CN116148175A - A method for detecting the peel strength of ceramic aluminum-clad substrate - Google Patents
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- 239000000758 substrate Substances 0.000 title claims abstract description 57
- 239000000919 ceramic Substances 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims abstract description 35
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 34
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 238000012360 testing method Methods 0.000 claims abstract description 23
- 238000005520 cutting process Methods 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims abstract description 4
- 230000001070 adhesive effect Effects 0.000 claims abstract description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 4
- 238000003698 laser cutting Methods 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 7
- 238000003801 milling Methods 0.000 abstract description 2
- 230000002411 adverse Effects 0.000 abstract 1
- 238000007719 peel strength test Methods 0.000 description 10
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- -1 LTCC Chemical compound 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- SWPMTVXRLXPNDP-UHFFFAOYSA-N 4-hydroxy-2,6,6-trimethylcyclohexene-1-carbaldehyde Chemical compound CC1=C(C=O)C(C)(C)CC(O)C1 SWPMTVXRLXPNDP-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000013441 quality evaluation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
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Abstract
Description
技术领域technical field
本发明属于半导体基板技术领域，涉及陶瓷覆铝基板，具体涉及一种检测陶瓷覆铝基板剥离强度的方法。The invention belongs to the technical field of semiconductor substrates, relates to ceramic aluminum-coated substrates, and in particular to a method for detecting the peeling strength of ceramic aluminum-coated substrates.
背景技术Background technique
随着电子技术的不断进步，在功率型电子元器件的封装应用中，散热基板不仅承担着电气连接和机械支撑等功能，更是热量传输的重要通道。陶瓷基板是功率模块中常用的材料，具有特殊的热、机械和电气特性，是适用于要求严苛的电力电子应用的理想之选，目前陶瓷基板种类有HTCC、LTCC、TFC、DBC、DBA、DPC等。直接覆铝陶瓷基板(DirectBondedAluminum，DBA)是基于DBC工艺技术发展起来的新型金属敷接陶瓷基板，是铝与陶瓷层键合而形成的基板，其结构与DBC基板相似，也可以像PCB一样蚀刻出各式各样的图形，但对于温度循环则具有较高的可靠性，这种特性来源于陶瓷和铝的独有接合技术。DBA基板具有良好的抗热震疲劳性能、耐热循环可靠性，可以在DBA基板的上面接合元件，下面接合冷却结构，将其作为模块使用，这些都得益于金属铝具有比铜更低的屈服强度，塑性高。然而由于金属铝的这些性质，类比采用DBC基板的剥离强度测试方法检测铝层与陶瓷键合强度的方法已经不适用了。With the continuous advancement of electronic technology, in the packaging application of power electronic components, the heat dissipation substrate not only undertakes the functions of electrical connection and mechanical support, but also is an important channel for heat transmission. Ceramic substrates are commonly used materials in power modules. They have special thermal, mechanical and electrical properties and are ideal for demanding power electronics applications. Currently, ceramic substrates include HTCC, LTCC, TFC, DBC, DBA, DPC, etc. Direct Bonded Aluminum (DBA) is a new type of metal-bonded ceramic substrate developed based on the DBC process technology. It is a substrate formed by bonding aluminum and ceramic layers. Its structure is similar to that of the DBC substrate and can also be etched like a PCB. A wide variety of patterns can be produced, but it has high reliability for temperature cycles. This characteristic comes from the unique bonding technology of ceramics and aluminum. The DBA substrate has good thermal shock fatigue resistance and thermal cycle reliability. It can be used as a module by bonding components on the top of the DBA substrate and a cooling structure on the bottom. Yield strength, high plasticity. However, due to these properties of metal aluminum, the method of detecting the bonding strength between the aluminum layer and the ceramic by analogy with the peel strength test method of the DBC substrate is no longer applicable.
