CN116396095B - 一种轻质保温隔热砖及其制备方法 - Google Patents
一种轻质保温隔热砖及其制备方法 Download PDFInfo
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Abstract
本发明公开了一种轻质保温隔热砖及其制备方法,所述制备方法包括以下步骤:步骤1:按照一定的配比称取电瓷厂废泥、分子筛废料、废弃稻壳灰、黄糊精和水于搅拌机中,室温搅拌一定时间,获得轻质保温隔热砖坯料;步骤2:将轻质保温隔热砖坯料转入模具中压制成形,并脱模,获得轻质保温隔热砖坯体;步骤3:将轻质保温隔热砖坯体在室温下静置一定时间后,移入烧结炉中,升温至一定温度保温一定时间后,随炉冷却至室温,即得轻质保温隔热砖。本发明制备得到的轻质保温隔热砖具有体积密度较低、导热系数较小、强度稳定性较好等优点。
Description
技术领域
本发明涉及保温隔热耐火材料技术领域,具体涉及一种以废弃稻壳灰、分子筛废料、电瓷厂废泥为原料的轻质保温隔热砖及其制备方法。
背景技术
目前,我国对于固废物处理多数采用填埋法。如电瓷厂污水沉降池中电瓷坯料和釉料的混合泥料,由于釉料中含有重金属氧化物,同时混合组分较复杂,无法采用填埋处理或重新烧制电瓷,仅能占用土地临时堆放;又如石油催化裂解分子筛,其主要成分为氧化铝和氧化硅,外附有少量稀有金属和重金属作为催化剂,在石油催化裂解过程中存在分子筛中毒、坍塌等现象造成分子筛失效,由于含有稀有金属和重金属,目前大部分也仅能占用土地进行堆放;又如生物质气化炉燃烧后的灰质物质,其主体成分为氧化硅和碳,但由于产量大,质量轻,颗粒粒径较小,堆积体积较大等因素,储存与填埋等处理都存在较大的难度。
如能将上述工业固体废弃物工业规模化处理,运用绿色设计技术对固废物进行重新的设计与生产,制备满足符合环境保护要求的新材料,从而实现对生态环境无害化处理,实现资源与能源得到最有效地配置。
专利号为CN107244888A的专利公开了一种利用陶瓷废泥生产透水砖陶瓷基料的方法,其制备方法为:将陶瓷废泥脱水处理制成半干料,加入莱阳土、苏州土和长石,通过混料、成型、烘干、烧成、破碎、筛分,得用于生产陶瓷透水砖的陶瓷基料,再将基料经4-10MPa加压,再经90-110℃烘干,最后经1150-1250℃烧结而成。
专利号为CN10787926A的专利公开了一种粉煤灰烧结砖的制备方法,包括将分子筛进行烘干并打散制得分子筛渣粉、将脱硝粉煤灰和分子筛渣粉按照(70~80):(20~30)的重量比进行配料然后加水湿混陈化、在25-35Mpa压制成砖坯,最后经1000-1150℃烧结而成。通过本发明的实施脱硝粉煤灰和分子筛工业渣泥都能得到有效的资源化利用,减少了它们对自然环境的污染。
专利号为CN108675714A的专利公开了一种改性炭化谷壳保温隔热砖的制备方法,按重量份数计,依次称取50~80份水泥、10~12份粉煤灰、25~30份砂、5~6份表面活性剂、15~25份改性炭化谷壳、2~6份加气剂和30~45份水,将水泥与水混合于搅拌机中,并向搅拌机中依次加入粉煤灰,砂,表面活性剂,改性炭化谷壳和加气剂,于温度为45~65℃、转速为200~350r/min的条件下搅拌混合30~40min后注模成型,得坯料,将坯料于室温条件下避光养护20~30天后,得改性炭化谷壳保温隔热砖,所制保温隔热砖在建筑材料技术行业中具有广阔的应用前景。
