CN116240625A - A pressure regulating device and process gas switching method for epitaxial equipment - Google Patents

Abstract

This application relates to the technical field of epitaxy equipment, and specifically provides a pressure regulating device and process gas switching method for epitaxy equipment. The device includes: an inflow pipeline connected to the inlet end of the reaction chamber; The exhaust pipe of the chamber is connected; the differential pressure detection component is connected to the inflow pipeline and the discharge pipeline at both ends, and is used to detect the pressure difference information between the inflow pipeline and the discharge pipeline; the carrier gas supply component is connected to the The inflow line and the discharge line are connected to supply the carrier gas to the inflow line and the discharge line; the process gas supply assembly is connected to the inflow line and the discharge line; the switching assembly is used to control the process gas supply assembly to flow into the The pipeline or discharge pipeline supplies process gas; the return gas assembly, the two ends of which are respectively connected with the exhaust pipe and the discharge pipeline of the reaction chamber, and are used to introduce part of the tail gas of the reaction chamber into the discharge pipeline; and the regulating assembly; the device Can effectively reduce the amount of carrier gas used.

Description

A pressure regulating device and process gas switching method for epitaxial equipment

technical field

The present application relates to the technical field of epitaxial equipment, in particular, to a pressure regulating device and process gas switching method for epitaxial equipment.

Background technique

The existing epitaxial growth process needs to feed process gases with different flow rates or different types of reaction gases into the reaction chamber at different time periods according to process requirements. Since the flow rate of the process gas is unstable when the process gas is started to be introduced, and the unstable flow rate of the process gas will affect the growth quality of the epitaxial growth process, so before the process gas is passed into the reaction chamber, the prior art first The process gas is passed into the discharge pipeline (VENT pipeline), and the process gas is switched from the discharge pipeline to the inflow pipeline (RUN pipeline) after the flow of the process gas is stable, so as to ensure the flow of the process gas into the reaction chamber Stablize.

When the process gas is switched from the discharge pipeline to the inflow pipeline, in order to avoid the situation that the gas is poured backward or the process gas cannot flow into the reaction chamber due to the excessive pressure difference between the discharge pipeline and the inflow pipeline, the existing technology It is necessary to adjust the flow rate of the carrier gas supplied by the carrier gas supply assembly to the discharge line and/or the flow rate of the carrier gas supplied by the carrier gas supply assembly to the inflow line according to the pressure difference between the discharge line and the inflow line, so that the discharge The pressure of the pipeline and the pressure of the inflow pipeline are basically balanced. Since the gas in the discharge pipeline is only composed of carrier gas, that is, the discharge pipeline only relies on the carrier gas supply component for direct gas supply, so the prior art has the problem of a large amount of carrier gas used.

For the above problems, there is no effective technical solution at present.

Contents of the invention

The purpose of this application is to provide a pressure regulating device and process gas switching method for epitaxial equipment, which can effectively reduce the amount of carrier gas used when adjusting the pressure difference between the inflow pipeline and the discharge pipeline.

In a first aspect, the present application provides a pressure regulating device for epitaxial equipment, which includes:

reaction chamber;

The inflow pipeline is connected with the inlet end of the reaction chamber;

The discharge pipeline is connected with the exhaust pipe of the reaction chamber;

A pressure difference detection component, the two ends of which are respectively connected to the inflow pipeline and the discharge pipeline, and are used to detect the pressure difference information between the inflow pipeline and the discharge pipeline;

The carrier gas supply assembly is connected with the inflow pipeline and the discharge pipeline respectively, and is used to supply the carrier gas for the inflow pipeline and the discharge pipeline;

Process gas supply assembly, connected to the inflow line and the discharge line;

A switch assembly for controlling the process gas supply assembly to supply process gas to the inflow line or the discharge line;

A gas return assembly, the two ends of which are respectively connected to the exhaust pipe and the discharge pipeline of the reaction chamber, and are used to introduce part of the tail gas of the reaction chamber into the discharge pipeline;

The adjusting component is used for adjusting the flow rate of the carrier gas supplied by the carrier gas supply component to the inflow pipeline and/or the flow rate of the carrier gas supplied by the carrier gas supply component to the discharge pipeline.

The application provides a pressure regulating device for epitaxial equipment, which introduces part of the tail gas of the reaction chamber into the discharge pipeline, and the tail gas entering the discharge pipeline will change the gas pressure in the discharge pipeline to change the flow into the pipeline and the discharge pipeline. The pressure difference between the pipelines, the device is equivalent to using part of the tail gas of the reaction chamber to replace part of the carrier gas in the discharge pipeline, that is, the gas in the discharge pipeline of the device is composed of the tail gas of the reaction chamber and the carrier gas, because Compared with the prior art, the device can reduce the amount of carrier gas in the discharge pipeline, so the device can effectively reduce the flow rate of the carrier gas supplied to the discharge pipeline by the carrier gas supply assembly, thereby effectively reducing the amount of carrier gas used.

Optionally, the pressure regulating device for epitaxial equipment further includes an electronic pressure sensor and an internal circulation assembly, both of which are arranged on the discharge pipeline, and the internal circulation assembly includes a first one-way valve, a second A circulation pump and a first pressure reducing valve.

In the technical solution, the gas in the discharge pipeline is circulated by setting an electronic pressure sensor and an internal circulation component, thereby effectively improving the stability of the gas pressure in the discharge pipeline.

Optionally, the gas return assembly includes a second one-way valve, a second circulation pump, a second decompression valve and a first mass flow controller connected in sequence, the second one-way valve is connected to the exhaust pipe of the reaction chamber, and the second A mass flow controller is connected to the discharge line.

In this technical solution, the tail gas in the reaction chamber is driven to flow toward the discharge pipeline by setting the second circulation pump, so that more tail gas is introduced into the discharge pipeline, thereby further reducing the amount of carrier gas used.

Optionally, the pressure regulating device for the epitaxial equipment further includes a first pressure gauge, a first diaphragm valve, a fine suction valve and a butterfly valve, and the first pressure gauge, the first diaphragm valve, the fine suction valve and the butterfly valve are all arranged in the air return between components and discharge line.

Optionally, the adjustment component includes a second mass flow controller, a second diaphragm valve and a third mass flow controller, the carrier gas supply component is connected to the discharge pipeline through the second mass flow controller and the second diaphragm valve, and the carrier gas The supply assembly is connected to the inflow line through a third mass flow controller.

In the second aspect, the present application also provides a process gas switching method, which is applied to a pressure regulating device for epitaxy equipment. The pressure regulating device for epitaxy equipment includes a reaction chamber, an inflow pipeline, a discharge pipeline, a pressure difference Detection components, carrier gas supply components, process gas supply components, switching components, return gas components and adjustment components, the inflow pipeline is connected to the inlet end of the reaction chamber, the discharge pipeline is connected to the exhaust pipe of the reaction chamber, and the pressure difference detection The two ends of the component are respectively connected to the inflow pipeline and the discharge pipeline, the differential pressure detection component is used to detect the pressure difference information between the inflow pipeline and the discharge pipeline, and the carrier gas supply component is connected to the inflow pipeline and the discharge pipeline respectively , the carrier gas supply component is used to supply the carrier gas for the inflow pipeline and the discharge pipeline, the process gas supply component is connected with the inflow pipeline and the discharge pipeline through the switching component, and the switching component is used to control the process gas supply component as the inflow pipeline or The discharge pipeline supplies the process gas, and the two ends of the return gas assembly are respectively connected with the exhaust pipe and the discharge pipeline of the reaction chamber. The flow rate of the carrier gas supplied by the supply component to the inflow pipeline and/or the flow rate of the carrier gas supplied by the carrier gas supply component to the discharge pipeline, the process gas switching method includes the following steps:

When the process gas supply component supplies process gas, control the return gas component to guide part of the tail gas of the reaction chamber into the discharge pipeline, and control the process gas supply component to supply process gas to the discharge pipeline through the switching component;

According to the differential pressure information, the regulating component is controlled to adjust the flow rate of the carrier gas supplied by the carrier gas supply component to the inflow pipeline and/or the flow rate of the carrier gas supplied to the discharge pipeline by the carrier gas supply component, so that the differential pressure information is at a preset first position. within a threshold range;

When the flow rate of the process gas is within the preset flow range and the differential pressure information is within the first threshold range, the switching component is used to control the process gas supply component to supply process gas to the inflow pipeline.

