting structure comprises a lifting mechanism, a receiving box 30 for receiving the head and tail materials is arranged above the lifting mechanism, and the conveying platform is further provided with a sucking disc assembly 70 for sucking the sheet materials.
In this embodiment, during operation, two ends of the silicon material in the initial state are tapered, and before the work of cutting into silicon wafers, the tapered portions of the head and tail materials need to be removed, so as to avoid damage caused by the cut silicon rod falling into the receiving box 30 directly, an opening 310 for the pallet to pass through is provided in the middle of the receiving box 30, and the receiving box 30 is arranged on the floating support.
In this embodiment, the cutting tool 102 is a conventional wire cutting tool, and uses a wire rope to move at a high speed to cut a silicon rod.
In this embodiment, the movable end of the lifting mechanism is fixedly connected to a supporting platform 220 via a sliding rail 211.
The supporting mechanism is located below the opening 310, and when the material is ready to be cut, the supporting mechanism extends out from below the material receiving box through the opening 310, so that the supporting mechanism can extend into the position below the silicon rod to be cut.
In the above embodiment, the lifting device is a hydraulic cylinder, an air cylinder or an electric cylinder drive. The lifting device in this embodiment is a lifting cylinder 210. The lifting cylinder 210 is vertically arranged, and the movable end of the lifting cylinder is fixedly connected with the supporting platform 220.
In one embodiment of the invention, the upper surface of the supporting platform is provided with lifting surfaces which are downwards inclined from two sides to the center so as to be beneficial to bearing against the bottom of the cylindrical silicon rod. The rod body cutting device can be used for supporting the rod when the receiving box 30 is not placed, and is helpful for supporting the rod body after cutting the silicon rod head material.
The specific receiving head and tail materials comprise the following steps:
(1) The positioning clamping jaw 10 clamps the silicon rod to be positioned below the cutting tool 102, and the floating support structure is positioned below two ends of the silicon rod to be cut on the conveying platform;
(2) A receiving box 30 for receiving the head and tail materials is arranged above the floating supporting structure on the conveying platform;
(3) The pallet of the floating support structure can pass through the bottom of the material receiving box 30 and make the upper edge thereof contact with the lower part of the position of the silicon rod to be cut, the cutting tool cuts the residual material at the end of the silicon rod, and the residual material cut by the silicon rod falls on the pallet 220 of the floating support;
(4) The lifting mechanism of the floating support descends to retain the silicon rod remainder in the receiving box 30.
The receiving box 30 for collecting the head and tail materials is transferred to the side, the slicing procedure of the silicon rod is continued on the conveying platform, the positioning clamping jaw 10 clamps the silicon rod during slicing, the cutting tool is used for slicing, and the sucking disc component is used for sucking and cutting the formed silicon wafer.
As shown in fig. 12-14, the chuck assembly 70 includes a chuck 720 capable of generating negative pressure and a telescopic mechanism for driving the chuck to extend and retract toward the silicon wafer; the sucker assembly is arranged on the sucker frame 710, a first sensor for sensing the telescopic length of the sucker is arranged on the sucker assembly or the sucker frame, and a second sensor for sensing the distance between the sucker and the silicon rod is arranged on the sucker frame or the sucker assembly;
in this embodiment, the telescopic mechanism is a locking cylinder 750, and in the step (4), the locking cylinder 750 itself has a locking mechanism, and when the limitation of the locking cylinder stroke needs to be ensured, the locking stroke is performed by using the locking mechanism.
(1) Before slicing, the telescopic mechanism drives the sucker to extend out for a set length, the telescopic mechanism releases the pressure on the sucker, and the sucker assembly is moved to enable the sucker to be close to the end part of the contact silicon rod;
(2) When the sucker meets the silicon rod, the telescopic end of the telescopic mechanism is propped against the silicon rod to retract;
in an embodiment, a first sensor 740 is fixed on the suction cup frame 710, and the first sensor is a contact sensor.
In this embodiment, the telescopic mechanism is a locking cylinder 750, and in the step (4), the locking cylinder 750 itself has a locking mechanism, and when the limitation of the locking cylinder stroke needs to be ensured, the locking stroke is performed by using the locking mechanism.
