CN116252435A - Automatic low-pressure injection molding production process and production line for industrial electronic detonator - Google Patents
Automatic low-pressure injection molding production process and production line for industrial electronic detonator Download PDFInfo
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- CN116252435A CN116252435A CN202310537925.9A CN202310537925A CN116252435A CN 116252435 A CN116252435 A CN 116252435A CN 202310537925 A CN202310537925 A CN 202310537925A CN 116252435 A CN116252435 A CN 116252435A
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- 238000001746 injection moulding Methods 0.000 title claims abstract description 122
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims abstract description 49
- 238000005507 spraying Methods 0.000 claims abstract description 34
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 26
- 230000008569 process Effects 0.000 claims abstract description 19
- 238000004806 packaging method and process Methods 0.000 claims abstract description 11
- 238000012545 processing Methods 0.000 claims abstract description 7
- 238000002347 injection Methods 0.000 claims description 35
- 239000007924 injection Substances 0.000 claims description 35
- 239000003292 glue Substances 0.000 claims description 22
- 239000004033 plastic Substances 0.000 claims description 17
- 229920003023 plastic Polymers 0.000 claims description 17
- 238000005516 engineering process Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000000084 colloidal system Substances 0.000 claims description 9
- 241000252254 Catostomidae Species 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 239000011265 semifinished product Substances 0.000 claims description 4
- 230000007306 turnover Effects 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims description 3
- 238000007781 pre-processing Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 2
- 238000012858 packaging process Methods 0.000 abstract description 5
- 239000005022 packaging material Substances 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 238000007599 discharging Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 238000003032 molecular docking Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/58—Applying the releasing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14008—Inserting articles into the mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1769—Handling of moulded articles or runners, e.g. sorting, stacking, grinding of runners
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C45/42—Removing or ejecting moulded articles using means movable from outside the mould between mould parts, e.g. robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
- B29C45/67—Mould opening, closing or clamping devices hydraulic
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Robotics (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
An automatic low-pressure injection molding production process and production line of industrial electronic detonators relate to the technical field of industrial electronic detonator packaging, and the process is a packaging process method for injecting packaging materials into a mould at the temperature of not more than 200 ℃ and rapidly curing and forming (5-50 seconds) at the very low injection molding pressure (1.5-40 bar). Meanwhile, the automatic low-pressure injection molding equipment is arranged, so that the automatic operation from the SMT connection table to injection molding packaging processing and then back to the SMT connection table can be realized, and the automatic low-pressure injection molding equipment is matched with a release agent spraying mechanism to ensure that the release agent is sprayed on an upper die and a lower die before each injection molding packaging process, so that the PCB target plate is prevented from falling off from the die without adhesion, and the damage to the PCB target plate caused by the grabbing process of an automatic mechanical arm is prevented.
Description
Technical Field
The invention relates to the technical field of industrial electronic detonator packaging, in particular to an automatic low-pressure injection molding production process and production line of an industrial electronic detonator.
Background
Under the level of moulding plastics down, the precision and the degree of automation of most injection molding device are limited, and self cylinder volume is great, so the injection molding device can't directly carry out the operation of moulding plastics to the little industry electronic detonator module of space of moulding plastics, adopts the shunt to connect a mouth of moulding plastics at present to operate, after the operation of moulding plastics is accomplished, all has a lot of residual packaging material at every turn of mouth of a river after moulding plastics, has mouth of a river material problem, has improved the processing cost of injection molding device intangibly.
Referring to an injection molding machine with a Chinese patent application number of CN201310743083.9, the servo driving motor drives an injection molding mechanism of the sol machine to rotate, the mechanism is rubbed with the millstone under the action of driving force, and the millstone screw grooves and the millstone grooves are mutually worn in, so that plastic particles are rapidly plasticized, and after molten plastic enters an injection mold, the injection molding is performed; after the precise and fine product is molded, the mold closing servo motor pulls out the injection mold through the mold opening and closing mechanism, the precise and fine product is ejected out of the mold under the drive of the ejection servo motor, a good product is molded, a conventional injection molding means is adopted in the contrast injection molding process, a tailing treatment process and equipment are not adopted, and a large amount of tailings are left on the surface of the mold after the ejection process and are difficult to treat.