This application provides a process gas switching method, which introduces part of the tail gas of the reaction chamber into the discharge pipeline, and the tail gas entering the discharge pipeline will change the gas pressure in the discharge pipeline to change the gap between the inflow pipeline and the discharge pipeline. This method is equivalent to using part of the tail gas of the reaction chamber to replace part of the carrier gas in the discharge pipeline, that is, the gas in the discharge pipeline of this method is composed of the tail gas of the reaction chamber and the carrier gas. Compared with the existing Technology, this method can reduce the amount of carrier gas in the discharge pipeline, so this method can effectively reduce the flow rate of the carrier gas supplied to the discharge pipeline by the carrier gas supply component, thereby effectively reducing the amount of carrier gas used.

Optionally, the adjustment component includes a second mass flow controller, a second diaphragm valve and a third mass flow controller, the carrier gas supply component is connected to the discharge pipeline through the second mass flow controller and the second diaphragm valve, and the carrier gas The supply component is connected to the inflow pipeline through the third mass flow controller, and the adjustment component is controlled according to the pressure difference information to adjust the flow rate of the carrier gas supplied by the carrier gas supply component to the inflow pipeline and/or the flow rate of the carrier gas supply component to the discharge pipeline. The flow rate of the carrier gas so that the pressure difference information is within the preset first threshold range includes:

According to the differential pressure information, control the second mass flow controller to adjust the flow rate of the carrier gas supplied to the discharge pipeline and/or control the third mass flow controller to adjust the flow rate of the carrier gas supplied to the inflow pipeline, so that the differential pressure information is at within the preset first threshold range.

Optionally, the gas return assembly includes a second one-way valve, a second circulation pump, a second decompression valve and a first mass flow controller connected in sequence, the second one-way valve is connected to the exhaust pipe of the reaction chamber, and the second A mass flow controller is connected to the discharge pipeline, and controls the adjustment component according to the differential pressure information to adjust the flow rate of the carrier gas supplied by the carrier gas supply component to the inflow pipeline and/or the flow rate of the carrier gas supplied by the carrier gas supply component to the discharge pipeline , the steps of making the differential pressure information within the preset first threshold range include:

Control the second mass flow controller to adjust the flow of the carrier gas supplied to the discharge pipeline according to the pressure difference information and/or control the first mass flow controller to adjust the flow of the exhaust gas introduced into the discharge pipeline, so that the pressure difference information is at a preset within the first threshold range.

Optionally, according to the pressure difference information, the second mass flow controller is controlled to adjust the flow rate of the carrier gas supplied to the discharge pipeline and/or the first mass flow controller is controlled to adjust the flow rate of the tail gas introduced into the discharge pipeline, so that the pressure difference The steps for the information being within the preset first threshold range include:

If the pressure difference information exceeds the preset first threshold range, control the second mass flow controller to adjust the flow rate of the carrier gas supplied to the discharge pipeline;

If the flow rate of the carrier gas supplied to the discharge pipeline is equal to the preset first flow threshold and the pressure difference information still exceeds the first threshold range, the first mass flow controller is controlled to adjust the flow rate of the exhaust gas introduced into the discharge pipeline.

Optionally, according to the pressure difference information, the second mass flow controller is controlled to adjust the flow rate of the carrier gas supplied to the discharge pipeline and/or the first mass flow controller is controlled to adjust the flow rate of the tail gas introduced into the discharge pipeline, so that the pressure difference The steps for the information being within the preset first threshold range include:

If the pressure difference information exceeds the preset first threshold range, control the first mass flow controller to adjust the flow rate of the exhaust gas introduced into the discharge pipeline;

If the flow rate of the exhaust gas introduced into the discharge pipeline is equal to the preset second flow threshold and the pressure difference information still exceeds the first threshold range, control the second mass flow controller to adjust the flow rate of the carrier gas supplied to the discharge pipeline, the second flow rate The threshold value is less than the gas output of the reaction chamber.

Since the technical solution will feed the carrier gas into the discharge pipeline only when the pressure difference information cannot be within the first threshold range by adjusting the flow rate of the exhaust gas introduced into the discharge pipeline, this technical solution can further reduce the adjustment of inflow. Carrier gas usage at differential pressure between line and vent line.

It can be known from the above that the application provides a pressure regulating device for epitaxial equipment and a process gas switching method, which introduces part of the tail gas of the reaction chamber into the discharge pipeline, and the tail gas entering the discharge pipeline will change the gas in the discharge pipeline. Pressure, to change the pressure difference between the inflow pipeline and the discharge pipeline, the device is equivalent to using part of the tail gas in the reaction chamber to replace part of the carrier gas in the discharge pipeline, that is, the gas in the discharge pipeline of the device is formed by the reaction The composition of the exhaust gas and the carrier gas in the chamber. Compared with the prior art, the device can reduce the amount of carrier gas in the discharge pipeline, so the device can effectively reduce the flow rate of the carrier gas supplied to the discharge pipeline by the carrier gas supply component, thereby Effectively reduce the amount of carrier gas used.

Description of drawings

Fig. 1 is a schematic structural diagram of a conventional pressure regulating device for epitaxial equipment.

FIG. 2 is a schematic structural diagram of a pressure regulating device for epitaxial equipment provided in an embodiment of the present application.

Fig. 3 is a flowchart of a process gas switching method provided in an embodiment of the present application.

Reference signs: 1. Reaction chamber; 111. Reaction chamber; 112. Induction coil; 113. Air bearing; 2. Inflow pipeline; 3. Discharge pipeline; 4. Pressure difference detection component; 5. Carrier gas supply component 6. Process gas supply component; 61. Argon gas supply component; 62. Source gas supply component; 7. Switching component; 71. The third diaphragm valve; 72. The fourth diaphragm valve; 73. The fifth diaphragm valve; 74. Sixth diaphragm valve; 8. Air return component; 81. Second one-way valve; 82. Second circulation pump; 83. Second pressure reducing valve; 84. First mass flow controller; 9. Electronic pressure sensor; 10 1. Internal circulation assembly; 101. First one-way valve; 102. First circulation pump; 103. First pressure reducing valve; 11. First pressure gauge; 12. First diaphragm valve; 13. Fine pumping valve; 14. Butterfly valve; 15, regulating component; 151, second mass flow controller; 152, second diaphragm valve; 153, third mass flow controller.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. The components of the embodiments of the application generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of the present application.

It should be noted that like numerals and letters denote similar items in the following figures, therefore, once an item is defined in one figure, it does not require further definition and explanation in subsequent figures. Meanwhile, in the description of the present application, the terms "first", "second" and the like are only used to distinguish descriptions, and cannot be understood as indicating or implying relative importance.

