CN116246997A - Jacking device for automatic material production and automatic material production equipment - Google Patents
Jacking device for automatic material production and automatic material production equipment Download PDFInfo
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- CN116246997A CN116246997A CN202310206938.8A CN202310206938A CN116246997A CN 116246997 A CN116246997 A CN 116246997A CN 202310206938 A CN202310206938 A CN 202310206938A CN 116246997 A CN116246997 A CN 116246997A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
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Abstract
Description
技术领域technical field
本申请涉及芯片自动化生产领域,特别是涉及物料自动化生产的顶升装置及物料自动化生产设备。This application relates to the field of automatic chip production, in particular to a jacking device for automatic production of materials and automatic production equipment for materials.
背景技术Background technique
一片晶圆可以加工出多个芯片(Chip),在分离之前,这些芯片设置在一张膜俗称蓝膜或胶膜的上面,在使用芯片之前,通常需将这些芯片逐一分离。A wafer can be processed into multiple chips (Chips). Before separation, these chips are placed on a film commonly known as blue film or adhesive film. Before using the chips, these chips usually need to be separated one by one.
公开号为CN101752204A的中国专利,公开了一种芯片与胶膜分离方法与芯片取出方法,其中使用了包含有刮板的顶针装置,首先将芯片定位于顶针装置上方的第一位置,沿第一方向以一适当距离水平移动上述之芯片,顶针装置的刮板大致上位于邻近上述之芯片的边缘部份;开启真空以吸附芯片连同胶膜向下;将顶针装置的刮板向上移动顶住芯片背面的胶膜;将芯片连同胶膜沿第二方向水平移动一个芯片长度的距离,其中第二方向相反于第一方向,即可将芯片与胶膜分离。The Chinese patent with the publication number CN101752204A discloses a method for separating a chip from an adhesive film and a method for taking out a chip, in which a thimble device including a scraper is used, and the chip is first positioned at the first position above the thimble device, along the first Move the above-mentioned chip horizontally with an appropriate distance in the direction. The scraper of the thimble device is generally located near the edge of the above-mentioned chip; turn on the vacuum to absorb the chip and the adhesive film downward; move the scraper of the thimble device upward to hold the chip The adhesive film on the back; the chip and the adhesive film can be separated from the adhesive film by moving the chip and the adhesive film horizontally along the second direction for a distance of one chip length, wherein the second direction is opposite to the first direction.
但是上述技术在芯片分离时需要采用刮板,会造成损坏芯片的风险,另外需要芯片连同胶膜一同移动,导致分离效率低。However, the above-mentioned technology needs to use a scraper when separating the chip, which will cause the risk of damaging the chip. In addition, the chip needs to move together with the adhesive film, resulting in low separation efficiency.
公开号为CN218447858U的中国专利,公开了一种便于蓝膜与芯片分离的装置,包括中空的蓝膜架、X、Y轴驱动机构和分离机构,分离机构包括底座、Z轴驱动机构、分离管、顶针、顶针固定座和缓冲组件,分离管通过Z轴驱动机构与底座滑动连接,且滑动方向为靠近或远离蓝膜架的上下方向,分离管的底部连通真空负压机,分离管的内壁上对称设有两条滑槽,顶针固定座的两侧均设有连接块,连接块与滑槽滑动连接,顶针与顶针固定座可拆卸连接,缓冲组件安装于滑槽内,且位于连接块靠近分离管的顶部一侧。该技术针对不同规格芯片,可方便更换顶针,另外通过缓冲组件的设置能够限制顶针的滑动速度和顶起高度,避免损坏芯片。The Chinese patent with the publication number CN218447858U discloses a device that facilitates the separation of the blue film and the chip, including a hollow blue film frame, X and Y axis drive mechanisms and a separation mechanism. The separation mechanism includes a base, a Z axis drive mechanism, and a separation tube. , thimble, thimble fixing seat and buffer assembly, the separation tube is slidingly connected with the base through the Z-axis drive mechanism, and the sliding direction is the up and down direction close to or away from the blue membrane frame, the bottom of the separation tube is connected to the vacuum negative pressure machine, and the inner wall of the separation tube There are two chute symmetrically on the top, and there are connecting blocks on both sides of the thimble fixing seat. near the top side of the separation tube. This technology can easily replace the thimble for chips of different specifications. In addition, the setting of the buffer component can limit the sliding speed and jacking height of the thimble to avoid damage to the chip.
但是上述技术结构限制较大,不适合分离小型芯片尤其是微型芯片,而且其利用弹簧的弹力对连接块及顶针滑动的速度进行缓冲减速的结构设计,严重影响了其在微型芯片方面的应用。However, the above-mentioned technical structure has relatively large limitations, and is not suitable for separating small chips, especially microchips, and its structural design of using the elastic force of the spring to buffer and decelerate the sliding speed of the connecting block and the thimble has seriously affected its application in microchips.
发明内容Contents of the invention
基于此,有必要提供一种物料自动化生产的顶升装置及物料自动化生产设备,可应用于芯片的自动化分离及其他生产工艺中。Based on this, it is necessary to provide a lifting device for automatic material production and automatic material production equipment, which can be applied to automatic separation of chips and other production processes.
在一个实施例中,一种物料自动化生产的顶升装置,包括顶针调节结构及顶针帽结构;In one embodiment, a jacking device for automatic material production, including a thimble adjustment structure and a thimble cap structure;
所述顶针调节结构以步进驱使偏心转动方式控制所述顶针帽结构的顶针升降;The thimble adjusting structure controls the lifting of the thimble of the thimble cap structure in a step-driven eccentric rotation manner;
所述顶针帽结构以负压吸附方式吸取待分离物料盘,通过所述顶针顶升以分离所述待分离物料盘的物料与料盘胶膜。The thimble cap structure absorbs the material disc to be separated by negative pressure adsorption, and lifts up through the thimble to separate the material of the material disc to be separated from the film of the material disc.
上述物料自动化生产的顶升装置,一方面以顶针配合负压吸附方式实现压力顶升,有利于实现待分离物料盘中的物料与料盘胶膜相分离;另一方面以步进驱使偏心转动方式实现顶针升降,有利于准确控制顶针升降的精细位置,且有利于批量化的大规模重复式的无差错应用;再一方面易于配合顶针帽结构实现顶针的更换,有利于适配各种不同规格的待分离物料盘及其物料分离;又一方面由于巧妙的结构设计,有利于应用于微型物料例如微型芯片。The lifting device for the automatic production of the above-mentioned materials, on the one hand, realizes the pressure lifting by means of thimble and negative pressure adsorption, which is beneficial to realize the separation of the material in the material tray to be separated from the film of the tray; on the other hand, it uses stepping to drive eccentric rotation It is beneficial to accurately control the fine position of the thimble lifting, and is conducive to large-scale repetitive error-free applications in batches; on the other hand, it is easy to cooperate with the thimble cap structure to realize the replacement of thimbles, which is conducive to adapting to various Specifications of the to-be-separated material tray and material separation; on the other hand, due to the ingenious structural design, it is beneficial to be applied to micro materials such as micro chips.
