CN116456253A - Acoustic sensor and intelligent wearing equipment - Google Patents

Abstract

The present invention provides an acoustic sensor and a smart wearable device. The acoustic sensor includes a shielding shell, a substrate, and a shell covering the base plate. The base plate and the shell form an accommodation cavity, and a MEMS chip, an ASIC chip, and a voice processing chip are arranged in the accommodation cavity. The MEMS chip is connected to the ASIC chip for signals, the ASIC chip is connected to the voice processing chip for signals, and the shielding shell is arranged outside the voice processing chip. The acoustic sensor is provided with a shielding shell in the accommodation cavity, and the shielding shell is set outside the voice processing chip to isolate and shield the voice processing chip, which can prevent the heat and electromagnetic signals generated by the voice processing chip from affecting other chips. , It can also prevent the heat and electromagnetic signals generated by other chips from affecting the voice processing chip. The acoustic sensor has the advantages of being able to isolate heat and electromagnetic signals and improve the signal quality of the acoustic sensor.

Description

Acoustic sensors and smart wearable devices

technical field

The invention relates to the technical field of sensors, in particular to an acoustic sensor and a smart wearable device.

Background technique

The acoustic sensor introduces a voice processing chip on the basis of the traditional MEMS acoustic sensor, so that the acoustic sensor not only has the function of picking up the voice signal of the MEMS acoustic sensor, but also has the function of voice signal processing. The existing technology is to mount the voice processing chip and MEMS chip on the surface of the PCB. The ASIC chip and the voice processing chip are stacked together. The chips are connected by gold wires. The surface of the ASIC chip is coated with glue, and the entire structure is protected by a shell. The voice processing chip is similar to a microprocessor, which will generate interference problems such as electromagnetic signals and heat during operation, thereby affecting the signal quality of the acoustic sensor.

In view of this, it is necessary to provide a new acoustic sensor and smart wearable device to solve or at least alleviate the above-mentioned technical defects.

Contents of the invention

The main purpose of the present invention is to provide an acoustic sensor and smart wearable device, aiming to solve the technical problem in the prior art that the voice processing chip of the acoustic sensor generates electromagnetic signals and heat that affects the signal quality of the acoustic sensor.

In order to achieve the above object, according to one aspect of the present invention, the present invention provides an acoustic sensor, comprising a shielding case, a base plate, and a shell covering the base plate, the base plate and the shell form an accommodating cavity, and the accommodating The cavity is provided with a MEMS chip, an ASIC chip and a voice processing chip, the MEMS chip is connected with the signal of the ASIC chip, the ASIC chip is connected with the signal of the voice processing chip, and the shielding shell is arranged outside the voice processing chip .

In one embodiment, the voice processing chip is disposed on the substrate, the shielding shell is disposed on the substrate to form a shielding cavity, and the voice processing chip is located in the shielding cavity.

In one embodiment, the substrate is provided with a receiving groove, the shielding shell and the receiving groove form a shielding cavity, and the voice processing chip is arranged in the shielding cavity.

In an embodiment, the shielding shell includes a plastic sealing layer or a glue layer, and the plastic sealing layer or the glue layer at least partially wraps the voice processing chip.

In one embodiment, the shielding shell includes a metal shell, and the metal shell is disposed outside the voice processing chip and spaced apart from the voice processing chip.

In one embodiment, the shielding shell includes a plastic shell, and the plastic shell is arranged outside the voice processing chip.

In one embodiment, the shielding shell includes an upper shell and a lower shell, the upper shell and the lower shell cooperate to form a shielding cavity, and the voice processing chip is arranged in the shielding cavity.

In one embodiment, the upper casing is a glue layer or a plastic sealing layer, the lower casing includes a plastic shell or a metal shell, and the lower casing is disposed on the substrate.

In one embodiment, the ASIC chip and the voice processing chip are stacked, and the ASIC chip is disposed on a side of the shielding shell away from the substrate.

In one embodiment, the MEMS chip is connected to the ASIC chip through gold wires, and the ASIC chip and the voice processing chip are respectively connected to the substrate through gold wires.

In one embodiment, a sound inlet is arranged on the substrate, and the MEMS chip is arranged facing the sound inlet.

In one embodiment, the housing is provided with a sound inlet.

According to still another aspect of the present invention, the present invention also provides a smart wearable device, which includes the above-mentioned acoustic sensor.