As shown in Figure 1, Figure 1 is a schematic structural diagram of an existing pressure regulating device for epitaxial equipment, PG in Figure 1 indicates a pressure gauge, DP in Figure 1 indicates a differential pressure gauge, and PV in Figure 1 indicates a diaphragm Valve, MFC in Figure 1 means mass flow controller, MV in Figure 1 means hand valve, and M in Figure 1 means butterfly valve. The existing pressure regulating device for epitaxial equipment includes a reaction chamber a, an inflow pipeline b, a discharge pipeline c, a differential pressure gauge, a hydrogen gas supply component d, an argon gas supply component e, a source gas supply component f, a switching component and Exhaust gas treatment components (SCRUBBER in Figure 1), switching components include diaphragm valve PV31, diaphragm valve PV32, diaphragm valve PV21 and diaphragm valve PV22. The process of the existing pressure regulating device for epitaxial equipment supplying process gas to reaction chamber a is as follows: 1. Diaphragm valve PV31 and diaphragm valve PV21 are closed, diaphragm valve PV32 and diaphragm valve PV22 are opened, so that the argon gas supply component e is The discharge pipeline c supplies argon gas and makes the source gas supply assembly f supply the source gas to the discharge pipeline c, and controls the mass flow controller MFC4 to adjust the flow rate of hydrogen supplied to the discharge pipeline c according to the differential pressure information detected by the differential pressure meter And/or control the mass flow controller MFC1 to adjust the flow rate of hydrogen supplied to the inflow pipeline b, so that the pressure difference information is within the preset range; 2. When the flow rates of argon and source gas no longer change and the pressure difference When the information is within the preset range, the diaphragm valve PV31 and diaphragm valve PV21 are opened, and the diaphragm valve PV32 and diaphragm valve PV22 are closed to switch the argon and source gas from the discharge line c to the inflow line b, and according to the differential pressure gauge The detected differential pressure information controls the mass flow controller MFC4 to adjust the flow rate of hydrogen gas supplied to the discharge pipeline c, so that the differential pressure information is within a preset range. Since the gas in the discharge pipeline c is only composed of hydrogen, that is, the discharge pipeline c only relies on the hydrogen supply component d for direct gas supply, so the prior art has the problem of a large amount of hydrogen used.

In the first aspect, as shown in Figure 2, the present application provides a pressure regulating device for epitaxial equipment, which includes:

reaction chamber 1;

The inflow pipeline 2 is connected with the inlet end of the reaction chamber 1;

The discharge pipeline 3 is connected with the exhaust pipe of the reaction chamber 1;

A differential pressure detection component 4, the two ends of which are respectively connected to the inflow pipeline 2 and the discharge pipeline 3, for detecting the pressure difference information between the inflow pipeline 2 and the discharge pipeline 3;

The carrier gas supply assembly 5 is connected to the inflow pipeline 2 and the discharge pipeline 3 respectively, and is used to supply the carrier gas for the inflow pipeline 2 and the discharge pipeline 3;

The process gas supply assembly 6 is connected with the inflow pipeline 2 and the discharge pipeline 3;

A switching component 7 is used to control the process gas supply component 6 to supply process gas to the inflow pipeline 2 or the discharge pipeline 3;

A gas return assembly 8, the two ends of which are respectively connected to the exhaust pipe of the reaction chamber 1 and the discharge pipeline 3, for introducing part of the tail gas of the reaction chamber 1 into the discharge pipeline 3;

The adjusting component 15 is used for adjusting the flow rate of the carrier gas supplied by the carrier gas supply component 5 to the inflow pipeline 2 and/or the flow rate of the carrier gas supplied by the carrier gas supply component 5 to the discharge pipeline 3 .

Among them, the reaction chamber 1 is the prior art, and the reaction chamber 1 includes a reaction chamber 111, an induction coil 112 and an air bearing 113, the air bearing 113 is arranged in the reaction chamber 111, and the air bearing 113 is used for supporting the wafer and in the During the growth process, the wafer is driven to rotate, and the induction coil 112 is arranged outside the reaction chamber 111 , and the induction coil 112 is used to heat the reaction chamber 111 . The inlet end of the reaction chamber 1 is connected to the inflow pipeline 2, and the outlet end of the reaction chamber 1 is provided with an exhaust pipe, and the exhaust pipe is connected to the exhaust pipeline 3 and the tail gas treatment assembly. The differential pressure detection component 4 can be a device that can detect differential pressure such as a differential pressure measuring instrument or a differential pressure gauge. It is used to detect the pressure difference information between the inflow pipeline 2 and the discharge pipeline 3, and the pressure difference information is the pressure difference between the inflow pipeline 2 and the discharge pipeline 3. The carrier gas supply assembly 5 can be a carrier gas storage tank, a carrier gas storage chamber or a carrier gas generation assembly, etc., which can store or generate carrier gas. The carrier gas supply assembly 5 is connected to the inflow pipeline 2 and the discharge pipeline 3 respectively, and the The gas supply assembly 5 is used to supply the carrier gas for the inflow pipeline 2 and the discharge pipeline 3. The carrier gas in this embodiment is preferably hydrogen, and the carrier gas supply assembly 5 is preferably a hydrogen supply assembly. The process gas supply assembly 6 can be a process gas storage tank, a process gas storage chamber, or a process gas generation assembly that can store or generate process gas. The process gas supply assembly 6 is connected to the inflow pipeline 2 and the discharge pipeline 3. The process gas The supply assembly 6 can supply process gas for the inflow pipeline 2 and the discharge pipeline 3. The process gas in this embodiment preferably includes argon and source gas (reaction gas), and the process gas supply assembly 6 is preferably an argon supply assembly 61 and a source Gas supply assembly 62. The switching component 7 can be a gas path switching valve, and the switching component 7 can also be a plurality of diaphragm valves. If the switching component 7 is a gas path switching valve, the input end of the gas path switching valve is connected to the process gas supply component 6, and the gas path switching valve The output ends of the valves are respectively connected to the inflow pipeline 2 and the discharge pipeline 3. If the switching assembly 7 is a plurality of diaphragm valves, the process gas supply assembly 6 is connected to the inflow pipeline 2 and the discharge pipeline 3 through different diaphragm valves, preferably , the process gas supply assembly 6 includes an argon gas supply assembly 61 and a source gas supply assembly 62, the switching assembly 7 includes a third diaphragm valve 71, a fourth diaphragm valve 72, a fifth diaphragm valve 73 and a sixth diaphragm valve 74, the argon gas supply The component 61 is connected to the inflow pipeline 2 through the third diaphragm valve 71, the argon gas supply component 61 is connected to the discharge pipeline 3 through the fourth diaphragm valve 72, and the source gas supply component 62 is connected to the inflow pipeline 2 through the fifth diaphragm valve 73 , the source gas supply assembly 62 is connected to the discharge pipeline 3 through the sixth diaphragm valve 74 . The two ends of the air return assembly 8 are respectively connected to the exhaust pipe of the reaction chamber 1 and the discharge pipeline 3, and the air return assembly 8 can be a gas return valve or a gas return device, etc., which can remove part of the tail gas of the reaction chamber 1 (in the exhaust pipe) Part of the gas) is introduced into the assembly of the discharge line 3. The regulating component 15 can be a mass flow controller, a solenoid valve or a gate valve, etc., which can change the gas flow rate. In this embodiment, the carrier gas supply component 5 can be used to adjust the flow rate of the carrier gas supplied to the pipeline 2 by controlling the regulating component 15. And/or the flow rate of the carrier gas supplied to the discharge pipeline 3 by the carrier gas supply assembly 5 to adjust the pressure difference information between the inflow pipeline 2 and the discharge pipeline 3 . It should be understood that, since the return gas component 8 introduces part of the exhaust gas into the discharge pipeline 3, before the switching component 7 controls the process gas supply component 6 to supply the process gas to the discharge pipeline 3, the gas in the discharge pipeline 3 is reacted The exhaust gas of the chamber 1 and the carrier gas supplied by the carrier gas supply assembly 5 are composed.

