CN116246997A - Jacking device for automatic material production and automatic material production equipment - Google Patents

Jacking device for automatic material production and automatic material production equipment Download PDF

Info

Publication number
CN116246997A
CN116246997A CN202310206938.8A CN202310206938A CN116246997A CN 116246997 A CN116246997 A CN 116246997A CN 202310206938 A CN202310206938 A CN 202310206938A CN 116246997 A CN116246997 A CN 116246997A
Authority
CN
China
Prior art keywords
thimble
guide seat
materials
adjusting
jacking device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202310206938.8A
Other languages
Chinese (zh)
Other versions
CN116246997B (en
Inventor
李伟
刘晓敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radium Technology Xi'an Co ltd
Original Assignee
Radium Technology Xi'an Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radium Technology Xi'an Co ltd filed Critical Radium Technology Xi'an Co ltd
Priority to CN202310206938.8A priority Critical patent/CN116246997B/en
Publication of CN116246997A publication Critical patent/CN116246997A/en
Application granted granted Critical
Publication of CN116246997B publication Critical patent/CN116246997B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/62Plastics recycling; Rubber recycling

Landscapes

  • Automatic Assembly (AREA)

Abstract

The application relates to a jacking device for automatic production of materials and automatic production equipment of the materials, comprising a thimble adjusting structure and a thimble cap structure; the thimble adjusting structure controls the thimble of the thimble cap structure to lift in a stepping driving eccentric rotation mode; the thimble cap structure absorbs the material disc to be separated in a negative pressure adsorption mode. According to the jacking device for the automatic production of the materials, on one hand, the ejector pin is matched with the negative pressure adsorption mode to realize pressure jacking, so that the separation of the materials in the material disc to be separated from the material disc adhesive film is facilitated; on the other hand, the lifting of the thimble is realized in a mode of driving the eccentric rotation in a stepping way, which is beneficial to accurately controlling the fine position of the lifting of the thimble and is beneficial to large-scale repeated error-free application in batches; on the other hand, the thimble cap structure is easy to be matched to realize replacement of the thimble, and is favorable for adapting to various material trays to be separated with different specifications and material separation thereof; on the other hand, the structure design is ingenious, and the method is beneficial to being applied to miniature materials such as miniature chips.

Description

物料自动化生产的顶升装置及物料自动化生产设备Jacking device for automatic material production and automatic material production equipment

技术领域technical field

本申请涉及芯片自动化生产领域,特别是涉及物料自动化生产的顶升装置及物料自动化生产设备。This application relates to the field of automatic chip production, in particular to a jacking device for automatic production of materials and automatic production equipment for materials.

背景技术Background technique

一片晶圆可以加工出多个芯片(Chip),在分离之前,这些芯片设置在一张膜俗称蓝膜或胶膜的上面,在使用芯片之前,通常需将这些芯片逐一分离。A wafer can be processed into multiple chips (Chips). Before separation, these chips are placed on a film commonly known as blue film or adhesive film. Before using the chips, these chips usually need to be separated one by one.

公开号为CN101752204A的中国专利,公开了一种芯片与胶膜分离方法与芯片取出方法,其中使用了包含有刮板的顶针装置,首先将芯片定位于顶针装置上方的第一位置,沿第一方向以一适当距离水平移动上述之芯片,顶针装置的刮板大致上位于邻近上述之芯片的边缘部份;开启真空以吸附芯片连同胶膜向下;将顶针装置的刮板向上移动顶住芯片背面的胶膜;将芯片连同胶膜沿第二方向水平移动一个芯片长度的距离,其中第二方向相反于第一方向,即可将芯片与胶膜分离。The Chinese patent with the publication number CN101752204A discloses a method for separating a chip from an adhesive film and a method for taking out a chip, in which a thimble device including a scraper is used, and the chip is first positioned at the first position above the thimble device, along the first Move the above-mentioned chip horizontally with an appropriate distance in the direction. The scraper of the thimble device is generally located near the edge of the above-mentioned chip; turn on the vacuum to absorb the chip and the adhesive film downward; move the scraper of the thimble device upward to hold the chip The adhesive film on the back; the chip and the adhesive film can be separated from the adhesive film by moving the chip and the adhesive film horizontally along the second direction for a distance of one chip length, wherein the second direction is opposite to the first direction.

但是上述技术在芯片分离时需要采用刮板,会造成损坏芯片的风险,另外需要芯片连同胶膜一同移动,导致分离效率低。However, the above-mentioned technology needs to use a scraper when separating the chip, which will cause the risk of damaging the chip. In addition, the chip needs to move together with the adhesive film, resulting in low separation efficiency.

公开号为CN218447858U的中国专利,公开了一种便于蓝膜与芯片分离的装置,包括中空的蓝膜架、X、Y轴驱动机构和分离机构,分离机构包括底座、Z轴驱动机构、分离管、顶针、顶针固定座和缓冲组件,分离管通过Z轴驱动机构与底座滑动连接,且滑动方向为靠近或远离蓝膜架的上下方向,分离管的底部连通真空负压机,分离管的内壁上对称设有两条滑槽,顶针固定座的两侧均设有连接块,连接块与滑槽滑动连接,顶针与顶针固定座可拆卸连接,缓冲组件安装于滑槽内,且位于连接块靠近分离管的顶部一侧。该技术针对不同规格芯片,可方便更换顶针,另外通过缓冲组件的设置能够限制顶针的滑动速度和顶起高度,避免损坏芯片。The Chinese patent with the publication number CN218447858U discloses a device that facilitates the separation of the blue film and the chip, including a hollow blue film frame, X and Y axis drive mechanisms and a separation mechanism. The separation mechanism includes a base, a Z axis drive mechanism, and a separation tube. , thimble, thimble fixing seat and buffer assembly, the separation tube is slidingly connected with the base through the Z-axis drive mechanism, and the sliding direction is the up and down direction close to or away from the blue membrane frame, the bottom of the separation tube is connected to the vacuum negative pressure machine, and the inner wall of the separation tube There are two chute symmetrically on the top, and there are connecting blocks on both sides of the thimble fixing seat. near the top side of the separation tube. This technology can easily replace the thimble for chips of different specifications. In addition, the setting of the buffer component can limit the sliding speed and jacking height of the thimble to avoid damage to the chip.

但是上述技术结构限制较大,不适合分离小型芯片尤其是微型芯片,而且其利用弹簧的弹力对连接块及顶针滑动的速度进行缓冲减速的结构设计,严重影响了其在微型芯片方面的应用。However, the above-mentioned technical structure has relatively large limitations, and is not suitable for separating small chips, especially microchips, and its structural design of using the elastic force of the spring to buffer and decelerate the sliding speed of the connecting block and the thimble has seriously affected its application in microchips.

发明内容Contents of the invention

基于此,有必要提供一种物料自动化生产的顶升装置及物料自动化生产设备,可应用于芯片的自动化分离及其他生产工艺中。Based on this, it is necessary to provide a lifting device for automatic material production and automatic material production equipment, which can be applied to automatic separation of chips and other production processes.

在一个实施例中,一种物料自动化生产的顶升装置,包括顶针调节结构及顶针帽结构;In one embodiment, a jacking device for automatic material production, including a thimble adjustment structure and a thimble cap structure;

所述顶针调节结构以步进驱使偏心转动方式控制所述顶针帽结构的顶针升降;The thimble adjusting structure controls the lifting of the thimble of the thimble cap structure in a step-driven eccentric rotation manner;

所述顶针帽结构以负压吸附方式吸取待分离物料盘,通过所述顶针顶升以分离所述待分离物料盘的物料与料盘胶膜。The thimble cap structure absorbs the material disc to be separated by negative pressure adsorption, and lifts up through the thimble to separate the material of the material disc to be separated from the film of the material disc.

上述物料自动化生产的顶升装置,一方面以顶针配合负压吸附方式实现压力顶升,有利于实现待分离物料盘中的物料与料盘胶膜相分离;另一方面以步进驱使偏心转动方式实现顶针升降,有利于准确控制顶针升降的精细位置,且有利于批量化的大规模重复式的无差错应用;再一方面易于配合顶针帽结构实现顶针的更换,有利于适配各种不同规格的待分离物料盘及其物料分离;又一方面由于巧妙的结构设计,有利于应用于微型物料例如微型芯片。The lifting device for the automatic production of the above-mentioned materials, on the one hand, realizes the pressure lifting by means of thimble and negative pressure adsorption, which is beneficial to realize the separation of the material in the material tray to be separated from the film of the tray; on the other hand, it uses stepping to drive eccentric rotation It is beneficial to accurately control the fine position of the thimble lifting, and is conducive to large-scale repetitive error-free applications in batches; on the other hand, it is easy to cooperate with the thimble cap structure to realize the replacement of thimbles, which is conducive to adapting to various Specifications of the to-be-separated material tray and material separation; on the other hand, due to the ingenious structural design, it is beneficial to be applied to micro materials such as micro chips.

