CN116249425A - 热电转换元件及用于热电转换元件的制造方法 - Google Patents

热电转换元件及用于热电转换元件的制造方法 Download PDF

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Publication number
CN116249425A
CN116249425A CN202211532141.9A CN202211532141A CN116249425A CN 116249425 A CN116249425 A CN 116249425A CN 202211532141 A CN202211532141 A CN 202211532141A CN 116249425 A CN116249425 A CN 116249425A
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China
Prior art keywords
thermoelectric conversion
layer
electrode
conversion units
insulating layer
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Pending
Application number
CN202211532141.9A
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English (en)
Chinese (zh)
Inventor
世古畅哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianma Japan Ltd
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Tianma Japan Ltd
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Application filed by Tianma Japan Ltd filed Critical Tianma Japan Ltd
Publication of CN116249425A publication Critical patent/CN116249425A/zh
Pending legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/82Interconnections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/81Structural details of the junction
    • H10N10/817Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
CN202211532141.9A 2021-12-08 2022-12-01 热电转换元件及用于热电转换元件的制造方法 Pending CN116249425A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-199328 2021-12-08
JP2021199328A JP7801122B2 (ja) 2021-12-08 2021-12-08 熱電変換素子及び熱電変換素子の製造方法

Publications (1)

Publication Number Publication Date
CN116249425A true CN116249425A (zh) 2023-06-09

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Application Number Title Priority Date Filing Date
CN202211532141.9A Pending CN116249425A (zh) 2021-12-08 2022-12-01 热电转换元件及用于热电转换元件的制造方法

Country Status (3)

Country Link
US (2) US11849640B2 (https=)
JP (1) JP7801122B2 (https=)
CN (1) CN116249425A (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3447915B2 (ja) * 1997-04-28 2003-09-16 シャープ株式会社 熱電素子及びそれを用いた熱電素子モジュール
TW468360B (en) * 1999-11-04 2001-12-11 Jeng-San Jou Thermopile infrared device, thermalpile infrared array device and the manufacturing method thereof
WO2011065185A1 (ja) 2009-11-27 2011-06-03 富士通株式会社 熱電変換モジュール及びその製造方法
US11276810B2 (en) 2015-05-14 2022-03-15 Nimbus Materials Inc. Method of producing a flexible thermoelectric device to harvest energy for wearable applications
JP6513476B2 (ja) 2015-05-21 2019-05-15 秋田県 熱電変換素子、発電デバイス
JP2018125498A (ja) * 2017-02-03 2018-08-09 Tdk株式会社 熱電変換装置

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Publication number Publication date
JP7801122B2 (ja) 2026-01-16
US20230180613A1 (en) 2023-06-08
US12082503B2 (en) 2024-09-03
US20240074314A1 (en) 2024-02-29
US11849640B2 (en) 2023-12-19
JP2023084926A (ja) 2023-06-20

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