CN116475877B

CN116475877B - Wafer polishing assembly, device and method

Info

Publication number: CN116475877B
Application number: CN202310470138.7A
Authority: CN
Inventors: 杨易; 汤灿东; 赵果; 吴伟平
Original assignee: Guangdong Changxin Precision Equipment Co Ltd
Current assignee: Guangdong Changxin Precision Equipment Co Ltd
Priority date: 2023-04-27
Filing date: 2023-04-27
Publication date: 2025-09-02
Anticipated expiration: 2043-04-27
Also published as: CN116475877A

Abstract

The present application relates to the field of wafer polishing technology, and specifically discloses a wafer polishing assembly, equipment, and method. The wafer polishing assembly includes: a tooling mechanism, a grinding shaft mechanism, and a flipping mechanism. The tooling mechanism includes: a clamp and a tooling driver. The clamp is used to clamp the wafer. The tooling driver is used to drive the clamp to move. The grinding shaft mechanism includes: a grinding shaft and a grinding shaft driver. The grinding shaft driver is used to drive the grinding shaft to move. The flipping mechanism is used for the wafer. The tooling mechanism can clamp the wafer and drive the wafer to slide. The flipping mechanism can flip the wafer to adjust the polishing surface of the wafer. The cooperation of the tooling mechanism, the grinding mechanism, and the flipping mechanism can automatically complete the polishing of the end edge of the wafer. Compared with the method in which the staff holds the wafer by hand, the tooling mechanism can effectively improve work efficiency and ensure the consistency of polishing of different wafers, effectively solving the problem of poor polishing consistency and low production efficiency of the existing wafer edge grinding method.

Description

Wafer polishing assembly, equipment and method

Technical Field

The application relates to the technical field of wafer polishing, in particular to a wafer polishing assembly and a wafer polishing method.

Background

In processing a semiconductor square wafer, the end edge of the wafer needs to be polished. The existing edging mode for wafers is generally that workers hold wafers for polishing, the polishing effects of different wafers are different easily due to operation deviation of the workers, and meanwhile, the wafers cannot be polished in batches, so that the problem of low production efficiency exists.

Disclosure of Invention

Accordingly, the present application is directed to a wafer polishing assembly, apparatus and method for solving the problems of poor polishing uniformity and low production efficiency of the conventional wafer polishing method.

In order to achieve the technical purpose, the first aspect of the application provides a wafer polishing assembly, which comprises a tooling mechanism, a grinding shaft mechanism and a turnover mechanism;

The tooling mechanism comprises a horizontal module, a clamp and a tooling driving piece;

The horizontal module is provided with a loading and unloading station, a first end surface station, a second end surface station and a turnover station;

the clamp is used for clamping the wafer and is arranged on the horizontal module;

the tool driving piece is connected with the clamp and used for driving the clamp to switch positions among the loading and unloading station, the first end surface station, the second end surface station and the overturning station;

the grinding shaft mechanism comprises a linear module, a grinding shaft and a grinding shaft driving piece;

the linear module is provided with an avoiding station and a polishing station;

The grinding shaft is arranged on the linear module;

the grinding shaft driving piece is connected with the grinding shaft and is used for driving the grinding shaft to switch positions between the avoidance station and the grinding station;

The polishing station is arranged between the first end surface station and the second end surface station, so that the polishing shaft positioned at the polishing station can polish the wafer on the first end surface station or the wafer on the second end surface station;

the turnover mechanism is arranged beside the turnover station and used for turnover of the wafer positioned at the turnover station.

Further, the linear module is vertically arranged;

the clamp is arranged on the horizontal module in a sliding manner along the horizontal direction;

The grinding shaft is slidably arranged on the linear module along the vertical direction;

the avoiding station is located above the polishing station.

Further, the turnover mechanism comprises an absorption part and a turnover motor;

The adsorption piece is used for adsorbing the wafer;

The overturning motor is in transmission connection with the adsorption piece and is used for driving the adsorption piece to rotate along the horizontal plane by a preset angle.

Further, the turnover mechanism also comprises a lifting cylinder and a supporting table;

the absorption part and the overturning motor are arranged on the supporting table;

the output end of the lifting cylinder is connected with the supporting table and used for driving the supporting table to lift.