在其中一个实施例中,所述顶针帽结构包括浮动块、气管接头、顶针导向座、顶针结构及顶针帽;In one of the embodiments, the thimble cap structure includes a floating block, an air pipe joint, a thimble guide seat, a thimble structure and a thimble cap;

所述浮动块安装于所述顶针导向座下,所述顶针结构安装于所述顶针导向座上,所述顶针帽盖设于所述顶针导向座上,所述顶针结构的顶针设置于所述浮动块上,且在所述浮动块的作用下具有相对所述顶针帽的透出状态及缩入状态;所述顶针帽配合所述顶针导向座形成负压腔室,所述顶针结构容置于所述负压腔室中,所述气管接头用于连通真空泵及所述负压腔室;The floating block is installed under the thimble guide seat, the thimble structure is installed on the thimble guide seat, the thimble cap is arranged on the thimble guide seat, and the thimble structure's thimble is arranged on the thimble guide seat. On the floating block, and under the action of the floating block, it has a penetrating state and a retracting state relative to the thimble cap; the thimble cap cooperates with the thimble guide seat to form a negative pressure chamber, and the thimble structure accommodates In the negative pressure chamber, the air pipe joint is used to communicate with the vacuum pump and the negative pressure chamber;

所述顶针调节结构包括步进电机、感应器、偏心凸轮及连接板;The thimble adjustment structure includes a stepping motor, an inductor, an eccentric cam and a connecting plate;

所述顶针导向座、所述步进电机及所述感应器均固定于所述连接板上,且所述步进电机与所述感应器电连接,所述偏心凸轮安装于所述步进电机的输出轴上,所述偏心凸轮邻近所述感应器且与所述浮动块相接触,所述偏心凸轮用于在所述输出轴带动下以相异位置抵接所述浮动块以控制所述顶针的位置,使所述顶针处于透出状态或缩入状态;所述偏心凸轮还用于在转动到所述感应器处时,由所述感应器驱动所述步进电机反向步进转动,以使所述偏心凸轮调整转动方向。The thimble guide seat, the stepping motor and the inductor are all fixed on the connecting plate, and the stepping motor is electrically connected to the inductor, and the eccentric cam is installed on the stepping motor On the output shaft of the eccentric cam, the eccentric cam is adjacent to the sensor and in contact with the floating block, and the eccentric cam is used to abut against the floating block at different positions driven by the output shaft to control the The position of the thimble makes the thimble in the transparent state or the retracted state; the eccentric cam is also used to drive the stepper motor to reverse step rotation when it rotates to the inductor , so that the eccentric cam adjusts the direction of rotation.

进一步地,在其中一个实施例中,所述连接板开设有轴槽,所述输出轴穿过所述轴槽,所述偏心凸轮与所述步进电机分别位于所述连接板的两侧。Further, in one of the embodiments, the connecting plate is provided with a shaft slot, the output shaft passes through the shaft slot, and the eccentric cam and the stepping motor are respectively located on both sides of the connecting plate.

进一步地,在其中一个实施例中,所述浮动块包括本体、形变凸出结构、固定部及弹性件;Further, in one of the embodiments, the floating block includes a body, a deformed protrusion structure, a fixing part and an elastic part;

所述形变凸出结构及所述固定部均设置于所述本体上且分别位于所述本体的两侧,所述固定部安装于所述顶针导向座或其第一导向座下;Both the deformable protruding structure and the fixing part are arranged on the body and are respectively located on both sides of the body, and the fixing part is installed under the thimble guide seat or its first guide seat;

所述浮动块于所述形变凸出结构与所述本体之间开设有让位槽,所述形变凸出结构相对于所述本体在所述让位槽中具有形变状态;The floating block is provided with a relief groove between the deformable protruding structure and the body, and the deformable protruding structure has a deformed state in the relief groove relative to the body;

所述弹性件穿过所述本体安装于所述浮动块上,所述顶针设置于所述弹性件上。The elastic member passes through the body and is installed on the floating block, and the thimble is arranged on the elastic member.

进一步地,在其中一个实施例中,所述浮动块还包括安装于所述弹性件上的动作承接台,所述顶针设置于所述动作承接台上。Further, in one of the embodiments, the floating block further includes an action receiving platform installed on the elastic member, and the thimble is arranged on the action receiving platform.

在其中一个实施例中,所述顶针调节结构还包括气缸安装座、第一滑轨及气缸;In one of the embodiments, the thimble adjusting structure further includes a cylinder mounting seat, a first slide rail and a cylinder;

所述第一滑轨及所述气缸均固定于所述气缸安装座上,所述连接板设置于所述第一滑轨上,所述气缸驱动连接所述连接板以使所述连接板于所述第一滑轨上滑动,用于初步定位所述顶针帽结构以配合所述偏心凸轮实现精准定位。Both the first slide rail and the air cylinder are fixed on the cylinder mounting seat, the connecting plate is arranged on the first slide rail, and the connecting plate is driven and connected by the air cylinder so that the connecting plate is on the Sliding on the first slide rail is used for preliminary positioning of the thimble cap structure to cooperate with the eccentric cam to achieve precise positioning.

进一步地,在其中一个实施例中,所述顶针调节结构还包括气缸连接块、气缸限位块及限位螺丝;Further, in one of the embodiments, the thimble adjustment structure further includes a cylinder connection block, a cylinder limit block and a limit screw;

所述气缸的输出部通过所述气缸连接块连接所述连接板;The output part of the cylinder is connected to the connection plate through the cylinder connection block;

所述气缸限位块固定于所述气缸安装座上且开设有限位槽;The cylinder limit block is fixed on the cylinder mounting seat and has a limit slot;

所述气缸连接块部分容置于所述限位槽中,所述限位螺丝安装于所述气缸限位块上且至少部分可调节地位于所述限位槽中,所述限位螺丝通过其凸出于所述限位槽中的长度,限制所述气缸连接块于所述限位槽中的最大高度。The connecting block of the cylinder is partially accommodated in the limiting groove, the limiting screw is installed on the limiting block of the cylinder and is at least partly adjustable in the limiting groove, and the limiting screw passes through The length it protrudes from the limiting groove limits the maximum height of the cylinder connection block in the limiting groove.

在其中一个实施例中,所述顶针调节结构还包括调节板、第二滑轨、第二调节螺丝及第二调节块;In one of the embodiments, the thimble adjustment structure further includes an adjustment plate, a second slide rail, a second adjustment screw and a second adjustment block;

所述第二滑轨及所述第二调节块均固定于所述调节板上,所述气缸安装座设置于所述第二滑轨上,所述第二调节螺丝固定于所述气缸安装座上且与所述第二调节块螺接,用于控制所述气缸安装座于所述第二滑轨上滑动;其中,所述第二滑轨与所述第一滑轨具有相互垂直的滑动方向。Both the second slide rail and the second adjustment block are fixed on the adjustment plate, the cylinder mount is arranged on the second slide rail, and the second adjustment screw is fixed on the cylinder mount and screwed with the second adjustment block, used to control the sliding of the cylinder mounting seat on the second slide rail; wherein, the second slide rail and the first slide rail have mutually perpendicular sliding direction.

在其中一个实施例中,所述顶针调节结构还包括底座、第三调节块、第三调节螺丝及第三滑轨;In one of the embodiments, the thimble adjustment structure further includes a base, a third adjustment block, a third adjustment screw and a third slide rail;

所述第三调节块及所述第三滑轨均固定于所述底座上,所述调节板设置于所述第三滑轨上,所述第三调节螺丝固定于所述调节板上且与所述第三调节块螺接,用于控制所述调节板于所述第三滑轨上滑动;其中,所述第三滑轨、所述第二滑轨与所述第一滑轨在三维空间具有相互垂直的滑动方向。Both the third adjustment block and the third slide rail are fixed on the base, the adjustment plate is arranged on the third slide rail, the third adjustment screw is fixed on the adjustment plate and The third adjusting block is screwed, and is used to control the sliding of the adjusting plate on the third slide rail; wherein, the third slide rail, the second slide rail and the first slide rail are three-dimensionally Spaces have sliding directions perpendicular to each other.

进一步地,在其中一个实施例中,所述顶针调节结构还包括第一螺调连接板及第二螺调连接板;所述第一螺调连接板一端连接于所述调节板,另一端螺接于所述底座,用于在松开状态下使能所述调节板于所述第三滑轨上滑动,且在紧固状态下阻止所述调节板于所述第三滑轨上滑动;所述第二螺调连接板一端连接于所述调节板,另一端螺接于所述气缸安装座,用于在松开状态下使能所述气缸安装座于所述第二滑轨上滑动,且在紧固状态下阻止所述气缸安装座于所述第二滑轨上滑动。Further, in one of the embodiments, the thimble adjustment structure further includes a first screw connection plate and a second screw connection plate; one end of the first screw connection plate is connected to the adjustment plate, and the other end is screwed connected to the base, used to enable the adjustment plate to slide on the third slide rail in a loose state, and prevent the adjustment plate from sliding on the third slide rail in a fastened state; One end of the second screw-adjusting connecting plate is connected to the adjustment plate, and the other end is screwed to the cylinder mounting seat for enabling the cylinder mounting seat to slide on the second slide rail in a loosened state , and prevent the cylinder mount from sliding on the second slide rail in a fastened state.

在其中一个实施例中,所述偏心凸轮具有感应片,所述感应器为光电感应器,所述感应器用于感应光线被所述感应片遮挡时,驱动所述步进电机反向步进转动。In one of the embodiments, the eccentric cam has a sensing piece, and the sensor is a photoelectric sensor, and the sensor is used to drive the stepper motor to reversely step and rotate when the light is blocked by the sensing piece. .

在其中一个实施例中,所述感应片具有扇形结构件,所述感应器用于感应光线被所述扇形结构件遮挡时,驱动所述步进电机反向步进转动。In one embodiment, the sensing sheet has a fan-shaped structure, and the sensor is used to drive the stepping motor to reversely step and rotate when sensing light is blocked by the fan-shaped structure.

