CN116175295A - A semiconductor graphite tube inner wall grinding device - Google Patents
A semiconductor graphite tube inner wall grinding device Download PDFInfo
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- CN116175295A CN116175295A CN202211497637.7A CN202211497637A CN116175295A CN 116175295 A CN116175295 A CN 116175295A CN 202211497637 A CN202211497637 A CN 202211497637A CN 116175295 A CN116175295 A CN 116175295A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/36—Single-purpose machines or devices
- B24B5/40—Single-purpose machines or devices for grinding tubes internally
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/35—Accessories
- B24B5/355—Feeding means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/50—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground, e.g. strings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
技术领域technical field
本发明涉及半导体石墨管加工技术领域,更具体的说是一种半导体石墨管内壁打磨装置。The invention relates to the technical field of semiconductor graphite tube processing, in particular to a grinding device for the inner wall of a semiconductor graphite tube.
背景技术Background technique
在半导体石墨管的加工过程中,通常需要对半导体石墨管的内壁进行打磨,但是由于半导体石墨管的内径较小,打磨的深度又较长,因此,打磨的过程中有一定的困难。During the processing of the semiconductor graphite tube, it is usually necessary to grind the inner wall of the semiconductor graphite tube, but because the inner diameter of the semiconductor graphite tube is small and the grinding depth is long, there are certain difficulties in the grinding process.
公开号为CN201820165374.2的一个中国实用新型,其公开了一种石墨管内孔研磨装置,包括卧式车床,卧式车床的三爪卡盘夹持有打磨装置,本实用新型解决了现有技术中的管体内壁研磨装置工作时需要实时精确控制纵向进给机构和横向进给机构的运动,且其运动机构的结构及运动方式复杂,不易操作的问题,但是其在使用过程中需要人工对石墨管进行上料或下料,工作效率较低,人工耗费时间长。A Chinese utility model whose publication number is CN201820165374.2 discloses a graphite tube inner hole grinding device, which includes a horizontal lathe, and the three-jaw chuck of the horizontal lathe holds the grinding device. The utility model solves the problem of the prior art The grinding device for the inner wall of the pipe needs to accurately control the movement of the longitudinal feed mechanism and the transverse feed mechanism in real time, and the structure and movement mode of the movement mechanism are complex and difficult to operate. However, it needs manual adjustment during use. Graphite tubes are used for loading or unloading, the work efficiency is low, and the labor time is long.
发明内容Contents of the invention
本发明的目的是针对现有技术的不足之处,提供一种半导体石墨管内壁打磨装置,通过设置转盘上料组件和下料组件,实现半导体石墨管的自动上下料的操作,通过设置转盘带动夹持组件和半导体石墨管进行转动,在转动的过程中完成上料、打磨和下料的工作,实现了循环不间断的打磨操作,提高了工作效率。The object of the present invention is to aim at the deficiencies of the prior art, to provide a semiconductor graphite tube inner wall grinding device, by setting the turntable feeding assembly and the unloading assembly, to realize the operation of automatic loading and unloading of the semiconductor graphite tube, by setting the turntable to drive The clamping component and the semiconductor graphite tube are rotated, and the work of loading, grinding and unloading is completed during the rotating process, realizing the uninterrupted grinding operation and improving the work efficiency.