在其中一个实施例中,所述顶针帽结构包括浮动块、气管接头、顶针导向座、顶针结构及顶针帽;In one of the embodiments, the thimble cap structure includes a floating block, an air pipe joint, a thimble guide seat, a thimble structure and a thimble cap;
所述浮动块安装于所述顶针导向座下,所述顶针结构安装于所述顶针导向座上,所述顶针帽盖设于所述顶针导向座上,所述顶针结构的顶针设置于所述浮动块上,且在所述浮动块的作用下具有相对所述顶针帽的透出状态及缩入状态;所述顶针帽配合所述顶针导向座形成负压腔室,所述顶针结构容置于所述负压腔室中,所述气管接头用于连通真空泵及所述负压腔室;The floating block is installed under the thimble guide seat, the thimble structure is installed on the thimble guide seat, the thimble cap is arranged on the thimble guide seat, and the thimble structure's thimble is arranged on the thimble guide seat. On the floating block, and under the action of the floating block, it has a penetrating state and a retracting state relative to the thimble cap; the thimble cap cooperates with the thimble guide seat to form a negative pressure chamber, and the thimble structure accommodates In the negative pressure chamber, the air pipe joint is used to communicate with the vacuum pump and the negative pressure chamber;
所述顶针调节结构包括步进电机、感应器、偏心凸轮及连接板;The thimble adjustment structure includes a stepping motor, an inductor, an eccentric cam and a connecting plate;
所述顶针导向座、所述步进电机及所述感应器均固定于所述连接板上,且所述步进电机与所述感应器电连接,所述偏心凸轮安装于所述步进电机的输出轴上,所述偏心凸轮邻近所述感应器且与所述浮动块相接触,所述偏心凸轮用于在所述输出轴带动下以相异位置抵接所述浮动块以控制所述顶针的位置,使所述顶针处于透出状态或缩入状态;所述偏心凸轮还用于在转动到所述感应器处时,由所述感应器驱动所述步进电机反向步进转动,以使所述偏心凸轮调整转动方向。The thimble guide seat, the stepping motor and the inductor are all fixed on the connecting plate, and the stepping motor is electrically connected to the inductor, and the eccentric cam is installed on the stepping motor On the output shaft of the eccentric cam, the eccentric cam is adjacent to the sensor and in contact with the floating block, and the eccentric cam is used to abut against the floating block at different positions driven by the output shaft to control the The position of the thimble makes the thimble in the transparent state or the retracted state; the eccentric cam is also used to drive the stepper motor to reverse step rotation when it rotates to the inductor , so that the eccentric cam adjusts the direction of rotation.
进一步地,在其中一个实施例中,所述连接板开设有轴槽,所述输出轴穿过所述轴槽,所述偏心凸轮与所述步进电机分别位于所述连接板的两侧。Further, in one of the embodiments, the connecting plate is provided with a shaft slot, the output shaft passes through the shaft slot, and the eccentric cam and the stepping motor are respectively located on both sides of the connecting plate.
进一步地,在其中一个实施例中,所述浮动块包括本体、形变凸出结构、固定部及弹性件;Further, in one of the embodiments, the floating block includes a body, a deformed protrusion structure, a fixing part and an elastic part;
所述形变凸出结构及所述固定部均设置于所述本体上且分别位于所述本体的两侧,所述固定部安装于所述顶针导向座或其第一导向座下;Both the deformable protruding structure and the fixing part are arranged on the body and are respectively located on both sides of the body, and the fixing part is installed under the thimble guide seat or its first guide seat;
所述浮动块于所述形变凸出结构与所述本体之间开设有让位槽,所述形变凸出结构相对于所述本体在所述让位槽中具有形变状态;The floating block is provided with a relief groove between the deformable protruding structure and the body, and the deformable protruding structure has a deformed state in the relief groove relative to the body;
所述弹性件穿过所述本体安装于所述浮动块上,所述顶针设置于所述弹性件上。The elastic member passes through the body and is installed on the floating block, and the thimble is arranged on the elastic member.
进一步地,在其中一个实施例中,所述浮动块还包括安装于所述弹性件上的动作承接台,所述顶针设置于所述动作承接台上。Further, in one of the embodiments, the floating block further includes an action receiving platform installed on the elastic member, and the thimble is arranged on the action receiving platform.
在其中一个实施例中,所述顶针调节结构还包括气缸安装座、第一滑轨及气缸;In one of the embodiments, the thimble adjusting structure further includes a cylinder mounting seat, a first slide rail and a cylinder;
所述第一滑轨及所述气缸均固定于所述气缸安装座上,所述连接板设置于所述第一滑轨上,所述气缸驱动连接所述连接板以使所述连接板于所述第一滑轨上滑动,用于初步定位所述顶针帽结构以配合所述偏心凸轮实现精准定位。Both the first slide rail and the air cylinder are fixed on the cylinder mounting seat, the connecting plate is arranged on the first slide rail, and the connecting plate is driven and connected by the air cylinder so that the connecting plate is on the Sliding on the first slide rail is used for preliminary positioning of the thimble cap structure to cooperate with the eccentric cam to achieve precise positioning.
进一步地,在其中一个实施例中,所述顶针调节结构还包括气缸连接块、气缸限位块及限位螺丝;Further, in one of the embodiments, the thimble adjustment structure further includes a cylinder connection block, a cylinder limit block and a limit screw;
所述气缸的输出部通过所述气缸连接块连接所述连接板;The output part of the cylinder is connected to the connection plate through the cylinder connection block;
所述气缸限位块固定于所述气缸安装座上且开设有限位槽;The cylinder limit block is fixed on the cylinder mounting seat and has a limit slot;
所述气缸连接块部分容置于所述限位槽中,所述限位螺丝安装于所述气缸限位块上且至少部分可调节地位于所述限位槽中,所述限位螺丝通过其凸出于所述限位槽中的长度,限制所述气缸连接块于所述限位槽中的最大高度。The connecting block of the cylinder is partially accommodated in the limiting groove, the limiting screw is installed on the limiting block of the cylinder and is at least partly adjustable in the limiting groove, and the limiting screw passes through The length it protrudes from the limiting groove limits the maximum height of the cylinder connection block in the limiting groove.