Further, the device also comprises a cooling mechanism;

the cooling mechanism comprises a grinding fluid spray pipe;

The grinding fluid spray pipe is arranged beside the grinding shaft and used for spraying grinding fluid to the grinding shaft.

Further, the cooling mechanism also comprises a grinding fluid collecting pipe and a centrifugal filter;

The liquid inlet end of the grinding liquid collecting pipe is arranged below the grinding shaft and is used for collecting the sprayed grinding liquid;

the centrifugal filter is connected with the liquid outlet end of the grinding fluid collecting pipe.

Further, waterproof covers are arranged on the horizontal module, the linear module and the turnover mechanism.

Further, the dust removing device also comprises a dust removing pipe;

the dust removal pipe is arranged beside the grinding shaft and used for absorbing dust generated in the grinding process.

The second aspect of the application provides wafer polishing equipment, which comprises a frame, an electric control assembly and the wafer polishing assembly;

the electric control assembly and the wafer polishing assembly are arranged on the frame;

the electric control assembly is electrically connected with the tool driving piece, the grinding shaft driving piece and the turnover mechanism in the wafer grinding assembly.

A third aspect of the present application provides a wafer polishing method, applied to the wafer polishing assembly described in any one of the above;

the method comprises the following steps:

S1, clamping a wafer by a clamp;

S2, controlling the clamp to move to a first end surface station;

S3, moving the grinding shaft to a grinding station to grind one end edge to be ground of the top surface of the wafer, and moving the grinding shaft to an avoiding station after finishing grinding;

s4, controlling the clamp to move to a second end surface station;

S5, polishing the end edge to be polished of the top surface of the wafer through a polishing shaft positioned at a polishing station;

s6, after the clamp is controlled to move the overturning station, horizontally overturning the wafer according to a preset angle through an overturning mechanism;

And S7, repeating the steps S2 to S6 until the eight end edges to be polished of the wafer are polished.

According to the technical scheme, the wafer polishing assembly comprises a tool mechanism, a grinding shaft mechanism and a turnover mechanism, wherein the tool mechanism comprises a horizontal module, a clamp and a tool driving piece, the horizontal module is provided with a loading and unloading station, a first end face station, a second end face station and a turnover station, the clamp is used for clamping a wafer and is arranged on the horizontal module, the tool driving piece is connected with the clamp and is used for driving the clamp to switch positions among the loading and unloading station, the first end face station, the second end face station and the turnover station, the grinding shaft mechanism comprises a linear module, a grinding shaft and a grinding shaft driving piece, the linear module is provided with an avoiding station and a grinding station, the grinding shaft is arranged on the linear module, the grinding shaft driving piece is connected with the grinding shaft and is used for driving the grinding shaft to switch positions between the avoiding station and the turnover station, the grinding shaft is arranged between the first end face station and the second end face station, so that the grinding shaft can be arranged at the side of the wafer and the turnover station or the turnover station is used for turning the wafer.

The wafer polishing device has the advantages that the wafer can be clamped and driven to slide through the tool mechanism, the wafer on the turnover station can be turned through the turnover mechanism, the polishing surface of the wafer can be automatically adjusted, the end edge of the wafer can be automatically polished through the cooperation of the tool mechanism, the polishing mechanism and the turnover mechanism, and compared with the mode that a worker holds the wafer in a handheld manner, the working efficiency can be effectively improved, the polishing consistency of different wafers is guaranteed, and the problems that the polishing consistency of an existing wafer edging manner is poor and the production efficiency is low are effectively solved.

Drawings

In order to more clearly illustrate the embodiments of the application or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the application, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.

Fig. 1 is a schematic overall structure of a wafer polishing assembly according to an embodiment of the present application;

Fig. 2 is a perspective view of a wafer polishing assembly according to an embodiment of the present application before and after polishing;

FIG. 3 is a front view of a wafer polishing assembly according to an embodiment of the present application;

Fig. 4 is a schematic diagram of a tooling mechanism in a wafer polishing assembly according to an embodiment of the present application;

Fig. 5 is an overall front view of a wafer polishing assembly according to an embodiment of the present application, with a jig at a loading and unloading station or a flipping station;

FIG. 6 is an elevation view of an overall structure of a wafer polishing assembly provided in accordance with an embodiment of the present application with a clamp positioned at a first end station or a second end station;

FIG. 7 is a schematic view of a spindle mechanism in a wafer polishing assembly according to an embodiment of the present application;

