CN116159403A - Semiconductor waste gas treatment device and semiconductor waste gas treatment system - Google Patents

Abstract

The invention relates to the field of semiconductor manufacturing technology, and provides a semiconductor waste gas treatment device and a semiconductor waste gas treatment system. The semiconductor waste gas treatment device includes a reaction chamber, a collar and a cooler, and the cooler is provided with a channel for cooling liquid circulation. The channel is arranged around the outside of the reaction chamber, the collar is provided with an overflow hole, the collar is sleeved on the bottom of the reaction chamber, and a hole for storing the cooling liquid is formed between the collar and the reaction chamber. Storage Room. The cooling liquid is stored in the storage chamber at the bottom of the reaction chamber to ensure that the welding seam at the bottom of the reaction chamber does not directly contact the exhaust gas and reduce the corrosion of the bottom of the reaction chamber. At the same time, the cooling liquid has been circulating in the channel to ensure that the cooling liquid will not accumulate for a long time, resulting in high acidity, which reduces the temperature in the reaction chamber, slows down the corrosion rate, and improves the service life of the reaction chamber.

Description

Semiconductor waste gas treatment device and semiconductor waste gas treatment system

technical field

The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor waste gas treatment device and a semiconductor waste gas treatment system.

Background technique

In the production and manufacture of integrated circuits, various special gases are used to meet the process requirements, such as: CF gas, cl2NF3 and other harmful gases, which are mainly highly toxic and acidic. Such gases cannot be discharged directly. Therefore, adsorption tail gas treatment equipment is required for treatment and discharge. The basic principle of adsorption tail gas treatment equipment is to use high temperature to open the chemical bonds of gas, and then combine with oxygen to form oxides and then fuse with water.

Because most of the process gases used in semiconductors are highly corrosive gases, such as HF, HBr, and HCl, which double the corrosive strength when combined with water, which has a great impact on the service life of the reaction chamber, and may even cause reaction The cavity is severely corroded, especially the weld seam on the outer wall of the bottom of the reaction cavity, which is prone to sensitization effect, and the temperature of the corrosion position is high, which leads to an accelerated corrosion rate, further reduces the corrosion resistance of the reaction cavity, and affects the reaction cavity. normal use.

Contents of the invention

The present invention aims to solve at least one of the technical problems existing in the related art. For this reason, the present invention proposes a semiconductor waste gas treatment device, through.

The present invention also proposes a semiconductor waste gas treatment system, comprising the above-mentioned semiconductor waste gas treatment device.

The semiconductor waste gas treatment device according to the embodiment of the first aspect of the present invention includes a reaction chamber, a collar and a cooler, the cooler is provided with a channel for cooling liquid circulation, and the channel is arranged around the outside of the reaction chamber, so An overflow hole is provided on the collar, the collar is set on the bottom of the reaction chamber, and a storage chamber for storing the cooling liquid is formed between the collar and the reaction chamber.

According to the semiconductor waste gas treatment device of the embodiment of the present invention, the channel extends along the axial direction of the reaction chamber.

According to the semiconductor waste gas treatment device of the embodiment of the present invention, the cooler includes a water storage tank, and the water storage tank communicates with the channel.

According to the semiconductor waste gas treatment device of the embodiment of the present invention, the cooler further includes a circulation pump and a circulation branch, and the circulation pump communicates with the water storage tank and the channel through the circulation branch.

According to the semiconductor waste gas treatment device of the embodiment of the present invention, a liquid outlet hole is provided at the bottom of the collar, and communicates with the water storage tank through the liquid outlet hole.

According to the semiconductor waste gas treatment device of the embodiment of the present invention, a pressure gauge is arranged on the circulation branch.

According to the semiconductor waste gas treatment device of the embodiment of the present invention, the cooler further includes a control module connected to the circulation pump to control the operation of the circulation pump.

According to the semiconductor waste gas treatment device of the embodiment of the present invention, a flow-limiting hole is provided outside the reaction chamber, and the flow-limiting hole is communicated with the channel.

According to the semiconductor waste gas treatment device of the embodiment of the present invention, a cooling device is provided between the collar and the water storage tank.

Furthermore, an embodiment of the present invention also provides a semiconductor waste gas treatment system, including the above-mentioned semiconductor waste gas treatment device.