本发明的技术解决措施如下:Technical solutions of the present invention are as follows:
一种半导体石墨管内壁打磨装置,包括支撑架,所述支撑架上设置有转动组件,所述转动组件包括转盘,所述转盘设置为中空结构,所述转盘的左右两侧分别设置有上料组件和下料组件,所述转盘上固定设置有若干个承载板,若干个所述承载板上均滑动设置有夹持组件,所述转盘内固定设置有导向组件,所述转盘的上方设置有打磨组件,所述转盘内还设置有吸尘组件,所述上料组件用于输送半导体石墨管,所述转动组件用于带动夹持组件进行转动,所述夹持组件用于在转动的过程中与导向组件配合将半导体石墨管进行夹持或松开,所述打磨组件用于将半导体石墨管的内壁进行打磨,所述吸尘组件用于将打磨过程中产生的废屑进行收集,所述下料组件用于输出打磨后的半导体石墨管。A device for grinding the inner wall of a semiconductor graphite tube, comprising a support frame, on which a rotating assembly is arranged, the rotating assembly includes a turntable, the turntable is set as a hollow structure, and the left and right sides of the turntable are respectively provided with feeding Assemblies and blanking assemblies, several bearing plates are fixedly arranged on the turntable, clamping assemblies are slidably arranged on several of the carrying plates, guide assemblies are fixedly arranged inside the turntable, and a A grinding assembly, a dust suction assembly is also provided in the turntable, the feeding assembly is used to transport the semiconductor graphite tube, the rotating assembly is used to drive the clamping assembly to rotate, and the clamping assembly is used to Cooperate with the guide assembly to clamp or loosen the semiconductor graphite tube, the grinding assembly is used to grind the inner wall of the semiconductor graphite tube, and the dust suction assembly is used to collect the waste chips generated during the grinding process. The above-mentioned blanking assembly is used to output the polished semiconductor graphite tube.
作为一种优选,所述转动组件还包括固定设置在支撑架上的固定座、转动设置在固定座内的转轴、固定设置在固定座上的电机座以及固定设置在电机座上的电机a,所述电机a的输出轴与转轴固定连接,所述支撑架上还固定设置有支撑杆,所述支撑杆上固定设置有转动座,所述转盘转动设置在转动座上,所述转盘固定设置在转轴上,所述转轴转动设置在转动座内。As a preference, the rotating assembly further includes a fixed seat fixed on the support frame, a rotating shaft rotatably arranged in the fixed seat, a motor seat fixed on the fixed seat, and a motor a fixed on the motor seat, The output shaft of the motor a is fixedly connected to the rotating shaft, and a support rod is fixedly arranged on the support frame, and a rotating seat is fixedly arranged on the supporting rod, and the rotating disk is arranged on the rotating seat, and the rotating disk is fixedly arranged On the rotating shaft, the rotating shaft is rotatably arranged in the rotating seat.
作为一种优选,所述上料组件包括固定架a、转动设置在固定架a上的输送带a、固定设置在固定架a上的上料箱以及固定设置在固定架a上的限位板a,所述上料箱位于输送带a的上方。As a preference, the feeding assembly includes a fixed frame a, a conveyor belt a rotatably arranged on the fixed frame a, a feeding box fixedly arranged on the fixed frame a, and a limit plate fixedly arranged on the fixed frame a a, the upper material box is located above the conveyor belt a.
作为一种优选,所述承载板上开设有通槽,所述通槽的两侧均开设有滑槽a,所述转盘的内壁上开设有滑槽b,所述夹持组件包括滑动设置在滑槽a内的滑块a、滑动设置在滑槽a内的滑块b、固定设置在滑块a上的夹持板a、固定设置在滑块b上的夹持板b、铰接设置在滑块a底部的连接杆a、铰接设置在滑块b底部的连接杆b、滑动设置在滑槽b内的连接轴以及固定连接在连接轴和滑槽b之间的弹簧,所述连接杆a与连接杆b的底部均转动设置在连接轴上,所述夹持板a和夹持板b均设置为弧形结构。As a preference, a through groove is opened on the bearing plate, a chute a is opened on both sides of the through trough, a chute b is opened on the inner wall of the turntable, and the clamping assembly includes a The slider a in the chute a, the slider b slidably arranged in the chute a, the clamping plate a fixed on the slider a, the clamping plate b fixed on the slider b, the hinged set on The connecting rod a at the bottom of the slider a, the connecting rod b hingedly arranged at the bottom of the slider b, the connecting shaft slidingly arranged in the chute b, and the spring fixedly connected between the connecting shaft and the chute b, the connecting rod Both a and the bottom of the connecting rod b are rotatably arranged on the connecting shaft, and the clamping plate a and the clamping plate b are both arranged in an arc-shaped structure.