At present, a plurality of tedious procedures for removing residual tailings are adopted, and due to the irregularity of the tailings after injection molding each time, automatic equipment cannot be uniformly adopted for removing, manual treatment is adopted, and manual material taking and discharging are not suggested for controlling the formation of the tailings, so that the damage rate of semi-finished products in the process is too high and dangerous.
Therefore, in order to solve the defects in the prior art, it is necessary to provide an automatic low-pressure injection molding production process and production line for industrial electronic detonators.
Disclosure of Invention
The invention aims to avoid the defects of the prior art and provide an automatic low-pressure injection molding production process and production line of an industrial electronic detonator, wherein the process is a packaging process method for injecting packaging materials into a mould at the temperature of not more than 200 ℃ and rapidly curing and forming (5-50 seconds) at very low injection pressure (1.5-40 bar).
Meanwhile, the automatic low-pressure injection molding equipment is arranged, so that the automatic operation from the SMT connection table to injection molding packaging processing and then back to the SMT connection table can be realized, and the automatic low-pressure injection molding equipment is matched with a release agent spraying mechanism to ensure that the release agent is sprayed on an upper die and a lower die before each injection molding packaging process, so that the sheet-shaped PCB target plate is prevented from falling off from the die without adhesion, and the damage to the PCB target plate caused by the grabbing process of an automatic mechanical arm is prevented.
The above object of the present invention is achieved by the following means.
The automatic low-pressure injection molding production process for the industrial electronic detonator is characterized by setting up an automatic low-pressure injection molding production line for the industrial electronic detonator, realizing full-automatic low-pressure injection molding of semi-finished products of the industrial electronic detonator without tails, and comprises the following specific processes:
s1, initializing equipment, namely electrifying an SMT connection table, a lifting mechanism, automatic low-pressure injection equipment and a six-axis mechanical arm, and ventilating the automatic low-pressure injection equipment;
s2, preprocessing, setting equipment operation parameters, preheating automatic low-pressure injection molding equipment and starting an SMT (surface mounted technology) connection platform;
s3, spraying a release agent, starting a release agent spraying mechanism, and uniformly spraying an upper die and a lower die of the automatic low-pressure injection molding equipment according to preset parameters;
s4, feeding, grabbing a PCB target plate positioned at the lifting mechanism by a six-axis mechanical arm, and placing the PCB target plate into an injection mold;
s5, die assembly and injection molding are carried out, automatic low-pressure injection molding equipment works, a die assembly cylinder is pressed down, a die is assembled, a needle valve is opened, an injection molding link is entered, a revolution motor drives a glue pump, glue liquid is pumped out of a plastic cylinder, and the glue liquid is pumped into the die through a conveying pipe and a glue gun, so that injection molding is completed;
s6, blanking, grabbing the injection molded PCB target plate by the six-axis mechanical arm to an SMT (surface mount technology) connection table, and conveying to the next processing procedure.
Specifically, the feeding process flow in step S4 is as follows:
s41, placing the PCB target plate on an SMT (surface mount technology) connection table for conveying;
s42, judging whether a PCB target plate is placed on a supporting plate of the SMT connection table, if yes, executing waiting by the six-axis mechanical arm, and if no, executing a step S43;
s43, the lifting mechanism lifts the PCB target plate on the supporting plate to position;
s44, confirming whether a die of the automatic low-pressure injection molding equipment is in a die-opening state, and if the die is in a non-die-opening state, executing waiting by the six-axis mechanical arm; if the mold is in the mold opening state, step S45 is performed;
s45, sucking the PCB target plate from the supporting plate by using a sucker at one side of the six-axis mechanical arm, shifting to the position of the die, detecting whether the finished PCB target plate exists in the die, and if so, entering step S46; if not, go to step S47;
s46, the six-axis mechanical arm adsorbs a finished PCB target plate in the die by adopting an unadsorbed end at the other side, and then the PCB target plate is placed in the die and then the step S48 is carried out;
s47, placing the adsorbed PCB target plate in a die by using a six-axis mechanical arm, and performing step S48;
s46, performing injection molding packaging.