The working principle of this embodiment is: the air return assembly 8 can introduce part of the tail gas of the reaction chamber 1 into the discharge pipeline 3, and the tail gas entering the discharge pipeline 3 will change the gas pressure in the discharge pipeline 3 to change the flow into the pipeline 2 and the pressure difference between the discharge pipeline 3, the device is equivalent to using part of the tail gas of the reaction chamber 1 to replace part of the carrier gas in the discharge pipeline 3, that is, the gas in the discharge pipeline 3 of the device is discharged from the reaction chamber 1 Compared with the prior art, the device can reduce the amount of carrier gas in the discharge pipeline 3, so the device can effectively reduce the flow rate of the carrier gas supplied to the discharge pipeline 3 by the carrier gas supply assembly 5 , thus effectively reducing the amount of carrier gas used.

The application provides a pressure regulating device for epitaxial equipment, which introduces part of the tail gas of the reaction chamber 1 into the discharge pipeline 3, and the tail gas entering the discharge pipeline 3 will change the gas pressure in the discharge pipeline 3 to change the inflow The pressure difference between the pipeline 2 and the discharge pipeline 3, the device is equivalent to using part of the tail gas of the reaction chamber 1 to replace part of the carrier gas in the discharge pipeline 3, that is, the gas in the discharge pipeline 3 of the device is formed by the reaction The composition of exhaust gas and carrier gas in chamber 1, because compared with the prior art, this device can reduce the amount of carrier gas in the discharge pipeline 3, so this device can effectively reduce the carrier gas supplied to the discharge pipeline 3 by the carrier gas supply assembly 5 flow, thereby effectively reducing the amount of carrier gas used.

In some embodiments, the pressure regulating device for epitaxial equipment further includes an electronic pressure sensor 9 and an internal circulation assembly 10, both of which are arranged on the discharge pipeline 3, and the internal circulation assembly 10 includes sequentially The first one-way valve 101, the first circulation pump 102 and the first decompression valve 103 are connected. The electronic pressure sensor 9 can detect the gas pressure in the discharge pipeline 3 and adjust the gas pressure in the discharge pipeline 3 to a set value. The first one-way valve 101, the first circulation pump 102 and the first decompression valve 103 are all prior art, and this embodiment makes the gas circulation flow in the discharge pipeline 3 by setting the electronic pressure sensor 9 and the internal circulation assembly 10, Therefore, the gas pressure stability in the discharge pipeline 3 is effectively improved.

In some embodiments, the air return assembly 8 includes a second one-way valve 81, a second circulation pump 82, a second pressure reducing valve 83 and a first mass flow controller 84 connected in sequence, and the second one-way valve 81 is connected with the reaction The exhaust pipe of the chamber 1 is connected, and the first mass flow controller 84 is connected with the discharge pipeline 3 . The second one-way valve 81, the second circulation pump 82, the second decompression valve 83 and the first mass flow controller 84 are all conventional devices, and their respective operating principles will not be discussed in detail here. In this embodiment, by setting the first Two one-way valves 81 allow part of the tail gas in the reaction chamber 1 to flow toward the discharge pipeline 3 in one direction. The first mass flow controller 84 can adjust the flow of the tail gas introduced into the discharge pipeline 3, so this embodiment can control the first mass flow controller 84 to adjust the flow of the tail gas introduced into the discharge pipeline 3 according to the pressure difference information, so as to adjust the discharge Information on the pressure difference between line 3 and inflow line 2. It should be understood that if the air return assembly 8 does not include the second circulation pump 82, the air return assembly 8 can only rely on the pressure difference between the exhaust pipe of the reaction chamber 1 and the discharge pipeline 3 to guide the tail gas of the reaction chamber 1 into the exhaust gas. Pipeline 3. Therefore, in this embodiment, the second circulation pump 82 is provided to drive the tail gas of the reaction chamber 1 to flow toward the discharge pipe 3, so that more tail gas is introduced into the discharge pipe 3, thereby further reducing the amount of carrier gas used.

In some embodiments, the pressure regulating device for epitaxial equipment further includes a first pressure gauge 11, a first diaphragm valve 12, a fine pumping valve 13 and a butterfly valve 14, the first pressure gauge 11, the first diaphragm valve 12, a fine pumping valve Both the valve 13 and the butterfly valve 14 are arranged between the air return assembly 8 and the discharge pipeline 3 . Specifically, the exhaust pipe of the reaction chamber 1 is connected with the air return assembly 8, the input end of the first diaphragm valve 12 and the input end of the fine pumping valve 13, and the first pressure gauge 11 is arranged on the air return assembly 8 and the fine pumping valve. On the exhaust pipe between 13, the input end of the butterfly valve 14 is connected to the output end of the first diaphragm valve 12 and the output end of the fine suction valve 13, and the output end of the butterfly valve 14 is connected to the discharge pipeline 3.

In some embodiments, the regulating assembly 15 includes a second mass flow controller 151 , a second diaphragm valve 152 and a third mass flow controller, and the carrier gas supply assembly 5 passes through the second mass flow controller 151 and the second diaphragm valve 152 It is connected with the discharge pipeline 3 , and the carrier gas supply assembly 5 is connected with the inflow pipeline 2 through the third mass flow controller 153 . The second mass flow controller 151 , the second diaphragm valve 152 and the third mass flow controller 153 are all existing devices, and their respective operating principles will not be discussed in detail here.

It can be known from the above that the application provides a pressure regulating device for epitaxial equipment, which guides part of the tail gas of the reaction chamber 1 into the discharge pipeline 3, and the tail gas entering the discharge pipeline 3 will change the gas pressure in the discharge pipeline 3 , to change the pressure difference between the inflow pipeline 2 and the discharge pipeline 3, the device is equivalent to using part of the tail gas of the reaction chamber 1 to replace part of the carrier gas in the discharge pipeline 3, that is, the discharge pipeline 3 of the device The gas in the reaction chamber 1 is composed of tail gas and carrier gas. Compared with the prior art, the device can reduce the amount of carrier gas in the discharge pipeline 3, so the device can effectively reduce the supply of the carrier gas supply component 5 to the discharge pipeline. 3 carrier gas flow, thus effectively reducing the amount of carrier gas used.