在其中一个实施例中,所述顶针导向座包括第一导向座、第一密封圈、第二导向座及第二密封圈;In one of the embodiments, the thimble guide seat includes a first guide seat, a first sealing ring, a second guide seat and a second sealing ring;

所述第二导向座固定于所述第一导向座上且通过所述第一密封圈与所述第一导向座相密封,所述顶针帽盖设于所述第二导向座上且通过所述第二密封圈与所述第二导向座相密封;The second guide seat is fixed on the first guide seat and is sealed with the first guide seat through the first sealing ring, and the thimble cap is arranged on the second guide seat and passed through the first guide seat. The second sealing ring is sealed with the second guide seat;

所述第一导向座、所述第二导向座及所述顶针帽之间共同形成所述负压腔室,所述气管接头固定于所述第一导向座上且通过所述第一导向座连通所述负压腔室;及/或,The first guide seat, the second guide seat and the thimble cap jointly form the negative pressure chamber, the air pipe joint is fixed on the first guide seat and passes through the first guide seat communicating with the negative pressure chamber; and/or,

所述顶针导向座还包括浮动轴,所述浮动轴位于所述负压腔室中;The thimble guide seat also includes a floating shaft, and the floating shaft is located in the negative pressure chamber;

所述浮动轴固定于所述浮动块或其弹性件上,所述顶针结构安装于所述浮动轴上,所述浮动轴用于在所述浮动块的作用下带动所述顶针结构相对所述顶针帽移动,以使所述顶针具有所述透出状态及所述缩入状态。The floating shaft is fixed on the floating block or its elastic member, the thimble structure is installed on the floating shaft, and the floating shaft is used to drive the thimble structure relative to the floating block under the action of the floating block. The thimble cap moves so that the thimble has the transparent state and the retracted state.

进一步地,在其中一个实施例中,所述顶针结构还包括顶针固定座及顶针锁紧帽,所述顶针固定座安装于所述顶针导向座上,所述顶针可拆卸地安装于所述顶针固定座上,所述顶针锁紧帽安装于所述顶针固定座上且在紧固状态下锁紧所述顶针。Further, in one of the embodiments, the thimble structure further includes a thimble fixing seat and a thimble locking cap, the thimble fixing seat is installed on the thimble guide seat, and the thimble is detachably installed on the thimble On the fixing seat, the thimble locking cap is installed on the thimble fixing seat and locks the thimble in a fastened state.

进一步地,在其中一个实施例中,所述顶针帽开设有过针孔及吸附孔,所述顶针穿设于所述过针孔中以抵接所述待分离物料盘的薄膜上的物料,所述吸附孔用于接触所述待分离物料盘其他位置的薄膜。Further, in one of the embodiments, the thimble cap is provided with a pin hole and an adsorption hole, and the thimble is passed through the pin hole to contact the material on the film of the material tray to be separated, The adsorption holes are used to contact the film at other positions of the material disc to be separated.

在其中一个实施例中,所述物料为芯片。In one of the embodiments, the material is a chip.

在其中一个实施例中,一种物料自动化生产设备,包括上料装置、下料装置及任一实施例所述物料自动化生产的顶升装置;In one of the embodiments, an automatic production equipment for materials, including a feeding device, a feeding device, and a jacking device for the automatic production of materials described in any embodiment;

所述上料装置用于将待分离物料盘输送至所述物料自动化生产的顶升装置的顶针帽结构;The feeding device is used to transport the material tray to be separated to the thimble cap structure of the jacking device for the automatic production of the material;

所述下料装置用于收取从待分离物料盘完成分离的物料及料盘胶膜。The unloading device is used to collect the material separated from the material tray to be separated and the film of the tray.

附图说明Description of drawings

为了更清楚地说明本申请实施例或传统技术中的技术方案,下面将对实施例或传统技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅是本申请的一些实施例,对于本领域普通技术人员而言,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or the conventional technology. Obviously, the accompanying drawings in the following description are only examples For some embodiments of the application, those skilled in the art can also obtain other drawings based on these drawings without creative work.

图1为本申请所述物料自动化生产的顶升装置一实施例的结构示意图。Fig. 1 is a schematic structural view of an embodiment of a jacking device for the automatic production of materials described in the present application.

图2为图1所示实施例的顶针帽结构的结构示意图。Fig. 2 is a structural schematic diagram of the thimble cap structure of the embodiment shown in Fig. 1 .

图3为图2所示实施例的结构分解示意图。FIG. 3 is an exploded schematic diagram of the structure of the embodiment shown in FIG. 2 .

图4为图3所示实施例的浮动块的结构示意图。FIG. 4 is a schematic structural diagram of the slider of the embodiment shown in FIG. 3 .

图5为图1所示实施例的另一标识示意图。Fig. 5 is a schematic diagram of another identification of the embodiment shown in Fig. 1 .

图6为图5所示实施例的A处放大示意图。FIG. 6 is an enlarged schematic view of A of the embodiment shown in FIG. 5 .

图7为图6所示实施例的B处放大示意图。FIG. 7 is an enlarged schematic view of B of the embodiment shown in FIG. 6 .

图8为图7所示实施例的状态对比示意图。FIG. 8 is a schematic diagram of state comparison of the embodiment shown in FIG. 7 .

图9为图1所示实施例的顶针调节结构的结构示意图。FIG. 9 is a structural schematic diagram of the ejector pin adjustment structure of the embodiment shown in FIG. 1 .

图10为图9所示实施例的结构分解示意图。FIG. 10 is an exploded schematic diagram of the structure of the embodiment shown in FIG. 9 .

图11为图1所示实施例的另一方向示意图。FIG. 11 is a schematic diagram of another direction of the embodiment shown in FIG. 1 .

图12为图11所示实施例的C处放大示意图。FIG. 12 is an enlarged schematic view of point C of the embodiment shown in FIG. 11 .

附图标记:Reference signs:

顶针调节结构100、底座101、第三调节块102、第三调节螺丝103、第三滑轨104、调节板105、第二滑轨106、气缸安装座107、第一滑轨108、气缸109、步进电机110、感应器111、感应片112、偏心凸轮113、连接板114、气缸连接块115、气缸限位块116、限位螺丝117、第一螺调连接板118、第二调节螺丝119、第二调节块120、第二螺调连接板121、轴槽122、限位槽123;Thimble adjustment structure 100, base 101, third adjustment block 102, third adjustment screw 103, third slide rail 104, adjustment plate 105, second slide rail 106, cylinder mount 107, first slide rail 108, cylinder 109, Stepping motor 110, inductor 111, induction plate 112, eccentric cam 113, connection plate 114, cylinder connection block 115, cylinder limit block 116, limit screw 117, first screw adjustment connection plate 118, second adjustment screw 119 , the second adjustment block 120, the second screw connection plate 121, the shaft groove 122, the limit groove 123;

顶针帽结构200、浮动块218、气管接头219、第一导向座220、第一密封圈221、第二导向座222、浮动轴223、第二密封圈224、顶针固定座225、顶针锁紧帽226、顶针227、顶针帽228、过针孔229、吸附孔230、顶针导向座231、本体232、形变凸出结构233、让位槽234、固定部235、弹性件236、动作承接台237、顶针结构238;Thimble cap structure 200, floating block 218, air pipe joint 219, first guide seat 220, first sealing ring 221, second guide seat 222, floating shaft 223, second sealing ring 224, thimble fixing seat 225, thimble locking cap 226, thimble 227, thimble cap 228, needle hole 229, adsorption hole 230, thimble guide seat 231, body 232, deformation protruding structure 233, give way groove 234, fixed part 235, elastic member 236, action receiving platform 237, Thimble structure 238;

透出状态300、缩入状态400。The out state 300 and the retracted state 400 .

具体实施方式Detailed ways

为使本申请的上述目的、特征和优点能够更加明显易懂,下面结合附图对本申请的具体实施方式做详细的说明。在下面的描述中阐述了很多具体细节以便于充分理解本申请。但是本申请能够以很多不同于在此描述的其它方式来实施,本领域技术人员可以在不违背本申请内涵的情况下做类似改进,因此本申请不受下面公开的具体实施例的限制。In order to make the above-mentioned purpose, features and advantages of the present application more obvious and understandable, the specific implementation manners of the present application will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the application. However, the present application can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

需要说明的是,当组件被称为“固定于”或“设置于”另一个组件,它可以直接在另一个组件上或者也可以存在居中的组件。当一个组件被认为是“连接”另一个组件,它可以是直接连接到另一个组件或者可能同时存在居中组件。本申请的说明书所使用的术语“垂直的”、“水平的”、“上”、“下”、“左”、“右”以及类似的表述只是为了说明的目的,并不表示是唯一的实施方式。It should be noted that when a component is referred to as being “fixed on” or “set on” another component, it may be directly on the other component or there may also be an intervening component. When a component is said to be "connected" to another component, it may be directly connected to the other component or there may be intervening components at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for the purpose of illustration only and do not represent the only implementation Way.

此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本申请的描述中,“多个”的含义是至少两个,例如两个,三个等,除非另有明确具体的限定。In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present application, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

在本申请中,除非另有明确的规定和限定,第一特征在第二特征“上”、“下”可以是第一特征直接和第二特征接触,或第一特征和第二特征间接地通过中间媒介接触。而且,第一特征在第二特征“之上”、“上方”和“上面”可以是第一特征在第二特征正上方或斜上方,或仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方,或仅表示第一特征水平高度小于第二特征。In this application, unless otherwise clearly specified and limited, a first feature is "on" or "under" a second feature, which means that the first feature is directly in contact with the second feature, or that the first feature and the second feature are indirectly in contact with each other. contact through an intermediary. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the level of the first feature is higher than that of the second feature. "Below", "beneath" and "under" the first feature may mean that the first feature is directly below or obliquely below the second feature, or it just means that the level of the first feature is smaller than that of the second feature.