Preferably, the mold closing injection molding in step S46 is specifically performed as follows:
a1, pressing down a die closing cylinder to close the die;
a2, opening a needle valve channel for injection molding, wherein the injection molding time, the injection molding pressure and the injection molding revolution are respectively controlled by a PLC main board;
a3, after reaching the preset glue injection time, closing a needle valve channel, and opening a die after the preset cooling time;
and A4, ejecting the finished PCB target plate by an ejection mechanism to finish demoulding.
Specifically, in the step S2, the automatic low-pressure injection molding equipment is preheated by placing the granular colloid into a plastic cylinder, heating the granular colloid to 200-220 ℃ by a heating module, melting the granular colloid to a fluid state, and simultaneously heating a conveying pipe and a glue gun to 200 ℃.
Furthermore, the release agent spraying mechanism in the step S3 is controlled by the PLC main board to perform multiple, fixed-point and quantitative spraying.
An automatic low pressure injection molding production line of industrial electronic detonator, which is characterized in that: the automatic injection molding machine comprises SMT (surface mount technology) connection tables for bearing and conveying PCB target plates, wherein each SMT connection table is provided with a lifting mechanism and is matched with 1-2 automatic low-pressure injection molding equipment;
the automatic low-pressure injection molding equipment grabs the lifting mechanism or the PCB target plate on the automatic low-pressure injection molding equipment through the six-axis mechanical arm, and accurately controls the internal mechanism of the automatic low-pressure injection molding equipment through the PLC main board, and the automatic low-pressure injection molding equipment is provided with the full-automatic release agent spraying mechanism.
Preferably, the release agent spraying mechanism stretches into a gap between an upper die and a lower die of the automatic low-pressure injection molding equipment, and the upper die and the lower die are uniformly sprayed according to preset spraying parameters;
the release agent spraying mechanism comprises a sliding table module and a turnover mechanism, wherein the sliding table module consists of an X-axis sliding table and a Y-axis sliding table, the bottom of the Y-axis sliding table is fixed on a fixed sliding block of the X-axis sliding table, a rotary cylinder is installed at the working end of the Y-axis sliding table, and an opening and closing cylinder with a release agent bottle rack is installed on the rotary cylinder.
Further, the movable end of the six-axis mechanical arm is provided with at least 2 groups of suckers capable of adsorbing the PCB target plate, a pressure sensor for monitoring the grabbing state is further arranged, the six-axis mechanical arm is prevented from being empty to grab and missing to grab, the grabbing state of the six-axis mechanical arm is sensed through the pressure sensor, and the suckers are controlled through the PLC main board.
According to the invention, the injection molding packaging of the industrial electronic detonator is processed in a one-to-many manner by adopting an automatic production line, the six-axis mechanical arm automatically grabs, the PLC main board automatically and accurately controls injection molding parameters, the efficiency of injection molding packaging is effectively improved, meanwhile, the design of a full-automatic release agent spraying mechanism is combined, the generation of tailings is reduced, and the problem of water gap materials is solved.
Drawings
The invention is further illustrated by the accompanying drawings, which are not to be construed as limiting the invention in any way.
Fig. 1 is a schematic perspective view of an industrial electronic detonator automated low-pressure injection molding production line.
Fig. 2 is a schematic perspective view of the automated low pressure injection molding apparatus of fig. 1.
Fig. 3 is a schematic perspective view of the release agent spraying mechanism of fig. 2.
Fig. 4 is a schematic perspective view of a six-axis mechanical arm.
Fig. 5 is a schematic perspective view of the suction cup.
Fig. 6 is a schematic view of the injection molding module of fig. 1.
Fig. 7 is a process flow diagram of an automated low pressure injection molding process for industrial electronic detonators.
From fig. 1 to 7, it includes:
1. an automated low pressure injection molding apparatus;
2. an injection molding module;
3. an upper die;
4. a lower die;
5. a needle valve;
6. a release agent spraying mechanism;
7. a slipway module;
8. an X-axis sliding table;
9. a Y-axis sliding table;
10. a fixed slide block;
11. a turnover mechanism;
12. a rotary cylinder;
13. an opening and closing cylinder;
14. a six-axis mechanical arm;
15. a suction cup;
16. a PCB target board;
17. SMT (surface mount technology) connection table
18. A power control box;
19. a pneumatic control box;
20. and a main body frame.
