CN116437578B - Through hole device for printed circuit board production - Google Patents
Through hole device for printed circuit board production Download PDFInfo
- Publication number
- CN116437578B CN116437578B CN202310692109.5A CN202310692109A CN116437578B CN 116437578 B CN116437578 B CN 116437578B CN 202310692109 A CN202310692109 A CN 202310692109A CN 116437578 B CN116437578 B CN 116437578B
- Authority
- CN
- China
- Prior art keywords
- hole
- circuit board
- printed circuit
- punching
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000004080 punching Methods 0.000 claims abstract description 24
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000000084 colloidal system Substances 0.000 claims abstract description 23
- 229910052709 silver Inorganic materials 0.000 claims abstract description 23
- 239000004332 silver Substances 0.000 claims abstract description 23
- 239000002002 slurry Substances 0.000 claims abstract description 16
- 238000005507 spraying Methods 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims description 13
- 239000007921 spray Substances 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 11
- 239000003292 glue Substances 0.000 description 4
- 238000011010 flushing procedure Methods 0.000 description 2
- 125000003003 spiro group Chemical group 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/005—Punching of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model discloses a through hole device for producing a printed circuit board, which comprises a bedplate, wherein supporting legs are arranged on four sides of the bottom of the bedplate, a collecting frame for collecting silver colloid is arranged at the top of the bedplate, a table frame is arranged in the collecting frame, a mounting groove is arranged at the top of the table frame, a first punching hole is arranged at the bottom of the mounting groove, and a push rod of a hydraulic cylinder is connected with a punching mechanism for punching the printed circuit board and spraying silver colloid in the punching hole. Under the control of the laser range finder and the PLC, the electromagnetic valve is opened in the process that the nozzle passes through the punching inner wall, the external silver colloid pressurizing equipment is discharged into the slurry collecting box through the hose and the calandria, then the silver colloid is effectively covered in the printed circuit board hole through the two layers of nozzles, and after the punch is retracted, the diameter of the section of the punch is smaller than the diameter of the hole inner wall, but the excessive silver colloid on the hole inner wall can be scraped, so that the hole and the through colloid are integrated in the whole process, and the time of the printed circuit board through hole process is saved.
Description
Technical Field
The utility model belongs to the technical field of printed circuit board production, and particularly relates to a through hole device for printed circuit board production.
Background
The printed circuit board through hole process is to open holes in the printed circuit board and to fill silver paste into the opened holes to ensure the conductivity of the hole wall.
The authorized bulletin number is: the utility model patent of CN213938446U discloses a printed circuit board through hole device, which relates to devices such as a motor box, a motor, a second fixed column, a power connection control box, a first fixed column, a through hole head, a travel switch and the like, when the through hole head does not work on a circuit board, the travel switch in the power connection control box can sense, so that the rotation of the motor to the through hole head can be stopped, and the motor is prevented from idling all the time when no work is performed.
The authorized bulletin number is: the utility model patent of CN103561547B discloses a printed circuit board through hole jig, which relates to a through hole printing table and a through hole on a through hole printing template, wherein the mold holes on the through hole printing template correspond to holes needing through holes on a circuit board substrate, the through hole printing table and the holes on the through hole printing template form an inverted funnel shape, suction force is increased, holes needing no through holes are not drilled on the through hole printing template, dispersion of the suction force is avoided, suction force of the through holes is improved, and printing ink of the through holes can easily penetrate through the substrate and uniformly adhere to the hole wall.
Therefore, in the conventional printed circuit board production process, the hole opening and glue filling operation needs to be performed in a distributed manner, and in this working mode, a large amount of time for transferring and transferring installation has to be lost in the batch production of the printed circuit board hole opening operation, so that it is necessary to provide a hole opening device integrating the hole opening operation and the glue filling operation.
Disclosure of Invention
The utility model aims to provide a through hole device for producing a printed circuit board, which solves the problems in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a through hole device is used in printed circuit board production, includes the platen, the bottom four sides of platen are provided with supporting leg one, the top of platen is provided with the collection frame of collecting silver colloid, be provided with a frame in the collection frame, the top of a frame is equipped with the mounting groove and the bottom of mounting groove is equipped with first punching a hole, be provided with clamp plate and clamp plate in the bench frame and be equipped with the second and punch a hole, be connected with the top of bracing piece and bracing piece on the platen and be provided with the roof, be provided with the pneumatic cylinder on the roof, and the ejector pin of pneumatic cylinder is connected with and punches a hole to the printed circuit board and to the mechanism that spouts silver colloid in punching a hole.