In the above solution, the MEMS chip is used to receive the sound signal and transmit it to the ASIC chip connected to the signal. After processing, the ASIC chip is transmitted to the voice processing chip connected to the signal. The voice processing chip is similar to a microprocessor. Since the voice processing chip generates heat when it is working, the heat generated may affect the work of other chips, and the voice processing chip has radiation when it is working, which will generate electromagnetic signals, and the generated electromagnetic signals will also affect the work of other chips. Similarly, heat and electromagnetic signals generated by other chips may also affect the normal operation of the voice processing chip, thus affecting the signal quality of the acoustic sensor. In the invention, a shielding shell is provided in the accommodation cavity, and the shielding shell is set outside the voice processing chip to isolate and shield the voice processing chip, which can prevent the heat and electromagnetic signals generated by the voice processing chip from affecting other chips. It can also prevent the heat and electromagnetic signals generated by other chips from affecting the voice processing chip. The invention has the advantages of being able to isolate heat and electromagnetic signals and improve the signal quality of the acoustic sensor.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some implementations of the present invention. For those skilled in the art, other drawings can also be obtained according to the structures shown in these drawings without creative effort.

FIG. 1 is a schematic cross-sectional structure diagram of an acoustic sensor according to a first embodiment of the present invention;

2 is a schematic cross-sectional structure diagram of an acoustic sensor according to a second embodiment of the present invention;

Fig. 3 is an exploded view of the partial structure of Fig. 2;

4 is a schematic cross-sectional structure diagram of an acoustic sensor according to a third embodiment of the present invention;

Fig. 5 is a partial structural schematic diagram of Fig. 4;

Fig. 6 is a schematic cross-sectional structure diagram of an acoustic sensor according to a fourth embodiment of the present invention.

Label description:

1. Shell; 2. Substrate; 3. Accommodating cavity; 4. MEMS chip; 5. ASIC chip; 6. Voice processing chip; 7. Shielding shell; 71. Plastic sealing layer; 72. Glue layer; 73. Metal shell; 74 , plastic shell; 75, upper shell; 76, lower shell; 8, shielding cavity; 9, gold wire; 10, sound inlet; 11, glue layer; 12, accommodation tank.

The realization of the purpose of the present invention, functional characteristics and advantages will be further described with reference to the accompanying drawings in combination with the implementation modes.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

It should be noted that all directional indications (such as up, down, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship, movement conditions, etc. between the components in a certain posture (as shown in the drawings), If the specific posture changes, the directional indication also changes accordingly.

In addition, in the present invention, descriptions such as "first", "second" and so on are used for description purposes only, and should not be understood as indicating or implying their relative importance or implicitly indicating the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features.

Moreover, the technical solutions of the various embodiments of the present invention can be combined with each other, but it must be based on the realization of those skilled in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered as a combination of technical solutions. Does not exist, nor is it within the scope of protection required by the present invention.

1 to 6, according to one aspect of the present invention, the present invention provides an acoustic sensor, comprising a substrate 2 and a housing 1 covering the substrate 2, the substrate 2 and the housing 1 are formed with a housing chamber 3, and the housing 3 A MEMS chip 4, an ASIC chip 5 and a voice processing chip 6 are provided, the MEMS chip 4 is signal-connected to the ASIC chip 5, the ASIC chip 5 is signal-connected to the voice processing chip 6, and a shielding shell 7 is included, and the shielding shell 7 is set on the voice processing Chip 6 out.

In the foregoing embodiment, the MEMS chip 4 is used to receive the sound signal and transmits it to the ASIC chip 5 connected to the signal, and the ASIC chip 5 is processed and then transmitted to the voice processing chip 6 connected to the signal, and the voice processing chip 6 is similar to a microprocessor. The processing chip 6 makes the acoustic sensor not only have the function of picking up the voice signal, but also have the function of processing the voice signal. Since the voice processing chip 6 generates heat when it works, the generated heat may affect the work of other chips, and the voice processing chip 6 has radiation when it works, which will generate electromagnetic signals, which will also affect the work of other chips. Similarly, the heat and electromagnetic signals generated by other chips may also affect the normal operation of the voice processing chip 6, thus affecting the signal quality of the acoustic sensor. In this embodiment, a shielding shell 7 is provided in the accommodation cavity 3, and the shielding shell 7 is placed outside the voice processing chip 6 to isolate and shield the voice processing chip 6, which can prevent the heat and electromagnetic radiation generated by the voice processing chip 6. The signal affects other chips, and can also prevent the heat and electromagnetic signals generated by other chips from affecting the voice processing chip 6 . This embodiment has the advantage of being able to isolate heat and electromagnetic signals and improve the signal quality of the acoustic sensor. The acoustic sensor can be an intelligent acoustic sensor, and the substrate 2 can be a printed circuit board.