作为一种优选,所述导向组件包括固定设置在转动座上的连接柱和固定设置在连接柱上的凸轮,所述凸轮与转轴同轴心。As a preference, the guide assembly includes a connecting post fixedly arranged on the rotating seat and a cam fixedly arranged on the connecting post, and the cam is coaxial with the rotating shaft.
作为一种优选,所述打磨组件包括固定设置在支撑架上的固定板、固定设置在固定板上的气缸、在气缸带动下的活塞杆、转动设置在活塞杆底部的转动杆、固定设置在转动杆底部的打磨棒、固定设置在活塞杆上的电机b、固定设置在转动杆上的皮带轮a、固定设置在电机b输出轴上的皮带轮b以及连接在皮带轮a和皮带轮b之间的皮带,所述固定板上还固定设置有滑轨,所述电机b滑动设置在滑轨上,所述打磨棒的外径与半导体石墨管的内径一致。As a preference, the grinding assembly includes a fixed plate fixed on the support frame, a cylinder fixed on the fixed plate, a piston rod driven by the cylinder, a rotating rod fixed at the bottom of the piston rod, and a cylinder fixed on the bottom of the piston rod. The grinding rod at the bottom of the rotating rod, the motor b fixed on the piston rod, the pulley a fixed on the rotating rod, the pulley b fixed on the output shaft of the motor b, and the belt connected between the pulley a and the pulley b A slide rail is fixedly arranged on the fixed plate, the motor b is slidably arranged on the slide rail, and the outer diameter of the grinding rod is consistent with the inner diameter of the semiconductor graphite tube.
作为一种优选,所述吸尘组件包括开设在转动座顶部的若干个吸尘孔、固定连接在转动座上的吸尘管、固定设置在转动座上的挡板以及固定设置在支撑架上的吸尘器,所述挡板顶部开设有缺口,所述吸尘管与吸尘孔相连通,所述吸尘管的另一端与吸尘器固定连接。As a preference, the dust suction assembly includes several suction holes opened on the top of the rotating base, a dust suction pipe fixedly connected to the rotating base, a baffle fixed on the rotating base and a support frame In the vacuum cleaner, there is a gap on the top of the baffle, the suction pipe communicates with the suction hole, and the other end of the suction pipe is fixedly connected to the vacuum cleaner.
作为一种优选,所述下料组件包括固定架b、转动设置在固定架b上的输送带b以及固定设置在固定架b两侧的限位板b。As a preference, the unloading assembly includes a fixed frame b, a conveyor belt b rotatably arranged on the fixed frame b, and limiting plates b fixedly arranged on both sides of the fixed frame b.
作为一种优选,所述夹持板a和夹持板b的内表面均固定设置有若干个橡胶凸起。As a preference, the inner surfaces of the clamping plate a and the clamping plate b are both fixedly provided with several rubber protrusions.
作为又一种优选,所述挡板的一侧与转盘的内壁相贴合,另一侧与凸轮的表面相贴合。As yet another preference, one side of the baffle is in contact with the inner wall of the turntable, and the other side is in contact with the surface of the cam.
本发明的有益效果在于:The beneficial effects of the present invention are:
1.本发明设置有上料组件和下料组件,通过设置输送带a将半导体石墨管输送至夹持组件处,通过设置输送带b将打磨完的半导体石墨管进行下料输出,实现了自动上下料的操作,提高了工作效率。1. The present invention is provided with a loading assembly and a blanking assembly, by setting the conveyor belt a to transport the semiconductor graphite tube to the clamping assembly, and by setting the conveyor belt b to carry out the blanking output of the polished semiconductor graphite tube, realizing automatic The operation of loading and unloading improves work efficiency.