The above one or more technical solutions in the embodiments of the present invention have at least one of the following technical effects:

An embodiment of the present invention provides a semiconductor waste gas treatment device, including a reaction chamber, a collar and a cooler, the cooler is provided with a channel for cooling liquid circulation, and the channel is arranged around the outside of the reaction chamber, so An overflow hole is provided on the collar, the collar is set on the bottom of the reaction chamber, and a storage chamber for storing the cooling liquid is formed between the collar and the reaction chamber. The cooling liquid is stored in the storage chamber at the bottom of the reaction chamber to ensure that the welding seam at the bottom of the reaction chamber does not directly contact the exhaust gas and reduce the corrosion of the bottom of the reaction chamber. At the same time, the cooling liquid has been circulating in the channel to ensure that the cooling liquid will not accumulate for a long time, reduce the temperature in the reaction chamber, slow down the corrosion rate, and improve the service life of the reaction chamber.

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the following will briefly introduce the drawings that need to be used in the descriptions of the embodiments or related technologies. Obviously, the drawings in the following description are only For some embodiments of the invention, those skilled in the art can also obtain other drawings based on these drawings without creative effort.

Figure 1 is a schematic structural diagram of a semiconductor waste gas treatment device provided by an embodiment of the present invention;

Fig. 2 is a schematic flow diagram of the cooling liquid provided by the embodiment of the present invention.

Reference signs:

1. Reaction chamber; 11. Restriction hole;

2. Collar; 21. Overflow hole; 22. Storage chamber; 23. Liquid outlet hole;

3. Cooler; 31. Channel; 32. Water storage tank; 33. Circulation pump; 34. Circulation branch; 35. Pressure gauge; 36. Control module;

4. Cooling device.

Detailed ways

Embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but should not be used to limit the scope of the present invention.

In the description of the embodiments of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "inner" and "outer" are Based on the orientation or positional relationship shown in the drawings, it is only for the convenience of describing the embodiments of the present invention and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, therefore It should not be understood as a limitation to the embodiments of the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and should not be understood as indicating or implying relative importance.

In the description of the embodiments of the present invention, it should be noted that unless otherwise specified and limited, the terms "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection, Or integrated connection; it can be mechanical connection or electrical connection; it can be direct connection or indirect connection through an intermediary. Those of ordinary skill in the art can understand the specific meanings of the above terms in the embodiments of the present invention in specific situations.

In the embodiments of the present invention, unless otherwise specified and limited, the first feature may be in direct contact with the first feature or the first feature and the second feature may pass through the middle of the second feature. Media indirect contact. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

In addition, in the description of the embodiments of the present invention, unless otherwise specified, the meanings of "multiple", "multiple roots" and "multiple groups" are two or more, "several", "several roots", "Several groups" means one or more than one.

In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or feature is included in at least one embodiment or example of the embodiments of the present invention. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other.

An embodiment of one aspect of the present invention, as shown in FIG. 1 , provides a semiconductor waste gas treatment device, including a reaction chamber 1, a collar 2 and a cooler 3, and the cooler 3 is provided with a passage 31 for cooling liquid circulation , the channel 31 is arranged around the outside of the reaction chamber 1, the collar 2 is provided with an overflow hole 21, the collar 2 is set on the bottom of the reaction chamber 1, and the reaction chamber 1 A storage chamber 22 for storing the cooling liquid is formed therebetween. The cooling liquid is stored in the storage chamber 22 at the bottom of the reaction chamber 1 to ensure that the welding seam at the bottom of the reaction chamber 1 does not directly contact with the exhaust gas, thereby reducing corrosion at the bottom of the reaction chamber 1 . At the same time, the cooling liquid has been circulating in the channel 31 to ensure that the cooling liquid will not accumulate for a long time, reduce the temperature in the reaction chamber 1, slow down the corrosion rate, and improve the service life of the reaction chamber 1 .