实际应用中，陶瓷基板的破坏形式与基板材料、界面强度、制造过程中的残余应力、工艺缺陷、所承受的载荷等多方面因素相关；通常将垂直于陶瓷基板界面的正应力定义为剥离应力，作用于基板界面的面力定义为剪切力，对应的强度分别称之为剥离强度和剪切强度，以此作为评价陶瓷基板的强度的参数。对于DBC基板来说，工业界常采用剥离强度作为生产质量评价标准。在环境温度25℃、环境湿度65％的试验条件下对DBC样品进行剥离测试，样品宽度为5mm，位移施加速率为50mm/min。剥离强度通常与母材关联极大，传统DBC基板使用的金属铜具有较高的屈服强度，而DBA基板由于铝的低断裂强度特征，在进行剥离测试时，使用刀刃铣削底部金属铝的过程中，铝极有可能发生断裂现象导致测试无法继续进行。在均匀拉起金属铝的过程中，由于铝与陶瓷的键合强度往往大于金属铝本身的剪切力或脆性，铝往往发生瞬时变形、瞬时断裂，在提拉的过程中使得测试带被拉断从而影响测量结果。因此，如何准确的对陶瓷覆铝基板的剥离强度进行测试成为了亟待解决的问题。In practical applications, the failure mode of ceramic substrates is related to many factors such as substrate materials, interface strength, residual stress in the manufacturing process, process defects, and loads; usually, the normal stress perpendicular to the ceramic substrate interface is defined as the peeling stress , the surface force acting on the substrate interface is defined as shear force, and the corresponding strength is called peel strength and shear strength, respectively, which are used as parameters for evaluating the strength of ceramic substrates. For DBC substrates, the industry often uses peel strength as the production quality evaluation standard. The peeling test was performed on the DBC sample under the test conditions of ambient temperature 25°C and ambient humidity 65%, the sample width was 5mm, and the displacement application rate was 50mm/min. The peel strength is usually closely related to the base material. The metal copper used in the traditional DBC substrate has a high yield strength, while the DBA substrate has low fracture strength characteristics of aluminum. During the peel test, the metal aluminum at the bottom is milled with a knife edge. , the aluminum is very likely to break and the test cannot continue. In the process of evenly pulling up the metal aluminum, since the bonding strength between aluminum and ceramics is often greater than the shear force or brittleness of the metal itself, the aluminum often deforms and breaks instantaneously, and the test strip is pulled during the pulling process. break and affect the measurement results. Therefore, how to accurately test the peel strength of the ceramic aluminum-clad substrate has become an urgent problem to be solved.
发明内容Contents of the invention
本发明针对上述问题进行改进，针对铝断裂强度低，采用传统剥离强度测试方法容易发生断裂导致测试无法继续进行的缺陷进行，进而提供了一种检测陶瓷覆铝基板剥离强度的方法。为了实现上述目的，本发明采用的具体方案如下：The present invention improves on the above-mentioned problems, aiming at the low fracture strength of aluminum, which is prone to breakage by the traditional peel strength test method and makes the test impossible to continue, and further provides a method for detecting the peel strength of ceramic aluminum-clad substrates. In order to achieve the above object, the specific scheme adopted by the present invention is as follows:
本发明提供的检测陶瓷覆铝基板剥离强度的方法，包括如下步骤：The method for detecting the peel strength of a ceramic aluminum-clad substrate provided by the present invention comprises the following steps:
S1，取母板陶瓷覆铝基板产品，经图形转移、蚀刻制备标准的5～10mm宽度的测试图样；S1, take the motherboard ceramic aluminum-clad substrate product, and prepare a standard test pattern with a width of 5-10mm through pattern transfer and etching;
S2，在背面距顶部15～20mm处使用光纤激光切割机沿短方向切割，形成长端侧和短端侧；S2, use a fiber laser cutting machine to cut along the short direction at a distance of 15 to 20 mm from the top on the back to form the long end side and the short end side;
S3，将铝层朝内，短端侧沿切割线弯曲90°，用胶粘剂将剩余的长端侧部分的陶瓷面与硬板粘结；S3, the aluminum layer faces inward, the short end side is bent 90° along the cutting line, and the ceramic surface of the remaining long end side part is bonded to the hard plate with an adhesive;
S4，参照标准90°剥离强度测试方法，使用90°剥离试验机，将夹头直接夹住短端侧头端，以一定速度垂直提拉，记录至少100mm剥离长度内剥离力的最大值与最小值，并计算相应的剥离强度值。S4, referring to the standard 90°peel strength test method, using a 90°peel tester, clamp the chuck directly to the head of the short end, pull it vertically at a certain speed, and record the maximum and minimum peel force within a peeling length of at least 100mm value, and calculate the corresponding peel strength value.