In the second aspect, as shown in Figure 3, the present application also provides a process gas switching method, which is applied to a pressure regulating device for epitaxy equipment, and the pressure regulating device for epitaxy equipment includes a reaction chamber 1, an inflow pipeline 2. Discharge pipeline 3, differential pressure detection component 4, carrier gas supply component 5, process gas supply component 6, switching component 7, return gas component 8 and adjustment component 15, inflow pipeline 2 and the inlet end of reaction chamber 1 connection, the discharge pipeline 3 is connected to the exhaust pipe of the reaction chamber 1, and the two ends of the differential pressure detection component 4 are respectively connected to the inflow pipeline 2 and the discharge pipeline 3, and the differential pressure detection component 4 is used to detect the inflow pipeline 2 and the discharge pipeline 3. The pressure difference information between the discharge pipelines 3, the carrier gas supply assembly 5 is connected with the inflow pipeline 2 and the discharge pipeline 3 respectively, the carrier gas supply assembly 5 is used to supply the carrier gas for the inflow pipeline 2 and the discharge pipeline 3, The process gas supply assembly 6 is connected to the inflow pipeline 2 and the discharge pipeline 3 through the switch assembly, the switch assembly 7 is used to control the process gas supply assembly 6 to supply process gas for the inflow pipeline 2 or the discharge pipeline 3, and the return gas assembly 8 Both ends are respectively connected to the exhaust pipe of the reaction chamber 1 and the discharge pipeline 3, the return gas component 8 is used to introduce part of the tail gas of the reaction chamber 1 into the discharge pipeline 3, and the adjustment component 15 is used to adjust the supply of the carrier gas supply component 5 to The flow rate of the carrier gas flowing into the pipeline 2 and/or the flow rate of the carrier gas supplied to the discharge pipeline 3 by the carrier gas supply assembly 5, the process gas switching method includes the following steps:

S1. When the process gas supply component 6 supplies process gas, control the return gas component 8 to guide part of the tail gas of the reaction chamber 1 into the discharge pipeline 3, and control the process gas supply component 6 to supply process gas to the discharge pipeline 3 through the switching component 7 ;

S2. According to the differential pressure information, control the adjustment component 15 to adjust the flow rate of the carrier gas supplied by the carrier gas supply component 5 to the inflow pipeline 2 and/or the flow rate of the carrier gas supplied to the discharge pipeline 3 by the carrier gas supply component 5, so that the pressure The difference information is within a preset first threshold range;

S3. When the flow rate of the process gas is within the preset flow range and the differential pressure information is within the first threshold range, control the process gas supply component 6 to supply process gas to the inflow pipeline 2 through the switching component 7 .

Among them, the reaction chamber 1 is the prior art, and the reaction chamber 1 includes a reaction chamber 111, an induction coil 112 and an air bearing 113, the air bearing 113 is arranged in the reaction chamber 111, and the air bearing 113 is used for supporting the wafer and in the During the growth process, the wafer is driven to rotate, and the induction coil 112 is arranged outside the reaction chamber 111 , and the induction coil 112 is used to heat the reaction chamber 111 . The inlet end of the reaction chamber 1 is connected to the inflow pipeline 2, and the outlet end of the reaction chamber 1 is provided with an exhaust pipe, and the exhaust pipe is connected to the exhaust pipeline 3 and the tail gas treatment assembly. The differential pressure detection component 4 can be a device that can detect differential pressure such as a differential pressure measuring instrument or a differential pressure gauge. It is used to detect the pressure difference information between the inflow pipeline 2 and the discharge pipeline 3, and the pressure difference information is the pressure difference between the inflow pipeline 2 and the discharge pipeline 3. The carrier gas supply assembly 5 can be a carrier gas storage tank, a carrier gas storage chamber or a carrier gas generation assembly, etc., which can store or generate carrier gas. The carrier gas supply assembly 5 is connected to the inflow pipeline 2 and the discharge pipeline 3 respectively, and the The gas supply assembly 5 is used to supply the carrier gas for the inflow pipeline 2 and the discharge pipeline 3. The carrier gas in this embodiment is preferably hydrogen, and the carrier gas supply assembly 5 is preferably a hydrogen supply assembly. The process gas supply assembly 6 can be a process gas storage tank, a process gas storage chamber, or a process gas generation assembly that can store or generate process gas. The process gas supply assembly 6 is connected to the inflow pipeline 2 and the discharge pipeline 3. The process gas The supply assembly 6 can supply process gas for the inflow pipeline 2 and the discharge pipeline 3. The process gas in this embodiment preferably includes argon and source gas (reaction gas), and the process gas supply assembly 6 is preferably an argon supply assembly 61 and a source Gas supply assembly 62. The switching component 7 can be a gas path switching valve, and the switching component 7 can also be a plurality of diaphragm valves. If the switching component 7 is a gas path switching valve, the input end of the gas path switching valve is connected to the process gas supply component 6, and the gas path switching valve The output ends of the valves are respectively connected to the inflow pipeline 2 and the discharge pipeline 3. If the switching component 7 is a plurality of diaphragm valves, the process gas supply component 6 is connected to the inflow pipeline 2 and the discharge pipeline 3 through different diaphragm valves. The two ends of the air return assembly 8 are respectively connected to the exhaust pipe of the reaction chamber 1 and the discharge pipeline 3, and the air return assembly 8 can be a gas return valve or a gas return device, etc., which can remove part of the tail gas of the reaction chamber 1 (in the exhaust pipe) Part of the gas) is introduced into the assembly of the discharge line 3. The regulating component 15 can be a mass flow controller, a solenoid valve or a gate valve, etc., which can change the gas flow rate. In this embodiment, the carrier gas supply component 5 can be used to adjust the flow rate of the carrier gas supplied to the pipeline 2 by controlling the regulating component 15. And/or the flow rate of the carrier gas supplied to the discharge pipeline 3 by the carrier gas supply assembly 5 to adjust the pressure difference information between the inflow pipeline 2 and the discharge pipeline 3 . It should be understood that, since the return gas component 8 introduces part of the exhaust gas into the discharge pipeline 3, before the switching component 7 controls the process gas supply component 6 to supply the process gas to the discharge pipeline 3, the gas in the discharge pipeline 3 is reacted The exhaust gas of the chamber 1 and the carrier gas supplied by the carrier gas supply assembly 5 are composed.

Step S1 is equivalent to controlling the gas return component 8 to introduce part of the tail gas of the reaction chamber 1 into the discharge pipeline 3 when the process gas needs to be introduced into the reaction chamber 1, and controlling the process gas supply component 6 to the discharge pipeline 3 through the switching component 7 Supply process gas.

The first threshold range of step S2 is a preset range. If the pressure difference information is within the first threshold range, when the process gas is switched from the discharge pipeline 3 to the inflow pipeline 2, there will be no gas backflow or process gas failure. The situation of flowing into the reaction chamber 1; if the pressure difference information exceeds the first threshold range, when the process gas is switched from the discharge pipeline 3 to the inflow pipeline 2, the gas will flow backward or the process gas cannot flow into the reaction chamber 1. At this time, it is necessary to control the adjustment component 15 to adjust the flow rate of the carrier gas supplied by the carrier gas supply component 5 to the inflow pipeline 2 and/or the flow rate of the carrier gas supplied by the carrier gas supply component 5 to the discharge pipeline 3 . In order to ensure that the flow rate of the gas entering the reaction chamber 1 is stable, the adjustment assembly 15 of this embodiment preferably supplies the carrier gas with a constant flow rate for the inflow pipeline 2, when adjusting the pressure difference information between the inflow pipeline 2 and the discharge pipeline 3 , the regulating component 15 of this embodiment preferably only regulates the flow rate of the carrier gas supplied to the discharge pipeline 3 by the carrier gas supply component 5 .