Preferably, the inner top of the table frame is connected with a second supporting leg, the bottom of the second supporting leg is supported at the bottom of the collecting frame, and openings are formed in four sides of the collecting frame.
Preferably, the flushing and spraying mechanism comprises a slurry collecting box connected to the ejector rod of the hydraulic cylinder, a spray pipe corresponding to the first punching position and the second punching position is arranged at the bottom of the slurry collecting box and is communicated with the slurry collecting box, a one-way valve is screwed in the spray pipe, a spray nozzle is arranged at the bottom of the spray pipe, a punch head is connected to the bottom of the spray pipe, and a pressing groove capable of punching a printed circuit board is arranged at the lower end of the punch head.
Preferably, the both sides of converging thick liquid box are provided with the sideboard, the sideboard interpolation is equipped with slide bar and the lower extreme of slide bar is connected on the clamp plate, the top of slide bar is connected with the roof, the cover is equipped with the spring on the slide bar and the both ends of spring are supported respectively on sideboard and clamp plate.
Preferably, the rear portion of converging thick liquid box is connected with calandria and converging thick liquid box intercommunication, the one end of calandria is connected with the solenoid valve, the feed liquor end of solenoid valve is connected with the takeover, the takeover passes through the hose and is connected with peripheral hardware silver colloid pressurization equipment, one side be connected with the connecting plate on the sideboard and be provided with laser range finder on the connecting plate, the position that just corresponds the laser range finder and penetrate the head on the clamp plate is provided with the reflecting plate.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, the ejector rod of the hydraulic cylinder continues to extend to drive the punch to move downwards, the punch effectively opens holes on the printed circuit board through the second punching holes and the first punching holes one by one, the electromagnetic valve is opened in the process that the nozzle passes through the inner wall of the punching holes under the control of the laser range finder and the PLC, the external silver colloid pressurizing equipment is arranged into the paste collecting box through the hose and the discharge pipe, then the silver colloid is effectively covered in the holes of the printed circuit board through the two layers of nozzles, and after the punch is retracted, the diameter of the section of the punch is smaller than the diameter of the inner wall of the holes, but the excessive silver colloid on the inner wall of the holes can be scraped off, so that the holes and the through-colloid are integrated in the whole process, and the time of the through-hole process of the printed circuit board is saved.
Drawings
FIG. 1 is a schematic front view of the present utility model;
FIG. 2 is a schematic view in partial cutaway of FIG. 1;
fig. 3 is a schematic diagram of a connection and amplification structure of a slurry collecting box according to the present utility model.
In the figure: 1 platen, 2 supporting legs I, 3 collecting frames, 4 frames, 5 supporting legs II, 6 openings, 7 mounting grooves, 8 first punching holes, 9 pressing plates, 10 second punching holes, 11 supporting rods, 12 top plates, 13 hydraulic cylinders, 14 slurry collecting boxes, 15 side plates, 16 sliding rods, 17 top plates, 18 springs, 19 calandria, 20 electromagnetic valves, 21 connecting pipes, 22 hoses, 23 connecting plates, 24 laser range finders, 25 reflecting plates, 26 spraying pipes, 27 one-way valves, 28 spraying pipes, 29 punching heads and 31 grooving grooves.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.
Referring to fig. 1 and 2, a through hole device for producing a printed circuit board comprises a platen 1, a first supporting leg 2 is fixed on four sides of the bottom of the platen 1 through bolts, a collecting frame 3 for collecting silver colloid is fixed on the top of the platen 1 through bolts, a table frame 4 is fixed in the collecting frame 3 through bolts, the table frame 4 is of a square frame structure with an open lower end, a second supporting leg 5 is screwed on the inner top of the table frame 4, the bottom of the second supporting leg 5 is supported on the bottom of the collecting frame 3, an opening 6 is arranged on four sides of the collecting frame 3 through bolts, the opening 6 is arranged, silver colloid entering the collecting frame 3 is discharged to the outside, a mounting groove 7 is formed in the top of the table frame 4, the mounting groove 7 is of a square step groove, the mounting groove 7 is slidably inserted into the printed circuit board, a first pressing plate 9 is arranged on the bottom of the table frame 4, a second punching hole 10 is arranged in the table frame 9, the first punching hole 8 and the second punching hole 10 are correspondingly arranged on the bottom of the collecting frame 3, a hydraulic cylinder 13 is arranged on the top of the hydraulic cylinder 13 through a reversing valve, and is connected with the hydraulic cylinder 13 through a reversing valve, and the hydraulic cylinder 13 is arranged on the other side of the reversing cylinder, which is connected with the top of the hydraulic cylinder 13.