In an embodiment of the present invention, the telescopic rod of the locking cylinder 750 is fixed with a sensing slider 760 capable of contacting with the telescopic rod, when the telescopic rod of the locking cylinder 750 is retracted by being propped by the silicon rod, the sensing slider 760 contacts with the contact sensor, and the moving assembly stops moving;
(1) The sucker generates negative pressure to suck the surface of the crystal bar, the telescopic mechanism locks the stroke, the position of the sucker is kept, and the sucker keeps suction;
(2) The cutting tool is used for cutting the silicon rod, and the silicon slice cut by the silicon slice is adsorbed on the sucker.
In this embodiment, the second sensor 730 is a photoelectric sensor for ranging.
In an embodiment of the present invention, in order to collect sliced silicon wafers, a wafer receiving box 620 is designed in the embodiment, the wafer receiving box 620 includes an outer box body, a partition 621 is fixed in the outer box body, and a receiving area is formed between adjacent partition boards.
As shown in fig. 10-11, in order to place the silicon wafer on the suction cup into the wafer receiving box 620, a finger cylinder 430 for clamping the silicon wafer is further provided beside the gripper jaw 420, the finger cylinder 430 is connected with a telescopic end of the silicon wafer clamping lifting cylinder 440 to drive lifting, and the silicon wafer clamping lifting cylinder 440 is driven by the jaw driving mechanism to move transversely.
The telescopic end of the silicon wafer clamping lifting cylinder 440 stretches and contracts to drive the finger cylinder 430 to lift, the clamping lifting cylinder 440 is driven by the clamping jaw driving mechanism to transversely move, when a wafer is taken out, the finger cylinder is opened and positioned above the silicon wafer adsorbed by the suction cup, then the silicon wafer is clamped, and after the suction cup releases the suction, the finger cylinder moves to a material receiving area of the wafer material receiving box 620 to place the silicon wafer.
In order to facilitate transferring materials, independent separation of personnel taking materials and a working area is achieved, a transfer platform 200 is arranged beside the conveying platform 100, a gripping device can clamp a receiving box or/and a sheet receiving box 620 to be placed between the transfer platform and the conveying platform, a gripping device 40 is arranged above the conveying platform and the transfer platform 200 and comprises a supporting frame 410 and a gripper clamping jaw 420 arranged below the supporting frame, and the gripper clamping jaw is driven to lift and transversely move by a clamping jaw driving mechanism.
In the step (1), the receiving box is transferred from the transferring platform to the upper part of the floating supporting structure by the grabbing device, and after the residual materials in the step (4) are retained in the receiving box, the receiving box carrying the residual materials of the silicon rod is transferred to the transferring platform 200 by the grabbing device.
In an embodiment of the present invention, a moving trolley 60 is further disposed on the transfer platform, more than two silicon rod feeding plates 610 are fixed on the moving trolley 60, a concave receiving slot is formed in the middle of each silicon rod feeding plate, and in the step (1), the silicon rods are pre-set on the silicon rod feeding plates and then are set on the positioning clamping jaws of the conveying platform by the grabbing device.
The interval between the silicon rod feeding plates 610 on the moving trolley 60 can be used for placing the material receiving box 30 and the sheet material receiving box 620, so that the head and tail material residues and finished products can be conveniently converted between the conveying platform 100 and the transferring platform 200. After the material receiving box 30 and the sheet material receiving box 620 are located on the moving trolley 60, the moving trolley can move along the transferring platform 200 by arranging a moving wheel or a chain in a dragging manner, so that an operator can obtain the head and tail material residues in the material receiving box 30 and the silicon wafer in the sheet material receiving box 620 in an environment far away from the cutting area.
The positioning clamping jaw 10 comprises a bracket 110 and a pair of clamps 120 which are positioned on the bracket and driven to open and close by a driving mechanism, wherein the middle part of each clamp is concave, the lower part of each clamp is fixed on a clamp sliding block 130, the clamp sliding blocks 130 are in sliding fit with the bracket 110, and a cylinder, a hydraulic cylinder, an electric cylinder or a screw-nut mechanism is used for driving and clamping a silicon rod. In this embodiment, the middle part of each clamp slider 130 has a thread, the paired clamp sliders 130 are screwed on a screw rod, and the screw rod is opposite to the two clamp sliders 130 in rotation direction, so that the pair of clamps 120 can be folded or separated in the rotation process.