The preset flow range of step S3 is the preset range. When the flow rate of the process gas is within the preset flow range, the process gas supplied by the process gas supply component 6 at this time can meet the requirements of the epitaxial growth process. At this time, the process gas can be passed into the reaction chamber 1, so when the flow rate of the process gas is within the preset flow range and the pressure difference information is within the first threshold range, step S3 controls the process gas supply component 6 to flow into the pipeline 2 through the switching component 7 Supply process gas. It should be understood that after the process gas is switched from the discharge pipeline 3 to the inflow pipeline 2, the gas pressure in the discharge pipeline 3 will decrease. In order to ensure that the pressure of the discharge pipeline 3 and the inflow pipeline 2 are basically balanced (pressure The difference information is within the first threshold range), after the process gas is switched from the exhaust pipeline 3 to the inflow pipeline 2, this embodiment controls the carrier gas supply component 5 to increase the flow rate of the carrier gas supplied to the exhaust pipeline 3. It should also be understood that since different epitaxial growth processes and different stages of the same epitaxial growth process require different process gases, those skilled in the art can change the size of the preset flow rate range according to actual needs.

The working principle of this embodiment is: the air return assembly 8 can introduce part of the tail gas of the reaction chamber 1 into the discharge pipeline 3, and the tail gas entering the discharge pipeline 3 will change the gas pressure in the discharge pipeline 3 to change the flow into the pipeline 2 and the pressure difference between the discharge pipeline 3, this method is equivalent to using part of the tail gas of the reaction chamber 1 to replace part of the carrier gas in the discharge pipeline 3, that is, the gas in the discharge pipeline 3 of this method is discharged from the reaction chamber 1 Composition of exhaust gas and carrier gas, because compared with the prior art, this method can reduce the amount of carrier gas in the discharge pipeline 3, so this method can effectively reduce the flow rate of the carrier gas supplied to the discharge pipeline 3 by the carrier gas supply assembly 5 , thus effectively reducing the amount of carrier gas used.

A process gas switching method provided by this application is to introduce part of the tail gas of the reaction chamber 1 into the discharge pipeline 3, and the tail gas entering the discharge pipeline 3 will change the gas pressure in the discharge pipeline 3 to change the inflow pipeline 2 and The pressure difference between the discharge pipelines 3, this method is equivalent to using part of the tail gas of the reaction chamber 1 to replace part of the carrier gas in the discharge pipeline 3, that is, the gas in the discharge pipeline 3 of this method is replaced by the tail gas of the reaction chamber 1 and carrier gas, because compared with the prior art, this method can reduce the amount of carrier gas in the discharge pipeline 3, so this method can effectively reduce the flow rate of the carrier gas supplied to the discharge pipeline 3 by the carrier gas supply assembly 5, thereby Effectively reduce the amount of carrier gas used.

In some embodiments, the regulating assembly 15 includes a second mass flow controller 151 , a second diaphragm valve 152 and a third mass flow controller, and the carrier gas supply assembly 5 passes through the second mass flow controller 151 and the second diaphragm valve 152 Connected with the discharge pipeline 3, the carrier gas supply assembly 5 is connected with the inflow pipeline 2 through the third mass flow controller 153, step S2 includes:

S21. Control the second mass flow controller 151 to adjust the flow of the carrier gas supplied to the discharge pipeline 3 according to the pressure difference information and/or control the third mass flow controller 153 to adjust the flow of the carrier gas supplied to the inflow pipeline 2, So that the pressure difference information is within the preset first threshold range.

The working principle of this embodiment is: since the second mass flow controller 151 can adjust the flow rate of the carrier gas supplied to the discharge pipeline 3 by the carrier gas supply assembly 5, and the third mass flow controller 153 can adjust the flow of the carrier gas supply assembly 5 The flow rate of the carrier gas supplied to the inflow pipeline 2, so this embodiment can control the second mass flow controller 151 to adjust the flow rate of the carrier gas supplied to the discharge pipeline 3 and/or control the third mass flow control according to the pressure difference information The controller 153 adjusts the flow rate of the carrier gas supplied to the inflow pipeline 2, so that the pressure difference information is within the preset first threshold range. Specifically, if the pressure difference information exceeds the first threshold range and the gas pressure of the discharge pipeline 3 is greater than the gas pressure of the inflow pipeline 2, this embodiment can only control the second mass flow controller 151 to reduce the supply of the carrier gas supply component 5. The flow rate of the carrier gas to the discharge pipeline 3, this embodiment can also only control the third mass flow controller 153 to increase the flow rate of the carrier gas supplied by the carrier gas supply assembly 5 to the inflow pipeline 2, this embodiment can also control The second mass flow controller 151 reduces the flow rate of the carrier gas supplied by the carrier gas supply assembly 5 to the discharge pipeline 3 and controls the third mass flow controller 153 to increase the carrier gas supplied by the carrier gas supply assembly 5 to the inflow pipeline 2 If the pressure difference information exceeds the first threshold range and the gas pressure of the discharge pipeline 3 is less than the gas pressure of the inflow pipeline 2, this embodiment can only control the second mass flow controller 151 to increase the supply of the carrier gas supply component 5 The flow rate of the carrier gas to the discharge pipeline 3, this embodiment can also only control the third mass flow controller 153 to reduce the flow rate of the carrier gas supplied by the carrier gas supply assembly 5 to the inflow pipeline 2, this embodiment can also control The second mass flow controller 151 increases the flow rate of the carrier gas supplied by the carrier gas supply assembly 5 to the discharge pipeline 3 and controls the third mass flow controller 153 to reduce the carrier gas supplied by the carrier gas supply assembly 5 to the inflow pipeline 2 If the pressure difference information is within the first threshold range, control the second mass flow controller 151 and the third mass flow controller 153 to maintain the current flow. This embodiment is equivalent to adjusting the gas pressure of the inflow pipeline 2 and/or the discharge pipeline 3 according to the pressure difference information, so that the pressure difference information is within the first threshold range.

In some embodiments, the air return assembly 8 includes a second one-way valve 81, a second circulation pump 82, a second pressure reducing valve 83 and a first mass flow controller 84 connected in sequence, and the second one-way valve 81 is connected with the reaction The exhaust pipe of chamber 1 is connected, and the first mass flow controller 84 is connected with discharge pipeline 3, and step S2 includes:

S21', control the second mass flow controller 151 to adjust the flow of the carrier gas supplied to the discharge pipeline 3 according to the pressure difference information and/or control the first mass flow controller 84 to adjust the flow of the tail gas introduced into the discharge pipeline 3, so as to Make the differential pressure information be within the preset first threshold range.

The working principle of this embodiment is: since the first mass flow controller 84 can adjust the flow rate of the exhaust gas introduced into the discharge pipeline 3, the second mass flow controller 151 can adjust the carrier gas supplied to the discharge pipeline 3 by the carrier gas supply assembly 5. The flow rate of the exhaust gas, and the change of the flow rate of the exhaust gas introduced into the discharge pipeline 3 and the change of the flow rate of the carrier gas supplied to the discharge pipeline 3 by the carrier gas supply assembly 5 will cause the gas pressure of the discharge pipeline 3 to change, so the Implementation can control the second mass flow controller 151 to adjust the flow rate of the carrier gas supplied to the discharge pipeline 3 and/or control the first mass flow controller 84 to adjust the flow rate of the exhaust gas introduced into the discharge pipeline 3 according to the pressure difference information, so as to adjust The pressure difference information between the discharge pipeline 3 and the inflow pipeline 2, so that the pressure difference information is within the preset first threshold range.

In some embodiments, step S21' includes:

S211. If the pressure difference information exceeds the preset first threshold range, control the second mass flow controller 151 to adjust the flow rate of the carrier gas supplied to the discharge pipeline 3;

S212. If the flow rate of the carrier gas supplied to the discharge pipeline 3 is equal to the preset first flow threshold and the pressure difference information still exceeds the first threshold range, control the first mass flow controller 84 to adjust the flow rate of the exhaust gas introduced into the discharge pipeline 3 flow.