Detailed Description
The invention will be further described with reference to the following examples.
Example 1
As shown in fig. 1-7, an automatic low-pressure injection molding production process of an industrial electronic detonator is constructed, an automatic low-pressure injection molding production line of the industrial electronic detonator is constructed, full-automatic low-pressure injection molding of semi-finished products of the industrial electronic detonator without tails is realized, and the specific process is as follows:
s1, initializing equipment, electrifying an SMT connection table 17, a lifting mechanism, automatic low-pressure injection equipment 1 and a six-axis mechanical arm 14, ventilating the automatic low-pressure injection equipment 1, and detecting whether each electronic module part operates normally.
S2, preprocessing, setting equipment operation parameters, preheating the automatic low-pressure injection molding equipment 1 and starting the SMT connection table 17.
The operation parameters comprise a rubber cylinder preheating temperature, a rubber tube preheating temperature, a rubber gun preheating temperature, a rubber injection motor rotating speed, a time delay time length, a pressure maintaining value, a time delay time length and a cooling time length.
The PV value of the preheating temperature of the rubber cylinder is 165-185, the PV value of the preheating temperature of the rubber tube is 180-195, the PV value of the preheating temperature of the rubber gun is 170-190, the rotating speed of the rubber injection motor is 86-92 RPM/s, the pressure maintaining value is 300 bar/s, and the cooling time is 6-8s.
The automatic low-pressure injection molding equipment 1 is preheated by putting the granular colloid into a plastic cylinder, heating the granular colloid to 200-220 ℃ by a heating module, melting the granular colloid to a fluid state, and simultaneously heating a conveying pipe and a glue gun to 200 ℃.
S3, starting a release agent spraying mechanism 6, and uniformly spraying release agents on the upper die 3 and the lower die 4 of the automatic low-pressure injection molding equipment 1 according to preset parameters.
The release agent spraying mechanism 6 is controlled by the PLC main board, and can perform multiple, fixed-point and quantitative spraying according to preset instructions, so that the packaged PCB target plate 16 can be ensured to be smoothly released.
S4, on the SMT (surface mount technology) connection table 17 of the PCB runner, a material feeding signal is sent out by a material arrangement module, the six-axis mechanical arm 14 grabs the PCB target plate 16 positioned at the lifting mechanism, and the PCB target plate 16 is placed in the injection mold.
The feeding process flow is as follows in detail:
s41, placing the PCB target plate 16 on the SMT docking station 17 for conveying.
S42, judging whether the PCB target plate 16 is placed on the supporting plate of the SMT docking station 17, if yes, executing waiting by the six-axis mechanical arm 14, and if no, executing step S43.
S43, the lifting mechanism lifts the PCB target plate 16 on the supporting plate to position.
S44, confirming whether the mold of the automatic low-pressure injection molding equipment 1 is in a mold opening state, and if the mold is in a non-mold opening state, executing waiting by the six-axis mechanical arm 14; if the mold is opened, the process proceeds to step S45.
S45, sucking the PCB target plate 16 from the supporting plate by using the sucking disc 15 on one side of the six-axis mechanical arm 14, shifting to the mold position, detecting whether the finished PCB target plate 16 exists in the mold, and if so, entering step S46; if not, the process proceeds to step S47.
S46, the six-axis mechanical arm 14 adsorbs the finished PCB target plate 16 in the die by adopting the non-adsorbed end at the other side, and then the PCB target plate 16 is placed in the die, and then the step S48 is performed.
S47, the six-axis mechanical arm 14 places the adsorbed PCB target plate 16 in a die, and step S48 is performed.
S46, performing injection molding packaging.
The specific operation of the injection molding package is as follows:
a1, pressing down a die closing cylinder to close the die.
A2, opening a needle valve 5 channel, and performing injection molding, wherein the injection molding time, the injection molding pressure and the injection molding revolution are respectively controlled by the PLC main board.
The PLC mainboard obtains the settlement parameter through the touch central control screen on the automatic low pressure injection molding equipment, and in the operation process, the PLC mainboard passes through the signal of telecommunication with the parameter information who sets for to the controlled part, and the controlled part is worked according to the instruction that the PLC mainboard sent accurately.