The semiconductor waste gas treatment device of the embodiment of the present invention, as shown in Figure 1, includes a reaction chamber 1 for waste gas reaction treatment, the reaction chamber 1 is a top-down through structure, and the collar 2 is sleeved on the bottom of the reaction chamber 1 , corresponding to the part of the reaction chamber 1, the cooler 3 constructs a channel 31 arranged around the reaction chamber 1, and the cooling liquid circulates in the channel 31, and an overflow hole 21 is provided on the collar 2, and the overflow hole 21 communicates with the channel 31. The storage chamber 22 and the reaction chamber 1, that is, the coolant flows through the channel 31 and after the storage chamber 22 is full, it overflows into the reaction chamber 1 along the overflow port and flows out from the bottom of the collar 2 . Optionally, the number of channels 31 may be one or more, which is not specifically limited in this application.

As shown in Figure 2, the present invention stores the cooling liquid in the storage chamber 22 after the cooling liquid of the cooler 3 flows through the passage 31 through the setting of the passage 31, so that the storage chamber 22 is filled with cooling liquid to prevent waste gas from contacting the bottom of the reaction chamber 1. Corrosion occurs in contact with the weld seam. At the same time, when the storage chamber 22 is full of coolant, the excess coolant will flow out from the overflow hole 21, so that the coolant in the storage chamber 22 is continuously circulated to ensure that the coolant will not accumulate for a long time and cause its acidity. Enhanced, can improve the cooling effect of the reaction chamber 1, the circulating flow of the cooling liquid reduces the temperature at the bottom of the reaction chamber 1, and can slow down the corrosion efficiency. The semiconductor waste gas treatment device of the present invention can use cooling liquid to prevent the waste gas from contacting the weld seam at the bottom of the reaction chamber 1, delay corrosion, effectively reduce the corrosion rate of the reaction chamber 1, and at the same time reduce the temperature of the reaction chamber 1, and slow down the impact of the waste gas on the reaction chamber. 1 corrosion, the cooling liquid can also be evenly distributed at the bottom of the reaction chamber 1 and there is always enough cooling liquid stored in the storage chamber 22, effectively isolating the contact between the exhaust gas and the weld seam at the bottom of the reaction chamber 1, and preventing the corrosion of the bottom of the reaction chamber 1. Corrosion, prolong service life.

According to an embodiment provided by the present invention, the channel 31 extends along the axial direction of the reaction chamber 1. In this embodiment, the channel 31 is linear and arranged along the axial direction outside the reaction chamber 1. The channel 31 has a certain The width can cover the surface of the outer wall of the reaction chamber 1 , and the cooling liquid flowing through the channel 31 can cool the reaction chamber 1 to a certain extent.

In other embodiments, the shape and direction of the channel 31 can be set according to actual needs, and can also be partly bent, fully bent, or arranged in a spiral manner along the axial direction outside the reaction chamber 1, etc. This application does not do this Specific limits.

According to an embodiment provided by the present invention, the cooler 3 includes a water storage tank 32 arranged outside the reaction chamber 1, the water storage tank 32 communicates with the channel 31, and the water storage tank 32 can be used to provide cooling liquid in the channel 31, and the cooling liquid is in the After flowing through the channel 31, the storage chamber 22 and the reaction chamber 1, it can return to the water storage tank 32 for recycling.

According to an embodiment provided by the present invention, an overflow hole 21 is provided on the side wall of the collar 2, and a storage chamber 22 is formed between the collar 2 and the reaction chamber 1, and the storage chamber 22 is used to store cooling liquid to ensure the reaction The weld seam at the bottom of cavity 1 is not in contact with the exhaust gas. It can be understood that the height of the overflow hole 21 determines the volume of the storage chamber 22, and the height of the overflow hole 21 can be set according to the needs of the reaction chamber 1 that needs to be isolated. The higher the height of the overflow hole 21, the higher the storage chamber. The larger the volume of 22, the more coolant it can hold, and the larger the isolated area.

According to an embodiment provided by the present invention, in order to realize the circulating flow of the cooling liquid between the channel 31, the storage chamber 22, the reaction chamber 1 and the water storage tank 32, the cooler 3 is also provided with a circulation pump 33 and a circulation branch 34. The pump 33 is connected to the water storage tank 32 and the channel 31 through the circulation branch 34 to provide power for the circulating flow of the cooling liquid, to ensure the flow efficiency of the cooling liquid to the greatest extent, and to prevent the long-term accumulation of the cooling liquid in the storage chamber 22 and cause the storage chamber 22 to The acidity of the cooling liquid increases, which instead accelerates the corrosion rate of the weld seam at the bottom of the reaction chamber 1. The circulation pump 33 accelerates the flow of the cooling liquid, which can also improve the cooling efficiency of the reaction chamber 1 and reduce the corrosion efficiency of the reaction chamber 1.