As shown in fig. 5, in operation, the positioning clamping jaw 10 may be designed with a plurality of positioning clamping jaws to be beneficial to adapting to different lengths of silicon rods, the clamp 120 and the bracket 110 are in sliding fit, the opening and closing size of the clamp 120 can adapt to silicon rods with different diameters, and besides the clamp slider 130 described in the embodiment is driven by an independent cylinder, the clamp can also be opened and closed by adopting a finger cylinder, a screw nut pair and other modes.
As shown in fig. 7 and 8, similar to the positioning jaw structure, the gripper jaw 420 includes a pair of clamping plates, the pair of clamping plates 421 are respectively fixed on a jaw slider 422, the middle part of the jaw slider is slidably matched with a jaw guide rail, and the jaw slider 422 is driven by an air cylinder or a screw-nut mechanism to move along the jaw guide rail 423 so as to drive the pair of clamping plates to move opposite or back to clamp the material box or the silicon rod.
In this embodiment, the jaw driving mechanism includes a translation cylinder 411 fixed on the upper portion of the support frame 410, and a lifting jaw cylinder 412 fixedly connected to the movable end of the translation cylinder, and drives the jaw rail 423 to move up and down under the action of a screw nut mechanism of the jaw cylinder 412.
In the initial state, the material receiving box which is not transferred into the silicon rod can realize that the gripper clamping jaw 420 stretches across the conveying platform 100 and the transferring platform 200 by utilizing the translation electric cylinder 411, and the lifting clamping jaw cylinder 412 realizes that the gripper clamping jaw 420 lifts to clamp the silicon rod or the material receiving box.
As shown in the drawing, in the present invention, a longitudinal rack is further fixed on the top of the support frame 410, the translation cylinder 411 is fixedly connected to a transfer bracket, a longitudinal motor is fixed on the transfer bracket, and a longitudinal driving gear meshed with the longitudinal rack is fixed at an output end of the longitudinal motor.
In practical design, the gripper jaw 420 may be disposed at the movable end of the three-axis sliding table to implement three-axis displacement of the gripper jaw 420 in a cartesian coordinate system in space.
As shown in fig. 2, 6 and 14, the bottom of the positioning jaw, the floating support structure and the suction cup frame are all fixed with a moving assembly to drive the positioning jaw, the floating support and the suction cup assembly to move along the length direction of the conveying platform, in this embodiment, the moving assembly 50 includes a moving plate 510, a moving motor is fixed at the lower part of the moving plate, a gear 530 is fixed at the output end of the moving motor 520, and a rack 540 meshed with the gear 530 is fixed on the conveying platform.
In the step (1), the position for clamping the silicon rod or moving the silicon rod to the residual material of the silicon rod to be cut is adjusted according to the requirement, and the bottom parts of the positioning clamping jaw and the floating support structure are both fixed with a moving assembly 50 so as to drive the positioning clamping jaw and the floating support to move along the length direction of the conveying platform.
And the movable sucker assembly utilizes the movable assembly 50 to enable the end of the sucker close to the silicon rod to be sliced to be close to the silicon rod, and in the process, when the second sensor 730 senses that the distance is relatively short, the speed of the sucker can be reduced to prevent the sucker from impacting the silicon rod too fast.
In practical design, the moving assembly 50 moves along the conveying platform by using a positioning jaw and a floating support structure which are meshed with a gear and a rack, in this embodiment, the support 110 of the positioning jaw is fixedly connected or integrated with the moving plate 510, and the lifting mechanism of the floating support structure 20 is fixedly connected with the moving plate 510 via a base.
Because the end parts of the residual materials of the material heads at the head end and the tail end of the cut silicon rod are in a conical shape and cylindrical shape, a groove 320 for avoiding cutting materials is formed in one side of the material receiving box, and the groove 320 is used for avoiding one side of the conical shape.
The silicon rod weight on cylindric one side is heavier, connect outside one side of magazine to be fixed with the flange 330 that prevents that the cutting material from dropping, thereby the flange can assist in supporting the heavier one side of silicon rod weight and avoid the silicon rod clout that falls to appear the upset because of both ends weight difference in the upper and lower operation in-process.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present invention.

