CN116184176A - Radio frequency chip test equipment - Google Patents
Radio frequency chip test equipment Download PDFInfo
- Publication number
- CN116184176A CN116184176A CN202310325809.0A CN202310325809A CN116184176A CN 116184176 A CN116184176 A CN 116184176A CN 202310325809 A CN202310325809 A CN 202310325809A CN 116184176 A CN116184176 A CN 116184176A
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- 238000012360 testing method Methods 0.000 title claims abstract description 66
- 238000003860 storage Methods 0.000 claims abstract description 69
- 230000007246 mechanism Effects 0.000 claims abstract description 54
- 238000003825 pressing Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims description 9
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- 230000009977 dual effect Effects 0.000 claims 1
- 238000007599 discharging Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 239000000047 product Substances 0.000 description 8
- 239000000523 sample Substances 0.000 description 8
- 239000013589 supplement Substances 0.000 description 7
- 238000002955 isolation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000005012 migration Effects 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2862—Chambers or ovens; Tanks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses radio frequency chip testing equipment, which comprises a workbench, an empty TARY disc storage bin, a chip loading bin, an NG storage bin, an OK storage bin, a fine positioning mechanism arranged on one side of the OK storage bin, Y-axis moving modules symmetrically arranged on the left side and the right side above the workbench, X-axis moving modules arranged on the Y-axis moving modules on the two sides, a TARY disc carrying mechanism arranged on the X-axis moving modules, a double-head chip photographing and taking component arranged on the X-axis moving modules, a testing jig arranged above the workbench and positioned on one side of the OK storage bin, and a chip pressing mechanism arranged on one side of the testing jig; the device has the beneficial effects that under the condition of meeting the stability of high-frequency test of the radio frequency chip, the automatic feeding and discharging can be realized to independently store test OK and NG products, meanwhile, the test of the radio frequency chip of multiple varieties is met, and the device has no all power of an air source and absorbs all used electric power to reduce the interference of air on electromagnetic waves.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to testing equipment for radio frequency chips with electromagnetic frequency less than or equal to 40G.
Background
Because the volume of the radio frequency chip is small, the manufacturing process is complex, and the radio frequency chip with faults can be produced, the radio frequency chip is usually required to be tested before being put into use so as to ensure the quality of the radio frequency chip; in the related art, a test device is generally adopted to test the radio frequency chip, when the radio frequency chip is tested, the front surface of the radio frequency chip can be placed in a test cavity in the test device upwards, then a probe in the test device is manually controlled to move from bottom to top, so that the probe is closely contacted with a pin in the radio frequency chip, and finally the radio frequency chip is tested through the probe; when the manual control probe is contacted with the pin, if the pressure between the probe and the pin is too small, poor contact between the probe and the pin can be caused, so that the radio frequency chip cannot be tested; if the pressure between the probe and the pin is too large, the probe and the radio frequency chip can be damaged, so that the service lives of the test equipment and the radio frequency chip are influenced;
chinese patent CN114660444B discloses a test device for a radio frequency chip, which mainly discloses testing of the chip, but the feeding and subsequent test control are more dependent on manpower, more requirements are required during working, and the working efficiency is lower, so that the whole test and transportation of the chip cannot be completed well;
in view of the above, there is a need for improvements to existing chip test equipment that can accommodate the current needs of chip test applications.
Disclosure of Invention
The invention aims to solve the problems, and designs radio frequency chip testing equipment.
The technical scheme of the invention for achieving the purpose is that the radio frequency chip testing equipment comprises a workbench, an empty TARY disc storage bin arranged above the workbench, a chip feeding bin arranged on the workbench and positioned at one side of the empty TARY disc storage bin, an NG storage bin arranged on the workbench and positioned at one side of the chip feeding bin, an OK storage bin arranged on the workbench and positioned at one side of the NG storage bin, a fine positioning mechanism arranged at one side of the OK storage bin, Y-axis moving modules symmetrically arranged at the left side and the right side above the workbench, X-axis moving modules arranged on the Y-axis moving modules at two sides, a TARY disc carrying mechanism arranged on the X-axis moving modules, a double-head chip photographing and taking component arranged on the X-axis moving modules, a testing jig arranged above the workbench and positioned at one side of the fine positioning mechanism and a chip pressing mechanism arranged at one side of the testing jig.