2.本发明设置有转动组件、夹持组件和导向组件,通过设置转盘带动夹持组件转动,在从上料组件转动至打磨组件的路径上,夹持组件与凸轮配合,使得夹持板a和夹持板b逐渐合拢将半导体石墨管进行固定,在送打磨组件转动到下料组件的路径上,夹持组件与凸轮配合,使得夹持板a和夹持板b逐渐分开将半导体石墨管松开,实现了自动夹紧和松开的操作。2. The present invention is provided with a rotating assembly, a clamping assembly and a guide assembly. The clamping assembly is driven to rotate by setting a turntable. On the path from the feeding assembly to the grinding assembly, the clamping assembly cooperates with the cam to make the clamping plate a Gradually close the clamping plate b to fix the semiconductor graphite tube. On the path from the feeding and grinding assembly to the blanking assembly, the clamping assembly cooperates with the cam, so that the clamping plate a and the clamping plate b are gradually separated to separate the semiconductor graphite tube. Unclamping realizes automatic clamping and unclamping operations.
3.本发明还设置有吸尘组件,通过设置吸尘器、吸尘孔和吸尘管,在对半导体石墨管进行打磨时,在吸尘器的作用下,打磨产生的废屑被吸入吸尘孔内再经吸尘管进入吸尘器内进行收集,避免打磨的废屑散落一地,污染作业环境,此外,吸尘器的废屑可以定期进行清理。3. The present invention is also provided with a dust-absorbing assembly. By arranging a vacuum cleaner, a dust-absorbing hole and a dust-absorbing tube, when the semiconductor graphite tube is polished, under the action of the vacuum cleaner, the waste chips generated by grinding are sucked into the dust-absorbing hole and then It enters the vacuum cleaner through the suction pipe for collection, so as to prevent the waste from grinding from being scattered all over the place and pollute the working environment. In addition, the waste from the vacuum cleaner can be cleaned regularly.
综上所述,本发明具有工作效率高、自动化程度高等优点,适合半导体石墨管加工技术领域。In summary, the present invention has the advantages of high work efficiency and high degree of automation, and is suitable for the technical field of semiconductor graphite tube processing.
附图说明Description of drawings
下面结合附图对本发明做进一步的说明:Below in conjunction with accompanying drawing, the present invention will be further described:
图1为半导体石墨管内壁打磨装置;Fig. 1 is a semiconductor graphite tube inner wall grinding device;
图2为图1的A处放大示意图;Figure 2 is an enlarged schematic view of A in Figure 1;
图3为转动组件的结构示意图;Fig. 3 is the structural representation of rotating assembly;
图4为转盘的正视剖面示意图;Fig. 4 is the schematic diagram of front view section of turntable;
图5为转盘的侧视剖面示意图;Fig. 5 is a schematic side view sectional view of the turntable;
图6为半导体石墨管打磨时的状态示意图。Fig. 6 is a schematic diagram of the state when the semiconductor graphite tube is polished.
附图标记:1-支撑架;11-承载板;12-半导体石墨管;13-通槽;14-滑槽a;15-滑槽b;2-转动组件;21-转盘;22-固定座;23-转轴;24-电机座;25-电机a;26-支撑杆;27-转动座;3-上料组件;31-固定架a;32-输送带a;33-上料箱;34-限位板a;4-下料组件;41-固定架b;42-输送带b;43-限位板b;5-夹持组件;51-滑块a;52-滑块b;53-夹持板a;54-夹持板b;55-连接杆a;56-连接杆b;57-连接轴;58-弹簧;6-导向组件;61-连接柱;62-凸轮;7-打磨组件;71-固定板;72-气缸;73-活塞杆;74-转动杆;75-打磨棒;76-电机b;77-皮带轮a;78-皮带轮b;79-皮带;8-吸尘组件;81-吸尘孔;82-吸尘管;83-挡板;84-吸尘器;85-缺口;9-橡胶凸起;91-滑轨。Reference signs: 1-support frame; 11-carrying plate; 12-semiconductor graphite tube; 13-through slot; 14-chute a; 15-chute b; 2-rotating assembly; ;23-rotating shaft; 24-motor seat; 25-motor a; 26-support rod; 27-rotary seat; 3-feeding assembly; -Limiting plate a; 4-Blanking assembly; 41-Fixer b; 42-Conveyor belt b; 43-Limiting plate b; 5-Clamping assembly; 51-Slider a; 52-Slider b; 53 - clamping plate a; 54- clamping plate b; 55- connecting rod a; 56- connecting rod b; 57- connecting shaft; 58- spring; 6- guide assembly; 61- connecting column; 62- cam; Grinding assembly; 71-fixed plate; 72-cylinder; 73-piston rod; 74-rotating rod; 75-grinding rod; 76-motor b; 77-pulley a; 78-pulley b; Components; 81-suction hole; 82-suction pipe; 83-baffle; 84-vacuum cleaner; 85-notch; 9-rubber protrusion; 91-sliding rail.