Referring to fig. 1, 2 and 3, the flushing and spraying mechanism comprises a slurry collecting box 14 fixed at the lower end of a push rod of a hydraulic cylinder 13 by bolts, a spray pipe 26 corresponding to the positions of a first punched hole 8 and a second punched hole 10 is integrally arranged at the bottom of the slurry collecting box 14, the spray pipe 26 is communicated with the slurry collecting box 14, the slurry collecting box 14 is used for collecting silver colloid and spraying downwards through the spray pipe 26, side plates 15 are welded at the left and right sides of the slurry collecting box 14, a slide rod 16 is inserted in the side plates 15 in a sliding manner, the lower ends of the slide rod 16 are in threaded connection with a pressing plate 9, a top plate 17 is welded at the top of the slide rod 16, springs 18 are sleeved on the slide rod 16, two ends of the springs 18 are respectively elastically supported on the side plates 15 and the pressing plate 9, the springs 18 are in a compression rebound type, the left and right sides of the springs 18 are under the elastic support of the springs 18 when the push rod of the hydraulic cylinder 13 is retracted in the earlier stage, so that the pressing plate 9 keeps to be pressed on the top of the table frame 4, and thus in the process that a punch 29 pulls out a printed circuit board, under the pressure of the pressing plate 9, the stability of the printed circuit board is ensured, a circular hole arranged at the rear part of the slurry collecting box 14 is welded with a calandria 19 in a seamless way, the calandria 19 is an L-shaped pipe, the calandria 19 is communicated with the slurry collecting box 14, the right end flange of the calandria 19 is connected with an electromagnetic valve 20, the liquid inlet end flange of the electromagnetic valve 20 is connected with a connecting pipe 21, the connecting pipe 21 is connected with external silver colloid pressurizing equipment through a hose 22, a power wire of the electromagnetic valve 20 is connected with a power wire lower pile of an external relay, a power wire upper pile of the relay is connected with an external power supply through a cable, a coil terminal of the relay is connected with a control output end of a PLC (programmable logic controller), a connecting plate 23 is integrally arranged on a side plate 15 on the right side, a laser range finder 24 is fixed on the connecting plate 23 through screws, a jet head of the laser range finder 24 penetrates through the connecting plate 23, a plate groove is arranged at the position corresponding to the jet head of the laser range finder 24 on the pressing plate 9, and adopt the resin glue to bond in the board groove to have reflecting plate 25, reflecting plate 25 is used for reflecting the laser pulse that the head of laser range finder 24 launched, the signal output part of laser range finder 24 passes through the transmission line and connects the PLC analog input port, set for the PLC action distance value, this action distance value satisfies, spout 28 upwards or when the downward through printed circuit board opening inner wall, switch on solenoid valve 20's power, the power of solenoid valve 20 is kept to the rest time, the spiro union has check valve 27 in spray tube 26, spout 28 has been seted up to the bottom of spray tube 26, spout 28 divides two-layer, the setting is left and right sides to the lower one deck, be the arc opening, the upper one deck is the setting back and forth, also be the arc opening, four arc openings can make up a circular hole, consequently, can effectively let the printed circuit board trompil cover the silver glue in inserting the printed circuit board trompil, the bottom spiro union of spray tube 26 has punch 29 and punch 29's lower extreme is equipped with the grooving 31 that can be printed circuit board, grooving 31 is the conical recess, the setting of grooving 31, be favorable to cutting down the printed circuit board fast, thereby the trompil is effective.
The working principle of this embodiment is as follows: the reversing valve is operated, the ejector rod of the hydraulic cylinder 13 is retracted, the pressing plate 9 is driven to move upwards, the printed circuit board can be placed into the mounting groove 7, the reversing valve is operated, the ejector rod of the hydraulic cylinder 13 extends, when the pressing plate 9 is effectively pressed on the table frame 4, the position of the printed circuit board in the mounting groove 7 is stabilized, at the moment, the ejector rod of the hydraulic cylinder 13 continues to extend, the punch 29 is driven to move downwards, the punch 29 is driven to punch holes on the printed circuit board through the second punching 10 and the first punching 8 one by one, in the process, the punch 29 effectively opens holes on the printed circuit board, under the control of the laser range finder 24 and the PLC, the electromagnetic valve 20 which is opened in the process of opening the nozzle 28 through the punching inner wall is realized, the external silver colloid pressurizing equipment is discharged into the slurry collecting box 14 through the hose 22 and the exhaust pipe 19, then the silver colloid is effectively covered in the holes of the printed circuit board through the two layers of the nozzle 28, and after the punch 29 is retracted, the diameter of the section of the punch 29 is smaller than the diameter of the inner wall of the hole, the redundant silver colloid on the inner wall of the hole is scraped, so that the hole is formed in the whole process, the hole and the hole is integrated into a whole.