Referring to FIG. 1 , in one embodiment, the voice processing chip 6 is disposed on the substrate 2 , the shielding case 7 is covered on the substrate 2 to form a shielding cavity 8 , and the voice processing chip 6 is located in the shielding cavity 8 . The voice processing chip 6 is mounted on the surface of the substrate 2, the shielding case 7 includes a shielding space with an opening formed at one end, and the opening of the shielding case 7 is arranged on the substrate 2, so that the shielding case 7 and the substrate 2 together form a sealed In the shielding chamber 8, the voice processing chip 6 is located in the shielding chamber 8, which can play a good role in isolating electromagnetic signals while playing the role of heat insulation.

Referring to FIG. 2 and FIG. 3 , in one embodiment, the substrate 2 is provided with a receiving groove 12 , the shielding shell 7 and the receiving groove 12 form a shielding chamber 8 , and the voice processing chip 6 is disposed in the shielding chamber 8 . A housing groove 12 can be dug downward on the side of the substrate 2 facing the housing cavity 3, and the voice processing chip 6 is first placed in the housing tank 12, and the voice processing chip 6 and the housing tank 12 are connected by gold wires 9 or pads to realize voice The processing chip 6 is connected to the signal of the substrate 2 , and then the shielding shell 7 is covered on the voice processing chip 6 . This design can not only play a good role in isolating heat and electromagnetic signals, but also effectively use space and reduce the vertical size of the acoustic sensor, that is, to make the acoustic sensor thinner, which is in line with the development trend of miniaturization of products. Specifically, the shielding shell 7 can be completely disposed in the receiving groove, and the top of the shielding shell 7 can be designed to be flush with the surface of the substrate 2 .

In one embodiment, the shielding shell 7 includes a plastic sealing layer 71 or a glue layer 72 , and the plastic sealing layer 71 or the glue layer 72 at least partially wraps the voice processing chip 6 . The molding layer 71 is formed by selective molding of molding compound, and the molding compound may be epoxy resin. Referring to Fig. 1, when the voice processing chip 6 is arranged on the substrate 2, the bottom of the voice processing chip 6 is mounted on the substrate 2 and connected to the gold wire 9, which can be selectively plastic-packed on the top and side of the voice processing chip 6 A layer of plastic sealing layer 71 is plastic-sealed, and the plastic sealing layer wraps the gold wire 9 connecting the voice processing chip 6 and the substrate 2, which not only can effectively isolate heat, but also can play a certain role of electromagnetic signal shielding. Of course, it is also possible to coat the top and side walls of the voice processing chip 6 with liquid glue. After the glue solidifies, a glue layer 72 is formed. It can play an effective role in heat insulation, and also has a certain role in electromagnetic signal shielding.

Referring to Fig. 2 and Fig. 3, in another embodiment, when the speech processing chip 6 is arranged in the containing groove 12, the speech processing chip 6 can be placed in the containing groove 12 first, then add liquid glue to make it fill up. The receiving tank 12 is preferably not to overflow the receiving tank 12. After the liquid glue solidifies, a glue layer 72 is formed, and the glue layer 72 wraps the gold wire 9 connecting the voice processing chip 6 and the substrate 2 . Of course, it is also possible to place the voice processing chip 6 in the housing groove 12 and then connect the gold wire 9 to fill the housing tank 12 with the molding compound, and form a plastic sealing layer 71 after curing to fill the housing tank 12 and wrap the voice processing chip. 6 and the gold wire 9 connecting the voice processing chip 6 to the substrate 2.