专利号为CN103604525A的专利公开了一种基于高压电瓷废料的莫来石轻质隔热砖及其制备方法。其技术方案是:先以65.0~95.0wt%的高压电瓷废料与5.0~35.0wt%的粘土为原料,外加所述原料2.0~4.0wt%的结合剂和4.0~8.0wt%的水,混合再在每吨原料中加入500~1000L的造孔剂,搅4~6h,困料15~30h,压制成型;然后在60~120℃条件下干燥20~28h,在1200~1500℃条件下保温4~8h,即得莫来石轻质隔热砖。所述高压电瓷废料的主要化学成分是:Al2O3含量≥55.0wt%,SiO2含量≥38.0wt%,K2O含量≥3.0wt%,Na2O含量≥0.3wt%。本发明具有工艺简单、节约资源和环境友好的特点,所制得的莫来石轻质隔热砖耐压强度较高、体积稳定性较高、体积密度较低和导热系数较低。
综上所述,若能利用废弃稻壳灰、分子筛废料、电瓷厂废泥为原料制备轻质保温隔热砖,不仅能够实现固体废弃物的零排放,而且能够变废为宝,实现陶瓷固废的高值化利用,更能减少资源的消耗,节约能耗。
应该注意,上面对技术背景的介绍只是为了方便对本申请的技术方案进行清楚、完整的说明,并方便本领域技术人员的理解而阐述的。不能仅仅因为这些方案在本申请的背景技术部分进行了阐述而认为上述技术方案为本领域技术人员所公知。
发明内容
鉴于目前存在的上述不足,本发明提供一种以废弃稻壳灰、分子筛废料、电瓷厂废泥为原料的轻质保温隔热砖及其制备方法,本申请制备方法制备得到的轻质保温隔热砖具有体积密度较低、导热系数较小、强度稳定性较好等优点。
为了达到上述目的,本发明提供一种轻质保温隔热砖的制备方法,包括以下步骤:
步骤1:按照一定的配比称取电瓷厂废泥、分子筛废料、废弃稻壳灰、黄糊精和水于搅拌机中,室温搅拌一定时间,获得轻质保温隔热砖坯料;
步骤2:将轻质保温隔热砖坯料转入模具中压制成形,并脱模,获得轻质保温隔热砖坯体;
步骤3:将轻质保温隔热砖坯体在室温下静置一定时间后,移入烧结炉中,升温至一定温度保温一定时间后,随炉冷却至室温,即得轻质保温隔热砖。
依照本发明的一个方面,在步骤1中,按照重量份计,所述电瓷厂废泥为5-10份,所述分子筛废料为10-25份,所述废弃稻壳灰为65-85份,所述黄糊精为5-8份,所述水为10-15份。
依照本发明的一个方面,在步骤1中,所述室温搅拌的时间为2-4h。
依照本发明的一个方面,在步骤2中,所述压制成型的压力为5-8Mpa。
依照本发明的一个方面,所述步骤3具体为:将轻质保温隔热砖坯体在室温下静置12-24h,再移入烧结炉中,升温至1250-1350℃保温2-3h,随炉冷却至室温,即得轻质保温隔热砖。
依照本发明的一个方面,所述升温具体为:以3-5℃/min升温速率于100-120℃保温3-4h;以3-5℃/min升温速率于300-350℃保温2-3h;以3-5℃/min升温速率于600-650℃保温2-3h;以3-5℃/min升温速率于900-950℃保温2-3h;以3-5℃/min升温速率于1100-1150℃保温2-3h;以3-5℃/min升温速率于1250-1350℃保温2-3h。
需要说明的是,以3-5℃/min升温速率于100-120℃保温3-4h,此温度保温目的为使砖坯体中的水分尽量烘干;以3-5℃/min升温速率于300-350℃保温2-3h,此温度保温目的为使砖坯体中矿物吸附水、废泥中有机物和部分低温挥发物尽量除去;以3-5℃/min升温速率于600-650℃保温2-3h,此温度保温目的为使砖坯体中黄糊精以及废弃稻壳灰碳热分解;以3-5℃/min升温速率于900-950℃保温2-3h此温度保温目的为使砖坯体中废弃稻壳灰碳氧化分解完全,其为砖坯孔隙主要形成阶段;以3-5℃/min升温速率于1100-1150℃保温2-3h,此温度保温目的为使砖坯中固体开始熔解,莫来石等物质开始生成;以3-5℃/min升温速率于1250-1350℃保温2-3h,此温度保温目的为使砖坯体中氧化硅、莫来石等晶体进一步长大,同时熔体物质扩散增强,对砖体中固相物质润湿性增大,有利于砖体冷却后强度的提升。