FIG. 8 is a schematic view of a polishing shaft and a wafer polishing assembly according to an embodiment of the present application;

FIG. 9 is a schematic diagram of a flipping mechanism in a wafer polishing assembly according to an embodiment of the present application;

Fig. 10 is a schematic diagram of an overall structure of a wafer polishing apparatus according to an embodiment of the present application;

In the figure:

10. the device comprises a tooling mechanism, a horizontal module, 12, a clamp, 13, a tooling driving piece, 14, a sliding table, 15 and a compacting plate;

20. The device comprises a grinding shaft mechanism, a linear module, a grinding shaft driving piece, a grinding shaft motor, a synchronous belt and a synchronous belt, wherein the grinding shaft mechanism comprises a linear module, a grinding shaft driving piece, a grinding shaft motor and a synchronous belt;

30. A turnover mechanism; 31, an adsorption piece, 32, a turnover motor, 33, a lifting cylinder, 34, a supporting table, 35 and a vacuum valve group;

40. the wafer, 41, end edges to be polished, 42, end edges not to be polished, 43, a first end face, 44 and a second end face;

50. A cooling mechanism; 51, grinding fluid spray pipes, 52, grinding fluid collecting pipes, 53, centrifugal filters;

60. a waterproof cover; 61, a peripheral waterproof cover, 62, a motor protective cover;

70. a dust removal pipe;

100. a frame; 101, a frame bottom plate 102, a closed shell;

200. an electric control assembly 201, a control panel;

A. the device comprises a loading and unloading station, a first end face station, a second end face station, a turning station, an avoiding station, a polishing station, a first edge, a second edge and a theta and chamfering angle.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments disclosed in the specification without making any inventive effort, are intended to be within the scope of the application as claimed.

In the description of the embodiments of the present application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the embodiments of the present application and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In describing embodiments of the present application, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, interchangeably connected, integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediary, or in communication between two elements. The specific meaning of the above terms in embodiments of the present application will be understood in detail by those of ordinary skill in the art.

Referring to fig. 1 to 3, a first aspect of the present application provides a wafer polishing assembly, which includes a tool mechanism 10, a grinding shaft mechanism 20 and a turning mechanism 30. The tool mechanism 10, the grinding shaft mechanism 20 and the turnover mechanism 30 may be disposed on the chassis base 101.

The wafer polishing assembly provided in this embodiment is used to polish the wafer 40. The object of polishing may be the end face or end edge of the wafer 40. In the embodiment of the present application, the end edge of the wafer 40 is a polishing object.

Specifically, in the present embodiment, the wafer 40 is a rectangular block with eight to-be-polished end edges 41 and four non-polished end edges 42. Eight end edges 41 to be polished are located on a first end face 43 and a second end face 44 of the wafer 40. The effect of polishing the wafer 40 before and after polishing is schematically shown in fig. 2 and 3.

After the end edge 41 to be polished of the wafer 40 is polished, the angles of the first edge M, the second edge N and the chamfer angle θ of the chamfer can be adjusted according to the actual required processing technology.

Referring to fig. 4 to 6, the tooling mechanism 10 includes a horizontal module 11, a clamp 12 and a tooling driving member 13, wherein the horizontal module 11 is provided with a loading and unloading station a, a first end surface station B, a second end surface station C and a turnover station D, the clamp 12 is used for clamping a wafer 40 and is arranged on the horizontal module 11, and the tooling driving member 13 is connected with the clamp 12 and is used for driving the clamp 12 to switch positions among the loading and unloading station a, the first end surface station B, the second end surface station C and the turnover station D.

The clamp 12 may be a contoured clamp that adapts to the shape of the wafer 40 to better clamp the wafer. And, soft silica gel can be arranged on the clamping surface of the clamp 12 to avoid damaging the surface of the wafer 40. The clamp 12 is provided with a clamp driver for controlling the opening and closing of the clamp 12.

Referring to fig. 5 to 7, the grinding shaft mechanism 20 includes a linear module 21, a grinding shaft 22 and a grinding shaft driving member 23, wherein the linear module 21 is provided with an avoiding station E and a grinding station F, the grinding shaft 22 is disposed on the linear module 21, the grinding shaft driving member 23 is connected to the grinding shaft 22 and is used for driving the grinding shaft 22 to switch positions between the avoiding station E and the grinding station F, and the grinding station F is disposed between the first end surface station B and the second end surface station C, so that the grinding shaft 22 at the grinding station F can grind the wafer 40 on the first end surface station B or the wafer 40 on the second end surface station C.