除非另有定义,本申请的说明书所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。在本申请的说明书中所使用的术语只是为了描述具体的实施方式的目的,不是旨在于限制本申请。本申请的说明书所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。Unless otherwise defined, all technical and scientific terms used in the description of the present application have the same meaning as commonly understood by those skilled in the technical field of the present application. The terms used in the description of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The term "and/or" used in the specification of the present application includes any and all combinations of one or more related listed items.

本申请公开了一种物料自动化生产的顶升装置及物料自动化生产设备,其包括以下实施例的部分结构或全部结构;即,所述物料自动化生产的顶升装置及物料自动化生产设备包括以下的部分技术特征或全部技术特征。在本申请一个实施例中,一种物料自动化生产的顶升装置,包括顶针调节结构及顶针帽结构;所述顶针调节结构以步进驱使偏心转动方式控制所述顶针帽结构的顶针升降;所述顶针帽结构以负压吸附方式吸取待分离物料盘,通过所述顶针顶升以分离所述待分离物料盘的物料与料盘胶膜。上述物料自动化生产的顶升装置,一方面以顶针配合负压吸附方式实现压力顶升,有利于实现待分离物料盘中的物料与料盘胶膜相分离;另一方面以步进驱使偏心转动方式实现顶针升降,有利于准确控制顶针升降的精细位置,且有利于批量化的大规模重复式的无差错应用;再一方面易于配合顶针帽结构实现顶针的更换,有利于适配各种不同规格的待分离物料盘及其物料分离;又一方面由于巧妙的结构设计,有利于应用于微型物料例如微型芯片。The present application discloses a jacking device and automated material production equipment for automatic material production, which includes part or all of the structures of the following embodiments; that is, the jacking device for automatic material production and automatic material production equipment includes the following Some technical features or all technical features. In one embodiment of the present application, a jacking device for automatic production of materials includes a thimble adjustment structure and a thimble cap structure; the thimble adjustment structure controls the thimble lifting of the thimble cap structure by stepping and driving eccentric rotation; The thimble cap structure absorbs the material disc to be separated by negative pressure adsorption, and lifts up through the thimble to separate the material of the material disc to be separated from the film of the material disc. The lifting device for the automatic production of the above-mentioned materials, on the one hand, realizes the pressure lifting by means of thimble and negative pressure adsorption, which is beneficial to realize the separation of the material in the material tray to be separated from the film of the tray; on the other hand, it uses stepping to drive eccentric rotation It is beneficial to accurately control the fine position of the thimble lifting, and is conducive to large-scale repetitive error-free applications in batches; on the other hand, it is easy to cooperate with the thimble cap structure to realize the replacement of thimbles, which is conducive to adapting to various Specifications of the to-be-separated material tray and material separation; on the other hand, due to the ingenious structural design, it is beneficial to be applied to micro materials such as micro chips.

在其中一个实施例中,一种物料自动化生产的顶升装置如图1所示,其包括顶针调节结构100及顶针帽结构200;所述顶针调节结构100以步进驱使偏心转动方式控制所述顶针帽结构200的顶针升降;所述顶针帽结构200以负压吸附方式吸取待分离物料盘,通过所述顶针顶升以分离所述待分离物料盘的物料与料盘胶膜。当顶针顶升时,将物料从料盘胶膜上顶起,使得物料与料盘胶膜相分离,此状态下可通过吸取方式移开物料,然后顶针下降,继续处理所述待分离物料盘的另一物料。In one embodiment, a jacking device for automatic production of materials is shown in Figure 1, which includes a thimble adjustment structure 100 and a thimble cap structure 200; The thimble of the thimble cap structure 200 is raised and lowered; the thimble cap structure 200 absorbs the material disc to be separated by negative pressure adsorption, and is lifted by the thimble to separate the material of the material disc to be separated from the film of the material disc. When the thimble is lifted, the material is lifted from the film of the tray, so that the material is separated from the film of the tray. In this state, the material can be removed by suction, and then the thimble is lowered to continue processing the material tray to be separated. another material.

如图2所示,在其中一个实施例中,所述顶针帽结构200包括浮动块218、气管接头219、顶针导向座231、顶针结构238及顶针帽228;所述浮动块218安装于所述顶针导向座231下,所述顶针帽228盖设于所述顶针导向座231上,所述顶针帽228配合所述顶针导向座231形成负压腔室,所述顶针结构238安装于所述顶针导向座231上,且所述顶针结构238容置于所述负压腔室中,所述气管接头219用于连通真空泵及所述负压腔室。进一步地,在其中一个实施例中,所述气管接头219的数量为两个,其中一个连通真空泵及所述负压腔室,另一个连通气阀及所述负压腔室,分别用于受控从所述负压腔室抽气及补充外部空气进入所述负压腔室。这样的设计,通过真空泵的配合,有利于快速且准确地控制所述负压腔室的负压状态,从而准确地吸附待分离物料盘的料盘胶膜,实现待分离物料盘及其物料分离,即实现待分离物料盘的物料与料盘胶膜相分离。As shown in Figure 2, in one of the embodiments, the thimble cap structure 200 includes a floating block 218, a gas pipe joint 219, a thimble guide seat 231, a thimble structure 238 and a thimble cap 228; the floating block 218 is installed on the Under the thimble guide seat 231, the thimble cap 228 is covered on the thimble guide seat 231, the thimble cap 228 cooperates with the thimble guide seat 231 to form a negative pressure chamber, and the thimble structure 238 is installed on the thimble The thimble structure 238 is accommodated in the negative pressure chamber, and the air pipe joint 219 is used to communicate with the vacuum pump and the negative pressure chamber. Further, in one of the embodiments, the number of the air pipe joints 219 is two, one of which communicates with the vacuum pump and the negative pressure chamber, and the other communicates with the air valve and the negative pressure chamber, respectively for receiving The control pumps air from the negative pressure chamber and supplements external air into the negative pressure chamber. Such a design, through the cooperation of the vacuum pump, is conducive to quickly and accurately controlling the negative pressure state of the negative pressure chamber, so as to accurately absorb the material tray film of the material tray to be separated, and realize the separation of the material tray and its materials. , that is to realize the separation of the material in the material tray to be separated from the film of the tray.

结合图3,在其中一个实施例中,所述顶针导向座231包括第一导向座220、第一密封圈221、第二导向座222及第二密封圈224;所述第二导向座222固定于所述第一导向座220上且通过所述第一密封圈221与所述第一导向座220相密封,所述顶针帽228盖设于所述第二导向座222上且通过所述第二密封圈224与所述第二导向座222相密封;所述第一导向座220、所述第二导向座222及所述顶针帽228之间共同形成所述负压腔室,所述气管接头219固定于所述第一导向座220上且通过所述第一导向座220连通所述负压腔室;在其中一个实施例中,所述顶针导向座231还包括浮动轴223,所述浮动轴223位于所述负压腔室中;所述浮动轴223固定于所述浮动块218或其弹性件236上,所述顶针结构238安装于所述浮动轴223上,所述浮动轴223用于在所述浮动块218的作用下带动所述顶针结构238相对所述顶针帽228移动,如图6及图7所示,以使所述顶针227具有所述透出状态300,或者如图8所示,所述浮动轴223用于在所述浮动块218的作用下带动所述顶针结构238相对所述顶针帽228移动,以使所述顶针227具有所述缩入状态400。这样的设计,有利于实现往复运动的顶升结构,整体结构紧凑简洁,且具有结构简单的优点。3, in one embodiment, the thimble guide seat 231 includes a first guide seat 220, a first seal ring 221, a second guide seat 222 and a second seal ring 224; the second guide seat 222 is fixed On the first guide seat 220 and sealed with the first guide seat 220 through the first sealing ring 221, the thimble cap 228 is covered on the second guide seat 222 and passed through the first guide seat 220 Two sealing rings 224 are sealed with the second guide seat 222; the negative pressure chamber is jointly formed between the first guide seat 220, the second guide seat 222 and the thimble cap 228, and the trachea The joint 219 is fixed on the first guide seat 220 and communicates with the negative pressure chamber through the first guide seat 220; in one embodiment, the thimble guide seat 231 also includes a floating shaft 223, the The floating shaft 223 is located in the negative pressure chamber; the floating shaft 223 is fixed on the floating block 218 or its elastic member 236, the thimble structure 238 is installed on the floating shaft 223, and the floating shaft 223 It is used to drive the thimble structure 238 to move relative to the thimble cap 228 under the action of the floating block 218, as shown in FIG. 6 and FIG. 7, so that the thimble 227 has the transparent state 300, or as As shown in FIG. 8 , the floating shaft 223 is used to drive the thimble structure 238 to move relative to the thimble cap 228 under the action of the floating block 218 , so that the thimble 227 has the retracted state 400 . Such a design is conducive to the realization of a reciprocating jacking structure, and the overall structure is compact and simple, and has the advantage of a simple structure.