Claims (10)

1. The silicon rod cutting device is characterized by comprising a cutting tool and a conveying platform positioned below the cutting tool, wherein a positioning clamping jaw for clamping a silicon rod is arranged on the conveying platform; the conveying platform is further provided with a floating supporting structure, the floating supporting structure comprises a lifting mechanism and a receiving box which is arranged above the lifting mechanism and used for receiving the head and the tail materials and is arranged on the conveying platform, and the conveying platform is further provided with a sucking disc component for sucking the sheet materials.
2. The silicon rod cutting device according to claim 1, wherein a transfer platform is arranged beside the conveying platform, the gripping device can clamp the receiving box to be placed between the transfer platform and the conveying platform, the gripping device is arranged above the conveying platform and the transfer platform and comprises a supporting frame and a gripper jaw positioned below the supporting frame, the gripper jaw is driven to transversely move by a gripper driving mechanism, and the gripper jaw is driven to lift by a gripper lifting cylinder.
3. A silicon rod cutting device according to claim 1 or 2, wherein the suction cup assembly comprises a suction cup capable of generating negative pressure and a telescopic mechanism for driving the suction cup to extend and retract towards the silicon wafer; the sucker assembly is arranged on the sucker frame, the sucker assembly or the sucker frame is provided with a first sensor for sensing the telescopic length of the sucker, and the sucker frame or the sucker assembly is provided with a second sensor for sensing the distance between the sucker and the silicon rod.
4. The silicon rod cutting device according to claim 1, wherein the middle part of the receiving box is provided with an opening for the upper end of the lifting mechanism to pass through, the upper end of the lifting mechanism is provided with a supporting table, and the upper surface of the supporting table is provided with a lifting surface which deflects downwards from two sides to the center.
5. A silicon rod cutting device according to claim 3, wherein the transfer platform is further provided with a moving trolley capable of moving along the transfer platform, more than two silicon rod feeding plates are fixed on the moving trolley, the middle part of each silicon rod feeding plate is provided with a concave receiving groove, the moving trolley is further provided with a sheet receiving box for receiving sheet silicon wafers, the sheet receiving box comprises an outer box body, a baffle plate is fixed in the outer box body, and a receiving area is formed between every two adjacent baffle plates.
6. A silicon rod cutting device according to claim 3, wherein the positioning clamping jaw comprises a bracket and a pair of clamps positioned on the bracket and driven to open and close by a driving mechanism, the middle part of each clamp is concave, the lower part of each clamp is fixed on a clamp sliding block, the clamp sliding blocks are in sliding fit with the bracket, and the clamp sliding blocks are driven by an air cylinder, a hydraulic cylinder or an electric cylinder to clamp the silicon rod.
7. A silicon rod cutting device according to claim 3, wherein the gripper jaw comprises a pair of clamping plates, the clamping plates are respectively fixed on a jaw sliding block, the middle part of the jaw sliding block is in sliding fit with a jaw guide rail, the jaw sliding block is driven by a cylinder or a screw nut mechanism to move along the jaw guide rail so as to drive the clamping plates to move oppositely or back to clamp a butt joint material box or a silicon rod, the jaw driving mechanism comprises a translation electric cylinder fixed on the upper part of the support frame, the movable end of the translation electric cylinder is fixedly connected with the gripper lifting electric cylinder, and the movable end of the gripper lifting electric cylinder is fixed on the gripper jaw.
8. A silicon rod cutting device according to claim 2 or 8, wherein the gripper jaw is further provided with a finger cylinder for clamping a silicon wafer, the finger cylinder is connected with a telescopic end of the silicon wafer clamping lifting cylinder to drive lifting, and the silicon wafer clamping lifting cylinder is driven by a jaw driving mechanism to move transversely.
9. A silicon rod cutting device according to claim 3, wherein the positioning clamping jaw, the floating support structure and the bottom of the sucker frame are all fixed with a moving assembly for driving the positioning clamping jaw, the floating support and the sucker assembly to move along the length direction of the conveying platform, the moving assembly comprises a moving plate, a moving motor is fixed at the lower part of the moving plate, a gear is fixed at the output end of the moving motor, and a rack meshed with the gear is fixed on the conveying platform.
10. A silicon rod cutting device according to claim 3, wherein a flange for preventing cut materials from falling is fixed on one side of the outer portion of the receiving box, and a groove for avoiding the cut materials is formed on one side of the receiving box.
CN202310623675.0A 2023-05-30 2023-05-30 Silicon rod cutting device Pending CN116476253A (en)

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CN202310623675.0A CN116476253A (en) 2023-05-30 2023-05-30 Silicon rod cutting device

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Application Number Priority Date Filing Date Title
CN202310623675.0A CN116476253A (en) 2023-05-30 2023-05-30 Silicon rod cutting device

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CN116476253A true CN116476253A (en) 2023-07-25

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CN202310623675.0A Pending CN116476253A (en) 2023-05-30 2023-05-30 Silicon rod cutting device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117341078A (en) * 2023-11-16 2024-01-05 福建天石源智能装备有限公司 A device for unloading residual material from cutting silicon rods and a method for unloading materials

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117341078A (en) * 2023-11-16 2024-01-05 福建天石源智能装备有限公司 A device for unloading residual material from cutting silicon rods and a method for unloading materials

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