When the grinding shaft 22 is located at the avoiding station E, the clamp 12 can be moved from the first end surface station B to the second end surface station C, that is, the avoiding station E can provide the grinding shaft 22 to avoid the moving track of the clamp 12.

It should be noted that the grinding mechanism 20 may further include a grinding motor 24 and a synchronous belt 25. The output end of the grinding shaft motor 24 is connected with the grinding shaft 22 in a synchronous rotation way through the synchronous belt 25 and is used for driving the grinding shaft 22 to rotate so as to polish the wafer 40.

Specifically, when the jig 12 is positioned at the loading and unloading station a, loading operation and unloading operation may be performed, wherein the loading operation refers to clamping the wafer 40 that is not polished on the jig 12, and the unloading operation refers to removing the polished wafer 40 from the jig 12. After the clamping device 12 performs the loading operation to clamp the wafer 40, the tooling driving plate 13 drives the clamping device 12 to move to the first end station B.

Since the polishing station F is disposed between the first end station B and the second end station C, the end surfaces of the wafer 40 adjacent to the grinding shaft 22 are different when the jig 12 is disposed between the first end station B and the second end station C, for example, the first end surface 43 of the wafer 40 is the end surface adjacent to the grinding shaft 22 when the jig 12 is disposed at the first end station B, and the second end surface 44 of the wafer 40 is the end surface adjacent to the grinding shaft 22 when the jig 12 is disposed at the second end station C. Therefore, under the condition that the wafer 40 does not turn over, the end edges on two different end faces of the wafer 40 can be polished through the cooperation of the tool mechanism 10 and the grinding shaft mechanism 20.

The turnover mechanism 30 is disposed beside the turnover station D, and is used for turning over the wafer 40 located at the turnover station D.

The process of turning over the wafer 40 by the turning mechanism 30 may be that the fixture driving member 13 drives the fixture 12 to move to the turning station D, and then the fixture 12 releases the clamping of the wafer 40, so that the turning mechanism 30 drives the wafer 40 to turn over.

Through the cooperation of the tool mechanism 10, the grinding shaft mechanism 20 and the turnover mechanism 30, the position and the placement angle of the wafer 40 can be automatically adjusted, the end edges 41 to be polished on the wafer 40 are polished, the polishing efficiency can be effectively improved compared with the conventional hand-held wafer polishing mode, meanwhile, the clamp 12 can simultaneously clamp a plurality of wafers 40 to polish the plurality of wafers 40 simultaneously, and polishing consistency of different wafers 40 can be ensured while polishing efficiency is further improved.

As an embodiment, referring to fig. 8, the clamp 12 may be matched with the pressing plate 15 to clamp the wafer 40, and then the grinding shaft 22 grinds the end edge of the top surface of the wafer 40, and the turning mechanism 30 may change the top surface of the wafer 40, so that the grinding shaft 22 may grind each end edge 41 to be ground of the wafer 40.

In a more specific embodiment, the linear module 21 is arranged vertically, the clamp 12 is arranged on the horizontal module 11 in a sliding manner in the horizontal direction, the grinding shaft 22 is arranged on the linear module 21 in a sliding manner in the vertical direction, and the avoiding station E is positioned above the grinding station F.

Specifically, the longitudinal direction of the horizontal module 11 is the X-axis direction, and the longitudinal direction of the linear module 21 is the Z-axis direction. With the grinding spindle 22 positioned at the evasion station E, the grinding spindle 22 is positioned above the clamp 12 such that the clamp 12 and wafer 40 can slide past under the grinding spindle 22.

In this embodiment, the fixture 12 slidable along the X-axis direction is matched with the grinding shaft 22 sliding along the Z-axis direction, so that the end edge of the wafer 40 can be ground into different shapes such as a C-shaped chamfer, a circular arc chamfer, and the like.

The shaft core material of the grinding shaft 22 can be tungsten steel, the surface of the grinding shaft is sintered with diamond grit, hard and fine diamond grit particles are firmly combined with the shaft core through a high-temperature sintering process, and finally, the whole run-out tolerance of the whole grinding shaft 22 is ensured through a grinding machine grinding process.