依照本发明的一个方面,所述电瓷厂废泥为电瓷厂污水沉降池中电瓷坯体和釉料混合泥浆干燥后的废弃泥料,主要化学成分为:Al2O3含量45~50wt%;SiO2含量30~35%wt%;K2O含量3~6wt%;Na2O含量2~5wt%;Fe2O3含量1~3wt%;MgO含量1~2wt%;CaO含量1~2wt%;烧失量(LOI)5-8%。
依照本发明的一个方面,所述分子筛废料来自于石化炼油厂,主要化学成分为:Al2O3含量48~52wt%;SiO2含量40~45%wt%;La2O3含量2.5-4.0wt%;CeO2含量0.1-1.0wt%;Na2O含量0.1~0.35wt%;Fe2O3含量0.3~0.6wt%;V含量0.2~0.3wt%;Ni含量0.2~0.4wt%;SO4 2-含量0.5-1.5wt%。
依照本发明的一个方面,所述废弃稻壳灰来自于稻壳经生物质气化炉燃烧后的灰质物质,主要化学成分为:SiO2含量60-80wt%;C含量19.5-39.9wt%;其余微量组分为0.1-0.5wt%,包括Fe2O3、Na2O、K2O。
基于同一发明构思,本发明还公开了上述任一制备方法制备得到的轻质保温隔热砖,所述轻质保温隔热砖含有线状莫来石晶体,其长度为5-20um;所述轻质保温隔热砖的体积密度为0.89-1.25g/cm3,显气孔率为39.6-58.1%,常温抗折强度为13.27-25.63MPa,350℃测得导热率为0.101-0.127·m-1·k-1,重烧线变化率≤1%。
本发明的有益效果:
(1)本申请的稻壳灰在高温下碳化进行造孔,从而起到砖体隔热的目的;本申请的稻壳灰密度小,从而实现了砖体轻质的目的;本申请的稻壳灰的碳含量较多,灰质中的轻质氧化硅易吸附于分子筛上,形成线状莫来石结构(图1中白色箭头为线状莫来石);在砖体中线性莫来石结构起到拉扯的作用,可以增加多孔结构的强度;
(2)本申请的分子筛的主体成分是氧化铝和氧化硅,同时里面还有其他的重金属元素,在本专利烧结温度体系下,微米级分子筛氧化铝和氧化硅易转变为莫来石;
(3)本发明以废弃稻壳灰、分子筛废料、电瓷厂废泥为原料制备轻质保温隔热砖,实现固体废弃物的综合循环利用,不仅能够减少废弃稻壳灰、分子筛废料、电瓷厂废泥堆放和填埋所带来的环境问题,而且具有生产工艺简单,能够降低轻质保温隔热砖的生产成本的特点,同时有利于提高对上述固体废弃物回收利用技术的实际应用,实现相关废弃物的高附加值化。
(4)本发明所制轻质保温隔热砖,所采用电瓷厂废泥具有较好的高温粘结性;分子筛废料主要由铝、硅、氧元素组成,且内部结构为介孔状;稻壳灰为经生物质气化炉燃烧后的灰质物质,主要成分为氧化硅和碳。将上述三种原料结合起来制备轻质保温隔热砖,原料配比简单,化学成分相近,高温烧结活性和砖体气孔率较高,砖体硅-铝骨架结构强度较好,尤其上述固体废弃物中重金属元素在烧结温度条件下可以金属氧化物形式存在于砖体骨架结构体系中,能对重金属元素起到很好的封存固结作用。
(5)本发明所制轻质保温隔热砖,由于所用废弃物颗粒小、塑性强,因此在制备保温隔热砖坯过程中仅需常用混料和成型加压装置,不需要对硬质固体废弃物球磨过程,保温砖坯体制备过程工艺简单,能耗较低。
附图说明
图1为本发明实施例2制备得到的轻质保温隔热砖的SEM图;
图2为本发明实施例2制备得到的轻质保温隔热砖的XRD图;