在其中一个实施例中,所述顶针调节结构还包括调节板、第二滑轨、第二调节螺丝及第二调节块;In one of the embodiments, the thimble adjustment structure further includes an adjustment plate, a second slide rail, a second adjustment screw and a second adjustment block;
所述第二滑轨及所述第二调节块均固定于所述调节板上,所述气缸安装座设置于所述第二滑轨上,所述第二调节螺丝固定于所述气缸安装座上且与所述第二调节块螺接,用于控制所述气缸安装座于所述第二滑轨上滑动;其中,所述第二滑轨与所述第一滑轨具有相互垂直的滑动方向。Both the second slide rail and the second adjustment block are fixed on the adjustment plate, the cylinder mount is arranged on the second slide rail, and the second adjustment screw is fixed on the cylinder mount and screwed with the second adjustment block, used to control the sliding of the cylinder mounting seat on the second slide rail; wherein, the second slide rail and the first slide rail have mutually perpendicular sliding direction.
在其中一个实施例中,所述顶针调节结构还包括底座、第三调节块、第三调节螺丝及第三滑轨;In one of the embodiments, the thimble adjustment structure further includes a base, a third adjustment block, a third adjustment screw and a third slide rail;
所述第三调节块及所述第三滑轨均固定于所述底座上,所述调节板设置于所述第三滑轨上,所述第三调节螺丝固定于所述调节板上且与所述第三调节块螺接,用于控制所述调节板于所述第三滑轨上滑动;其中,所述第三滑轨、所述第二滑轨与所述第一滑轨在三维空间具有相互垂直的滑动方向。Both the third adjustment block and the third slide rail are fixed on the base, the adjustment plate is arranged on the third slide rail, the third adjustment screw is fixed on the adjustment plate and The third adjusting block is screwed, and is used to control the sliding of the adjusting plate on the third slide rail; wherein, the third slide rail, the second slide rail and the first slide rail are three-dimensionally Spaces have sliding directions perpendicular to each other.
进一步地,在其中一个实施例中,所述顶针调节结构还包括第一螺调连接板及第二螺调连接板;所述第一螺调连接板一端连接于所述调节板,另一端螺接于所述底座,用于在松开状态下使能所述调节板于所述第三滑轨上滑动,且在紧固状态下阻止所述调节板于所述第三滑轨上滑动;所述第二螺调连接板一端连接于所述调节板,另一端螺接于所述气缸安装座,用于在松开状态下使能所述气缸安装座于所述第二滑轨上滑动,且在紧固状态下阻止所述气缸安装座于所述第二滑轨上滑动。Further, in one of the embodiments, the thimble adjustment structure further includes a first screw connection plate and a second screw connection plate; one end of the first screw connection plate is connected to the adjustment plate, and the other end is screwed connected to the base, used to enable the adjustment plate to slide on the third slide rail in a loose state, and prevent the adjustment plate from sliding on the third slide rail in a fastened state; One end of the second screw-adjusting connecting plate is connected to the adjustment plate, and the other end is screwed to the cylinder mounting seat for enabling the cylinder mounting seat to slide on the second slide rail in a loosened state , and prevent the cylinder mount from sliding on the second slide rail in a fastened state.
在其中一个实施例中,所述偏心凸轮具有感应片,所述感应器为光电感应器,所述感应器用于感应光线被所述感应片遮挡时,驱动所述步进电机反向步进转动。In one of the embodiments, the eccentric cam has a sensing piece, and the sensor is a photoelectric sensor, and the sensor is used to drive the stepper motor to reversely step and rotate when the light is blocked by the sensing piece. .
在其中一个实施例中,所述感应片具有扇形结构件,所述感应器用于感应光线被所述扇形结构件遮挡时,驱动所述步进电机反向步进转动。In one embodiment, the sensing sheet has a fan-shaped structure, and the sensor is used to drive the stepping motor to reversely step and rotate when sensing light is blocked by the fan-shaped structure.
在其中一个实施例中,所述顶针导向座包括第一导向座、第一密封圈、第二导向座及第二密封圈;In one of the embodiments, the thimble guide seat includes a first guide seat, a first sealing ring, a second guide seat and a second sealing ring;
所述第二导向座固定于所述第一导向座上且通过所述第一密封圈与所述第一导向座相密封,所述顶针帽盖设于所述第二导向座上且通过所述第二密封圈与所述第二导向座相密封;The second guide seat is fixed on the first guide seat and is sealed with the first guide seat through the first sealing ring, and the thimble cap is arranged on the second guide seat and passed through the first guide seat. The second sealing ring is sealed with the second guide seat;
所述第一导向座、所述第二导向座及所述顶针帽之间共同形成所述负压腔室,所述气管接头固定于所述第一导向座上且通过所述第一导向座连通所述负压腔室;及/或,The first guide seat, the second guide seat and the thimble cap jointly form the negative pressure chamber, the air pipe joint is fixed on the first guide seat and passes through the first guide seat communicating with the negative pressure chamber; and/or,
所述顶针导向座还包括浮动轴,所述浮动轴位于所述负压腔室中;The thimble guide seat also includes a floating shaft, and the floating shaft is located in the negative pressure chamber;
所述浮动轴固定于所述浮动块或其弹性件上,所述顶针结构安装于所述浮动轴上,所述浮动轴用于在所述浮动块的作用下带动所述顶针结构相对所述顶针帽移动,以使所述顶针具有所述透出状态及所述缩入状态。The floating shaft is fixed on the floating block or its elastic member, the thimble structure is installed on the floating shaft, and the floating shaft is used to drive the thimble structure relative to the floating block under the action of the floating block. The thimble cap moves so that the thimble has the transparent state and the retracted state.
进一步地,在其中一个实施例中,所述顶针结构还包括顶针固定座及顶针锁紧帽,所述顶针固定座安装于所述顶针导向座上,所述顶针可拆卸地安装于所述顶针固定座上,所述顶针锁紧帽安装于所述顶针固定座上且在紧固状态下锁紧所述顶针。Further, in one of the embodiments, the thimble structure further includes a thimble fixing seat and a thimble locking cap, the thimble fixing seat is installed on the thimble guide seat, and the thimble is detachably installed on the thimble On the fixing seat, the thimble locking cap is installed on the thimble fixing seat and locks the thimble in a fastened state.