Referring to FIG. 4 , in one embodiment, the shielding shell 7 includes a metal shell 73 , and the metal shell 73 is disposed outside the voice processing chip 6 and spaced apart from the voice processing chip 6 . The metal shell 73 cooperates with the substrate 2 to form the shielding cavity 8 , and the process of setting the metal shell 73 is relatively simple, and it only needs to be soldered with solder paste or glued to the substrate 2 . Metal shell 73 can play better electromagnetic shielding effect, but because metal shell 73 thermal conductivity is better, in order to play the effect of heat isolation, can be provided with interval between speech processing chip 6 and metal shell 73, and shielding cavity 8 is vacuumized inside to effectively insulate heat. Specifically, when the voice processing chip 6 is arranged on the substrate 2, the voice processing chip 6 can be installed on the substrate 2 and connected with the gold wire 9, and then the metal shell 73 can be mounted on the substrate 2. When the voice processing chip 6 is arranged in the holding tank 12, the voice processing chip 6 can also be installed on the substrate 2 and connected to the gold wire 9 earlier, and the voice processing chip 6 and the holding tank 12 side wall slots are reserved. Good clearance is provided to facilitate mounting of the metal shell 73 ; or the metal shell 73 is directly mounted on the opening of the receiving groove 12 to close the receiving groove 12 .

Referring to FIG. 4 , in one embodiment, the shielding shell 7 includes a plastic shell 74 , and the plastic shell 74 is disposed outside the voice processing chip 6 . The use of the plastic shell 74 can play a better role in heat insulation and shielding of electromagnetic signals, and the cost of using the plastic shell 74 is low, and it is not easy to conduct electricity with other components in the accommodation cavity 3 . In a specific embodiment, a gap can be provided between the voice processing chip 6 and the plastic shell 74, and the interior can be evacuated to effectively insulate heat. Specifically, when the voice processing chip 6 is arranged on the substrate 2, the voice processing chip 6 can be installed on the substrate 2 first and the gold wire 9 can be connected, and then the plastic shell 74 can be pasted on the substrate 2. When the voice processing chip 6 is arranged in the holding tank 12, the voice processing chip 6 can also be installed on the substrate 2 and connected to the gold wire 9 earlier, and the voice processing chip 6 and the holding tank 12 side wall slots are reserved. Good clearance is provided to facilitate the mounting of the plastic shell 74; or the opening of the receiving groove 12 is directly closed at the opening of the plastic shell 74 after mounting.

5 and 6, in one embodiment, the shielding shell 7 includes an upper shell 75 and a lower shell 76, the upper shell 75 and the lower shell 76 cooperate to form a shielding cavity 8, and the voice processing chip 6 is arranged in the shielding cavity 8 within. The lower housing 76 is used to support the voice processing chip 6, and the upper housing 75 and the lower housing 76 cooperate to form an airtight shielding chamber 8. The voice processing chip 6 is arranged in the shielding chamber 8, which can provide better heat insulation and protection. Signal shielding effect. During specific manufacturing, the lower case 76 can be mounted on the substrate 2 first, then the voice processing chip 6 is placed on the lower case 76 , and then the upper case 75 is covered on the lower case 76 . Alternatively, the voice processing chip 6 is placed in the lower case 76 outside first, then the upper case 75 is covered on the lower case 76 , and finally the entire shielding case 7 is mounted on the substrate 2 together.

In one embodiment, the upper shell 75 is a glue layer 72 or a plastic seal layer 71 , the lower shell 76 includes a plastic shell 74 or a metal shell 73 , and the lower shell 76 is disposed on the substrate 2 . It should be noted that when the lower shell 76 is a metal shell 73, since the metal shell 73 has a better heat conduction effect, in order to achieve a better thermal insulation effect, a layer of glue can be placed on the bottom of the lower shell 76 first, and then the voice processing The chip 6 is bonded to the bottom of the lower housing 76, and the glue acts as a heat insulator, and then the voice processing chip 6 is connected to the substrate 2 or the receiving tank 12 through a gold wire 9 for signal connection, and finally the plastic sealing layer 71 is formed by selective plastic sealing or in the The voice processing chip 6 is coated with liquid glue to be cured to form a glue layer 72 , and the plastic sealing layer 71 or glue layer 72 wraps the gold wire 9 connecting the voice processing chip 6 and the substrate 2 . The methods of setting the glue layer 72 and the plastic sealing layer 71 are similar to those described above, and will not be repeated here. Of course, in this embodiment, the accommodating groove 12 may also be provided on the substrate 2 , and the shielding shell 7 is arranged in the accommodating groove 12 .