图3为本发明对比例1制备得到的轻质保温隔热砖的SEM图;
图4为本发明对比例1制备得到的轻质保温隔热砖的XRD图;
图5为本发明对比例2制备得到的轻质保温隔热砖的SEM图;
图6为本发明对比例2制备得到的轻质保温隔热砖的XRD图;
图7为本发明对比例3制备得到的轻质保温隔热砖的SEM图;
图8为本发明对比例3制备得到的轻质保温隔热砖的XRD图。
具体实施方式
为使本发明更加容易理解,下面结合具体实施例,进一步阐述本发明。应理解,这些实施例仅用于说明本发明而不用于限制本发明的范围,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。除非另有定义,下文所用专业术语和本领域专业技术人员所理解的含义一致;除非特殊说明,本文所涉及的原料、试剂均可从市场购买,或通过公知的方法制得。
实施例1
一种轻质保温隔热砖的制备方法:
先称取5份电瓷厂废泥,10份分子筛废料,85份废弃稻壳灰为所述轻质保温隔热砖原料,外加8份黄糊精,15份水放入搅拌机中,于室温下搅拌2h,制得轻质保温隔热砖坯料。
将坯料转入模具中于8Mpa压制成形,将脱模后砖坯在室温条件下静置24h。
将砖坯移入烧结炉中,以3℃/min升温速率于120℃保温4h,以4℃/min升温速率于350℃保温2h,以4℃/min升温速率于650℃保温2h,以5℃/min升温速率于950℃保温2h,以3℃/min升温速率于1150℃保温2h,以5℃/min升温速率于1350℃保温2h,随炉冷却至室温,即得轻质保温隔热砖。
本实施例所制备的轻质隔热砖体积密度0.89g/cm3;气孔率为58.1%;常温抗压强度13.27MPa;350℃导热率为0.112W·m-1·k-1,重烧线变化率≤1%。
实施例2
一种轻质保温隔热砖的制备方法:
先称取6份电瓷厂废泥,15份分子筛废料,79份废弃稻壳灰为所述轻质保温隔热砖原料,外加8份黄糊精,14份水放入搅拌机中,于室温下搅拌2h,制得轻质保温隔热砖坯料。
将坯料转入模具中于7Mpa压制成形,将脱模后砖坯在室温条件下静置24h。
将砖坯移入烧结炉中,以3℃/min升温速率于120℃保温4h,以5℃/min升温速率于330℃保温2h,以3℃/min升温速率于620℃保温2.5h,以3℃/min升温速率于920℃保温3h,以4℃/min升温速率于1100℃保温2h,以3℃/min升温速率于1300℃保温2h,随炉冷却至室温,即得轻质保温隔热砖。
本实施例所制备的轻质隔热砖体积密度0.93g/cm3;气孔率为53.4%;常温抗压强度15.85MPa;350℃导热率为0.101W·m-1·k-1,重烧线变化率≤1%。
实施例3
一种轻质保温隔热砖的制备方法:
先称取7份电瓷厂废泥,18份分子筛废料,75份废弃稻壳灰为所述轻质保温隔热砖原料,外加7份黄糊精,13份水放入搅拌机中,于室温下搅拌2.5h,制得轻质保温隔热砖坯料。
将坯料转入模具中于6Mpa压制成形,将脱模后砖坯在室温条件下静置16h。
将砖坯移入烧结炉中,以3℃/min升温速率于110℃保温3h,以3℃/min升温速率于300℃保温3h,以4℃/min升温速率于630℃保温2h,以4℃/min升温速率于930℃保温2.5h,以4℃/min升温速率于1120℃保温2.5h,以4℃/min升温速率于1280℃保温3h,随炉冷却至室温,即得轻质保温隔热砖。
本实施例所制备的轻质隔热砖体积密度0.98g/cm3;气孔率为49.7%;常温抗压强度19.54MPa;350℃导热率为0.113W·m-1·k-1,重烧线变化率≤1%。
实施例4