优选的，在本发明提供的检测陶瓷覆铝基板剥离强度的方法中，陶瓷覆铝基板为覆铝氮化铝陶瓷基板；该覆铝氮化铝陶瓷基板的厚度为0.38～1.0mm，铝层厚度为0.2～0.6mm。Preferably, in the method for detecting the peel strength of a ceramic aluminum-clad substrate provided by the present invention, the ceramic aluminum-clad substrate is an aluminum-coated aluminum nitride ceramic substrate; the thickness of the aluminum-coated aluminum nitride ceramic substrate is 0.38 to 1.0 mm, and the aluminum layer The thickness is 0.2-0.6mm.
优选的，在本发明提供的检测陶瓷覆铝基板剥离强度的方法中，覆铝氮化铝陶瓷基板的厚度为0.635mm，铝层厚度为0.2mm。Preferably, in the method for detecting the peel strength of a ceramic aluminum-clad substrate provided by the present invention, the thickness of the aluminum-clad aluminum nitride ceramic substrate is 0.635 mm, and the thickness of the aluminum layer is 0.2 mm.
优选的，在本发明提供的检测陶瓷覆铝基板剥离强度的方法中，硬板优选为铁板。Preferably, in the method for detecting the peel strength of ceramic aluminum-clad substrates provided by the present invention, the hard plate is preferably an iron plate.
优选的，在本发明提供的检测陶瓷覆铝基板剥离强度的方法中，陶瓷覆铝基板母板的尺寸为138×190mm。Preferably, in the method for detecting the peel strength of the ceramic aluminum-clad substrate provided by the present invention, the size of the ceramic aluminum-clad substrate mother board is 138×190 mm.
优选的，在本发明提供的检测陶瓷覆铝基板剥离强度的方法中，其中，S4中，垂直提拉速度为50mm/min。Preferably, in the method for detecting the peel strength of the ceramic aluminum-clad substrate provided by the present invention, in S4, the vertical pulling speed is 50 mm/min.
优选的，在本发明提供的检测陶瓷覆铝基板剥离强度的方法中，90°剥离试验机为标准90°剥离试验机。Preferably, in the method for detecting the peel strength of ceramic aluminum-clad substrates provided by the present invention, the 90° peel tester is a standard 90° peel tester.
本发明的有益技术效果Beneficial technical effect of the present invention
本发明结合传统的剥离强度测试方法，对陶瓷覆铝基板样本的制备进行改进，解决了采用传统测试方法进行检测时，金属铝瞬时断裂、变形导致试验无效性的情况；同时省去了传统剥离强度测试方法中使用刀刃铣削底部图形的过程，避免了陶瓷及结合面处损伤，能够大幅节约时间并提升数据准确度。The present invention combines the traditional peel strength test method to improve the preparation of ceramic aluminum-clad substrate samples, and solves the situation that the test is invalid due to the instantaneous fracture and deformation of metal aluminum when the traditional test method is used for detection; at the same time, the traditional peeling method is omitted. In the strength test method, the process of using the blade to mill the bottom figure avoids damage to the ceramic and the joint surface, which can greatly save time and improve data accuracy.
因此，本发明解决了目前针对陶瓷覆铝基板的剥离强度缺少检测方法的情况，同时该方法也可用于传统陶瓷覆铜基板剥离强度的测试，无需安装新的工装治具，节约成本同时提升效率及准确性。Therefore, the present invention solves the current lack of detection methods for the peel strength of ceramic aluminum-clad substrates. At the same time, this method can also be used for testing the peel strength of traditional ceramic copper-clad substrates, without the need to install new fixtures, saving costs and improving efficiency. and accuracy.
附图说明Description of drawings
图1为本发明中母板陶瓷覆铝基板产品的预设测试图形；Fig. 1 is the preset test pattern of the motherboard ceramic aluminum-clad substrate product in the present invention;
图2为本发明中切割完成后测试图形样品粘接在铁板上的结构示意图；Fig. 2 is the structural representation that test pattern sample is bonded on iron plate after cutting among the present invention;
图3为本发明中图样剥离强度测试过程中记录的力-位移曲线。Fig. 3 is the force-displacement curve recorded during the peel strength test of the pattern in the present invention.