如图3所示,在其中一个实施例中,所述顶针结构238包括顶针227,进一步地,所述顶针结构238还包括顶针固定座225及顶针锁紧帽226,所述顶针固定座225安装于所述顶针导向座231上,所述顶针227可拆卸地安装于所述顶针固定座225上,所述顶针锁紧帽226安装于所述顶针固定座225上且在紧固状态下锁紧所述顶针227。在其中一个实施例中,所述顶针调节结构100以步进驱使偏心转动方式控制所述顶针帽结构200的顶针227升降;所述顶针帽结构200以负压吸附方式吸取待分离物料盘,通过所述顶针227顶升以分离所述待分离物料盘的物料与料盘胶膜;所述顶针结构238的顶针227设置于所述浮动块218上,且在所述浮动块218的作用下具有相对所述顶针帽228的透出状态300如图7所示,以及具有相对所述顶针帽228的缩入状态400如图8所示;所述浮动轴223用于在所述浮动块218的作用下带动所述顶针结构238相对所述顶针帽228移动,以使所述顶针227具有所述透出状态300及所述缩入状态400。这样的设计,可以为设备提供适用于不同微型尺寸规格物料的顶升结构,且解决微型物料例如微型芯片取料时易与上料料盘胶膜即蓝膜相粘连的情况,以实现设备的通用性,自动上料的高精度和高稳定性。As shown in Figure 3, in one of the embodiments, the thimble structure 238 includes a thimble 227, further, the thimble structure 238 also includes a thimble fixing seat 225 and a thimble locking cap 226, and the thimble fixing seat 225 is installed On the thimble guide seat 231, the thimble 227 is detachably mounted on the thimble fixing seat 225, and the thimble locking cap 226 is installed on the thimble fixing seat 225 and locked in a fastened state The thimble 227 . In one of the embodiments, the thimble adjustment structure 100 controls the lift of the thimble 227 of the thimble cap structure 200 in a step-by-step driving eccentric rotation manner; The thimble 227 is lifted to separate the material of the material tray to be separated from the film of the tray; the thimble 227 of the thimble structure 238 is arranged on the floating block 218, and has a The penetrating state 300 relative to the thimble cap 228 is shown in FIG. 7 , and the retracted state 400 relative to the thimble cap 228 is shown in FIG. 8 ; Under the action, the thimble structure 238 is driven to move relative to the thimble cap 228 , so that the thimble 227 has the transparent state 300 and the retracted state 400 . Such a design can provide the equipment with a jacking structure suitable for materials of different micro sizes, and solve the problem that micro materials such as micro chips are easy to stick to the plastic film of the feeding tray, that is, the blue film, so as to realize the safety of the equipment. Versatility, high precision and high stability of automatic feeding.

结合图7及图8,进一步地,在其中一个实施例中,所述顶针帽228开设有过针孔229及吸附孔230,所述顶针227穿设于所述过针孔229中以抵接所述待分离物料盘的薄膜上的物料,所述吸附孔230用于接触所述待分离物料盘其他位置的薄膜。在其中一个实施例中,所述物料为芯片。本申请各实施例涉及物料半导体类自动化生产设备,可实现多规格微型半导体尤其是多规格芯片在自动化设备中料和料盘分离,此方法主要用于物料测试中取料过程中,单个来料与蓝膜分离,辅助自动上料吸嘴取料,使得自动化操作更精确。现有设备无此结构,在取料过程中会发生漏料,来料物料取料时与来料物料放置的蓝膜粘连,取料位置不准确,效率低等问题。7 and 8, further, in one embodiment, the thimble cap 228 is provided with a needle hole 229 and an adsorption hole 230, and the thimble 227 is passed through the needle hole 229 to abut against The material on the film of the material tray to be separated, the adsorption hole 230 is used to contact the film at other positions of the material plate to be separated. In one of the embodiments, the material is a chip. Each embodiment of the present application relates to automatic production equipment for material semiconductors, which can realize the separation of multi-standard micro-semiconductors, especially multi-standard chips, from the material tray in the automatic equipment. Separated from the blue film, it assists the automatic feeding nozzle to take out the material, making the automatic operation more accurate. Existing equipment does not have this structure, material leakage will occur during the retrieving process, the incoming material will stick to the blue film placed on the incoming material when retrieving, the retrieving position is inaccurate, and the efficiency is low.

为了提高分离效率,在其中一个实施例中,所述顶针227的数量为至少二个,且各所述顶针227规则排列;进一步地,在其中一个实施例中,各所述顶针227规则排列直线形或者矩阵形状等。进一步地,在其中一个实施例中,各所述顶针227之间间隔至少一个物料位置,即每次被分离的至少两个物料之间,间隔有其他未被分离的至少一个物料。这样的设计,有利于一次分离多个物料例如多个芯片。In order to improve separation efficiency, in one of the embodiments, the number of the thimbles 227 is at least two, and each of the thimbles 227 is regularly arranged; further, in one of the embodiments, each of the thimbles 227 is regularly arranged in a straight line shape or matrix shape etc. Further, in one of the embodiments, there is at least one material position between each ejector pin 227 , that is, at least one material that is not separated is separated between at least two materials that are separated each time. Such a design is beneficial to separate multiple materials such as multiple chips at one time.

为了精确控制顶针的顶升高度及在顶升过程中避免损伤物料,进一步地,在其中一个实施例中,如图4所示,所述浮动块218包括本体232、形变凸出结构233、固定部235及弹性件236;所述形变凸出结构233及所述固定部235均设置于所述本体232上且分别位于所述本体232的两侧,所述固定部235安装于所述顶针导向座231或其第一导向座220下;结合图5及图6,所述浮动块218于所述形变凸出结构233与所述本体232之间开设有让位槽234,所述形变凸出结构233相对于所述本体232在所述让位槽234中具有形变状态;结合图3,所述弹性件236穿过所述本体232安装于所述浮动块218上,所述顶针227设置于所述弹性件236上。进一步地,在其中一个实施例中,所述浮动块218还包括安装于所述弹性件236上的动作承接台237,所述顶针227设置于所述动作承接台237上。In order to precisely control the lifting height of the thimble and avoid damage to the material during the lifting process, further, in one embodiment, as shown in FIG. part 235 and elastic part 236; the deformation protruding structure 233 and the fixing part 235 are both arranged on the body 232 and are respectively located on both sides of the body 232, and the fixing part 235 is installed on the thimble guide Seat 231 or its first guide seat 220; with reference to Figure 5 and Figure 6, the floating block 218 has a relief groove 234 between the deformation protruding structure 233 and the body 232, and the deformation protruding The structure 233 has a deformed state in the relief groove 234 relative to the body 232; referring to FIG. on the elastic member 236 . Further, in one of the embodiments, the floating block 218 further includes an action receiving platform 237 installed on the elastic member 236 , and the thimble 227 is arranged on the action receiving platform 237 .

各实施例中,如图9及图10所示,所述顶针调节结构100包括步进电机110、感应器111、偏心凸轮113及连接板114;并且,所述步进电机110及所述感应器111均固定于所述连接板114上,且所述步进电机110与所述感应器111电连接。结合图5及图6,所述顶针导向座231固定于所述连接板114上;在其中一个实施例中,所述顶针导向座231的第一导向座220固定于所述连接板114上。并且,所述偏心凸轮113安装于所述步进电机110的输出轴上,所述偏心凸轮113邻近所述感应器111,且所述偏心凸轮113与所述浮动块218相接触,所述偏心凸轮113用于在所述输出轴带动下以相异位置抵接所述浮动块218以控制所述顶针227的位置,使得所述顶针227处于所述透出状态300或所述顶针227处于所述缩入状态400;即所述偏心凸轮113与所述浮动块218始终处于接触状态,例如两者形成点接触或者线接触,所述偏心凸轮113最顶端处于不同圆弧点时,所述顶针227所处的突出高度不同,从而实现顶出的高度精确限制,以达成物料与料盘胶膜相分离的目的。所述偏心凸轮113还用于在转动到所述感应器111处时,由所述感应器111驱动所述步进电机110反向步进转动,以使所述偏心凸轮113调整转动方向。进一步地,这样的设计,通过控制偏心凸轮113与步进电机110轴心的偏心距设计,即可控制顶针的上下升降距离,形成了精准的往复行程控制,从而提供了结构简单、位置精确的顶升机构,运行故障率低,对物料损伤可能性极小,无论是取样分离还是规模分离均适用。In each embodiment, as shown in Figure 9 and Figure 10, the thimble adjustment structure 100 includes a stepping motor 110, an inductor 111, an eccentric cam 113 and a connecting plate 114; and, the stepping motor 110 and the induction The sensors 111 are fixed on the connection board 114 , and the stepper motor 110 is electrically connected to the inductor 111 . Referring to FIG. 5 and FIG. 6 , the thimble guide seat 231 is fixed on the connection plate 114 ; in one embodiment, the first guide seat 220 of the thimble guide seat 231 is fixed on the connection plate 114 . And, the eccentric cam 113 is installed on the output shaft of the stepping motor 110, the eccentric cam 113 is adjacent to the inductor 111, and the eccentric cam 113 is in contact with the slider 218, the eccentric The cam 113 is used to abut against the floating block 218 at different positions driven by the output shaft to control the position of the thimble 227, so that the thimble 227 is in the transparent state 300 or the thimble 227 is in the stated position. The retracted state 400; that is, the eccentric cam 113 and the floating block 218 are always in a contact state, for example, the two form point contact or line contact. When the topmost ends of the eccentric cam 113 are at different arc points, the thimble The protruding heights of 227 are different, so as to realize the precise limit of the ejection height, so as to achieve the purpose of separating the material from the film of the tray. The eccentric cam 113 is also used to drive the stepper motor 110 to rotate in a reverse step direction by the inductor 111 when it rotates to the sensor 111 , so that the eccentric cam 113 can adjust the direction of rotation. Furthermore, such a design, by controlling the eccentricity design of the eccentric cam 113 and the axis of the stepper motor 110, can control the up and down lift distance of the thimble, forming a precise reciprocating stroke control, thereby providing a simple structure and accurate position. The jacking mechanism has a low operation failure rate, and the possibility of damage to the material is extremely small, and it is applicable to both sampling separation and scale separation.