The foregoing description is only of the preferred embodiments of the present utility model, and is not intended to limit the scope of the present utility model.
Claims (4)
1. A through hole device for producing a printed circuit board is characterized in that: including platen (1), the bottom four sides of platen (1) are provided with supporting leg one (2), the top of platen (1) is provided with collects collection frame (3) of silver colloid, be provided with platform frame (4) in collection frame (3), the top of platform frame (4) is equipped with mounting groove (7) and the bottom of mounting groove (7) is equipped with first hole (8) that punches a hole, be provided with clamp plate (9) on platform frame (4) and be equipped with second hole (10) that punch a hole in clamp plate (9), be connected with bracing piece (11) and the top of bracing piece (11) is provided with roof (12) on platen (1), be provided with pneumatic cylinder (13) on roof (12), and the ejector pin of pneumatic cylinder (13) is connected with and spouts the mechanism to the hole in punching of spraying silver colloid, the hole is including connecting the top of pneumatic cylinder (13) on the ejector pin sink box (14), the bottom of sink box (14) is provided with and punches a hole (8) and second hole (10) in being provided with second hole (26) and be provided with spout (26) corresponding to punch a hole and spout (26) in spout (26) and spout (28) are opened in spout (26), the bottom of the spray pipe (26) is connected with a punch (29), and the lower end of the punch (29) is provided with a pressing groove (31) capable of punching a printed circuit board.
2. A through-hole assembly for printed circuit board production according to claim 1, wherein: the inner top of the table frame (4) is connected with a second supporting leg (5), the bottom of the second supporting leg (5) is supported at the bottom of the collecting frame (3), and openings (6) are formed in four sides of the collecting frame (3).
3. A through-hole assembly for printed circuit board production according to claim 1, wherein: the slurry collecting box is characterized in that side plates (15) are arranged on two sides of the slurry collecting box (14), sliding rods (16) are arranged in the side plates (15) in an inserted mode, the lower ends of the sliding rods (16) are connected to the pressing plate (9), top plates (17) are connected to the tops of the sliding rods (16), springs (18) are sleeved on the sliding rods (16), and two ends of the springs (18) are respectively supported on the side plates (15) and the pressing plate (9).
4. A through-hole assembly for printed circuit board production according to claim 3, wherein: the rear portion that gathers thick liquid box (14) is connected with calandria (19) and gathers thick liquid box (14) intercommunication, the one end of calandria (19) is connected with solenoid valve (20), the feed liquor end of solenoid valve (20) is connected with takeover (21), takeover (21) are connected with peripheral hardware silver colloid pressurization equipment through hose (22), one side be connected with connecting plate (23) and connecting plate (23) on sideboard (15) and be provided with laser range finder (24), the position that just corresponds laser range finder (24) to penetrate the head on clamp plate (9) is provided with reflecting plate (25).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310692109.5A CN116437578B (en) | 2023-06-13 | 2023-06-13 | Through hole device for printed circuit board production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310692109.5A CN116437578B (en) | 2023-06-13 | 2023-06-13 | Through hole device for printed circuit board production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116437578A CN116437578A (en) | 2023-07-14 |
| CN116437578B true CN116437578B (en) | 2023-09-15 |
Family
ID=87087579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310692109.5A Active CN116437578B (en) | 2023-06-13 | 2023-06-13 | Through hole device for printed circuit board production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116437578B (en) |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4002326A1 (en) * | 1989-01-27 | 1990-08-02 | Hitachi Seiko Kk | METHOD AND DEVICE FOR PERFORATING A PRINTED CIRCUIT BOARD |