As an implementation manner, referring to fig. 4, the tooling mechanism 10 may further include a sliding table 14, the fixture 12 is detachably disposed on the sliding table 14 by pins, and the sliding table 14 is slidably disposed on the horizontal module 11. So that different models of clamps 12 may be selected when dealing with different size types of wafers 10.

In one embodiment, referring to fig. 9, the turnover mechanism 30 includes an adsorption member 31 and a turnover motor 32, wherein the adsorption member 31 is used for adsorbing the wafer 40, and the turnover motor 32 is in transmission connection with the adsorption member 31 and is used for driving the adsorption member 31 to rotate along a horizontal plane by a preset angle.

Specifically, the adsorbing member 31 may be a vacuum chuck, and correspondingly, the turnover mechanism 30 further includes a vacuum valve group 35, and the vacuum valve group 35 provides an adsorbing force for the adsorbing member 31. The overturning motor 32 is used for driving the adsorbing member 31 to horizontally overturn, and the overturning angle, that is, the preset angle can be set according to actual needs, for example, in this embodiment, the wafer 40 is square, the preset angle can be 90 degrees, the preset angle can be 60 degrees if the wafer 40 is in a hexagonal column shape, and the preset angle can be 180 degrees if the polished object is the end face of the wafer 40.

It should be noted that the rotation of the adsorbing member 31 along the horizontal plane means that the rotation axis and the rotation plane of the adsorbing member 31 are both located on the horizontal plane, that is, on the plane formed by the X axis and the Y axis.

The turnover mechanism 30 performs turnover, which may be that the wafer 40 on the turnover station D is sucked by the suction member 31 and then the wafer 40 is released by the clamp 12, and the wafer 40 is re-clamped by the clamp 12 after the suction member 31 and the wafer 40 are turned by 90 ° by the turnover motor 32.

Similarly, the suction member 31 may include a plurality of suction members to simultaneously process a plurality of wafers 40. Correspondingly, the turnover motor 32 can comprise a plurality of turnover motors, or the turnover motor 32 is connected with a plurality of absorption parts 31 through synchronous belt synchronous transmission.

Further, the turnover mechanism 30 further comprises a lifting air cylinder 33 and a supporting table 34, wherein the adsorption piece 31 and the turnover motor 32 are arranged on the supporting table 34, and the output end of the lifting air cylinder 33 is connected with the supporting table 34 and used for driving the supporting table 34 to lift.

Specifically, the lifting cylinder 33 is used for driving the supporting table 34 to lift so as to drive the suction member 31 and the turnover motor 32 to lift, so that the suction member 31 and the wafer 40 are prevented from being turned over and interfering with the fixture 12.

In one embodiment, the grinding machine further comprises a cooling mechanism 50, wherein the cooling mechanism 50 comprises a grinding fluid spray pipe 51, and the grinding fluid spray pipe 51 is arranged beside the grinding shaft 22 and used for spraying grinding fluid to the grinding shaft 22.

By providing the grinding fluid spray pipe 51, the temperature of the wafer 40 can be reduced and the smoothness of the polished wafer 40 can be increased during the polishing process of the polishing shaft 22, thereby improving the polishing quality.

In another embodiment, the cooling mechanism 50 further comprises a grinding fluid collection pipe 52 (shown in fig. 10) and a centrifugal filter 53 (shown in fig. 10), wherein the fluid inlet end of the grinding fluid collection pipe 52 is arranged below the grinding shaft 22 and used for collecting sprayed grinding fluid, and the centrifugal filter 53 is connected with the fluid outlet end of the grinding fluid collection pipe 52.

Specifically, after the grinding fluid is sprayed onto the grinding spindle 22 and the wafer 40, the abrasive material carrying the wafer 40 enters the grinding fluid collection tube 52 and then flows out of the fluid outlet end into the centrifugal filter 53. The centrifugal filter 53 rotates at a high speed to filter the grinding fluid and collect the rare material dust particles worn out by grinding.

In one embodiment, the horizontal module 11, the linear module 21 and the turnover mechanism 30 are all provided with a waterproof cover 60.

The waterproof cover 60 is used for shielding the grinding fluid and preventing the grinding fluid from entering the device. The waterproof cover 60 on the horizontal module 11 may be an organ cover structure, so that the waterproof cover can slide along with the clamp 12 in the sliding process of the clamp 12, and has a sliding waterproof function.