基于缩小占位面积的考虑,进一步地,在其中一个实施例中,如图10所示,所述连接板114开设有轴槽122,所述输出轴穿过所述轴槽122,所述偏心凸轮113与所述步进电机110分别位于所述连接板114的两侧。这样的设计,通过两侧的平衡设计,有利于缩小所述物料自动化生产的顶升装置的外形尺寸,从而有利于增加所述物料自动化生产的顶升装置的分布密度,形成物料分离阵列,进而实现小厂房的大批量分离处理,在有限的生产面积提升了分离的效率及产能。Based on the consideration of reducing the occupied area, further, in one of the embodiments, as shown in FIG. The cam 113 and the stepping motor 110 are respectively located on two sides of the connecting plate 114 . Such a design, through the balanced design on both sides, is conducive to reducing the overall size of the lifting device for the automatic production of the material, thereby helping to increase the distribution density of the lifting device for the automatic production of the material, forming a material separation array, and then Realize large-scale separation processing in small workshops, and improve separation efficiency and production capacity in a limited production area.

在其中一个实施例中,如图11及图12所示,所述顶针调节结构100还包括气缸安装座107、第一滑轨108及气缸109;所述第一滑轨108及所述气缸109均固定于所述气缸安装座107上,所述连接板114设置于所述第一滑轨108上,所述气缸109驱动连接所述连接板114以使所述连接板114于所述第一滑轨108上滑动,用于初步定位所述顶针帽结构200以配合所述偏心凸轮113实现精准定位;进一步地,即以步进驱使偏心转动方式实现精准定位顶升物料使得物料从料盘胶膜分离,如有必要可以通过气缸驱动顶针导向座带动顶针结构及顶针帽整体从第一滑轨滑动,从而实现快速的粗略定位,结合后面具有第二滑轨及第三滑轨的实施例,有利于在三维空间沿着空间直角坐标系的定位,准确控制所述顶针的位置。In one of the embodiments, as shown in Figure 11 and Figure 12, the thimble adjustment structure 100 also includes a cylinder mounting seat 107, a first slide rail 108 and a cylinder 109; the first slide rail 108 and the cylinder 109 are all fixed on the cylinder mounting seat 107, the connecting plate 114 is arranged on the first slide rail 108, and the cylinder 109 drives and connects the connecting plate 114 so that the connecting plate 114 is on the first sliding rail 108. Sliding on the slide rail 108 is used to initially position the thimble cap structure 200 to cooperate with the eccentric cam 113 to achieve precise positioning; Membrane separation, if necessary, the thimble guide seat can be driven by the cylinder to drive the thimble structure and the thimble cap to slide from the first slide rail as a whole, so as to achieve rapid and rough positioning. Combined with the embodiment with the second slide rail and the third slide rail later, It is beneficial to the positioning along the space rectangular coordinate system in the three-dimensional space, and accurately controls the position of the thimble.

为了避免在顶升中损伤物料,进一步地,在其中一个实施例中,如图12所示,所述顶针调节结构100还包括气缸连接块115、气缸限位块116及限位螺丝117;所述气缸109的输出部通过所述气缸连接块115连接所述连接板114;所述气缸限位块116固定于所述气缸安装座107上且开设有限位槽123;所述气缸连接块115部分容置于所述限位槽123中,所述限位螺丝117安装于所述气缸限位块116上且至少部分可调节地位于所述限位槽123中,所述限位螺丝117通过其凸出于所述限位槽123中的长度,限制所述气缸连接块115于所述限位槽123中的最大高度。这样的设计,有利于保护物料,尤其是配合限位螺丝使得所述物料自动化生产的顶升装置适配于各种不同规格物料的分离处理。In order to avoid damage to materials during jacking, further, in one embodiment, as shown in Figure 12, the thimble adjustment structure 100 also includes a cylinder connection block 115, a cylinder limit block 116 and a limit screw 117; The output portion of the cylinder 109 is connected to the connection plate 114 through the cylinder connection block 115; the cylinder limit block 116 is fixed on the cylinder mounting seat 107 and has a limit groove 123; the cylinder connection block 115 part Accommodated in the limiting groove 123, the limiting screw 117 is installed on the cylinder limiting block 116 and at least partially adjustable in the limiting groove 123, the limiting screw 117 passes through it The length protruding from the limiting groove 123 limits the maximum height of the cylinder connecting block 115 in the limiting groove 123 . Such a design is beneficial to the protection of the materials, especially the jacking device for automatic production of the materials with the limit screw is suitable for the separation and treatment of various materials of different specifications.

在其中一个实施例中,如图9及图10所示,所述顶针调节结构100还包括调节板105、第二滑轨106、第二调节螺丝119及第二调节块120;所述第二滑轨106及所述第二调节块120均固定于所述调节板105上,所述气缸安装座107设置于所述第二滑轨106上,所述第二调节螺丝119固定于所述气缸安装座107上且与所述第二调节块120螺接,用于控制所述气缸安装座107于所述第二滑轨106上滑动;其中,所述第二滑轨106与所述第一滑轨108具有相互垂直的滑动方向。这样就实现了二维方向的定位调整。In one embodiment, as shown in Figures 9 and 10, the thimble adjustment structure 100 further includes an adjustment plate 105, a second slide rail 106, a second adjustment screw 119 and a second adjustment block 120; the second Both the slide rail 106 and the second adjustment block 120 are fixed on the adjustment plate 105, the cylinder mount 107 is arranged on the second slide rail 106, and the second adjustment screw 119 is fixed on the cylinder On the mounting base 107 and screwed with the second adjustment block 120, it is used to control the sliding of the cylinder mounting base 107 on the second slide rail 106; wherein, the second slide rail 106 is connected with the first slide rail 106 The sliding rails 108 have sliding directions perpendicular to each other. In this way, the positioning adjustment in the two-dimensional direction is realized.

在其中一个实施例中,如图9及图10所示,所述顶针调节结构100还包括底座101、第三调节块102、第三调节螺丝103及第三滑轨104;所述第三调节块102及所述第三滑轨104均固定于所述底座101上,所述调节板105设置于所述第三滑轨104上,所述第三调节螺丝103固定于所述调节板105上且与所述第三调节块102螺接,用于控制所述调节板105于所述第三滑轨104上滑动;其中,所述第三滑轨104、所述第二滑轨106与所述第一滑轨108在三维空间具有相互垂直的滑动方向。这样就实现了三维方向的定位调整。In one of the embodiments, as shown in Figure 9 and Figure 10, the thimble adjustment structure 100 further includes a base 101, a third adjustment block 102, a third adjustment screw 103 and a third slide rail 104; the third adjustment Both the block 102 and the third slide rail 104 are fixed on the base 101, the adjustment plate 105 is arranged on the third slide rail 104, and the third adjustment screw 103 is fixed on the adjustment plate 105 And screwed with the third adjustment block 102, used to control the adjustment plate 105 to slide on the third slide rail 104; wherein, the third slide rail 104, the second slide rail 106 and the The first sliding rails 108 have sliding directions perpendicular to each other in three-dimensional space. In this way, the positioning adjustment in the three-dimensional direction is realized.

进一步地,在其中一个实施例中,如图9及图10所示,所述顶针调节结构100还包括第一螺调连接板118及第二螺调连接板121;所述第一螺调连接板118一端连接于所述调节板105,另一端螺接于所述底座101,用于在松开状态下使能所述调节板105于所述第三滑轨104上滑动,且在紧固状态下阻止所述调节板105于所述第三滑轨104上滑动;所述第二螺调连接板121一端连接于所述调节板105,另一端螺接于所述气缸安装座107,用于在松开状态下使能所述气缸安装座107于所述第二滑轨106上滑动,且在紧固状态下阻止所述气缸安装座107于所述第二滑轨106上滑动。这样的设计,有利于简单便捷地调整顶针与待分离物料盘的相对位置,有利于在顶升分离之前,准确调整所述顶针在升降方向的位置,确保后续的顶升操作过程中,所述顶针只需在升降方向进行移动即可。Further, in one of the embodiments, as shown in FIG. 9 and FIG. 10 , the thimble adjustment structure 100 also includes a first screw connection plate 118 and a second screw connection plate 121; the first screw connection One end of the plate 118 is connected to the adjustment plate 105, and the other end is screwed to the base 101, for enabling the adjustment plate 105 to slide on the third slide rail 104 in the loosened state, and when fastened prevent the adjustment plate 105 from sliding on the third slide rail 104; one end of the second screw connection plate 121 is connected to the adjustment plate 105, and the other end is screwed to the cylinder mounting seat 107 for The cylinder mount 107 is allowed to slide on the second slide rail 106 in the loose state, and the cylinder mount 107 is prevented from sliding on the second slide rail 106 in the fastened state. Such a design is conducive to simply and conveniently adjusting the relative position of the thimble and the material tray to be separated, and is conducive to accurately adjusting the position of the thimble in the lifting direction before jacking and separation, so as to ensure that during the subsequent jacking operation, the The thimble only needs to move in the lifting direction.

如图9及图10所示,在其中一个实施例中,所述偏心凸轮113具有感应片112,所述感应器111为光电感应器,所述感应器111用于感应光线被所述感应片112遮挡时,驱动所述步进电机110反向步进转动。在其中一个实施例中,所述感应片112具有扇形结构件,所述感应器111用于感应光线被所述扇形结构件遮挡时,驱动所述步进电机110反向步进转动。这样的设计,有利于实现低故障率的重复运动,且实现成本低,占用空间小,因此具有较高的适用性。As shown in Fig. 9 and Fig. 10, in one of the embodiments, the eccentric cam 113 has a sensor 112, the sensor 111 is a photoelectric sensor, and the sensor 111 is used to sense that light is detected by the sensor When 112 is blocked, the stepper motor 110 is driven to rotate in reverse steps. In one embodiment, the sensing sheet 112 has a fan-shaped structure, and the sensor 111 is used to drive the stepping motor 110 to reversely step and rotate when the light is blocked by the fan-shaped structure. Such a design is conducive to realizing repetitive motion with a low failure rate, and has low cost and small footprint, so it has high applicability.