具体实施方式Detailed ways
现结合实施例和附图，对本发明作详细描述，但应当理解，下面所具体描述的内容是说明性的而非限制性的，不应以此限制本发明的保护范围。The present invention will now be described in detail in conjunction with the embodiments and accompanying drawings, but it should be understood that the content described below is illustrative rather than restrictive, and should not limit the protection scope of the present invention.
本实施例提供的检测陶瓷覆铝基板剥离强度的方法包括如下步骤：The method for detecting the peel strength of a ceramic aluminum-clad substrate provided in this embodiment includes the following steps:
S1，取母板陶瓷覆铝基板产品，图形转移、蚀刻制备标准的5mm宽度剥离强度测试图样，具体步骤如下：S1, take the mother board ceramic aluminum-clad substrate product, pattern transfer, etch to prepare a standard 5mm width peel strength test pattern, the specific steps are as follows:
(1)陶瓷覆铝基板使用氮化铝陶瓷，厚度为0.635mm，铝层厚度为0.2mm；(1) The ceramic aluminum-clad substrate uses aluminum nitride ceramics, the thickness is 0.635mm, and the thickness of the aluminum layer is 0.2mm;
(2)采用138×190mm母板产品，制备标准5mm宽度剥离强度测试用图样，进行图形转移，即贴膜、曝光、显影、蚀刻液浸泡、退膜，制备标准的5mm宽度剥离强度测试图样(图1)。(2) Using a 138×190mm mother board product, prepare a standard 5mm width peel strength test pattern, carry out pattern transfer, that is, film sticking, exposure, development, etching solution soaking, film removal, and prepare a standard 5mm width peel strength test pattern (Fig. 1).
S2，使用光纤激光切割机，将母版平分切割后，在背面距顶部15～20mm处使用光纤激光切割机沿短方向切割，形成长端侧和短端侧；S2, use a fiber laser cutting machine to cut the mother plate in half, and use a fiber laser cutting machine to cut along the short direction at a distance of 15 to 20 mm from the top of the back to form a long end side and a short end side;
S3，将铝层朝内，短端侧沿切割线弯曲90°，用胶粘剂将剩余的长端侧部分的陶瓷面与硬板粘结，完成后效果参见图2；S3, put the aluminum layer inward, bend the short end side 90° along the cutting line, and use adhesive to bond the ceramic surface of the remaining long end side part to the hard board. See Figure 2 for the finished effect;
S4，参照标准90°剥离强度测试方法，使用90°剥离试验机，将夹头直接夹住短端侧头端，以50mm/min速度垂直提拉，记录至少100mm剥离长度内剥离力的最大值与最小值，测试过程中的力-位移曲线参见图3，然后计算相应的剥离强度值。S4, referring to the standard 90°peel strength test method, using a 90°peel tester, clamp the chuck directly to the head of the short end, pull vertically at a speed of 50mm/min, and record the maximum value of the peeling force within a peeling length of at least 100mm With the minimum value, the force-displacement curve during the test is shown in Fig. 3, and then the corresponding peel strength value is calculated.
对比传统剥离强度测试方法，本发明在制定宽度为5mm的长条状标准测试图形后，直接进行剥离测试，避免了传统测试方法中，使用刀刃铣削底部铝后提拉过程中，铝发生瞬时变形断裂，无法测定剥离强度值，无法判断实际强度的情形。Compared with the traditional peel strength test method, the present invention directly conducts the peel test after formulating a strip-shaped standard test pattern with a width of 5mm, avoiding the instantaneous deformation of the aluminum during the pull-up process after milling the bottom aluminum with a knife edge in the traditional test method Fracture, the peel strength value cannot be measured, and the actual strength cannot be judged.
以上显示和描述了本发明的基本原理、主要特征和本发明的优点。本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是说明本发明的原理，在不脱离本发明精神和范围的前提下本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等同物界定。The basic principles, main features and advantages of the present invention have been shown and described above. Those skilled in the industry should understand that the present invention is not limited by the above-mentioned embodiments, and that described in the above-mentioned embodiments and the description only illustrates the principles of the present invention, and the present invention also has various aspects without departing from the spirit and scope of the present invention. Variations and improvements all fall within the scope of the claimed invention. The protection scope of the present invention is defined by the appended claims and their equivalents.
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