To the further supplement of this technical scheme, tip one side of empty TARY disk feed bin, on-chip feed bin, NG storage bin, OK storage bin is equipped with two sets of laser sensor, the below both sides of empty TARY disk feed bin, on-chip feed bin, NG storage bin, OK storage bin are equipped with the slider respectively and are equipped with the slide rail below thereof, slider slidable mounting is on the slide rail, empty TARY disk feed bin, on-chip feed bin, NG storage bin, OK storage bin are hollow form and are equipped with the feed bin lifting assembly under it.
According to the technical scheme, support assemblies are arranged on the front side and the rear side of the lower portion of the Y-axis moving module.
To the further supplement of this technical scheme, X axle removes the module slidable mounting on the Y axle that removes the module in left and right sides, TARY dish transport mechanism includes Z axle and removes the module, with Z axle remove the module and be connected TARY dish centre gripping subassembly, Z axle removes the module slidable mounting on X axle removes the module.
To the further supplement of this technical scheme, the material subassembly is got in taking a picture to double-end chip includes the protection frame, sets up the camera subassembly of taking a picture in the protection frame, sets up in the protection frame and is located the double-end axle of camera subassembly one side of taking a picture and get the subassembly, protection frame slidable mounting is on X axle removal module.
To the further supplement of this technical scheme, the subassembly is photographed to camera includes lift control electric jar, the counterpoint camera subassembly of being connected with lift control electric jar, lift control electric jar fixed mounting is in the guard frame internal surface, counterpoint camera subassembly is vertical placing.
To the further supplement of this technical scheme, the double-end axle gets material subassembly and includes sucking disc subassembly and clamping jaw subassembly, sucking disc subassembly is close to protection frame one side and is equipped with lift control module, be equipped with longitudinal movement subassembly on the clamping jaw subassembly.
To the further supplement of this technical scheme, the test fixture top is equipped with spacing subassembly, spacing subassembly is hollow form and its cross-section is concave font.
To the further supplement of this technical scheme, chip hold-down mechanism slope sets up, chip hold-down mechanism includes horizontal migration control mechanism, the Z axle that is connected with horizontal migration control mechanism removes control mechanism, the pressure head of being connected with Z axle and remove control mechanism, set up the pressure sensor on Z axle removes control mechanism, horizontal migration control mechanism is the slope and sets up on the workstation.
According to the technical scheme, the empty TARY disc storage bin is provided with the position sensor for detecting the placement height of the empty TARY disc, so that timely alarming and material changing are facilitated.
The device has the advantages that under the condition that high-frequency test stability of the radio frequency chip is met, automatic feeding and discharging can be realized, test OK and NG products are stored independently, meanwhile, multi-variety radio frequency chip test is met, all power of an air source is not needed, all power used by the device is absorbed, and interference of air to electromagnetic waves is reduced.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
FIG. 3 is a schematic view of a portion of the bottom internal structure of the present invention;
FIG. 4 is a schematic view of a first angular portion of the present invention;
FIG. 5 is a schematic view of a second angular portion of the present invention;
FIG. 6 is a schematic view of a third angular portion of the present invention;
in the figure, 1, a workbench; 2. empty TARY tray bin; 3. feeding the chips into a bin; 4. NG storage bin; 5. OK storage bin; 6. a fine positioning mechanism; 7. a Y-axis moving module; 8. an X-axis moving module; 9. a TARY disk handling mechanism; 91. a Z-axis moving module; 92. a TARY disc clamp assembly; 10. the double-end chip photographing and taking component; 101. a protective frame; 102. a camera shooting component; 1021. a lifting control electric cylinder; 1022. aligning the camera assembly; 103. a double-ended shaft material taking assembly; 1031. a suction cup assembly; 1032. a jaw assembly; 1033. a lifting control module; 1034. a longitudinally moving assembly; 11. testing a jig; 12. a chip pressing mechanism; 121. a horizontal movement control mechanism; 122. a Z-axis movement control mechanism; 123. a pressure head; 13. a laser sensor; 14. a slide block; 15. a slide rail; 16. a bin lifting assembly; 17. a bracket assembly; 18. a limit component; 19. a handle; 20. and an isolation frame.