Referring to fig. 1, a peripheral waterproof cover 61 may be further disposed on the chassis base 101, and the tool mechanism 10, the grinding shaft mechanism 20 and the turning mechanism 30 are disposed in the peripheral waterproof cover 61, so as to prevent grinding fluid from flowing out of the peripheral waterproof cover 61. The outer periphery of the grinding shaft driving member 23 may be sleeved with a motor protection cover 62.

In one embodiment, the dust removal pipe 70 (shown in FIG. 10) is further included, and the dust removal pipe 70 is disposed beside the grinding shaft 22 for absorbing dust generated during the grinding process.

Dust generated by polishing can be purified through the dust removing pipe 70, and environmental pollution is avoided.

In a second aspect, referring to fig. 10, the present application provides a wafer polishing apparatus, which includes a frame 100, an electric control assembly 200, and a wafer polishing assembly according to any one of the above, wherein the electric control assembly 200 and the wafer polishing assembly are disposed on the frame 100, and the electric control assembly 200 is electrically connected to a tool driving member 13, a grinding shaft driving member 23, and a turnover mechanism 30 in the wafer polishing assembly.

Specifically, the frame 100 is provided with a closed casing 102, and the wafer polishing assembly and the electric control assembly 200 are both arranged in the closed casing 102, so that the whole-process closed operation is realized, and dust generated by the operation is led out through the dust removal pipe 70. The electric control assembly 200 is used for controlling the start and stop of the tool driving piece 13 and the grinding shaft driving piece 23 and controlling the turnover of the turnover mechanism 30, and meanwhile, the electric control assembly can be electrically connected with the centrifugal filter 53 to control the start and stop of the centrifugal filter 53.

It should be noted that, the electric control assembly 200 may be connected with a control panel 201, where the control panel 201 is disposed on the rack 100, so as to be convenient for a worker to control.

A third aspect of the present application provides a wafer polishing method, applied to the wafer polishing assembly of any one of the above;

the method comprises the following steps:

s1, clamping the wafer 40 by the clamp 12.

Step S1 may be preceded by a step S0 of controlling the movement of the clamp 12 to the loading and unloading station A.

S2, controlling the clamp 12 to move to the first end surface station B.

And S3, moving the grinding shaft 22 to a grinding station F to grind one end edge 41 to be ground on the top surface of the wafer 40, and moving the grinding shaft 22 to an avoiding station E after finishing grinding.

S4, controlling the clamp 12 to move to the second end face station C.

S5, polishing the end edge to be polished of the top surface of the wafer 40 through a polishing shaft 22 positioned at a polishing station F;

S6, after the control clamp 12 moves the overturning station D, the wafer 40 is horizontally overturned by the overturning mechanism 30 according to a preset angle, wherein the preset angle can be 90 degrees.

And S7, repeating the steps S2 to S6 until the eight end edges 41 to be polished of the wafer 40 are polished.

Step S7 may be followed by a step S8 of controlling the gripper 12 to move to the loading and unloading station A to unload the wafer 40.

In this embodiment, the eight end edges 41 of the wafer 40 to be polished can be as shown in fig. 2.

By the wafer polishing method provided by the embodiment of the application, automatic loading and unloading, automatic sliding and automatic overturning of the wafer 40 can be realized, and finally, the automatic polishing of the wafer 40 is finished, so that the working intensity of staff can be effectively reduced, and the consistency of the polishing quality and the polishing degree of the wafer 40 is ensured.

While the application has been described in detail with reference to the examples, it will be apparent to those skilled in the art that the foregoing description of the preferred embodiments of the application may be modified or equivalents may be substituted for elements thereof, and that any modifications, equivalents, improvements or changes will fall within the spirit and principles of the application.