进一步地,在其中一个实施例中,所述顶针帽开设有过针孔及吸附孔,所述顶针穿设于所述过针孔中以抵接所述待分离物料盘的薄膜上的物料,所述吸附孔用于接触所述待分离物料盘其他位置的薄膜。Further, in one of the embodiments, the thimble cap is provided with a pin hole and an adsorption hole, and the thimble is passed through the pin hole to contact the material on the film of the material tray to be separated, The adsorption holes are used to contact the film at other positions of the material disc to be separated.
在其中一个实施例中,所述物料为芯片。In one of the embodiments, the material is a chip.
在其中一个实施例中,一种物料自动化生产设备,包括上料装置、下料装置及任一实施例所述物料自动化生产的顶升装置;In one of the embodiments, an automatic production equipment for materials, including a feeding device, a feeding device, and a jacking device for the automatic production of materials described in any embodiment;
所述上料装置用于将待分离物料盘输送至所述物料自动化生产的顶升装置的顶针帽结构;The feeding device is used to transport the material tray to be separated to the thimble cap structure of the jacking device for the automatic production of the material;
所述下料装置用于收取从待分离物料盘完成分离的物料及料盘胶膜。The unloading device is used to collect the material separated from the material tray to be separated and the film of the tray.
附图说明Description of drawings
为了更清楚地说明本申请实施例或传统技术中的技术方案,下面将对实施例或传统技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅是本申请的一些实施例,对于本领域普通技术人员而言,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or the conventional technology. Obviously, the accompanying drawings in the following description are only examples For some embodiments of the application, those skilled in the art can also obtain other drawings based on these drawings without creative work.
图1为本申请所述物料自动化生产的顶升装置一实施例的结构示意图。Fig. 1 is a schematic structural view of an embodiment of a jacking device for the automatic production of materials described in the present application.
图2为图1所示实施例的顶针帽结构的结构示意图。Fig. 2 is a structural schematic diagram of the thimble cap structure of the embodiment shown in Fig. 1 .
图3为图2所示实施例的结构分解示意图。FIG. 3 is an exploded schematic diagram of the structure of the embodiment shown in FIG. 2 .
图4为图3所示实施例的浮动块的结构示意图。FIG. 4 is a schematic structural diagram of the slider of the embodiment shown in FIG. 3 .
图5为图1所示实施例的另一标识示意图。Fig. 5 is a schematic diagram of another identification of the embodiment shown in Fig. 1 .
图6为图5所示实施例的A处放大示意图。FIG. 6 is an enlarged schematic view of A of the embodiment shown in FIG. 5 .
图7为图6所示实施例的B处放大示意图。FIG. 7 is an enlarged schematic view of B of the embodiment shown in FIG. 6 .
图8为图7所示实施例的状态对比示意图。FIG. 8 is a schematic diagram of state comparison of the embodiment shown in FIG. 7 .
图9为图1所示实施例的顶针调节结构的结构示意图。FIG. 9 is a structural schematic diagram of the ejector pin adjustment structure of the embodiment shown in FIG. 1 .
图10为图9所示实施例的结构分解示意图。FIG. 10 is an exploded schematic diagram of the structure of the embodiment shown in FIG. 9 .
图11为图1所示实施例的另一方向示意图。FIG. 11 is a schematic diagram of another direction of the embodiment shown in FIG. 1 .
图12为图11所示实施例的C处放大示意图。FIG. 12 is an enlarged schematic view of point C of the embodiment shown in FIG. 11 .
附图标记:Reference signs:
顶针调节结构100、底座101、第三调节块102、第三调节螺丝103、第三滑轨104、调节板105、第二滑轨106、气缸安装座107、第一滑轨108、气缸109、步进电机110、感应器111、感应片112、偏心凸轮113、连接板114、气缸连接块115、气缸限位块116、限位螺丝117、第一螺调连接板118、第二调节螺丝119、第二调节块120、第二螺调连接板121、轴槽122、限位槽123;
顶针帽结构200、浮动块218、气管接头219、第一导向座220、第一密封圈221、第二导向座222、浮动轴223、第二密封圈224、顶针固定座225、顶针锁紧帽226、顶针227、顶针帽228、过针孔229、吸附孔230、顶针导向座231、本体232、形变凸出结构233、让位槽234、固定部235、弹性件236、动作承接台237、顶针结构238;
透出状态300、缩入状态400。The out
具体实施方式Detailed ways
为使本申请的上述目的、特征和优点能够更加明显易懂,下面结合附图对本申请的具体实施方式做详细的说明。在下面的描述中阐述了很多具体细节以便于充分理解本申请。但是本申请能够以很多不同于在此描述的其它方式来实施,本领域技术人员可以在不违背本申请内涵的情况下做类似改进,因此本申请不受下面公开的具体实施例的限制。In order to make the above-mentioned purpose, features and advantages of the present application more obvious and understandable, the specific implementation manners of the present application will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the application. However, the present application can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.
需要说明的是,当组件被称为“固定于”或“设置于”另一个组件,它可以直接在另一个组件上或者也可以存在居中的组件。当一个组件被认为是“连接”另一个组件,它可以是直接连接到另一个组件或者可能同时存在居中组件。本申请的说明书所使用的术语“垂直的”、“水平的”、“上”、“下”、“左”、“右”以及类似的表述只是为了说明的目的,并不表示是唯一的实施方式。It should be noted that when a component is referred to as being “fixed on” or “set on” another component, it may be directly on the other component or there may also be an intervening component. When a component is said to be "connected" to another component, it may be directly connected to the other component or there may be intervening components at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for the purpose of illustration only and do not represent the only implementation Way.
此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本申请的描述中,“多个”的含义是至少两个,例如两个,三个等,除非另有明确具体的限定。In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present application, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.
在本申请中,除非另有明确的规定和限定,第一特征在第二特征“上”、“下”可以是第一特征直接和第二特征接触,或第一特征和第二特征间接地通过中间媒介接触。而且,第一特征在第二特征“之上”、“上方”和“上面”可以是第一特征在第二特征正上方或斜上方,或仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方,或仅表示第一特征水平高度小于第二特征。In this application, unless otherwise clearly specified and limited, a first feature is "on" or "under" a second feature, which means that the first feature is directly in contact with the second feature, or that the first feature and the second feature are indirectly in contact with each other. contact through an intermediary. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the level of the first feature is higher than that of the second feature. "Below", "beneath" and "under" the first feature may mean that the first feature is directly below or obliquely below the second feature, or it just means that the level of the first feature is smaller than that of the second feature.
除非另有定义,本申请的说明书所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。在本申请的说明书中所使用的术语只是为了描述具体的实施方式的目的,不是旨在于限制本申请。本申请的说明书所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。Unless otherwise defined, all technical and scientific terms used in the description of the present application have the same meaning as commonly understood by those skilled in the technical field of the present application. The terms used in the description of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The term "and/or" used in the specification of the present application includes any and all combinations of one or more related listed items.
本申请公开了一种物料自动化生产的顶升装置及物料自动化生产设备,其包括以下实施例的部分结构或全部结构;即,所述物料自动化生产的顶升装置及物料自动化生产设备包括以下的部分技术特征或全部技术特征。在本申请一个实施例中,一种物料自动化生产的顶升装置,包括顶针调节结构及顶针帽结构;所述顶针调节结构以步进驱使偏心转动方式控制所述顶针帽结构的顶针升降;所述顶针帽结构以负压吸附方式吸取待分离物料盘,通过所述顶针顶升以分离所述待分离物料盘的物料与料盘胶膜。上述物料自动化生产的顶升装置,一方面以顶针配合负压吸附方式实现压力顶升,有利于实现待分离物料盘中的物料与料盘胶膜相分离;另一方面以步进驱使偏心转动方式实现顶针升降,有利于准确控制顶针升降的精细位置,且有利于批量化的大规模重复式的无差错应用;再一方面易于配合顶针帽结构实现顶针的更换,有利于适配各种不同规格的待分离物料盘及其物料分离;又一方面由于巧妙的结构设计,有利于应用于微型物料例如微型芯片。The present application discloses a jacking device and automated material production equipment for automatic material production, which includes part or all of the structures of the following embodiments; that is, the jacking device for automatic material production and automatic material production equipment includes the following Some technical features or all technical features. In one embodiment of the present application, a jacking device for automatic production of materials includes a thimble adjustment structure and a thimble cap structure; the thimble adjustment structure controls the thimble lifting of the thimble cap structure by stepping and driving eccentric rotation; The thimble cap structure absorbs the material disc to be separated by negative pressure adsorption, and lifts up through the thimble to separate the material of the material disc to be separated from the film of the material disc. The lifting device for the automatic production of the above-mentioned materials, on the one hand, realizes the pressure lifting by means of thimble and negative pressure adsorption, which is beneficial to realize the separation of the material in the material tray to be separated from the film of the tray; on the other hand, it uses stepping to drive eccentric rotation It is beneficial to accurately control the fine position of the thimble lifting, and is conducive to large-scale repetitive error-free applications in batches; on the other hand, it is easy to cooperate with the thimble cap structure to realize the replacement of thimbles, which is conducive to adapting to various Specifications of the to-be-separated material tray and material separation; on the other hand, due to the ingenious structural design, it is beneficial to be applied to micro materials such as micro chips.
在其中一个实施例中,一种物料自动化生产的顶升装置如图1所示,其包括顶针调节结构100及顶针帽结构200;所述顶针调节结构100以步进驱使偏心转动方式控制所述顶针帽结构200的顶针升降;所述顶针帽结构200以负压吸附方式吸取待分离物料盘,通过所述顶针顶升以分离所述待分离物料盘的物料与料盘胶膜。当顶针顶升时,将物料从料盘胶膜上顶起,使得物料与料盘胶膜相分离,此状态下可通过吸取方式移开物料,然后顶针下降,继续处理所述待分离物料盘的另一物料。In one embodiment, a jacking device for automatic production of materials is shown in Figure 1, which includes a
如图2所示,在其中一个实施例中,所述顶针帽结构200包括浮动块218、气管接头219、顶针导向座231、顶针结构238及顶针帽228;所述浮动块218安装于所述顶针导向座231下,所述顶针帽228盖设于所述顶针导向座231上,所述顶针帽228配合所述顶针导向座231形成负压腔室,所述顶针结构238安装于所述顶针导向座231上,且所述顶针结构238容置于所述负压腔室中,所述气管接头219用于连通真空泵及所述负压腔室。进一步地,在其中一个实施例中,所述气管接头219的数量为两个,其中一个连通真空泵及所述负压腔室,另一个连通气阀及所述负压腔室,分别用于受控从所述负压腔室抽气及补充外部空气进入所述负压腔室。这样的设计,通过真空泵的配合,有利于快速且准确地控制所述负压腔室的负压状态,从而准确地吸附待分离物料盘的料盘胶膜,实现待分离物料盘及其物料分离,即实现待分离物料盘的物料与料盘胶膜相分离。As shown in Figure 2, in one of the embodiments, the
结合图3,在其中一个实施例中,所述顶针导向座231包括第一导向座220、第一密封圈221、第二导向座222及第二密封圈224;所述第二导向座222固定于所述第一导向座220上且通过所述第一密封圈221与所述第一导向座220相密封,所述顶针帽228盖设于所述第二导向座222上且通过所述第二密封圈224与所述第二导向座222相密封;所述第一导向座220、所述第二导向座222及所述顶针帽228之间共同形成所述负压腔室,所述气管接头219固定于所述第一导向座220上且通过所述第一导向座220连通所述负压腔室;在其中一个实施例中,所述顶针导向座231还包括浮动轴223,所述浮动轴223位于所述负压腔室中;所述浮动轴223固定于所述浮动块218或其弹性件236上,所述顶针结构238安装于所述浮动轴223上,所述浮动轴223用于在所述浮动块218的作用下带动所述顶针结构238相对所述顶针帽228移动,如图6及图7所示,以使所述顶针227具有所述透出状态300,或者如图8所示,所述浮动轴223用于在所述浮动块218的作用下带动所述顶针结构238相对所述顶针帽228移动,以使所述顶针227具有所述缩入状态400。这样的设计,有利于实现往复运动的顶升结构,整体结构紧凑简洁,且具有结构简单的优点。3, in one embodiment, the thimble guide seat 231 includes a first guide seat 220, a first seal ring 221, a second guide seat 222 and a second seal ring 224; the second guide seat 222 is fixed On the first guide seat 220 and sealed with the first guide seat 220 through the first sealing ring 221, the thimble cap 228 is covered on the second guide seat 222 and passed through the first guide seat 220 Two sealing rings 224 are sealed with the second guide seat 222; the negative pressure chamber is jointly formed between the first guide seat 220, the second guide seat 222 and the thimble cap 228, and the trachea The joint 219 is fixed on the first guide seat 220 and communicates with the negative pressure chamber through the first guide seat 220; in one embodiment, the thimble guide seat 231 also includes a floating shaft 223, the The floating shaft 223 is located in the negative pressure chamber; the floating shaft 223 is fixed on the floating block 218 or its elastic member 236, the thimble structure 238 is installed on the floating shaft 223, and the floating shaft 223 It is used to drive the thimble structure 238 to move relative to the thimble cap 228 under the action of the floating block 218, as shown in FIG. 6 and FIG. 7, so that the thimble 227 has the transparent state 300, or as As shown in FIG. 8 , the floating shaft 223 is used to drive the thimble structure 238 to move relative to the thimble cap 228 under the action of the floating block 218 , so that the thimble 227 has the retracted state 400 . Such a design is conducive to the realization of a reciprocating jacking structure, and the overall structure is compact and simple, and has the advantage of a simple structure.
如图3所示,在其中一个实施例中,所述顶针结构238包括顶针227,进一步地,所述顶针结构238还包括顶针固定座225及顶针锁紧帽226,所述顶针固定座225安装于所述顶针导向座231上,所述顶针227可拆卸地安装于所述顶针固定座225上,所述顶针锁紧帽226安装于所述顶针固定座225上且在紧固状态下锁紧所述顶针227。在其中一个实施例中,所述顶针调节结构100以步进驱使偏心转动方式控制所述顶针帽结构200的顶针227升降;所述顶针帽结构200以负压吸附方式吸取待分离物料盘,通过所述顶针227顶升以分离所述待分离物料盘的物料与料盘胶膜;所述顶针结构238的顶针227设置于所述浮动块218上,且在所述浮动块218的作用下具有相对所述顶针帽228的透出状态300如图7所示,以及具有相对所述顶针帽228的缩入状态400如图8所示;所述浮动轴223用于在所述浮动块218的作用下带动所述顶针结构238相对所述顶针帽228移动,以使所述顶针227具有所述透出状态300及所述缩入状态400。这样的设计,可以为设备提供适用于不同微型尺寸规格物料的顶升结构,且解决微型物料例如微型芯片取料时易与上料料盘胶膜即蓝膜相粘连的情况,以实现设备的通用性,自动上料的高精度和高稳定性。As shown in Figure 3, in one of the embodiments, the
结合图7及图8,进一步地,在其中一个实施例中,所述顶针帽228开设有过针孔229及吸附孔230,所述顶针227穿设于所述过针孔229中以抵接所述待分离物料盘的薄膜上的物料,所述吸附孔230用于接触所述待分离物料盘其他位置的薄膜。在其中一个实施例中,所述物料为芯片。本申请各实施例涉及物料半导体类自动化生产设备,可实现多规格微型半导体尤其是多规格芯片在自动化设备中料和料盘分离,此方法主要用于物料测试中取料过程中,单个来料与蓝膜分离,辅助自动上料吸嘴取料,使得自动化操作更精确。现有设备无此结构,在取料过程中会发生漏料,来料物料取料时与来料物料放置的蓝膜粘连,取料位置不准确,效率低等问题。7 and 8, further, in one embodiment, the
为了提高分离效率,在其中一个实施例中,所述顶针227的数量为至少二个,且各所述顶针227规则排列;进一步地,在其中一个实施例中,各所述顶针227规则排列直线形或者矩阵形状等。进一步地,在其中一个实施例中,各所述顶针227之间间隔至少一个物料位置,即每次被分离的至少两个物料之间,间隔有其他未被分离的至少一个物料。这样的设计,有利于一次分离多个物料例如多个芯片。In order to improve separation efficiency, in one of the embodiments, the number of the
为了精确控制顶针的顶升高度及在顶升过程中避免损伤物料,进一步地,在其中一个实施例中,如图4所示,所述浮动块218包括本体232、形变凸出结构233、固定部235及弹性件236;所述形变凸出结构233及所述固定部235均设置于所述本体232上且分别位于所述本体232的两侧,所述固定部235安装于所述顶针导向座231或其第一导向座220下;结合图5及图6,所述浮动块218于所述形变凸出结构233与所述本体232之间开设有让位槽234,所述形变凸出结构233相对于所述本体232在所述让位槽234中具有形变状态;结合图3,所述弹性件236穿过所述本体232安装于所述浮动块218上,所述顶针227设置于所述弹性件236上。进一步地,在其中一个实施例中,所述浮动块218还包括安装于所述弹性件236上的动作承接台237,所述顶针227设置于所述动作承接台237上。In order to precisely control the lifting height of the thimble and avoid damage to the material during the lifting process, further, in one embodiment, as shown in FIG.
各实施例中,如图9及图10所示,所述顶针调节结构100包括步进电机110、感应器111、偏心凸轮113及连接板114;并且,所述步进电机110及所述感应器111均固定于所述连接板114上,且所述步进电机110与所述感应器111电连接。结合图5及图6,所述顶针导向座231固定于所述连接板114上;在其中一个实施例中,所述顶针导向座231的第一导向座220固定于所述连接板114上。并且,所述偏心凸轮113安装于所述步进电机110的输出轴上,所述偏心凸轮113邻近所述感应器111,且所述偏心凸轮113与所述浮动块218相接触,所述偏心凸轮113用于在所述输出轴带动下以相异位置抵接所述浮动块218以控制所述顶针227的位置,使得所述顶针227处于所述透出状态300或所述顶针227处于所述缩入状态400;即所述偏心凸轮113与所述浮动块218始终处于接触状态,例如两者形成点接触或者线接触,所述偏心凸轮113最顶端处于不同圆弧点时,所述顶针227所处的突出高度不同,从而实现顶出的高度精确限制,以达成物料与料盘胶膜相分离的目的。所述偏心凸轮113还用于在转动到所述感应器111处时,由所述感应器111驱动所述步进电机110反向步进转动,以使所述偏心凸轮113调整转动方向。进一步地,这样的设计,通过控制偏心凸轮113与步进电机110轴心的偏心距设计,即可控制顶针的上下升降距离,形成了精准的往复行程控制,从而提供了结构简单、位置精确的顶升机构,运行故障率低,对物料损伤可能性极小,无论是取样分离还是规模分离均适用。In each embodiment, as shown in Figure 9 and Figure 10, the