According to an embodiment provided by the present invention, a liquid outlet hole 23 is provided at the bottom of the collar 2, and the size and quantity of the liquid outlet hole 23 can be adjusted according to the actual needs of discharging cooling liquid. After the cooling liquid, the cooling liquid above the overflow hole 21 will overflow from the overflow hole 21, reach the inside of the reaction chamber 1, and flow out through the liquid outlet hole 23 provided on the collar 2 at the bottom of the reaction chamber 1, and the The outflowing cooling liquid gathers in the water storage tank 32 , and performs the next cycle after necessary treatment in the water storage tank 32 .

According to one embodiment of the present invention, a pressure gauge 35 is provided on the circulation branch 34, the pressure gauge 35 can monitor the pressure of the coolant inside the circulation branch 34, and the pressure gauge 35 can also be used to judge whether the cooler 3 is abnormal Damage, when the measured value of the pressure gauge 35 changes abnormally, it is necessary to arrange maintenance in time. For example, when the measured value of the pressure gauge 35 is suddenly found to be significantly lower during the operation of the cooler 3, it may be that a certain pipeline is damaged or leaked or blockage, etc., at this time, arrangements can be made to overhaul pipelines such as the circulation branch 34 or the channel 31 to ensure the normal operation of the cooler 3 .

In other embodiments, other branches that need to use cooling liquid are also included, and the circulation branch 34 communicates with other branches for providing cooling liquid to other branches for convenient control. Optionally, a one-way valve may also be provided on the circulation branch 34 as required to control the flow direction of the cooling liquid in the circulation branch 34 , which is not specifically limited in the present application.

According to an embodiment of the present invention, the cooler 3 is also provided with a control module 36, and the control module 36 can control the operation of the circulating pump 33 according to the measured value of the pressure gauge 35, for example, control the power of the circulating pump 33 according to the measured value of the pressure gauge 35 , so as to achieve the purpose of controlling the flow rate of the coolant.

In other embodiments, a thermometer can also be installed on the circulation branch 34 or in the storage chamber 22 , and the thermometer is connected to the control module to regulate the operation of the circulation pump 33 according to the temperature. For example, when the thermometer detects that the temperature in the circulation branch 34 is greater than 25°C, the control module controls the circulation pump 33 to increase the power, increase the flow rate of the cooling liquid, further reduce the temperature of the cooling liquid, and reduce the corrosion rate of the reaction chamber 1 .

According to an embodiment of the present invention, a flow-restricting hole 11 is provided outside the reaction chamber 1, and the flow-limiting hole 11 is connected to the channel 31. The number of the flow-limiting hole 11 is adapted to the number of the channel 31 and can be set according to actual needs. , each channel 31 has a restricting hole 11 as a liquid inlet, the cooling liquid enters the channel 31 through the restricting hole 11, and after flowing through the entire channel 31 and the storage chamber 22, the excess cooling liquid enters the reaction through the overflow hole 21 chamber 1, and flows out from the outlet hole 23 at the bottom of the collar 2, and returns to the water storage tank 32 for the next cycle. The restrictor hole 11 is used as a liquid inlet hole of each channel 31 , which can further control the pressure, flow rate and flow rate of the cooling liquid entering the channel 31 . The flow-limiting hole 11 may be a hole provided outside the reaction chamber 1 , or an independent external flow-limiting device capable of controlling the flow rate of the cooling liquid, which is not specifically limited in the present application.

According to an embodiment of the present invention, a cooling device 4 is also provided between the collar 2 and the water storage tank 32, and the cooling device 4 can further cool the reaction chamber 1, and the liquid that flows out from the outlet hole 23 of the collar 2 The coolant is cooled to reduce the temperature of the coolant in the circulation process, improve the cooling effect and reduce the corrosion rate.

Another embodiment of the present invention further provides a semiconductor waste gas treatment system, including the semiconductor waste gas treatment device as in the above embodiment.