Detailed Description
Because the existing radio frequency chip test equipment is low in test frequency, inconvenient to operate, single in test product and incapable of meeting high-frequency test and high-efficiency working conditions, based on the fact that the radio frequency chip test equipment is designed on the basis of the defects of the prior art, the test of chips can be well completed, the using effect is good, and the radio frequency chip test equipment is capable of automatically feeding and discharging materials and meeting the test of multiple kinds of radio frequency chips.
In order to make the technical solution more clear for the person skilled in the art, the following details of the technical solution of the present invention will be described with reference to fig. 1 to 6:
the radio frequency chip testing equipment comprises a workbench 1, an empty TARY disc storage bin 2 arranged above the workbench 1, a chip feeding bin 3 arranged on the workbench 1 and positioned on one side of the empty TARY disc storage bin 2, an NG storage bin 4 arranged on the workbench 1 and positioned on one side of the chip feeding bin 3, an OK storage bin 5 arranged on the workbench 1 and positioned on one side of the NG storage bin 4, a fine positioning mechanism 6 arranged on one side of the OK storage bin 5, Y-axis moving modules 7 symmetrically arranged on the left side and the right side above the workbench 1, X-axis moving modules 8 arranged on the Y-axis moving modules 7 on two sides, a TARY disc carrying mechanism 9 arranged on the X-axis moving modules 8, a double-head chip photographing and taking assembly 10 arranged on the X-axis moving modules 8, a testing jig 11 arranged above the workbench 1 and positioned on one side of the fine positioning mechanism 6, and a chip pressing mechanism 12 arranged on one side of the testing jig 11; the application of each bin is different, and the empty TARY disc bin 2, the chip feeding bin 3, the NG storage bin 4 and the OK storage bin 5 are respectively used for the empty TARY disc supply and recovery of the radio frequency chip, the feeding of the radio frequency chip, the storage of NG products and the storage of OK products; during operation, firstly, manually placing a TARY disc filled with chips into a chip feeding bin 3, then adjusting a Y-axis moving module 7 and an X-axis moving module 8 to move according to the positions of the chips, so that a double-end chip photographing and taking assembly 10 is positioned right above the chips to be tested, then controlling the double-end chip photographing and taking assembly 10 to work, firstly performing photographing identification on the chips, then clamping the chips, then continuing to work the Y-axis moving module 7 and the X-axis moving module 8, enabling the double-end chip photographing and taking assembly 10 to move to the right above a testing jig 11 with the chips, then enabling the double-end chip photographing and taking assembly 10 to work to enable the chips to be placed on the testing jig 11, then testing the chips through a chip pressing mechanism 12, and in the process, returning to continuously clamp the chips after the double-end chip photographing and taking assembly 10 is placed on a fine positioning mechanism 6 after photographing; after the chip is tested by the chip compressing mechanism 12, judging whether the chip meets the requirement or does not meet the requirement, if the chip does not meet the requirement, clamping the chip by the double-head chip photographing and taking assembly 10 to place the chip on a TARY disc of the NG storage bin 4, and if the chip meets the requirement, clamping the chip by the double-head chip photographing and taking assembly 10 to place the chip on the TARY disc of the OK product storage; and then continuing to test chips to repeat the working process, and if all chips of one tray are tested, placing an empty tray into the empty tray bin 2 through the tray carrying mechanism 9.