下面继续结合图1至图12,继续对本申请所述物料自动化生产的顶升装置作出具体说明。The following will continue to describe the jacking device for the automatic production of materials described in this application in conjunction with FIGS. 1 to 12 .

本顶升装置主要包括顶针调节结构100和顶针帽结构200,还可以包括真空泵、气阀及相关的电控设备。The jacking device mainly includes a thimble adjusting structure 100 and a thimble cap structure 200, and may also include a vacuum pump, an air valve and related electric control equipment.

顶针调节结构100包括底座101;安装于底座101上的第三调节块102、第三调节螺丝103、第三滑轨104、调节板105;安装于调节板105上的第二滑轨106、气缸安装座107;安装于气缸安装座107上的第一滑轨108及气缸109;位于第一滑轨108上连接的连接板114;位于连接板114上的步进电机110、感应器111、气缸连接块115、气缸限位块116、限位螺丝117;安装于步进电机110上的偏心凸轮113及感应片112。The thimble adjustment structure 100 includes a base 101; a third adjustment block 102, a third adjustment screw 103, a third slide rail 104, and an adjustment plate 105 installed on the base 101; a second slide rail 106 installed on the adjustment plate 105, a cylinder Mounting seat 107; the first slide rail 108 and cylinder 109 installed on the cylinder mounting seat 107; the connection plate 114 connected on the first slide rail 108; the stepper motor 110, inductor 111, cylinder positioned on the connection plate 114 The connection block 115 , the cylinder limit block 116 , the limit screw 117 ; the eccentric cam 113 and the induction plate 112 installed on the stepper motor 110 .

顶针帽结构200包括浮动块218,气管接头219,第一导向座220:以及安装在第一导向座220上的第一密封圈221、第二导向座222及顶针固定座225,安装在第二导向座222上的第二密封圈224,以及安装在顶针固定座225上的顶针锁紧帽226、顶针227,还有安装在第二导向座222上的顶针帽228。The thimble cap structure 200 includes a floating block 218, an air pipe joint 219, a first guide seat 220: and a first sealing ring 221 installed on the first guide seat 220, a second guide seat 222 and a thimble holder 225, which are installed on the second guide seat 220. The second sealing ring 224 on the guide seat 222 , the thimble locking cap 226 and the thimble 227 installed on the thimble fixing seat 225 , and the thimble cap 228 installed on the second guide seat 222 .

顶针调节结构的原理说明如下:气缸109通过第一滑轨108带动连接板114,从而带动顶针帽结构运动至所需高度粗定位,步进电机110开始启动,带动偏心凸轮113运动,从而带动顶针帽结构200运动。The principle of the thimble adjustment structure is explained as follows: the cylinder 109 drives the connecting plate 114 through the first slide rail 108, thereby driving the thimble cap structure to move to the required height for rough positioning, the stepping motor 110 starts to drive the eccentric cam 113 to move, thereby driving the thimble Cap structure 200 movements.

顶针帽结构200的原理说明如下:步进电机110带动偏心凸轮113凸轮的圆心与电机轴偏心,偏心的圆心距为顶针帽结构中顶针227可以上下往复运动的距离,偏心凸轮113与浮动块218点接触,偏心凸轮113转动时带动浮动块218上下运动,最高点与最低点的差值为步进电机110轴心与偏心凸轮113轴心的距离。The principle of the thimble cap structure 200 is explained as follows: the stepper motor 110 drives the eccentric cam 113. The center of the cam is eccentric to the motor shaft. Point contact, when the eccentric cam 113 rotates, it drives the floating block 218 to move up and down, and the difference between the highest point and the lowest point is the distance between the axis of the stepper motor 110 and the axis of the eccentric cam 113 .

顶针帽结构200的步进电机110中浮动块218连接浮动轴223,顶针固定座225连接与顶针227连接,顶升最大行程时,顶针227会穿过顶针帽228上的过针孔229,超出高度就是将物料从上料蓝膜上顶升的高度,同时气管接头219抽真空,将整个顶针帽结构200内部形成负压状态乃至于接近真空状态,即顶针帽228的内部形成负压状态例如接近真空状态,物料上料的蓝膜吸附在顶针帽228上,这样更好地使物料和蓝膜分离。In the stepper motor 110 of the thimble cap structure 200, the floating block 218 is connected to the floating shaft 223, and the thimble holder 225 is connected to the thimble 227. When the maximum stroke is lifted, the thimble 227 will pass through the needle hole 229 on the thimble cap 228, beyond The height is the height at which the material is lifted from the feeding blue film. At the same time, the air pipe joint 219 is evacuated to form a negative pressure state inside the entire thimble cap structure 200 or even close to a vacuum state, that is, a negative pressure state is formed inside the thimble cap 228, for example Close to the vacuum state, the blue film of material feeding is adsorbed on the thimble cap 228, so that the material and the blue film can be separated better.

上述物料自动化生产的顶升装置的具体结构可作为设备的通用顶升装置,通过偏心凸轮113的带动,实现了步进电机110带动的结构在与步进电机110垂直90°的方向做竖直往复运动,针对不同的往复行程需求,只需调整偏心凸轮113大小以及偏心凸轮113与步进电机110轴心的偏心距离,结构其余整体形状和原理不变,因此具有很强的通用性。The specific structure of the jacking device for the automatic production of the above materials can be used as a general jacking device for the equipment. Driven by the eccentric cam 113, the structure driven by the stepping motor 110 can be vertically positioned in a direction 90° perpendicular to the stepping motor 110. Reciprocating motion, for different reciprocating stroke requirements, only need to adjust the size of the eccentric cam 113 and the eccentric distance between the eccentric cam 113 and the axis of the stepping motor 110, and the overall shape and principle of the structure remain unchanged, so it has strong versatility.

在其中一个实施例中,一种物料自动化生产设备,包括上料装置、下料装置及任一实施例所述物料自动化生产的顶升装置;所述上料装置用于将待分离物料盘输送至所述物料自动化生产的顶升装置的顶针帽结构;所述下料装置用于收取从待分离物料盘完成分离的物料及料盘胶膜。这样的设计,一方面以顶针配合负压吸附方式实现压力顶升,有利于实现待分离物料盘中的物料与料盘胶膜相分离;另一方面以步进驱使偏心转动方式实现顶针升降,有利于准确控制顶针升降的精细位置,且有利于批量化的大规模重复式的无差错应用;再一方面易于配合顶针帽结构实现顶针的更换,有利于适配各种不同规格的待分离物料盘及其物料分离;又一方面由于巧妙的结构设计,有利于应用于微型物料例如微型芯片。In one of the embodiments, an automatic material production equipment includes a feeding device, a feeding device, and a jacking device for the automatic production of materials described in any embodiment; the feeding device is used to transport the material tray to be separated The thimble cap structure of the jacking device for the automatic production of the material; the unloading device is used to collect the material separated from the material tray to be separated and the film of the tray. Such a design, on the one hand, uses the thimble to cooperate with the negative pressure adsorption method to realize the pressure lift, which is beneficial to realize the separation of the material in the material tray to be separated from the film of the tray; It is conducive to accurate control of the fine position of the thimble lifting, and is conducive to large-scale repetitive error-free application in batches; on the other hand, it is easy to cooperate with the structure of the thimble cap to realize the replacement of the thimble, which is conducive to adapting to various specifications of materials to be separated The disk and its material are separated; on the other hand, due to the ingenious structural design, it is beneficial to apply to micro materials such as micro chips.

需要说明的是,本申请的其它实施例还包括,上述各实施例中的技术特征相互组合所形成的、能够实施的物料自动化生产的顶升装置及物料自动化生产设备。It should be noted that other embodiments of the present application also include jacking devices and automatic material production equipment formed by combining the technical features of the above-mentioned embodiments, which can be implemented for automatic production of materials.

以上所述实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

以上所述实施例仅表达了本申请的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对申请专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本申请构思的前提下,还可以做出若干变形和改进,这些都属于本申请的保护范围。因此,本申请的专利保护范围应以所附权利要求为准。The above-mentioned embodiments only express several implementation modes of the present application, and the description thereof is relatively specific and detailed, but should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of this application should be based on the appended claims.