基于缩小占位面积的考虑,进一步地,在其中一个实施例中,如图10所示,所述连接板114开设有轴槽122,所述输出轴穿过所述轴槽122,所述偏心凸轮113与所述步进电机110分别位于所述连接板114的两侧。这样的设计,通过两侧的平衡设计,有利于缩小所述物料自动化生产的顶升装置的外形尺寸,从而有利于增加所述物料自动化生产的顶升装置的分布密度,形成物料分离阵列,进而实现小厂房的大批量分离处理,在有限的生产面积提升了分离的效率及产能。Based on the consideration of reducing the occupied area, further, in one of the embodiments, as shown in FIG. The
在其中一个实施例中,如图11及图12所示,所述顶针调节结构100还包括气缸安装座107、第一滑轨108及气缸109;所述第一滑轨108及所述气缸109均固定于所述气缸安装座107上,所述连接板114设置于所述第一滑轨108上,所述气缸109驱动连接所述连接板114以使所述连接板114于所述第一滑轨108上滑动,用于初步定位所述顶针帽结构200以配合所述偏心凸轮113实现精准定位;进一步地,即以步进驱使偏心转动方式实现精准定位顶升物料使得物料从料盘胶膜分离,如有必要可以通过气缸驱动顶针导向座带动顶针结构及顶针帽整体从第一滑轨滑动,从而实现快速的粗略定位,结合后面具有第二滑轨及第三滑轨的实施例,有利于在三维空间沿着空间直角坐标系的定位,准确控制所述顶针的位置。In one of the embodiments, as shown in Figure 11 and Figure 12, the
为了避免在顶升中损伤物料,进一步地,在其中一个实施例中,如图12所示,所述顶针调节结构100还包括气缸连接块115、气缸限位块116及限位螺丝117;所述气缸109的输出部通过所述气缸连接块115连接所述连接板114;所述气缸限位块116固定于所述气缸安装座107上且开设有限位槽123;所述气缸连接块115部分容置于所述限位槽123中,所述限位螺丝117安装于所述气缸限位块116上且至少部分可调节地位于所述限位槽123中,所述限位螺丝117通过其凸出于所述限位槽123中的长度,限制所述气缸连接块115于所述限位槽123中的最大高度。这样的设计,有利于保护物料,尤其是配合限位螺丝使得所述物料自动化生产的顶升装置适配于各种不同规格物料的分离处理。In order to avoid damage to materials during jacking, further, in one embodiment, as shown in Figure 12, the
在其中一个实施例中,如图9及图10所示,所述顶针调节结构100还包括调节板105、第二滑轨106、第二调节螺丝119及第二调节块120;所述第二滑轨106及所述第二调节块120均固定于所述调节板105上,所述气缸安装座107设置于所述第二滑轨106上,所述第二调节螺丝119固定于所述气缸安装座107上且与所述第二调节块120螺接,用于控制所述气缸安装座107于所述第二滑轨106上滑动;其中,所述第二滑轨106与所述第一滑轨108具有相互垂直的滑动方向。这样就实现了二维方向的定位调整。In one embodiment, as shown in Figures 9 and 10, the
在其中一个实施例中,如图9及图10所示,所述顶针调节结构100还包括底座101、第三调节块102、第三调节螺丝103及第三滑轨104;所述第三调节块102及所述第三滑轨104均固定于所述底座101上,所述调节板105设置于所述第三滑轨104上,所述第三调节螺丝103固定于所述调节板105上且与所述第三调节块102螺接,用于控制所述调节板105于所述第三滑轨104上滑动;其中,所述第三滑轨104、所述第二滑轨106与所述第一滑轨108在三维空间具有相互垂直的滑动方向。这样就实现了三维方向的定位调整。In one of the embodiments, as shown in Figure 9 and Figure 10, the
进一步地,在其中一个实施例中,如图9及图10所示,所述顶针调节结构100还包括第一螺调连接板118及第二螺调连接板121;所述第一螺调连接板118一端连接于所述调节板105,另一端螺接于所述底座101,用于在松开状态下使能所述调节板105于所述第三滑轨104上滑动,且在紧固状态下阻止所述调节板105于所述第三滑轨104上滑动;所述第二螺调连接板121一端连接于所述调节板105,另一端螺接于所述气缸安装座107,用于在松开状态下使能所述气缸安装座107于所述第二滑轨106上滑动,且在紧固状态下阻止所述气缸安装座107于所述第二滑轨106上滑动。这样的设计,有利于简单便捷地调整顶针与待分离物料盘的相对位置,有利于在顶升分离之前,准确调整所述顶针在升降方向的位置,确保后续的顶升操作过程中,所述顶针只需在升降方向进行移动即可。Further, in one of the embodiments, as shown in FIG. 9 and FIG. 10 , the
如图9及图10所示,在其中一个实施例中,所述偏心凸轮113具有感应片112,所述感应器111为光电感应器,所述感应器111用于感应光线被所述感应片112遮挡时,驱动所述步进电机110反向步进转动。在其中一个实施例中,所述感应片112具有扇形结构件,所述感应器111用于感应光线被所述扇形结构件遮挡时,驱动所述步进电机110反向步进转动。这样的设计,有利于实现低故障率的重复运动,且实现成本低,占用空间小,因此具有较高的适用性。As shown in Fig. 9 and Fig. 10, in one of the embodiments, the
下面继续结合图1至图12,继续对本申请所述物料自动化生产的顶升装置作出具体说明。The following will continue to describe the jacking device for the automatic production of materials described in this application in conjunction with FIGS. 1 to 12 .