In order to better place chips, two sides below the empty TARY disc storage bin 2, the chip feeding bin 3, the NG storage bin 4 and the OK storage bin 5 are respectively provided with a sliding block 14 and a sliding rail 15 below the sliding blocks, the sliding blocks 14 are slidably arranged on the sliding rails 15, handles 19 are arranged on the empty TARY disc storage bin 2, the chip feeding bin 3, the NG storage bin 4 and the OK storage bin 5 and used for being pulled out or pushed in by workers, the empty TARY disc storage bin 2, the chip feeding bin 3, the NG storage bin 4 and the OK storage bin 5 are hollow and are provided with a bin lifting assembly 16 under the empty TARY disc storage bin 2, the chip feeding bin 3, the NG storage bin 4 and the OK storage bin 5, and each group of bin is lifted by using 1 stepping motor to realize the lifting of the TARY height, wherein two groups of laser sensors 13 are arranged on one side of the end of the empty TARY disc storage bin 2, the chip feeding bin 3, the NG storage bin 4 and the OK storage bin 5 and used for positioning the lifting of the TARY disc and giving an alarm.
In order to better support and fix the Y-axis moving module 7, bracket assemblies 17 are arranged on the front side and the rear side below the Y-axis moving module 7, so that the X-axis moving module 8 can stably move on the Y-axis moving module 7.
Wherein, the X-axis moving module 8 is slidably mounted on the Y-axis moving module 7 on the left and right sides, the TARY disk carrying mechanism 9 comprises a Z-axis moving module 91 and a TARY disk clamping assembly 92 connected with the Z-axis moving module 91, the Z-axis moving module 91 is slidably mounted on the X-axis moving module 8, and the Z-axis moving module 91 can adjust the height of the TARY disk clamping assembly 92 according to the height of an empty TARY disk, thereby facilitating the TARY disk clamping assembly 92 to clamp the TARY disk so as to be placed in the empty TARY disk storage bin 2.
The structure of the dual-head chip photographing and taking assembly 10 will be described in detail below, the dual-head chip photographing and taking assembly 10 includes a protection frame 101, a camera photographing assembly 102 disposed in the protection frame 101, and a dual-head shaft taking assembly 103 disposed in the protection frame 101 and located at one side of the camera photographing assembly 102, where the protection frame 101 is slidably mounted on the X-axis moving module 8, and the protection frame 101 plays a role in protection, when the dual-head chip photographing and taking assembly 10 moves above a chip to be tested, firstly, the camera photographing assembly 102 photographs and identifies the product, and then the dual-head shaft taking assembly 103 clamps the chip, in detail, the camera photographing assembly 102 includes a lifting control cylinder 1021, and an alignment camera assembly 1022 connected with the lifting control cylinder 1021, the lifting control cylinder 1021 is fixedly mounted on the inner surface of the protection frame 101, and the alignment camera assembly 1022 is vertically placed, and the effect of the lifting control cylinder is that the alignment camera assembly 1022 is convenient to identify the chip according to the placement height of the chip, so that the subsequent dual-head shaft assembly 103 is convenient to clamp and take the chip; the double-end shaft material taking assembly 103 comprises a sucker assembly 1031 and a clamping jaw assembly 1032, wherein a lifting control module 1033 is arranged on one side, close to the protection frame 101, of the sucker assembly 1031, and a longitudinal moving assembly 1034 is arranged on the clamping jaw assembly 1032; and in the course of the work, camera subassembly 102 of shooing can discern the place position of chip and need place the position of chip and discern, prevent that the chip from placing the mistake.
When the product is placed on the test jig 11, the product may fall to the edge position and then fall, in order to better test the chip, a limiting component 18 is arranged above the test jig 11, the limiting component 18 is hollow, the section of the limiting component is concave, and the chip is placed in the limiting component 18 during testing.