一种轻质保温隔热砖的制备方法:
先称取8份电瓷厂废泥,20份分子筛废料,72份废弃稻壳灰为所述轻质保温隔热砖原料,外加6份黄糊精,12份水放入搅拌机中,于室温下搅拌3h,制得轻质保温隔热砖坯料。
将坯料转入模具中于7Mpa压制成形,将脱模后砖坯在室温条件下静置16h。
将砖坯移入烧结炉中,以4℃/min升温速率于110℃保温3.5h,以3℃/min升温速率于320℃保温2.5h,以5℃/min升温速率于640℃保温2.5h,以4℃/min升温速率于940℃保温2h,以5℃/min升温速率于1140℃保温2h,以4℃/min升温速率于1260℃保温3h,随炉冷却至室温,即得轻质保温隔热砖。
本实施例所制备的轻质隔热砖体积密度1.09g/cm3;气孔率为45.6%;常温抗压强度20.31MPa;350℃导热率为0.121W·m-1·k-1,重烧线变化率≤1%。
实施例5
一种轻质保温隔热砖的制备方法:
先称取9份电瓷厂废泥,22份分子筛废料,69份废弃稻壳灰为所述轻质保温隔热砖原料,外加6份黄糊精,11份水放入搅拌机中,于室温下搅拌4h,制得轻质保温隔热砖坯料。
将坯料转入模具中于6Mpa压制成形,将脱模后砖坯在室温条件下静置12h。
将砖坯移入烧结炉中,以3℃/min升温速率于100℃保温4h,以5℃/min升温速率于310℃保温3h,以3℃/min升温速率于600℃保温3h,以5℃/min升温速率于900℃保温3h,以3℃/min升温速率于1150℃保温2h,以3℃/min升温速率于1270℃保温3h,随炉冷却至室温,即得轻质保温隔热砖。
本实施例所制备的轻质隔热砖体积密度1.19g/cm3;气孔率为41.3%;常温抗压强度22.74MPa;350℃导热率为0.127W·m-1·k-1,重烧线变化率≤1%。
实施例6
一种轻质保温隔热砖的制备方法:
先称取10份电瓷厂废泥,25份分子筛废料,65份废弃稻壳灰为所述轻质保温隔热砖原料,外加5份黄糊精,10份水放入搅拌机中,于室温下搅拌4h,制得轻质保温隔热砖坯料。
将坯料转入模具中于5Mpa压制成形,将脱模后砖坯在室温条件下静止12h。
将砖坯移入烧结炉中,以5℃/min升温速率于110℃保温4h,以5℃/min升温速率于350℃保温2h,以3℃/min升温速率于610℃保温3h,以4℃/min升温速率于910℃保温2h,以4℃/min升温速率于1130℃保温3h,以3℃/min升温速率于1250℃保温3h,随炉冷却至室温,即得轻质保温隔热砖。
本实施例所制备的轻质隔热砖体积密度1.25g/cm3;气孔率为39.6%;常温抗压强度25.63MPa;350℃导热率为0.124W·m-1·k-1,重烧线变化率≤1%。
对比例1
一种轻质保温隔热砖的制备方法:
先称取6份电瓷厂废泥,15份分子筛废料,79份核桃壳粉(300目)为所述轻质保温隔热砖原料,外加8份黄糊精,14份水放入搅拌机中,于室温下搅拌2h,制得轻质保温隔热砖坯料。
将坯料转入模具中于7Mpa压制成形,将脱模后砖坯在室温条件下静置24h。
将砖坯移入烧结炉中,以3℃/min升温速率于120℃保温4h,以5℃/min升温速率于330℃保温2h,以3℃/min升温速率于620℃保温2.5h,以3℃/min升温速率于920℃保温3h,以4℃/min升温速率于1100℃保温2h,以3℃/min升温速率于1300℃保温2h,随炉冷却至室温,即得轻质保温隔热砖。
本对比例所制备的轻质隔热砖体积密度0.79g/cm3;气孔率为63.7%;常温抗压强度7.56MPa;350℃导热率为0.132W·m-1·k-1,重烧线变化率≤5%。
对比例2