具体实施方式Detailed ways
下面结合附图对本发明实施例中的技术方案进行清楚、完整地说明。The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings.
实施例一Embodiment one
下面详细描述本发明的实施例,所述实施例的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的,旨在用于解释本发明,而不能理解为对本发明的限制。Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.
如图1至图6所示,一种半导体石墨管内壁打磨装置,包括支撑架1,支撑架1上设置有转动组件2,转动组件2包括转盘21,转盘21设置为中空结构,转盘21的左右两侧分别设置有上料组件3和下料组件4,转盘21上固定设置有若干个承载板11,若干个承载板11上均滑动设置有夹持组件5,转盘21内固定设置有导向组件6,转盘21的上方设置有打磨组件7,转盘21内还设置有吸尘组件8,上料组件3用于输送半导体石墨管12,转动组件2用于带动夹持组件5进行转动,夹持组件5用于在转动的过程中与导向组件6配合将半导体石墨管12进行夹持或松开,打磨组件7用于将半导体石墨管12的内壁进行打磨,吸尘组件8用于将打磨过程中产生的废屑进行收集,下料组件4用于输出打磨后的半导体石墨管12。As shown in Figures 1 to 6, a semiconductor graphite tube inner wall grinding device includes a support frame 1, a
如图3所示,转动组件2还包括固定设置在支撑架1上的固定座22、转动设置在固定座22内的转轴23、固定设置在固定座22上的电机座24以及固定设置在电机座24上的电机a25,电机a25的输出轴与转轴23固定连接,支撑架1上还固定设置有支撑杆26,支撑杆26上固定设置有转动座27,转盘21转动设置在转动座27上,转盘21固定设置在转轴23上,转轴23转动设置在转动座27内,在使用时,开启电机a25,带动转盘21进行转动,在转动的过程中实现上料、打磨和下料的操作,大大提高了工作效率。As shown in Figure 3, the
如图1所示,上料组件3包括固定架a31、转动设置在固定架a31上的输送带a32、固定设置在固定架a31上的上料箱33以及固定设置在固定架a31上的限位板a34,上料箱33位于输送带a32的上方,在使用时,上料箱33内叠放有若干根半导体石墨管12,最底下的半导体石墨管12掉落至输送带a32上被输送至夹持组件5上,实现了自动上料的操作,提高了工作效率。As shown in Figure 1, the feeding assembly 3 includes a fixed frame a31, a conveyor belt a32 rotatably arranged on the fixed frame a31, a
如图4所示,承载板11上开设有通槽13,通槽13的两侧均开设有滑槽a14,转盘21的内壁上开设有滑槽b15,夹持组件5包括滑动设置在滑槽a14内的滑块a51、滑动设置在滑槽a14内的滑块b52、固定设置在滑块a51上的夹持板a53、固定设置在滑块b52上的夹持板b54、铰接设置在滑块a51底部的连接杆a55、铰接设置在滑块b52底部的连接杆b56、滑动设置在滑槽b15内的连接轴57以及固定连接在连接轴57和滑槽b15之间的弹簧58,连接杆a55与连接杆b56的底部均转动设置在连接轴57上,夹持板a53和夹持板b54均设置为弧形结构,在使用时,当夹持组件5位于上料组件3处时,此时,弹簧58被压缩,在上料组件3将半导体石墨管12输送至夹持板a53和夹持板b54之间时,在转盘21的带动下,在半导体石墨管12转动至打磨组件7的路径上,夹持板a53和夹持板b54在转动的过程中在凸轮62的作用下,逐渐合拢将半导体石墨管12进行夹持固定,此时,连接轴57滑动在滑槽b15内,弹簧58释放,使得半导体石墨管12在位于打磨组件7下方时已被固定住,当半导体石墨管12打磨完成后,在转盘21的带动下,在半导体石墨管13转动至下料组件4的路径上,夹持板a53和夹持板b54在转动的过程中在凸轮62的作用下,逐渐分开将半导体石墨管12进行松开,此时,连接轴57滑动在滑槽b15内,弹簧58被压缩,实现了自动固定半导体石墨管12的操作,无需人工进行固定。As shown in Figure 4, a
如图4和图5所示,导向组件6包括固定设置在转动座27上的连接柱61和固定设置在连接柱61上的凸轮62,凸轮62与转轴23同轴心,在使用时,通过设置凸轮62实现夹持板a53和夹持板b54的合拢和张开。As shown in Fig. 4 and Fig. 5, the