The structure of the chip pressing mechanism 12 will be described in detail below, the chip pressing mechanism 12 is disposed obliquely, the chip pressing mechanism 12 includes a horizontal movement control mechanism 121, a Z-axis movement control mechanism 122 connected to the horizontal movement control mechanism 121, a ram 123 connected to the Z-axis movement control mechanism 122, and a pressure sensor disposed on the Z-axis movement control mechanism 122, and the horizontal movement control mechanism 121 is disposed obliquely on the workbench 1; the chip pressing mechanism 12 firstly controls the horizontal movement control mechanism 121 to work, so that the pressing head 123 moves to a designated position above the test jig 11, then the Z-axis movement control mechanism 122 works, the pressing movement moves to the designated position to uniformly apply pressure to the test chip, and in the working process, the pressing pressure of the pressing head 123 is controlled by a precise pressure sensor.
And 10 layers of TARY discs can be stored in each bin, and the empty TARY disc bin 2 is provided with a position sensor for detecting the placement height of the empty TARY discs so as to be convenient for alarming and changing materials in time.
The bottom of the test jig 11 is provided with a heat dissipation device which can dissipate heat for the test jig 11; all power lines of the moving part are subjected to partition shielding treatment when entering the electric cabinet, an isolation frame 20 is arranged outside the electric cabinet to play a role in protection, and a plurality of visible windows are arranged on the isolation frame 20, and all the visible windows adopt 5+5 electromagnetic shielding glass to realize the isolation of the interference of external electromagnetic waves on radio frequency test.
The above technical solution only represents the preferred technical solution of the present invention, and some changes that may be made by those skilled in the art to some parts of the technical solution represent the principles of the present invention, and the technical solution falls within the scope of the present invention.
Claims (10)
1. The radio frequency chip test equipment is characterized by comprising a workbench (1), an empty TARY disc storage bin (2) arranged above the workbench (1), an on-chip storage bin (3) arranged on the workbench (1) and positioned on one side of the empty TARY disc storage bin (2), an NG storage bin (4) arranged on the workbench (1) and positioned on one side of the on-chip storage bin (3), an OK storage bin (5) arranged on the workbench (1) and positioned on one side of the NG storage bin (4), a fine positioning mechanism (6) arranged on one side of the OK storage bin (5), Y-axis moving modules (7) symmetrically arranged on the left side and the right side of the upper side of the workbench (1), X-axis moving modules (8) arranged on two sides, a TARY disc carrying mechanism (9) arranged on the X-axis moving modules (8), a double-head chip photographing assembly (10) arranged above the workbench (1) and positioned on one side of the fine positioning mechanism (6), and a material taking jig (11) arranged on one side of the fine positioning mechanism (12).
2. The radio frequency chip test equipment according to claim 1, wherein two groups of laser sensors (13) are arranged on one side of the end parts of the empty TARY disc storage bin (2), the on-chip storage bin (3), the NG storage bin (4) and the OK storage bin (5), sliding blocks (14) are respectively arranged on two sides below the empty TARY disc storage bin (2), the on-chip storage bin (3), the NG storage bin (4) and the OK storage bin (5), sliding rails (15) are arranged below the sliding blocks (14), the sliding blocks (14) are slidably mounted on the sliding rails (15), and the empty TARY disc storage bin (2), the on-chip storage bin (3), the NG storage bin (4) and the OK storage bin (5) are hollow and a bin lifting component (16) is arranged right below the empty TARY disc storage bin.
3. The radio frequency chip testing device according to claim 2, wherein the support assemblies (17) are arranged on the front side and the rear side below the Y-axis moving module (7).
4. The radio frequency chip testing apparatus according to claim 1, wherein the X-axis moving module (8) is slidably mounted on the Y-axis moving module (7) on the left and right sides, the TARY tray handling mechanism (9) includes a Z-axis moving module (91), and a TARY tray clamping assembly (92) connected to the Z-axis moving module (91), and the Z-axis moving module (91) is slidably mounted on the X-axis moving module (8).
