CN116324001A - 低温焊料、低温焊料的制造方法及低温焊料包覆导线 - Google Patents

低温焊料、低温焊料的制造方法及低温焊料包覆导线 Download PDF

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Publication number
CN116324001A
CN116324001A CN202180066720.6A CN202180066720A CN116324001A CN 116324001 A CN116324001 A CN 116324001A CN 202180066720 A CN202180066720 A CN 202180066720A CN 116324001 A CN116324001 A CN 116324001A
Authority
CN
China
Prior art keywords
low
temperature solder
temperature
alloy
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180066720.6A
Other languages
English (en)
Chinese (zh)
Inventor
岡田守弘
新井卓
新井杰也
新井寛昭
菅原美爱子
小林贤一
小宫秀利
松井正五
锦织润
森尚久
徳田辽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Okada Shouhong
Artbeam Co Ltd
Original Assignee
Gang Tianshouhong
Artbeam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gang Tianshouhong, Artbeam Co Ltd filed Critical Gang Tianshouhong
Publication of CN116324001A publication Critical patent/CN116324001A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
CN202180066720.6A 2020-10-01 2021-09-15 低温焊料、低温焊料的制造方法及低温焊料包覆导线 Pending CN116324001A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020-166977 2020-10-01
JP2020166977 2020-10-01
JP2020219193 2020-12-28
JP2020-219193 2020-12-28
PCT/JP2021/033865 WO2022070910A1 (ja) 2020-10-01 2021-09-15 低温半田、低温半田の製造方法、および低温半田被覆リード線

Publications (1)

Publication Number Publication Date
CN116324001A true CN116324001A (zh) 2023-06-23

Family

ID=80951440

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180066720.6A Pending CN116324001A (zh) 2020-10-01 2021-09-15 低温焊料、低温焊料的制造方法及低温焊料包覆导线

Country Status (5)

Country Link
JP (2) JP7576805B2 (https=)
KR (1) KR102877569B1 (https=)
CN (1) CN116324001A (https=)
TW (2) TW202344326A (https=)
WO (1) WO2022070910A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116324001A (zh) * 2020-10-01 2023-06-23 亚特比目有限会社 低温焊料、低温焊料的制造方法及低温焊料包覆导线
US11832386B2 (en) * 2021-12-16 2023-11-28 Dell Products L.P. Solder composition for use in solder joints of printed circuit boards

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09155587A (ja) * 1995-11-30 1997-06-17 Mitsui Mining & Smelting Co Ltd 錫−亜鉛系無鉛半田合金
JP2016026884A (ja) * 2014-07-02 2016-02-18 住友金属鉱山株式会社 中低温用のＢｉ−Ｓｎ−Ａｌ系はんだ合金及びはんだペースト
CN106216872A (zh) * 2016-08-11 2016-12-14 北京康普锡威科技有限公司 一种SnBiSb系低温无铅焊料及其制备方法
CN108971793A (zh) * 2018-08-24 2018-12-11 云南科威液态金属谷研发有限公司 一种低温无铅焊料
CN112352320A (zh) * 2018-06-26 2021-02-09 亚特比目有限会社 太阳能电池及太阳能电池的制造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4135268B2 (ja) 1998-09-04 2008-08-20 株式会社豊田中央研究所 無鉛はんだ合金
JP2005296983A (ja) 2004-04-09 2005-10-27 Hitachi Metals Ltd はんだ合金およびはんだボール
JP2007292901A (ja) 2006-04-24 2007-11-08 Optrex Corp 表示モジュール
US9279176B2 (en) 2008-11-27 2016-03-08 Hitachi Metals, Ltd. Lead wire for solar cell, manufacturing method and storage method thereof, and solar cell
JP5169871B2 (ja) * 2009-01-26 2013-03-27 富士通株式会社 はんだ、はんだ付け方法及び半導体装置
JP2013248664A (ja) * 2012-06-04 2013-12-12 Nippon Genma:Kk 鉛フリーはんだ合金およびはんだペースト
US20150037087A1 (en) * 2013-08-05 2015-02-05 Senju Metal Industry Co., Ltd. Lead-Free Solder Alloy
TW202206614A (zh) 2019-07-12 2022-02-16 日商亞特比目有限公司 ＳｎＺｎ焊料及其製造方法
CN116324001A (zh) 2020-10-01 2023-06-23 亚特比目有限会社 低温焊料、低温焊料的制造方法及低温焊料包覆导线

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09155587A (ja) * 1995-11-30 1997-06-17 Mitsui Mining & Smelting Co Ltd 錫−亜鉛系無鉛半田合金
JP2016026884A (ja) * 2014-07-02 2016-02-18 住友金属鉱山株式会社 中低温用のＢｉ−Ｓｎ−Ａｌ系はんだ合金及びはんだペースト
CN106216872A (zh) * 2016-08-11 2016-12-14 北京康普锡威科技有限公司 一种SnBiSb系低温无铅焊料及其制备方法
CN112352320A (zh) * 2018-06-26 2021-02-09 亚特比目有限会社 太阳能电池及太阳能电池的制造方法
CN108971793A (zh) * 2018-08-24 2018-12-11 云南科威液态金属谷研发有限公司 一种低温无铅焊料

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Publication number Publication date
JP7576805B2 (ja) 2024-11-01
KR102877569B1 (ko) 2025-10-27
KR20230075504A (ko) 2023-05-31
JP2024113075A (ja) 2024-08-21
JPWO2022070910A1 (https=) 2022-04-07
WO2022070910A1 (ja) 2022-04-07
TW202219286A (zh) 2022-05-16
TW202344326A (zh) 2023-11-16
JP7770637B2 (ja) 2025-11-17

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PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
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TA01 Transfer of patent application right

Effective date of registration: 20230630

Address after: 6-6, Wang Yiding, Nakano, Hachioji, Tokyo, Japan

Applicant after: ARTBEAM CO.,LTD.

Applicant after: Okada Shouhong

Address before: Tokyo, Japan

Applicant before: ARTBEAM Co.,Ltd.

Applicant before: Okada Shouhong

TA01 Transfer of patent application right