The first flow threshold in step S212 is a preset value, and those skilled in the art can actually change the size of the first flow threshold, and the first flow threshold is the maximum flow rate of the carrier gas supplied by the carrier gas supply assembly 5 to the discharge pipeline 3 value. This embodiment is equivalent to adjusting the pressure difference information between the inflow pipeline 2 and the discharge pipeline 3 by adjusting the flow rate of the carrier gas first when the pressure difference information exceeds the preset first threshold range. If only the carrier gas is adjusted If the flow rate cannot adjust the pressure difference information to be within the first threshold range, then adjust the pressure difference information between the inflow pipeline 2 and the discharge pipeline 3 by adjusting the flow rate of the carrier gas and the flow rate of the exhaust gas introduced into the discharge pipeline 3 .

In some embodiments, step S21' includes:

S211', if the pressure difference information exceeds the preset first threshold range, control the first mass flow controller 84 to adjust the flow rate of the exhaust gas introduced into the discharge pipeline 3;

S212', if the flow rate of the exhaust gas introduced into the discharge pipeline 3 is equal to the preset second flow threshold and the pressure difference information still exceeds the first threshold range, control the second mass flow controller 151 to adjust the carrier gas supplied to the discharge pipeline 3 The flow rate, the second flow rate threshold is less than the gas output of the reaction chamber 1 .

The second flow threshold in step S212' is a preset value, and those skilled in the art can actually change the size of the second flow threshold, and the second flow threshold is the maximum value of the flow of exhaust gas supplied by the return air assembly 8 to the exhaust pipeline 3 , it should be understood that, since the return air assembly 8 is used to introduce part of the tail gas of the reaction chamber 1 into the discharge pipeline 3, the flow rate of the tail gas entering the discharge pipeline 3 is smaller than the flow rate of the tail gas discharged from the reaction chamber 1, that is, the second flow rate The threshold is smaller than the gas output of the reaction chamber 1 . This embodiment is equivalent to adjusting the pressure difference information between the inflow pipeline 2 and the discharge pipeline 3 by first adjusting the flow rate of the exhaust gas introduced into the discharge pipeline 3 when the pressure difference information exceeds the preset first threshold range, If the pressure difference information cannot be adjusted to be within the first threshold range only by adjusting the flow rate of the exhaust gas introduced into the exhaust pipeline 3, then adjust the flow rate of the inflow pipeline 2 and the Pressure difference information between discharge lines 3. Because only when the pressure difference information cannot be within the first threshold range by adjusting the flow rate of the exhaust gas introduced into the discharge pipeline 3, this embodiment will feed the carrier gas into the discharge pipeline 3, so this embodiment can further reduce The amount of carrier gas used when adjusting the pressure difference between the inflow line 2 and the discharge line 3.

In some embodiments, the process gas switching method further includes the steps of:

S4. When the process gas does not need to be fed into the reaction chamber 1 and the pressure difference information is within the first threshold range, control the process gas supply component 6 to supply process gas to the discharge pipeline 3 through the switching component 7, and control the adjustment component according to the pressure difference information 15 Adjust the flow rate of the carrier gas supplied by the carrier gas supply assembly 5 to the inflow pipeline 2 and/or the flow rate of the carrier gas supplied by the carrier gas supply assembly 5 to the exhaust pipeline 3, so that the pressure difference information is within the first threshold range.

When the process gas does not need to flow into the reaction chamber 1 (for example, to complete the epitaxial growth) and the pressure difference information is within the first threshold range (that is, there will be no gas backflow), step S4 transfers the process gas from the inflow pipeline through the switching component 7 Switch to the discharge pipeline 3, and control the adjustment component 15 to adjust the flow rate of the carrier gas supplied to the inflow pipeline 2 by the carrier gas supply component 5 and/or the carrier gas supplied to the discharge pipeline 3 by the carrier gas supply component 5 according to the differential pressure information flow, so that the differential pressure information is within the first threshold range. It should be understood that if new epitaxial growth is required, this embodiment can control the process gas supply assembly 6 to supply the new epitaxial growth to the discharge pipeline 3 when the process gas is switched from the inflow pipeline to the discharge pipeline 3. process gas, and when the flow rate of the process gas is within the preset flow range and the pressure difference information is within the first threshold range, the process gas is switched from the discharge pipeline 3 to the inflow pipeline 2 to perform new epitaxial growth.

It can be known from the above that the application provides a process gas switching method, which introduces part of the tail gas of the reaction chamber 1 into the discharge pipeline 3, and the tail gas entering the discharge pipeline 3 will change the gas pressure in the discharge pipeline 3 to change the inflow The pressure difference between the pipeline 2 and the discharge pipeline 3, this method is equivalent to using part of the tail gas of the reaction chamber 1 to replace part of the carrier gas in the discharge pipeline 3, that is, the gas in the discharge pipeline 3 of this method is formed by the reaction The composition of exhaust gas and carrier gas in chamber 1, because compared with the prior art, this method can reduce the amount of carrier gas in the discharge pipeline 3, so this method can effectively reduce the carrier gas supplied to the discharge pipeline 3 by the carrier gas supply assembly 5 flow, thereby effectively reducing the amount of carrier gas used.

It can be seen from the above that the present application provides a pressure regulating device for epitaxial equipment and a process gas switching method, which guides part of the exhaust gas of the reaction chamber 1 into the exhaust pipeline 3, and the exhaust gas entering the exhaust pipeline 3 will change the exhaust pipeline. 3 to change the pressure difference between the inflow pipeline 2 and the discharge pipeline 3, this device is equivalent to using part of the tail gas of the reaction chamber 1 to replace part of the carrier gas in the discharge pipeline 3, that is, the device The gas in the discharge pipeline 3 is composed of the tail gas of the reaction chamber 1 and the carrier gas. Compared with the prior art, the device can reduce the amount of the carrier gas in the discharge pipeline 3, so the device can effectively reduce the carrier gas supply assembly 5 The flow rate of the carrier gas supplied to the discharge pipeline 3 can effectively reduce the usage of the carrier gas.

In the embodiments provided in this application, it should be understood that the disclosed devices and methods may be implemented in other ways. The device embodiments described above are only illustrative. For example, the division of the above units is only a logical function division, and there may be other division methods in actual implementation. For example, multiple units or components can be combined or can be Integrate into another robot, or some features may be ignored, or not implemented. In another point, the mutual coupling or direct coupling or communication connection shown or discussed may be through some communication interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms.

In addition, the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be raised to one place, or may also be distributed to multiple network units . Part or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

Furthermore, each functional module in each embodiment of the present application may be integrated to form an independent part, each module may exist independently, or two or more modules may be integrated to form an independent part.

In this document, relational terms such as first and second etc. are used only to distinguish one entity or operation from another without necessarily requiring or implying any such relationship between these entities or operations. Actual relationship or sequence.

The above descriptions are only examples of the present application, and are not intended to limit the scope of protection of the present application. For those skilled in the art, various modifications and changes may be made to the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this application shall be included within the protection scope of this application.