Claims

1. The wafer polishing assembly is characterized by comprising a tool mechanism (10), a grinding shaft mechanism (20) and a turnover mechanism (30);

The tooling mechanism (10) comprises a horizontal module (11), a clamp (12) and a tooling driving piece (13);

The horizontal module (11) is provided with a loading and unloading station (A), a first end surface station (B), a second end surface station (C) and a turnover station (D);

the clamp (12) is used for clamping a wafer (40) and is arranged on the horizontal module (11);

The tool driving piece (13) is connected with the clamp (12) and is used for driving the clamp (12) to switch positions among the loading and unloading station (A), the first end surface station (B), the second end surface station (C) and the overturning station (D);

The grinding shaft mechanism (20) comprises a linear module (21), a grinding shaft (22) and a grinding shaft driving piece (23);

The linear module (21) is provided with an avoiding station (E) and a polishing station (F);

The grinding shaft (22) is arranged on the linear module (21);

The grinding shaft driving piece (23) is connected with the grinding shaft (22) and is used for driving the grinding shaft (22) to switch positions between the avoiding station (E) and the grinding station (F);

The polishing station (F) is arranged between the first end surface station (B) and the second end surface station (C) so that the polishing shaft (22) positioned at the polishing station (F) can polish the wafer (40) on the first end surface station (B) or the wafer (40) on the second end surface station (C);

The turnover mechanism (30) is arranged beside the turnover station (D) and is used for turnover of the wafer (40) positioned at the turnover station (D);

the linear module (21) is vertically arranged;

The clamp (12) is slidably arranged on the horizontal module (11) along the horizontal direction;

the grinding shaft (22) is slidably arranged on the linear module (21) along the vertical direction;

The avoiding station (E) is located above the polishing station (F).

2. The wafer polishing assembly according to claim 1, wherein the flipping mechanism (30) comprises an adsorption member (31) and a flipping motor (32);

the adsorbing piece (31) is used for adsorbing the wafer (40);

The overturning motor (32) is in transmission connection with the adsorption piece (31) and is used for driving the adsorption piece (31) to rotate along the horizontal plane by a preset angle.

3. The wafer polishing assembly as set forth in claim 2, wherein the flipping mechanism (30) further comprises a lift cylinder (33) and a support table (34);

The adsorption piece (31) and the overturning motor (32) are arranged on the supporting table (34);

The output end of the lifting cylinder (33) is connected with the supporting table (34) and is used for driving the supporting table (34) to lift.

4. The wafer polishing assembly of claim 1, further comprising a cooling mechanism (50);

The cooling mechanism (50) comprises a grinding fluid spray pipe (51);

The grinding fluid spray pipe (51) is arranged beside the grinding shaft (22) and is used for spraying grinding fluid to the grinding shaft (22).

5. The wafer polishing assembly of claim 4, wherein the cooling mechanism (50) further comprises a grinding fluid collection tube (52) and a centrifugal filter (53);

The liquid inlet end of the grinding liquid collecting pipe (52) is arranged below the grinding shaft (22) and is used for collecting the sprayed grinding liquid;

the centrifugal filter (53) is connected with the liquid outlet end of the grinding liquid collecting pipe (52).

6. Wafer polishing assembly according to claim 4, wherein the horizontal module (11), the linear module (21) and the tilting mechanism (30) are provided with a waterproof cover (60).

7. The wafer polishing assembly of claim 1, further comprising a dust removal tube (70);

the dust removal pipe (70) is arranged beside the grinding shaft (22) and is used for absorbing dust generated in the grinding process.

8. A wafer polishing apparatus comprising a frame (100), an electrical control assembly (200), and a wafer polishing assembly according to any one of claims 1-7;

the electric control assembly (200) and the wafer polishing assembly are arranged on the frame (100);

the electric control assembly (200) is electrically connected with the tool driving piece (13), the grinding shaft driving piece (23) and the turnover mechanism (30) in the wafer grinding assembly.

9. A wafer polishing method, characterized by being applied to the wafer polishing assembly according to any one of claims 1 to 7;

the method comprises the following steps:

s1, clamping a wafer (40) through a clamp (12);

s2, controlling the clamp (12) to move to a first end surface station (B);

s3, moving the grinding shaft (22) to a grinding station (F) to grind one end edge (41) to be ground on the top surface of the wafer (40), and moving the grinding shaft (22) to an avoiding station (E) after finishing grinding;

s4, controlling the clamp (12) to move to a second end surface station (C);

S5, polishing the end edge (41) to be polished of the top surface of the wafer (40) through a polishing shaft (22) positioned at a polishing station (F);

s6, after the clamp (12) is controlled to move the overturning station (D), the wafer (40) is horizontally overturned according to a preset angle through the overturning mechanism (30);

and S7, repeating the steps S2 to S6 until the eight end edges (41) to be polished of the wafer (40) are polished.