| JP2000059010A (en) * | 1998-08-03 | 2000-02-25 | Nippon Carbide Ind Co Inc | Printed wiring board and manufacture thereof |
| WO2000072644A1 (en) * | 1999-05-25 | 2000-11-30 | Mitsui Mining & Smelting Co., Ltd. | Sheet for printed wiring board, method of forming via, resin sheet having filled via, printed wiring board and method of manufacturing the same |
| KR20020082444A (en) * | 2002-09-26 | 2002-10-31 | 최인진 | The hole-punching method of printed circuit board |
| DE10206440A1 (en) * | 2001-04-30 | 2002-11-14 | Isa Conductive Microsystems Gm | Circuit board through-hole connection method, by filling holes or openings with conductive adhesive and mounting SMD components |
| JP2004079584A (en) * | 2002-08-09 | 2004-03-11 | Noda Screen:Kk | Resin filling device |
| JP2006043804A (en) * | 2004-08-03 | 2006-02-16 | Matsushita Electric Ind Co Ltd | Punching device and punching method |
| JP2007208206A (en) * | 2006-02-06 | 2007-08-16 | Ibiden Engineering Kk | Method of manufacturing printed wiring board, and punching die used therefor |
| JP2008078464A (en) * | 2006-09-22 | 2008-04-03 | Nec Toppan Circuit Solutions Inc | Manufacturing method of printed wiring board and drilling apparatus |
| CN205283950U (en) * | 2015-12-11 | 2016-06-01 | 苏州米达思精密电子有限公司 | Automatic production equipment of strong piece of truncate in gluing |
| WO2017011703A1 (en) * | 2015-07-15 | 2017-01-19 | Printed Circuits, Inc. | Methods of manufacturing printed circuit boards |
| CN215835610U (en) * | 2021-09-26 | 2022-02-15 | 昆山万源通电子科技股份有限公司 | Based on processing of PCB circuit board is with equilibrium punching device |
| CN114654530A (en) * | 2022-05-23 | 2022-06-24 | 江油星联电子科技有限公司 | Hole site processingequipment is used in printed circuit board production |
| CN115397129A (en) * | 2022-10-27 | 2022-11-25 | 江油星联电子科技有限公司 | Printing device for processing circuit board |
-
2023
- 2023-06-13 CN CN202310692109.5A patent/CN116437578B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4002326A1 (en) * | 1989-01-27 | 1990-08-02 | Hitachi Seiko Kk | METHOD AND DEVICE FOR PERFORATING A PRINTED CIRCUIT BOARD |
| JP2000059010A (en) * | 1998-08-03 | 2000-02-25 | Nippon Carbide Ind Co Inc | Printed wiring board and manufacture thereof |
| WO2000072644A1 (en) * | 1999-05-25 | 2000-11-30 | Mitsui Mining & Smelting Co., Ltd. | Sheet for printed wiring board, method of forming via, resin sheet having filled via, printed wiring board and method of manufacturing the same |
| DE10206440A1 (en) * | 2001-04-30 | 2002-11-14 | Isa Conductive Microsystems Gm | Circuit board through-hole connection method, by filling holes or openings with conductive adhesive and mounting SMD components |
| JP2004079584A (en) * | 2002-08-09 | 2004-03-11 | Noda Screen:Kk | Resin filling device |
| KR20020082444A (en) * | 2002-09-26 | 2002-10-31 | 최인진 | The hole-punching method of printed circuit board |
| JP2006043804A (en) * | 2004-08-03 | 2006-02-16 | Matsushita Electric Ind Co Ltd | Punching device and punching method |
| JP2007208206A (en) * | 2006-02-06 | 2007-08-16 | Ibiden Engineering Kk | Method of manufacturing printed wiring board, and punching die used therefor |
| JP2008078464A (en) * | 2006-09-22 | 2008-04-03 | Nec Toppan Circuit Solutions Inc | Manufacturing method of printed wiring board and drilling apparatus |
| WO2017011703A1 (en) * | 2015-07-15 | 2017-01-19 | Printed Circuits, Inc. | Methods of manufacturing printed circuit boards |
| CN205283950U (en) * | 2015-12-11 | 2016-06-01 | 苏州米达思精密电子有限公司 | Automatic production equipment of strong piece of truncate in gluing |
| CN215835610U (en) * | 2021-09-26 | 2022-02-15 | 昆山万源通电子科技股份有限公司 | Based on processing of PCB circuit board is with equilibrium punching device |
| CN114654530A (en) * | 2022-05-23 | 2022-06-24 | 江油星联电子科技有限公司 | Hole site processingequipment is used in printed circuit board production |
| CN115397129A (en) * | 2022-10-27 | 2022-11-25 | 江油星联电子科技有限公司 | Printing device for processing circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116437578A (en) | 2023-07-14 |
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