The set parameters comprise injection, injection time, injection pressure, injection revolution and the like, and in actual production, the set injection and injection time is 12-15S, the injection pressure is 300 bar/S, the injection revolution is 86-92 RPM/S, and the parameters can be adjusted according to the running state of injection equipment.
A3, after the preset glue injection time is reached, the needle valve 5 channel is closed, the die is opened after the preset cooling time, the revolution motor drives the glue pump to pump out the glue solution from the plastic cylinder, and the glue solution is injected into the die through the conveying pipe and the glue gun.
And A4, ejecting the finished PCB target plate 16 by an ejection mechanism to finish demoulding.
S5, the automatic low-pressure injection molding equipment 1 works, a mold closing cylinder is pressed down, a mold is closed, a needle valve 5 is opened, an injection molding link is entered, a safety grating on the automatic low-pressure injection molding equipment 1 is not allowed to be blocked, a revolution motor drives a glue pump, glue liquid is pumped out of a plastic cylinder, and the glue liquid is injected into the mold through a conveying pipe and a glue gun, so that injection molding is completed.
Because of the cooperation of the self structure of the mould and the release agent spraying mechanism, no tailing is generated after injection molding.
Simultaneously, signals are sent to an automatic feeding (delay) module and an automatic discharging module, and the automatic discharging module controls the six-axis mechanical arm 14 to take out the injection molded product and place the injection molded product on the SMT connection table 17 (the placement position is required to be preset in the system).
S6, the six-axis mechanical arm 14 grabs the injection molded PCB target plate 16 to the SMT connection table 17, and conveys the injection molded PCB target plate to the next processing procedure, and the injection molded PCB target plate is automatically fed after being fed, and is a set of reciprocating motion.
As shown in fig. 1 to 7, the present invention provides an automatic low pressure injection molding process for industrial electronic detonators, which is a packaging process method of injecting packaging material into a mold at a low injection pressure (1.5 to 40 bar) at a temperature of not more than 200 ℃ and rapidly curing and forming (5 to 50 seconds).
Meanwhile, the automatic low-pressure injection molding equipment 1 is arranged, so that the automatic operation from the SMT connection table 17 to injection molding packaging processing and then to the SMT connection table 17 can be realized, the automatic low-pressure injection molding equipment 1 is matched with a release agent spraying process, the release agent spraying of the upper die 3 and the lower die 4 is ensured before each injection molding packaging, the situation that the piece of PCB target plate 16 is not adhered to and falls off from the die is ensured, and the damage to the PCB target plate 16 is caused in the process of grabbing by the automatic mechanical arm is arranged.
Example 2
As shown in fig. 1-6, an industrial electronic detonator automatic low-pressure injection molding production line comprises SMT (surface mount technology) connection tables 17 for bearing and conveying a PCB target plate 16, wherein the SMT connection tables 17 are provided with lifting mechanisms, and each SMT connection table 17 is adapted to 1-2 automatic low-pressure injection molding equipment 1.
Existing equipment is often composed of several major structures: the device comprises a main body frame 20, an electric control box 18, a pneumatic control box 19, an injection molding module 2, a rubber cylinder module, a feeding module and a discharging module.
As shown in fig. 3-5, the following is a difference of the present application from the prior art:
the main body frame 20, main body frame 20 is built by the aluminium alloy, and supplementary panel beating is bent and is made, has hexagon socket head cap screw to link.
The power control box 18, the placement area of all power control system components of the device, the main placement components include: PLC mainboard, input relay, output relay, auxiliary relay, counter, data register etc..
The injection molding module 2 comprises an injection mold, a needle valve 5, a mold closing cylinder, a safety grating, a release agent sprayer, a product ejection module and the like.
The plastic rubber cylinder module, the plastic rubber cylinder, the heating module, the rubber pump, the revolution motor, the conveying pipe (with self-heating), the rubber gun heating module and the like.
Automatic feeding, an SMT (surface mounting technology) connection table 17, a six-axis mechanical arm 14 and a sucker 15.
Automatic blanking, six-axis mechanical arm 14 and sucker 15 (automatic positioning camera).
The automatic low-pressure injection molding equipment 1 grabs a lifting mechanism or a PCB target plate 16 on the automatic low-pressure injection molding equipment 1 through a six-axis mechanical arm 14, controls the internal mechanism of the automatic low-pressure injection molding equipment 1 through a PLC main board, and is provided with a full-automatic release agent spraying mechanism 6.