如图2所示,打磨组件7包括固定设置在支撑架1上的固定板71、固定设置在固定板71上的气缸72、在气缸72带动下的活塞杆73、转动设置在活塞杆73底部的转动杆74、固定设置在转动杆74底部的打磨棒75、固定设置在活塞杆73上的电机b76、固定设置在转动杆74上的皮带轮a77、固定设置在电机b76输出轴上的皮带轮b78以及连接在皮带轮a77和皮带轮b78之间的皮带79,固定板71上还固定设置有滑轨91,电机b76滑动设置在滑轨91上,打磨棒75的外径与半导体石墨管12的内径一致,在使用时,当转盘21带动夹持组件5和半导体石墨管12转动至打磨组件7正下方时,此时,夹持组件5已经将半导体石墨管12进行固定,气缸72开始工作,活塞杆73向下移动带动转动杆74和打磨棒75向下移动,直至打磨棒75全部伸入半导体石墨管12的内部,此时,打磨棒75的外壁与半导体石墨管12的内壁相贴合,开启电机b76,带动电机b76的输出轴转动,从而带动转动杆74和打磨棒75进行转动,在打磨棒75转动的过程中将半导体石墨管12的内壁进行打磨,提高了打磨的精度和效率。As shown in Figure 2, the grinding assembly 7 includes a fixed
如图3和图4所示,吸尘组件8包括开设在转动座27顶部的若干个吸尘孔81、固定连接在转动座27上的吸尘管82、固定设置在转动座27上的挡板83以及固定设置在支撑架1上的吸尘器84,挡板83顶部开设有缺口85,吸尘管82与吸尘孔81相连通,吸尘管82的另一端与吸尘器84固定连接,在使用时,开启吸尘器84,在对半导体石墨管12进行打磨时,在吸尘器84的作用下,打磨产生的废屑被吸入吸尘孔81内再经吸尘管82进入吸尘器84内进行收集,吸尘器84的废屑可以定期进行清理,避免打磨的废屑散落一地,污染作业环境。As shown in FIGS. 3 and 4 , the dust suction assembly 8 includes several suction holes 81 opened on the top of the rotating
如图1所示,下料组件4包括固定架b41、转动设置在固定架b41上的输送带b42以及固定设置在固定架b41两侧的限位板b43,在使用时,当半导体石墨管12打磨完毕后,随着转盘21的转动,夹持组件5带动半导体石墨管12转动至输送带b42至,此时,夹持组件5已经松开对半导体石墨管12的夹持,半导体石墨管12的底部与输送带b42的顶面相贴合,使得输送带b42带动半导体石墨管12进行下料输出,实现了自动下料的操作,无需人工进行下料,省时省力,提高了工作效率。As shown in Figure 1, the blanking assembly 4 includes a fixed frame b41, a conveyor belt b42 that is rotatably arranged on the fixed frame b41, and a limit plate b43 that is fixedly arranged on both sides of the fixed frame b41. When in use, when the
如图5所示,挡板83的一侧与转盘21的内壁相贴合,另一侧与凸轮62的表面相贴合,通过设置挡板83,在吸尘孔81将打磨废屑吸取时,挡板83对废屑起到引导作用,引导废屑进入吸尘孔81内。As shown in Figure 5, one side of the
实施例二Embodiment two
如图3所示,其中与实施例一中相同或相应的部件采用与实施例一相应的附图标记,为简便起见,下文仅描述与实施例一的区别点;该实施例二与实施例一的不同之处在于:夹持板a53和夹持板b54的内表面均固定设置有若干个橡胶凸起9。As shown in Figure 3, wherein the same or corresponding parts with the first embodiment adopt the corresponding reference numerals with the first embodiment, for the sake of simplicity, only the difference from the first embodiment is described below; the second embodiment and the first embodiment One difference is that: the inner surfaces of the clamping plate a53 and the clamping plate b54 are fixedly provided with several rubber protrusions 9 .