Referring to FIG. 1 and FIG. 2 , in an embodiment, the ASIC chip 5 and the voice processing chip 6 are stacked, and the ASIC chip 5 is disposed on the side of the shielding shell 7 away from the substrate 2 . Along the direction perpendicular to the substrate 2 , the ASIC chip 5 is arranged above the speech processing chip 6 , and since the speech processing chip 6 is covered by the shielding case 7 , the ASIC chip 5 can be arranged on the top of the shielding case 7 . Specifically, it can be bonded to the shielding shell 7 by adhesive glue or double-sided adhesive tape, and this design can reduce the lateral dimension of the acoustic sensor. In one embodiment, the MEMS chip 4 is connected to the ASIC chip 5 through gold wires 9 , and the ASIC chip 5 and the voice processing chip 6 are connected to the substrate 2 through gold wires 9 . It is also possible to cover the adhesive layer 11 on the ASIC chip 5 to wrap the solder joints of the gold wire 9 and the ASIC chip 5 to prevent loosening.

The present invention is not only suitable for the acoustic sensor of sound inlet from the top, but also suitable for the acoustic sensor of sound inlet from the bottom. When the sound is fed from the bottom, the substrate 2 is provided with a sound inlet 10 , and the MEMS chip 4 is arranged facing the sound inlet 10 . When the sound is fed from the top, the housing is provided with a sound inlet 10 .

According to still another aspect of the present invention, the present invention also provides a smart wearable device, which includes the above-mentioned acoustic sensor. Since the smart wearable device includes all the technical solutions of all the embodiments of the above-mentioned acoustic sensor, it at least has all the beneficial effects brought by all the above-mentioned technical solutions, and will not be repeated here. The smart wearable device mentioned above may be a smart earphone, a smart phone or a smart phone.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and are not therefore limiting the scope of the present invention; although the application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should Understanding: under the technical conception of the present invention, it is still possible to modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; or directly or indirectly apply them in other related technical fields, However, these modifications or replacements do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application, and all of them should be covered by the scope of the claims and description of the present application. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims (13)

1. The utility model provides an acoustic sensor, its characterized in that includes shield shell, base plate and cover locate the shell of base plate, the base plate with the shell is formed with and holds the chamber, hold intracavity and be provided with MEMS chip, ASIC chip and speech processing chip, the MEMS chip with ASIC chip signal connection, ASIC chip with speech processing chip signal connection, the shield shell covers and locates outside the speech processing chip.

2. The acoustic sensor of claim 1, wherein the voice processing chip is disposed on the substrate, the shield can is disposed on the substrate to form a shield cavity, and the voice processing chip is disposed in the shield cavity.

3. The acoustic sensor of claim 1, wherein the substrate is provided with a receiving groove, the shield case and the receiving groove form a shield cavity, and the voice processing chip is disposed in the shield cavity.

4. An acoustic sensor according to claim 2 or 3, wherein the shielding shell comprises a plastic or glue layer, which at least partly encapsulates the speech processing chip.

5. An acoustic sensor according to claim 2 or 3 wherein the shield case comprises a metal case which is housed outside and spaced from the speech processing chip.

6. An acoustic sensor according to claim 2 or 3, wherein the shield case comprises a plastic case, the plastic case being housed outside the speech processing chip.

7. The acoustic sensor of claim 1, wherein the shield case comprises an upper case and a lower case that cooperate to form a shield cavity, the speech processing chip being disposed within the shield cavity.

8. The acoustic sensor of claim 7, wherein the upper housing is a glue or plastic layer, the lower housing comprises a plastic or metal shell, and the lower housing is disposed on the substrate.

9. The acoustic sensor of any of claims 1 or 2 or 3 or 7, wherein the ASIC chip is disposed in a stack with the speech processing chip, the ASIC chip being disposed on a side of the shield shell facing away from the substrate.

10. The acoustic sensor of any of claims 1 or 2 or 3 or 7, wherein the MEMS chip is signal-connected to the ASIC chip by gold wires, and wherein the ASIC chip and the speech processing chip are signal-connected to the substrate by gold wires.

11. The acoustic sensor of any of claims 1 or 2 or 3 or 7, wherein the substrate is provided with a sound inlet, and the MEMS chip is disposed facing the sound inlet.

12. The acoustic sensor of any of claims 1 or 2 or 3 or 7, wherein the housing is provided with a sound inlet.

13. A smart wearable device, characterized in that it comprises the acoustic sensor of any one of claims 1-12.