一种轻质保温隔热砖的制备方法:
先称取6份电瓷厂废泥,15份瓷粉,79份废弃稻壳灰为所述轻质保温隔热砖原料,外加8份黄糊精,14份水放入搅拌机中,于室温下搅拌2h,制得轻质保温隔热砖坯料。
将坯料转入模具中于7Mpa压制成形,将脱模后砖坯在室温条件下静置24h。
将砖坯移入烧结炉中,以3℃/min升温速率于120℃保温4h,以5℃/min升温速率于330℃保温2h,以3℃/min升温速率于620℃保温2.5h,以3℃/min升温速率于920℃保温3h,以4℃/min升温速率于1100℃保温2h,以3℃/min升温速率于1300℃保温2h,随炉冷却至室温,即得轻质保温隔热砖。
本对比例所制备的轻质隔热砖体积密度1.02g/cm3;气孔率为46.5%;常温抗压强度18.23MPa;350℃导热率为0.184W·m-1·k-1,重烧线变化率≤1%。
对比例3
一种轻质保温隔热砖的制备方法:
先称取6份铝矾土,15份分子筛废料,79份废弃稻壳灰为所述轻质保温隔热砖原料,外加8份黄糊精,14份水放入搅拌机中,于室温下搅拌2h,制得轻质保温隔热砖坯料。
将坯料转入模具中于7Mpa压制成形,将脱模后砖坯在室温条件下静置24h。
将砖坯移入烧结炉中,以3℃/min升温速率于120℃保温4h,以5℃/min升温速率于330℃保温2h,以3℃/min升温速率于620℃保温2.5h,以3℃/min升温速率于920℃保温3h,以4℃/min升温速率于1100℃保温2h,以3℃/min升温速率于1300℃保温2h,随炉冷却至室温,即得轻质保温隔热砖。
本实施例所制备的轻质隔热砖体积密度1.13g/cm3;气孔率为43.2%;常温抗压强度16.91MPa;350℃导热率为0.168W·m-1·k-1,重烧线变化率≤1%。
性能检测和结果分析:
由实施例2与对比例1可知,选用工业砖制备常用造孔剂核桃壳粉(300目)与本发明实例中稻壳灰相比,且由图2和图4的XRD图可以看出,对比例1虽说与实施例2烧成后砖体材料晶体结构相同,但对比例1的玻璃化程度较实施例2高,即对比例1砖体材料的结晶度没有实施例2强。由图1和图3的SEM图可以看出,对比例1中砖体微观结构气孔较大,球形分子筛形貌特征较明显,这主要是因为造孔剂核桃壳粉固相硅含量没有稻壳灰高,砖体烧造过程中核桃壳粉以挥发份物质脱离,宏观上造成砖体结构膨胀,微观上则使砖体组成物质如分子筛和电瓷厂废泥等物质结合产生间距,造成烧结过程中晶体结晶度较弱,且玻璃化程度较高等影响因素。因此对隔热砖整体物理性能产生影响,如气孔率,抗折强度,导热系数,重烧线变化率。
由实施例2与对比例2可知,选用工业砖制备常用瓷粉与本发明实例中球形分子筛相比,且由图2和图6的XRD图可以看出,对比例2与实施例2相比,烧成后砖体材料晶体物质除莫来石和氧化硅物质外,还存在氧化铝。由图1和图5的SEM图可以看出,对比例2中砖体微观结构气孔也较大,由于所选瓷粉为废弃瓷粉碎后物质,因此瓷粉在砖体结构中以块体形式存在,相比于分子筛的介孔结构,瓷粉的块体结构以及氧化铝晶体的形成不利于降低隔热砖的导热系数。因此选用瓷粉与本发明实例2中球形分子筛相比,对隔热砖整体物理性能产生影响,如气孔率,抗折强度,导热系数。
由实施例2与对比例3可知,选用工业砖制备常用铝矾土与本发明实例中电瓷厂废泥相比,且由图2和图8的XRD图可以看出,对比例3与实施例2相比,烧成后砖体材料晶体物质除莫来石和氧化硅物质外,还存在氧化铝。从图1和图7的SEM图可以看出,对比例3中砖体微观结构表面烧结较致密,由于所选铝矾土为电瓷厂用于制备电瓷坯体的主体成分,其组成为水铝石与高岭土的伴生物,相比于电瓷厂废泥,铝矾土的烧结致密度以及高温下氧化铝晶体的形成同样不利于降低隔热砖的导热系数。因此选用铝矾土与本发明实例2中电瓷厂废泥相比,对隔热砖整体物理性能产生影响,如气孔率,抗折强度,导热系数。