本顶升装置主要包括顶针调节结构100和顶针帽结构200,还可以包括真空泵、气阀及相关的电控设备。The jacking device mainly includes a
顶针调节结构100包括底座101;安装于底座101上的第三调节块102、第三调节螺丝103、第三滑轨104、调节板105;安装于调节板105上的第二滑轨106、气缸安装座107;安装于气缸安装座107上的第一滑轨108及气缸109;位于第一滑轨108上连接的连接板114;位于连接板114上的步进电机110、感应器111、气缸连接块115、气缸限位块116、限位螺丝117;安装于步进电机110上的偏心凸轮113及感应片112。The
顶针帽结构200包括浮动块218,气管接头219,第一导向座220:以及安装在第一导向座220上的第一密封圈221、第二导向座222及顶针固定座225,安装在第二导向座222上的第二密封圈224,以及安装在顶针固定座225上的顶针锁紧帽226、顶针227,还有安装在第二导向座222上的顶针帽228。The
顶针调节结构的原理说明如下:气缸109通过第一滑轨108带动连接板114,从而带动顶针帽结构运动至所需高度粗定位,步进电机110开始启动,带动偏心凸轮113运动,从而带动顶针帽结构200运动。The principle of the thimble adjustment structure is explained as follows: the
顶针帽结构200的原理说明如下:步进电机110带动偏心凸轮113凸轮的圆心与电机轴偏心,偏心的圆心距为顶针帽结构中顶针227可以上下往复运动的距离,偏心凸轮113与浮动块218点接触,偏心凸轮113转动时带动浮动块218上下运动,最高点与最低点的差值为步进电机110轴心与偏心凸轮113轴心的距离。The principle of the
顶针帽结构200的步进电机110中浮动块218连接浮动轴223,顶针固定座225连接与顶针227连接,顶升最大行程时,顶针227会穿过顶针帽228上的过针孔229,超出高度就是将物料从上料蓝膜上顶升的高度,同时气管接头219抽真空,将整个顶针帽结构200内部形成负压状态乃至于接近真空状态,即顶针帽228的内部形成负压状态例如接近真空状态,物料上料的蓝膜吸附在顶针帽228上,这样更好地使物料和蓝膜分离。In the
上述物料自动化生产的顶升装置的具体结构可作为设备的通用顶升装置,通过偏心凸轮113的带动,实现了步进电机110带动的结构在与步进电机110垂直90°的方向做竖直往复运动,针对不同的往复行程需求,只需调整偏心凸轮113大小以及偏心凸轮113与步进电机110轴心的偏心距离,结构其余整体形状和原理不变,因此具有很强的通用性。The specific structure of the jacking device for the automatic production of the above materials can be used as a general jacking device for the equipment. Driven by the
在其中一个实施例中,一种物料自动化生产设备,包括上料装置、下料装置及任一实施例所述物料自动化生产的顶升装置;所述上料装置用于将待分离物料盘输送至所述物料自动化生产的顶升装置的顶针帽结构;所述下料装置用于收取从待分离物料盘完成分离的物料及料盘胶膜。这样的设计,一方面以顶针配合负压吸附方式实现压力顶升,有利于实现待分离物料盘中的物料与料盘胶膜相分离;另一方面以步进驱使偏心转动方式实现顶针升降,有利于准确控制顶针升降的精细位置,且有利于批量化的大规模重复式的无差错应用;再一方面易于配合顶针帽结构实现顶针的更换,有利于适配各种不同规格的待分离物料盘及其物料分离;又一方面由于巧妙的结构设计,有利于应用于微型物料例如微型芯片。In one of the embodiments, an automatic material production equipment includes a feeding device, a feeding device, and a jacking device for the automatic production of materials described in any embodiment; the feeding device is used to transport the material tray to be separated The thimble cap structure of the jacking device for the automatic production of the material; the unloading device is used to collect the material separated from the material tray to be separated and the film of the tray. Such a design, on the one hand, uses the thimble to cooperate with the negative pressure adsorption method to realize the pressure lift, which is beneficial to realize the separation of the material in the material tray to be separated from the film of the tray; It is conducive to accurate control of the fine position of the thimble lifting, and is conducive to large-scale repetitive error-free application in batches; on the other hand, it is easy to cooperate with the structure of the thimble cap to realize the replacement of the thimble, which is conducive to adapting to various specifications of materials to be separated The disk and its material are separated; on the other hand, due to the ingenious structural design, it is beneficial to apply to micro materials such as micro chips.
需要说明的是,本申请的其它实施例还包括,上述各实施例中的技术特征相互组合所形成的、能够实施的物料自动化生产的顶升装置及物料自动化生产设备。It should be noted that other embodiments of the present application also include jacking devices and automatic material production equipment formed by combining the technical features of the above-mentioned embodiments, which can be implemented for automatic production of materials.
以上所述实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.
以上所述实施例仅表达了本申请的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对申请专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本申请构思的前提下,还可以做出若干变形和改进,这些都属于本申请的保护范围。因此,本申请的专利保护范围应以所附权利要求为准。The above-mentioned embodiments only express several implementation modes of the present application, and the description thereof is relatively specific and detailed, but should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of this application should be based on the appended claims.
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310206938.8A CN116246997B (en) | 2023-03-06 | 2023-03-06 | Jacking device for automated material production and automated material production equipment |
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| CN202310206938.8A CN116246997B (en) | 2023-03-06 | 2023-03-06 | Jacking device for automated material production and automated material production equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117373993A (en) * | 2023-10-30 | 2024-01-09 | 深圳市路远智能装备有限公司 | A material ejection mechanism and method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210176006U (en) * | 2019-05-31 | 2020-03-24 | 广东瑞谷光网通信股份有限公司 | Chip ejection mechanism |
| CN114933167A (en) * | 2022-04-27 | 2022-08-23 | 泉州兰姆达仪器设备有限公司 | Ejector pin mechanism of laser chip testing and sorting machine and working method thereof |
| CN115274540A (en) * | 2022-07-26 | 2022-11-01 | 长园半导体设备(珠海)有限公司 | Thimble mechanism |
| CN218182186U (en) * | 2022-07-20 | 2022-12-30 | 苏州科韵激光科技有限公司 | Thimble mechanism |
| CN115588639A (en) * | 2022-12-12 | 2023-01-10 | 常州铭赛机器人科技股份有限公司 | Chip supply device and chip supply method |
| CN218482267U (en) * | 2022-09-01 | 2023-02-14 | 深圳市大族半导体装备科技有限公司 | Thimble mechanism and semiconductor processing equipment |
-
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- 2023-03-06 CN CN202310206938.8A patent/CN116246997B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210176006U (en) * | 2019-05-31 | 2020-03-24 | 广东瑞谷光网通信股份有限公司 | Chip ejection mechanism |
| CN114933167A (en) * | 2022-04-27 | 2022-08-23 | 泉州兰姆达仪器设备有限公司 | Ejector pin mechanism of laser chip testing and sorting machine and working method thereof |
| CN218182186U (en) * | 2022-07-20 | 2022-12-30 | 苏州科韵激光科技有限公司 | Thimble mechanism |
| CN115274540A (en) * | 2022-07-26 | 2022-11-01 | 长园半导体设备(珠海)有限公司 | Thimble mechanism |
| CN218482267U (en) * | 2022-09-01 | 2023-02-14 | 深圳市大族半导体装备科技有限公司 | Thimble mechanism and semiconductor processing equipment |
| CN115588639A (en) * | 2022-12-12 | 2023-01-10 | 常州铭赛机器人科技股份有限公司 | Chip supply device and chip supply method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117373993A (en) * | 2023-10-30 | 2024-01-09 | 深圳市路远智能装备有限公司 | A material ejection mechanism and method |
| CN117373993B (en) * | 2023-10-30 | 2024-10-18 | 深圳市路远智能装备有限公司 | Material ejection mechanism and method |
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| CN116246997B (en) | 2023-09-29 |
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