The release agent spraying mechanism 6 stretches into the gap between the upper die 3 and the lower die 4 of the automatic low-pressure injection molding equipment 1, and uniformly sprays the upper die 3 and the lower die 4 according to preset spraying parameters.
The release agent spraying mechanism 6 comprises a sliding table module 7 and a turnover mechanism 11, wherein the sliding table module 7 consists of an X-axis sliding table 8 and a Y-axis sliding table 9, the bottom of the Y-axis sliding table 9 is fixed on a fixed sliding block 10 of the X-axis sliding table 8, a rotary cylinder 12 is arranged at the working end of the Y-axis sliding table 9, and an opening and closing cylinder 13 with a release agent bottle rack is arranged on the rotary cylinder 12.
The movable end of the six-axis mechanical arm 14 is provided with at least 2 groups of suckers 15 capable of adsorbing the PCB target plate 16, a pressure sensor for monitoring the grabbing state is also arranged, the six-axis mechanical arm 14 is prevented from being grabbed empty and not grabbed, the grabbing state of the six-axis mechanical arm 14 is sensed through the pressure sensor, and the suckers 15 are controlled through the PLC main board.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention.
Claims (8)
1. The automatic low-pressure injection molding production process of the industrial electronic detonator is characterized by setting up an automatic low-pressure injection molding production line of the industrial electronic detonator, realizing full-automatic and tailstock-free low-pressure injection molding of the semi-finished product of the industrial electronic detonator, and comprises the following specific processes of:
s1, initializing equipment, namely electrifying an SMT connection table, a lifting mechanism, automatic low-pressure injection equipment and a six-axis mechanical arm, and ventilating the automatic low-pressure injection equipment;
s2, preprocessing, setting equipment operation parameters, preheating automatic low-pressure injection molding equipment and starting an SMT (surface mounted technology) connection platform;
s3, spraying a release agent, starting a release agent spraying mechanism, and uniformly spraying an upper die and a lower die of the automatic low-pressure injection molding equipment according to preset parameters;
s4, feeding, grabbing a PCB target plate positioned at the lifting mechanism by a six-axis mechanical arm, and placing the PCB target plate into an injection mold;
s5, die assembly and injection molding are carried out, automatic low-pressure injection molding equipment works, a die assembly cylinder is pressed down, a die is assembled, a needle valve is opened, an injection molding link is entered, a revolution motor drives a glue pump, glue liquid is pumped out of a plastic cylinder, and the glue liquid is pumped into the die through a conveying pipe and a glue gun, so that injection molding is completed;
s6, blanking, grabbing the injection molded PCB target plate by the six-axis mechanical arm to an SMT (surface mount technology) connection table, and conveying to the next processing procedure.
2. An automated low pressure injection molding process for industrial electronic detonators according to claim 1, wherein: the feeding process flow in the step S4 is as follows in detail:
s41, placing the PCB target plate on an SMT (surface mount technology) connection table for conveying;
s42, judging whether a PCB target plate is placed on a supporting plate of the SMT connection table, if yes, executing waiting by the six-axis mechanical arm, and if no, executing a step S43;
s43, the lifting mechanism lifts the PCB target plate on the supporting plate to position;
s44, confirming whether a die of the automatic low-pressure injection molding equipment is in a die-opening state, and if the die is in a non-die-opening state, executing waiting by the six-axis mechanical arm; if the mold is in the mold opening state, step S45 is performed;
s45, sucking the PCB target plate from the supporting plate by using a sucker at one side of the six-axis mechanical arm, shifting to the position of the die, detecting whether the finished PCB target plate exists in the die, and if so, entering step S46; if not, go to step S47;
s46, the six-axis mechanical arm adsorbs a finished PCB target plate in the die by adopting an unadsorbed end at the other side, and then the PCB target plate is placed in the die and then the step S48 is carried out;
s47, placing the adsorbed PCB target plate in a die by using a six-axis mechanical arm, and performing step S48;
s46, performing injection molding packaging.