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本领域技术的技术人员在本发明公开的技术范围内,可轻易想到的变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以所述权利要求的保护范围为准。
Claims (5)
1.一种轻质保温隔热砖的制备方法,其特征在于,包括以下步骤
步骤1:按照一定的配比称取电瓷厂废泥、分子筛废料、废弃稻壳灰、黄糊精和水于搅拌机中,室温搅拌一定时间,获得轻质保温隔热砖坯料;其中,按照重量份计,所述电瓷厂废泥为5-10份,所述分子筛废料为10-25份,所述废弃稻壳灰为69-85份,所述黄糊精为5-8份,所述水为10-15份;所述电瓷厂废泥为电瓷厂污水沉降池中电瓷坯体和釉料混合泥浆干燥后的废弃泥料,主要化学成分为:Al2O3含量45~50wt%;SiO2含量30~35%wt%;K2O含量3~6wt%;Na2O含量2~5wt%;Fe2O3含量1~3wt%;MgO含量1~2wt%;CaO含量1~2wt%; 烧失量(LOI) 5-8%;所述废弃稻壳灰来自于稻壳经生物质气化炉燃烧后的灰质物质,主要化学成分为:SiO2含量60-80wt%;C含量19.5-39.9wt%;其余微量组分为0.1-0.5wt%,包括Fe2O3、Na2O、K2O;所述分子筛废料来自于石化炼油厂,主要化学成分为:Al2O3含量48~52wt%;SiO2含量40~45%wt%;La2O3含量2.5-4.0wt%;CeO2含量0.1-1.0wt%;Na2O含量0.1~0.35wt%;Fe2O3含量0.3~0.6wt%;V含量0.2~0.3wt%;Ni含量0.2~0.4wt%;SO4 2-含量0.5-1.5wt%;
步骤2:将轻质保温隔热砖坯料转入模具中压制成形,并脱模,获得轻质保温隔热砖坯体;
步骤3:将轻质保温隔热砖坯体在室温下静置12-24h,再移入烧结炉中,升温至1250-1350℃保温2-3h,随炉冷却至室温,即得轻质保温隔热砖。
2.根据权利要求1所述的轻质保温隔热砖的制备方法,其特征在于,在步骤1中,所述室温搅拌的时间为2-4h。
3.根据权利要求1所述的轻质保温隔热砖的制备方法,其特征在于,在步骤2中,所述压制成型的压力为5-8MPa。
4.根据权利要求1所述的轻质保温隔热砖的制备方法,其特征在于,所述升温具体为:以3-5℃/min升温速率于100-120℃保温3-4h;以3-5℃/min升温速率于300-350℃保温2-3h;以3-5℃/min升温速率于600-650℃保温2-3h;以3-5℃/min升温速率于900-950℃保温2-3h;以3-5℃/min升温速率于1100-1150℃保温2-3h;以3-5℃/min升温速率于1250-1350℃保温2-3h。
5.一种如权利要求1-4任一所述制备方法制备得到的轻质保温隔热砖,其特征在于,所述轻质保温隔热砖含有线状莫来石晶体,其长度为5-20μm;所述轻质保温隔热砖的体积密度为0.89-1.25 g/cm3,显气孔率为39.6-58.1%,常温抗折强度为13.27-25.63MPa,350℃测得导热率为0.101-0.127·m-1·k-1,重烧线变化率≤1%。
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