此处,本实施例通过在夹持板a53和夹持板b54的内表面设置橡胶凸起9,可以增加夹持板a53和夹持板b54与半导体石墨管12之间的摩擦力,一方面,使得夹持板a53和夹持板b54将半导体石墨管12夹持的更牢固,另一方面使得半导体石墨管12在打磨时不会转动,影响打磨的质量。Here, the present embodiment can increase the frictional force between the clamping plate a53 and the clamping plate b54 and the
工作过程work process
首先工作人员将半导体石墨管12叠放到上料箱33内,输送带a32开始运作,带动掉落在输送带a32上的半导体石墨管12输送至夹持板a53和夹持板b54之间,在转盘21的带动下,在半导体石墨管12转动至打磨组件7的路径上,夹持板a53和夹持板b54在转动的过程中在凸轮62的作用下,逐渐合拢将半导体石墨管12进行夹持固定,此时,连接轴57滑动在滑槽b15内,弹簧58释放,使得半导体石墨管12在位于打磨组件7下方时已被固定住,半导体石墨管12转动至打磨组件7下方时,气缸72开始工作,活塞杆73向下移动带动转动杆74和打磨棒75向下移动,直至打磨棒75全部伸入半导体石墨管12的内部,此时,打磨棒75的外壁与半导体石墨管12的内壁相贴合,开启电机b76,带动电机b76的输出轴转动,从而带动转动杆74和打磨棒75进行转动,打磨棒75对半导体石墨管12的内壁进行打磨,当半导体石墨管12打磨完成后,在转盘21的带动下,在半导体石墨管12转动至下料组件4的路径上,夹持板a53和夹持板b54在转动的过程中在凸轮62的作用下,逐渐分开将半导体石墨管12进行松开,此时,连接轴57滑动在滑槽b15内,弹簧58被压缩,在转动到输送带b42处时,输送带b42将半导体石墨管12进行输出下料。First, the staff stacks the
在本发明的描述中,需要理解的是,术语“前后”、“左右”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的设备或部件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对发明的限制。In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "front and rear", "left and right", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description. It is not intended to indicate or imply that the referred device or component must have a particular orientation, be constructed in a particular orientation, and operate in a particular orientation, and thus should not be construed as limiting the invention.
当然在本技术方案中,本领域的技术人员应当理解的是,术语“一”应理解为“至少一个”或“一个或多个”,即在一个实施例中,一个元件的数量可以为一个,而在另外的实施例中,该元件的数量可以为多个,术语“一”不能理解为对数量的限制。Of course, in this technical solution, those skilled in the art should understand that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of one element can be one , and in other embodiments, the number of the element may be more than one, and the term "a" cannot be understood as a limitation on the number.
以上结合附图所述的仅是本发明的优选实施方式,但本发明并不限于上述实施方式,应当指出,对于本领域的技术人员来说,在不脱离本发明结构的前提下,还可作出各种变形和改进,这些也应该视为本发明的保护范围,都不会影响本发明实施的效果和实用性。What is described above in conjunction with the accompanying drawings is only a preferred embodiment of the present invention, but the present invention is not limited to the above-mentioned embodiment. It should be pointed out that for those skilled in the art, without departing from the structure of the present invention Various modifications and improvements are made, which should also be regarded as the protection scope of the present invention, and will not affect the effect and practicability of the implementation of the present invention.
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