Claims (10)

1. A pressure regulating device for an epitaxial apparatus, the pressure regulating device for an epitaxial apparatus comprising:

a reaction chamber;

the inflow pipeline is connected with the air inlet end of the reaction chamber;

the exhaust pipeline is connected with an exhaust pipe of the reaction chamber;

the two ends of the differential pressure detection assembly are respectively connected with the inflow pipeline and the discharge pipeline and are used for detecting differential pressure information between the inflow pipeline and the discharge pipeline;

a carrier gas supply assembly connected to the inflow pipe and the discharge pipe, respectively, for supplying carrier gas to the inflow pipe and the discharge pipe;

A process gas supply assembly connected to the inflow line and the exhaust line;

a switching assembly for controlling the process gas supply assembly to supply process gas to the inflow line or the exhaust line;

the two ends of the air return assembly are respectively connected with the exhaust pipe of the reaction chamber and the exhaust pipeline, and are used for guiding part of tail gas of the reaction chamber into the exhaust pipeline;

and the regulating component is used for regulating the flow rate of the carrier gas supplied to the inflow pipeline by the carrier gas supply component and/or the flow rate of the carrier gas supplied to the discharge pipeline by the carrier gas supply component.

2. The pressure regulating device for an epitaxial apparatus of claim 1, further comprising an electronic pressure sensor and an internal circulation assembly, both of which are disposed on the discharge line, the internal circulation assembly comprising a first check valve, a first circulation pump, and a first pressure relief valve connected in sequence.

3. The pressure regulating device for an epitaxial apparatus of claim 1, wherein the return air assembly comprises a second check valve, a second circulation pump, a second pressure reducing valve, and a first mass flow controller connected in sequence, the second check valve being connected to the exhaust pipe of the reaction chamber, the first mass flow controller being connected to the exhaust line.

4. The pressure regulating device for an epitaxial apparatus of claim 1, further comprising a first pressure gauge, a first diaphragm valve, a fine suction valve, and a butterfly valve, the first pressure gauge, the first diaphragm valve, the fine suction valve, and the butterfly valve each disposed between the return air assembly and the discharge line.

5. A pressure regulating device for an epitaxial apparatus according to claim 1, wherein the regulating assembly comprises a second mass flow controller, a second diaphragm valve and a third mass flow controller, the carrier gas supply assembly being connected to the exhaust line through the second mass flow controller and the second diaphragm valve, the carrier gas supply assembly being connected to the inflow line through the third mass flow controller.

6. The utility model provides a process gas switching method which characterized in that is applied to the pressure regulating device for epitaxial equipment, the pressure regulating device for epitaxial equipment includes reaction chamber, inflow pipeline, discharge pipeline, pressure difference detection subassembly, carrier gas supply subassembly, process gas supply subassembly, switching component, return air subassembly and regulation subassembly, inflow pipeline is connected with the inlet end of reaction chamber, discharge pipeline is connected with the blast pipe of reaction chamber, pressure difference detection subassembly's both ends respectively with inflow pipeline and discharge pipeline are connected, pressure difference detection subassembly is used for detecting pressure difference information between inflow pipeline and the discharge pipeline, carrier gas supply subassembly is connected with inflow pipeline and discharge pipeline respectively, carrier gas supply subassembly is used for supplying carrier gas for inflow pipeline and discharge pipeline, process gas supply subassembly is connected with inflow pipeline and discharge pipeline through switching component, switching component is used for controlling the process gas supply subassembly and is for inflow pipeline or the blast pipe supply process gas, the both ends of return air subassembly are connected with the reaction chamber respectively with inflow pipeline and discharge pipeline respectively, carrier gas supply carrier gas flow is used for supplying carrier gas flow to the step of the switching component is supplied with the reaction chamber to the flow is supplied with the carrier gas to the step/is carried out to the carrier gas supply part of the carrier gas flow down to the reaction chamber is adjusted to the flow:

When the process gas supply assembly supplies the process gas, controlling the gas return assembly to guide part of tail gas of the reaction chamber into a discharge pipeline, and controlling the process gas supply assembly to supply the process gas to the discharge pipeline through the switching assembly;

controlling the regulating component to regulate the flow rate of the carrier gas supplied to the inflow pipeline by the carrier gas supply component and/or the flow rate of the carrier gas supplied to the discharge pipeline by the carrier gas supply component according to the pressure difference information so that the pressure difference information is within a preset first threshold range;

and when the flow rate of the process gas is in a preset flow rate range and the pressure difference information is in the first threshold value range, controlling the process gas supply assembly to supply the process gas to the inflow pipeline through the switching assembly.

7. The process gas switching method according to claim 6, wherein the regulating assembly includes a second mass flow controller, a second diaphragm valve, and a third mass flow controller, the carrier gas supply assembly is connected to the exhaust line through the second mass flow controller and the second diaphragm valve, the carrier gas supply assembly is connected to the inflow line through the third mass flow controller, the step of controlling the regulating assembly to regulate a flow rate of the carrier gas supplied to the inflow line by the carrier gas supply assembly and/or a flow rate of the carrier gas supplied to the exhaust line by the carrier gas supply assembly according to the pressure difference information such that the pressure difference information is within a preset first threshold range includes:

And controlling the second mass flow controller to regulate the flow rate of the carrier gas supplied to the discharge pipeline and/or controlling the third mass flow controller to regulate the flow rate of the carrier gas supplied to the inflow pipeline according to the pressure difference information so that the pressure difference information is within a preset first threshold range.

8. The process gas switching method according to claim 7, wherein the return gas assembly includes a second check valve, a second circulation pump, a second pressure reducing valve, and a first mass flow controller connected in this order, the second check valve being connected to an exhaust pipe of the reaction chamber, the first mass flow controller being connected to the exhaust pipe, the step of controlling the adjustment assembly according to the pressure difference information to adjust a flow rate of the carrier gas supplied from the carrier gas supply assembly to the inflow pipe and/or a flow rate of the carrier gas supplied from the carrier gas supply assembly to the exhaust pipe so that the pressure difference information is within a preset first threshold range includes:

and controlling the second mass flow controller to regulate the flow of the carrier gas supplied to the discharge pipeline and/or controlling the first mass flow controller to regulate the flow of the tail gas led into the discharge pipeline according to the pressure difference information so that the pressure difference information is within a preset first threshold range.

9. The process gas switching method according to claim 8, wherein the step of controlling the second mass flow controller to adjust the flow rate of the carrier gas supplied to the exhaust line and/or controlling the first mass flow controller to adjust the flow rate of the off-gas introduced into the exhaust line so that the differential pressure information is within a preset first threshold value range according to the differential pressure information comprises:

if the pressure difference information exceeds a preset first threshold range, controlling the second mass flow controller to adjust the flow of the carrier gas supplied to the discharge pipeline;

and if the flow rate of the carrier gas supplied to the discharge pipeline is equal to a preset first flow threshold value and the pressure difference information still exceeds the first threshold value range, controlling the first mass flow controller to adjust the flow rate of the tail gas led into the discharge pipeline.

10. The process gas switching method according to claim 8, wherein the step of controlling the second mass flow controller to adjust the flow rate of the carrier gas supplied to the exhaust line and/or controlling the first mass flow controller to adjust the flow rate of the off-gas introduced into the exhaust line so that the differential pressure information is within a preset first threshold value range according to the differential pressure information comprises:

If the pressure difference information exceeds a preset first threshold range, controlling the first mass flow controller to adjust the flow of the tail gas led into the discharge pipeline;

and if the flow rate of the tail gas led into the discharge pipeline is equal to a preset second flow rate threshold value and the pressure difference information still exceeds the first threshold value range, controlling the second mass flow controller to adjust the flow rate of the carrier gas supplied to the discharge pipeline, wherein the second flow rate threshold value is smaller than the gas outlet amount of the reaction chamber.

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