5. The radio frequency chip testing device according to claim 1, wherein the dual-head chip photographing and taking assembly (10) comprises a protection frame (101), a camera photographing assembly (102) arranged in the protection frame (101), and a dual-head shaft taking assembly (103) arranged in the protection frame (101) and positioned at one side of the camera photographing assembly (102), and the protection frame (101) is slidably mounted on the X-axis moving module (8).
6. The radio frequency chip testing apparatus according to claim 5, wherein the camera photographing assembly (102) comprises a lifting control electric cylinder (1021) and an alignment camera assembly (1022) connected with the lifting control electric cylinder (1021), the lifting control electric cylinder (1021) is fixedly installed on the inner surface of the protection frame (101), and the alignment camera assembly (1022) is vertically placed.
7. The radio frequency chip testing apparatus according to claim 5, wherein the dual spindle pick-up assembly (103) comprises a chuck assembly (1031) and a clamping jaw assembly (1032), a lifting control module (1033) is arranged on one side of the chuck assembly (1031) close to the protection frame (101), and a longitudinal movement assembly (1034) is arranged on the clamping jaw assembly (1032).
8. The radio frequency chip testing device according to claim 1, wherein a limiting component (18) is arranged above the testing jig (11), and the limiting component (18) is hollow and has a concave cross section.
9. The radio frequency chip testing apparatus according to claim 1, wherein the chip pressing mechanism (12) is disposed obliquely, the chip pressing mechanism (12) comprises a horizontal movement control mechanism (121), a Z-axis movement control mechanism (122) connected with the horizontal movement control mechanism (121), a pressure head (123) connected with the Z-axis movement control mechanism (122), and a pressure sensor disposed on the Z-axis movement control mechanism (122), and the horizontal movement control mechanism (121) is disposed obliquely on the workbench (1).
10. The radio frequency chip testing equipment according to claim 1, wherein the empty TARY tray bin (2) is provided with a position sensor for detecting the placement height of the empty TARY tray, so that timely warning and material changing are facilitated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310325809.0A CN116184176A (en) | 2023-03-30 | 2023-03-30 | Radio frequency chip test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310325809.0A CN116184176A (en) | 2023-03-30 | 2023-03-30 | Radio frequency chip test equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116184176A true CN116184176A (en) | 2023-05-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310325809.0A Pending CN116184176A (en) | 2023-03-30 | 2023-03-30 | Radio frequency chip test equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN116184176A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117741389A (en) * | 2023-10-09 | 2024-03-22 | 苏州索莱能智能科技有限公司 | A kind of radio frequency chip three-temperature testing equipment |
| CN119076398A (en) * | 2024-10-22 | 2024-12-06 | 苏州索莱能智能科技有限公司 | A high-precision automatic clamping and testing equipment for radio frequency chips |
| CN119355487A (en) * | 2024-10-22 | 2025-01-24 | 苏州索莱能智能科技有限公司 | A PCB test equipment for multiple RF ports |
| CN120178010A (en) * | 2025-05-22 | 2025-06-20 | 苏州索莱能智能科技有限公司 | A three-temperature test device and a radio frequency chip test method based on positioning |
-
2023
- 2023-03-30 CN CN202310325809.0A patent/CN116184176A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117741389A (en) * | 2023-10-09 | 2024-03-22 | 苏州索莱能智能科技有限公司 | A kind of radio frequency chip three-temperature testing equipment |
| CN119076398A (en) * | 2024-10-22 | 2024-12-06 | 苏州索莱能智能科技有限公司 | A high-precision automatic clamping and testing equipment for radio frequency chips |
| CN119355487A (en) * | 2024-10-22 | 2025-01-24 | 苏州索莱能智能科技有限公司 | A PCB test equipment for multiple RF ports |
| CN120178010A (en) * | 2025-05-22 | 2025-06-20 | 苏州索莱能智能科技有限公司 | A three-temperature test device and a radio frequency chip test method based on positioning |
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