In the semiconductor waste gas treatment system of the embodiment of the present invention, the semiconductor waste gas treatment device is provided with a reaction chamber 1 penetrating from top to bottom, and a collar 2 is set at the bottom of the reaction chamber 1, and a storage space is formed between the collar 2 and the reaction chamber 1. The chamber 22 and the collar 2 are also provided with an overflow hole 21. After the coolant flows through the channel 31 and the storage chamber 22, excess coolant flows into the reaction chamber 1 through the overflow hole 21 and is discharged from the bottom of the reaction chamber 1.

An embodiment of the present invention provides a semiconductor waste gas treatment device, including a reaction chamber 1, a collar 2 and a cooler 3, the cooler 3 is provided with a channel 31 for cooling liquid circulation, and the channel 31 surrounds the reaction chamber. The outside of the chamber 1 is provided, and the collar 2 is provided with an overflow hole 21. The collar 2 is sleeved on the bottom of the reaction chamber 1, and a cooling liquid is formed between the reaction chamber 1 and the reaction chamber 1. Storage room 22. The cooling liquid is stored in the storage chamber 22 at the bottom of the reaction chamber 1 to ensure that the weld seam at the bottom of the reaction chamber 1 does not directly contact the exhaust gas, thereby reducing the corrosion of the weld seam at the bottom of the reaction chamber 1 . At the same time, the cooling liquid has been circulating in the channel 31 to ensure that the cooling liquid will not accumulate for a long time, reduce the temperature in the reaction chamber 1, slow down the corrosion rate, and improve the service life of the reaction chamber 1 .

It should be noted that: the order of the above-mentioned embodiments of the present application is only for description, and does not represent the advantages and disadvantages of the embodiments. And the above describes the specific embodiments of this specification. Other implementations are within the scope of the following claims. In some cases, the actions or steps recited in the claims can be performed in an order different from that in the embodiments and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. Multitasking and parallel processing are also possible or may be advantageous in certain embodiments.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, rather than to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or Replacement does not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the protection scope of the present application.

Claims (10)

1. The utility model provides a semiconductor exhaust treatment device, its characterized in that, includes reaction chamber (1), lantern ring (2) and cooler (3), cooler (3) are equipped with passageway (31) that are used for the coolant liquid circulation, passageway (31) are centers on the outside setting of reaction chamber (1), be equipped with overflow hole (21) on lantern ring (2), lantern ring (2) cover are located the bottom of reaction chamber (1), with be formed with between reaction chamber (1) and save bin (22) of coolant liquid.

2. A semiconductor exhaust gas treatment device according to claim 1, characterized in that the channel (31) extends in the axial direction of the reaction chamber (1).

3. The semiconductor exhaust gas treatment device according to claim 1, characterized in that the cooler (3) comprises a water storage tank (32), the water storage tank (32) being in communication with the channel (31).

4. A semiconductor exhaust gas treatment device according to claim 3, characterized in that the cooler (3) further comprises a circulation pump (33) and a circulation branch (34), the circulation pump (33) being in communication with the water storage tank (32) and the channel (31) via the circulation branch (34).

5. The semiconductor exhaust gas treatment device according to claim 4, characterized in that the bottom of the collar (2) is provided with a liquid outlet hole (23), which is in communication with the water storage tank (32) through the liquid outlet hole (23).

6. The semiconductor exhaust gas treatment device according to claim 5, characterized in that a pressure gauge (35) is arranged on the circulation branch (34).

7. A semiconductor exhaust gas treatment device according to any one of claims 4-6, characterized in that the cooler (3) further comprises a control module (36), the control module (36) being connected to the circulation pump (33) for controlling the operation of the circulation pump (33).

8. The semiconductor exhaust gas treatment device according to claim 7, characterized in that a restriction orifice (11) is provided outside the reaction chamber (1), the restriction orifice (11) being provided in communication with the passage (31).

9. A semiconductor exhaust gas treatment device according to claim 8, characterized in that a cooling device (4) is arranged between the collar (2) and the water storage tank (32).

10. A semiconductor exhaust gas treatment system comprising a semiconductor exhaust gas treatment device according to any one of claims 1 to 9.

Images