3. An automated low pressure injection molding process for industrial electronic detonators according to claim 2, wherein: the mold closing injection molding in step S46 is specifically performed as follows:
a1, pressing down a die closing cylinder to close the die;
a2, opening a needle valve channel for injection molding, wherein the injection molding time, the injection molding pressure and the injection molding revolution are respectively controlled by a PLC main board;
a3, after reaching the preset glue injection time, closing a needle valve channel, and opening a die after the preset cooling time;
and A4, ejecting the finished PCB target plate by an ejection mechanism to finish demoulding.
4. An automated low pressure injection molding process for industrial electronic detonators according to claim 1, wherein: in the step S2, the automatic low-pressure injection molding equipment is preheated by putting the granular colloid into a plastic cylinder, heating the granular colloid to 200-220 ℃ by a heating module, melting the granular colloid to a fluid state, and simultaneously heating a conveying pipe and a glue gun to 200 ℃.
5. An automated low pressure injection molding process for industrial electronic detonators according to claim 1, wherein: the release agent spraying mechanism in the step S3 is controlled by the PLC main board to perform multiple, fixed-point and quantitative spraying.
6. An industrial electronic detonator automatic low-pressure injection molding production line based on the industrial electronic detonator automatic low-pressure injection molding production process as claimed in any one of claims 1 to 5, which is characterized in that: the automatic injection molding machine comprises SMT (surface mount technology) connection tables for bearing and conveying PCB target plates, wherein each SMT connection table is provided with a lifting mechanism and is matched with 1-2 automatic low-pressure injection molding equipment;
the automatic low-pressure injection molding equipment grabs the lifting mechanism or the PCB target plate on the automatic low-pressure injection molding equipment through the six-axis mechanical arm, controls the internal mechanism of the automatic low-pressure injection molding equipment through the PLC main board, and installs the full-automatic release agent spraying mechanism on the automatic low-pressure injection molding equipment.
7. An automated low pressure injection molding line for industrial electronic detonators according to claim 6, wherein: the release agent spraying mechanism stretches into the gap between the upper die and the lower die of the automatic low-pressure injection molding equipment, and uniformly sprays the upper die and the lower die according to preset spraying parameters;
the release agent spraying mechanism comprises a sliding table module and a turnover mechanism, wherein the sliding table module consists of an X-axis sliding table and a Y-axis sliding table, the bottom of the Y-axis sliding table is fixed on a fixed sliding block of the X-axis sliding table, a rotary cylinder is installed at the working end of the Y-axis sliding table, and an opening and closing cylinder with a release agent bottle rack is installed on the rotary cylinder.
8. An automated low pressure injection molding line for industrial electronic detonators according to claim 6, wherein: the movable end of the six-axis mechanical arm is provided with at least 2 groups of suckers capable of adsorbing the PCB target plate, a pressure sensor for monitoring the grabbing state is further arranged, the six-axis mechanical arm is prevented from being empty to grab and missing to grab, the grabbing state of the six-axis mechanical arm is sensed through the pressure sensor, and the suckers are controlled through the PLC main board.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310537925.9A CN116252435A (en) | 2023-05-15 | 2023-05-15 | Automatic low-pressure injection molding production process and production line for industrial electronic detonator |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310537925.9A CN116252435A (en) | 2023-05-15 | 2023-05-15 | Automatic low-pressure injection molding production process and production line for industrial electronic detonator |
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| CN203125838U (en) * | 2013-01-25 | 2013-08-14 | 昆山咏联电子塑胶有限公司 | Device for continuous and automatic insert embedding and finished product extraction in insert injection molding |
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| CN115071048A (en) * | 2022-07-25 | 2022-09-20 | 保融盛维(沈阳)科技有限公司 | Automatic injection molding method and injection molding device for digital electronic module |
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2023
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN203125838U (en) * | 2013-01-25 | 2013-08-14 | 昆山咏联电子塑胶有限公司 | Device for continuous and automatic insert embedding and finished product extraction in insert injection molding |
| CN105538597A (en) * | 2016-02-02 | 2016-05-04 | 苏州恒源盛模塑有限公司 | Automatic embedding injection molding equipment for iron parts and injection molding method |
| CN206536743U (en) * | 2017-03-09 | 2017-10-03 | 珠海市铭研塑胶有限公司 | A kind of automatic clamping and placing machine |
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