Claims (10)

1. The jacking device for automatic material production is characterized by comprising a thimble adjusting structure (100) and a thimble cap structure (200);
The thimble adjusting structure (100) drives the thimble (227) of the thimble cap structure (200) to lift in a stepping and eccentric rotation mode;
the thimble cap structure (200) absorbs the material disc to be separated in a negative pressure adsorption mode, and the thimble cap structure is lifted through the thimble (227) to separate the material of the material disc to be separated from the material disc adhesive film.
2. The jacking device for automated production of materials as claimed in claim 1, wherein the thimble cap structure (200) includes a slider (218), an air tube connector (219), a thimble guide seat (231), a thimble structure (238), and a thimble cap (228);
the floating block (218) is arranged below the thimble guide seat (231), the thimble structure (238) is arranged on the thimble guide seat (231), the thimble cap (228) is covered on the thimble guide seat (231), the thimble (227) of the thimble structure (238) is arranged on the floating block (218), and the floating block (218) has a penetrating state (300) and a retracting state (400) relative to the thimble cap (228); the thimble cap (228) is matched with the thimble guide seat (231) to form a negative pressure chamber, the thimble structure (238) is accommodated in the negative pressure chamber, and the air pipe connector (219) is used for communicating a vacuum pump with the negative pressure chamber;
The thimble adjusting structure (100) comprises a stepping motor (110), an inductor (111), an eccentric cam (113) and a connecting plate (114);
the thimble guide seat (231), the stepping motor (110) and the inductor (111) are all fixed on the connecting plate (114), the stepping motor (110) is electrically connected with the inductor (111), the eccentric cam (113) is installed on an output shaft of the stepping motor (110), the eccentric cam (113) is adjacent to the inductor (111) and is in contact with the floating block (218), and the eccentric cam (113) is used for abutting against the floating block (218) at different positions under the drive of the output shaft so as to control the position of the thimble (227), so that the thimble (227) is in a penetrating state (300) or a retracting state (400); the eccentric cam (113) is further configured to drive the stepping motor (110) to reversely rotate in a stepping manner by the sensor (111) when rotating to the sensor (111), so that the eccentric cam (113) adjusts the rotation direction.
3. The jacking device for automatic production of materials according to claim 2, wherein the thimble adjusting structure (100) further comprises a cylinder mounting seat (107), a first slide rail (108) and a cylinder (109);
the first slide rail (108) and the air cylinder (109) are both fixed on the air cylinder mounting seat (107), the connecting plate (114) is arranged on the first slide rail (108), the air cylinder (109) is in driving connection with the connecting plate (114) so that the connecting plate (114) slides on the first slide rail (108) and is used for preliminarily positioning the thimble cap structure (200) to be matched with the eccentric cam (113) to realize accurate positioning.
4. The jacking device for automated production of materials according to claim 3, wherein the thimble adjustment structure (100) further comprises an adjustment plate (105), a second slide rail (106), a second adjustment screw (119), and a second adjustment block (120);
the second sliding rail (106) and the second adjusting block (120) are both fixed on the adjusting plate (105), the cylinder mounting seat (107) is arranged on the second sliding rail (106), and the second adjusting screw (119) is fixed on the cylinder mounting seat (107) and is in threaded connection with the second adjusting block (120) for controlling the cylinder mounting seat (107) to slide on the second sliding rail (106); the second sliding rail (106) and the first sliding rail (108) have mutually perpendicular sliding directions.
5. The jacking device for automatic material production according to claim 4, wherein the thimble adjusting structure (100) further comprises a base (101), a third adjusting block (102), a third adjusting screw (103) and a third sliding rail (104);
the third adjusting block (102) and the third sliding rail (104) are both fixed on the base (101), the adjusting plate (105) is arranged on the third sliding rail (104), and the third adjusting screw (103) is fixed on the adjusting plate (105) and is in threaded connection with the third adjusting block (102) for controlling the adjusting plate (105) to slide on the third sliding rail (104); the third sliding rail (104), the second sliding rail (106) and the first sliding rail (108) have mutually perpendicular sliding directions in a three-dimensional space.
6. The jacking device for automatic material production according to claim 2, wherein the eccentric cam (113) is provided with a sensing piece (112), the sensor (111) is a photoelectric sensor, and the sensor (111) is used for driving the stepping motor (110) to reversely rotate in a stepping manner when sensing light shielded by the sensing piece (112).
7. The jacking device for automatic material production according to claim 6, wherein the sensing piece (112) is provided with a fan-shaped structural member, and the sensor (111) is used for driving the stepping motor (110) to reversely rotate in a stepping manner when light is shielded by the fan-shaped structural member.
8. The jacking device for automatic material production according to claim 2, wherein the thimble guide seat (231) comprises a first guide seat (220), a first sealing ring (221), a second guide seat (222) and a second sealing ring (224);
the second guide seat (222) is fixed on the first guide seat (220) and is sealed with the first guide seat (220) through the first sealing ring (221), and the thimble cap (228) is covered on the second guide seat (222) and is sealed with the second guide seat (222) through the second sealing ring (224);
The first guide seat (220), the second guide seat (222) and the thimble cap (228) form the negative pressure chamber together, and the air pipe connector (219) is fixed on the first guide seat (220) and is communicated with the negative pressure chamber through the first guide seat (220); and/or the number of the groups of groups,
the thimble guide seat (231) further comprises a floating shaft (223), and the floating shaft (223) is positioned in the negative pressure chamber;
the floating shaft (223) is fixed on the floating block (218) or an elastic piece (236) thereof, the thimble structure (238) is mounted on the floating shaft (223), and the floating shaft (223) is used for driving the thimble structure (238) to move relative to the thimble cap (228) under the action of the floating block (218), so that the thimble (227) has the penetrating state (300) and the retracting state (400).
9. The jacking device for automated production of materials as claimed in any one of claims 1 to 8, wherein the materials are chips.
10. An automatic material production device, which is characterized by comprising a feeding device, a discharging device and a jacking device for automatic material production according to any one of claims 1 to 9;
the feeding device is used for conveying a material disc to be separated to a thimble cap structure (200) of the jacking device for automatic production of the materials;
The discharging device is used for collecting materials which are separated from the material disc to be separated and the material disc adhesive film.
CN202310206938.8A 2023-03-06 2023-03-06 Jacking device for automated material production and automated material production equipment Active CN116246997B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310206938.8A CN116246997B (en) 2023-03-06 2023-03-06 Jacking device for automated material production and automated material production equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310206938.8A CN116246997B (en) 2023-03-06 2023-03-06 Jacking device for automated material production and automated material production equipment

Publications (2)

Publication Number Publication Date
CN116246997A true CN116246997A (en) 2023-06-09
CN116246997B CN116246997B (en) 2023-09-29

Family

ID=86634738

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310206938.8A Active CN116246997B (en) 2023-03-06 2023-03-06 Jacking device for automated material production and automated material production equipment

Country Status (1)

Country Link
CN (1) CN116246997B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117373993A (en) * 2023-10-30 2024-01-09 深圳市路远智能装备有限公司 A material ejection mechanism and method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN210176006U (en) * 2019-05-31 2020-03-24 广东瑞谷光网通信股份有限公司 Chip ejection mechanism
CN114933167A (en) * 2022-04-27 2022-08-23 泉州兰姆达仪器设备有限公司 Ejector pin mechanism of laser chip testing and sorting machine and working method thereof
CN115274540A (en) * 2022-07-26 2022-11-01 长园半导体设备(珠海)有限公司 Thimble mechanism
CN218182186U (en) * 2022-07-20 2022-12-30 苏州科韵激光科技有限公司 Thimble mechanism
CN115588639A (en) * 2022-12-12 2023-01-10 常州铭赛机器人科技股份有限公司 Chip supply device and chip supply method
CN218482267U (en) * 2022-09-01 2023-02-14 深圳市大族半导体装备科技有限公司 Thimble mechanism and semiconductor processing equipment

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN210176006U (en) * 2019-05-31 2020-03-24 广东瑞谷光网通信股份有限公司 Chip ejection mechanism
CN114933167A (en) * 2022-04-27 2022-08-23 泉州兰姆达仪器设备有限公司 Ejector pin mechanism of laser chip testing and sorting machine and working method thereof
CN218182186U (en) * 2022-07-20 2022-12-30 苏州科韵激光科技有限公司 Thimble mechanism
CN115274540A (en) * 2022-07-26 2022-11-01 长园半导体设备(珠海)有限公司 Thimble mechanism
CN218482267U (en) * 2022-09-01 2023-02-14 深圳市大族半导体装备科技有限公司 Thimble mechanism and semiconductor processing equipment
CN115588639A (en) * 2022-12-12 2023-01-10 常州铭赛机器人科技股份有限公司 Chip supply device and chip supply method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117373993A (en) * 2023-10-30 2024-01-09 深圳市路远智能装备有限公司 A material ejection mechanism and method
CN117373993B (en) * 2023-10-30 2024-10-18 深圳市路远智能装备有限公司 Material ejection mechanism and method

Also Published As

Publication number Publication date
CN116246997B (en) 2023-09-29

Similar Documents

Publication Publication Date Title
CN217361537U (en) Positioning device for wafer
CN114571725B (en) A printing device for LED packaging retaining wall
CN206590565U (en) A kind of backlight automatic feed mechanism
CN114918592B (en) Seam welder
CN107195576A (en) Chip XY movement, angle correction, jacking mechanism
CN207497012U (en) A kind of full visual field contraposition film pasting mechanism
CN116387234B (en) Wafer bearing device
CN116246997A (en) Jacking device for automatic material production and automatic material production equipment
CN102729457B (en) Artificial diamond blister tray molding equipment
CN112264851A (en) Detection processing equipment of ceramic filter
CN211306122U (en) Battery capping device
CN216818307U (en) Automatic unloader of chip carrier
CN115621169A (en) High-speed Mini-LED Die Bonder and Die Bonding Method
CN209963038U (en) XY self-correcting thimble module
CN219163372U (en) Wafer edge exposure device
CN219937008U (en) Attaching device
CN118431135A (en) A small-format LED transfer and die bonding equipment
CN219106108U (en) Sucker carrying device
CN115440627A (en) Vertical chip mounter
CN224198700U (en) An integrated circuit packaging picking and traying device
CN217043542U (en) LED wafer picks up brilliant sorting unit
CN113985699A (en) Double-sided nano-imprinting equipment
CN219505607U (en) Film combining equipment
CN223779344U (en) Multi-station unloading mechanism
CN117276106B (en) Full-automatic heat sink detection equipment

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant