CN116146088A - A semiconductor process self-sealing switch door structure - Google Patents

Abstract

The invention belongs to the field of semiconductor processing equipment, in particular to a self-sealing switch door structure of a semiconductor process. According to the self-sealing device, the fixed inner door frame provided with the guide flange, the movable outer door frame provided with the inclined groove and the inner pressing plate provided with the guide shaft are matched, and the inclined groove can press the corresponding guide shaft under the driving of the driving piece, so that the inner pressing plate moves inwards along the inclined surface, the rear side surface of the inner pressing plate covers the opening of the fixed inner door frame from the front side, and the self-sealing of the opening of the fixed inner door frame is realized. The invention can effectively realize the self-sealing of the opening of the fixed inner door frame, prevent the escape of the aerosol of the harmful chemical liquid during the semiconductor processing process, ensure the safety of operators and also ensure the process accuracy of the wafer process.

Description

A semiconductor process self-sealing switch door structure

technical field

The invention belongs to the field of semiconductor processing equipment, in particular to a semiconductor process self-sealing switch door structure.

Background technique

At present, the deglue, etching and organic development processes in the semiconductor process all use chemical liquids that are harmful to the human body, but in order to take and place the wafers, a door opening and closing device must be provided. At present, the switch door of most semiconductor processing equipment is a metal plate plus an edge frame of wear-resistant material, without a strict sealing device, which cannot block the overflow of harmful gas mist. The field requirements are strict, and the leakage of the switch gate will have a serious impact on the semiconductor process.

Contents of the invention

Aiming at the problem that the opening and closing doors of the existing semiconductor processing equipment need better sealing effect, the object of the present invention is to provide a semiconductor process self-sealing opening and closing door structure.

The purpose of the present invention is achieved through the following technical solutions:

A semiconductor process self-sealing switch door structure, including a fixed inner door frame, a movable outer door frame and an inner pressure plate;

The fixed inner door frame is installed on the process cavity outside the opening of the process cavity, and a guide flange is protruded from the front side of the fixed inner door frame on the lower side of the process cavity opening, and the top surface of the guide flange is An inclined surface, the inclined surface gradually slopes downward from the side away from the process chamber to the side close to the process chamber, and the inner side of the fixed inner door frame is provided with a fixed inner door frame opening corresponding to the opening of the process chamber;

The lower end of the movable outer door frame is open, and the movable outer door frame is located on the outside of the fixed inner door frame, and moves up and down under the drive of the driver; the left and right sides of the movable outer door frame are respectively provided with inclined grooves, and each The inclined grooves are gradually inclined downward from the side close to the process chamber to the side away from the process chamber;

The inner pressure plate is arranged on the inner side of the movable outer door frame, and the inner pressure plate is provided with a plurality of guide shafts, each of which extends into the adjacent inclined groove;

When the movable outer door frame descends to close the door, the movable outer door frame and the inner pressure plate first descend together; after the lower end of the inner pressure plate touches the inclined surface, the movable outer door frame continues to descend for a certain distance, each The inclined groove presses the corresponding guide shaft, so that the inner pressure plate moves inwardly along the inclined surface, and the rear side of the inner pressure plate covers the opening of the fixed inner door frame from the front side;

The movable outer door frame rises to open the door, and at this time, the inner pressure plate moves in reverse and moves away from the opening of the fixed inner door frame.

The driving part adopts a cylinder.

The driving end of the driving member is connected with an adapter plate, and the adapter plate is connected with the top surface of the movable outer door frame.

The driving member is installed on the process chamber on the upper side of the opening of the process chamber.

A sealing ring A is provided between the rear side of the fixed inner door frame and the process cavity, and the sealing ring A surrounds the outside of the opening of the process cavity, and the rear side of the fixed inner door frame is provided with a A's socket A.

A sealing ring B is provided on the front side of the fixed inner door frame, and the sealing ring B surrounds the opening of the fixed inner door frame, and an inlay for inlaying the sealing ring B is provided on the front side of the fixed inner door frame. Slot B.

An outer protective plate is installed on the front side of the movable outer door frame.

The inner pressure plate is provided with at least two guide shafts arranged in parallel, the left and right ends of each guide shaft extend into a corresponding inclined groove, and the length direction of each guide shaft is perpendicular to the movable The direction of movement of the outer door frame.

A plurality of guide shaft mounting seats are provided on the front side of the inner pressure plate corresponding to each of the guide shafts, and each of the guide shafts passes through the corresponding guide shaft mounting seats.

Each of the guide shafts is respectively provided with several snap rings for resisting the guide shaft installation seat or the movable outer door frame.

Advantage of the present invention and positive effect are:

The present invention can effectively realize the self-sealing of the opening of the fixed inner door frame by cooperating with the fixed inner door frame provided with the guide flange, the movable outer door frame provided with the inclined groove and the inner pressure plate provided with the guide shaft, and prevents semiconductor processing technology The mist of harmful chemical liquid overflows from time to time, which ensures the safety of operators and the accuracy of the wafer process.

Description of drawings

Fig. 1 is the overall three-dimensional structure schematic diagram of the present invention;

Fig. 2 is a schematic diagram of the overall split structure of the present invention;

Figure 3 is an enlarged view of A in Figure 2;

Fig. 4 is the overall side view structure schematic diagram when the present invention is opened;

Fig. 5 is an enlarged view at B of Fig. 4;

Figure 6 is a schematic side view of the overall structure of the present invention when it is about to be closed;

Figure 7 is a schematic side view of the overall structure of the present invention when it is closed;

Fig. 8 is a schematic structural diagram of the overall front view when the present invention is opened;

Fig. 9 is a schematic diagram of the overall front structure of the present invention when it is closed.

In the figure: 1 is the fixed inner door frame, 101 is the guide flange, 102 is the inclined surface, 103 is the mosaic groove B, 2 is the movable outer door frame, 201 is the inclined groove, 3 is the inner pressure plate, 4 is the driving part, 5 is the guide Shaft, 6 is an adapter plate, 7 is a sealing ring A, 8 is a sealing ring B, 9 is an outer protective plate, 10 is a guide shaft mounting seat, and 11 is a buckle ring;

001 is the process chamber, and 0011 is the opening of the process chamber.

Detailed ways

The present invention will be described in further detail below in conjunction with accompanying drawings 1-9.

A semiconductor process self-sealing switch door structure, as shown in Figures 1-9, this embodiment includes a fixed inner door frame 1, a movable outer door frame 2 and an inner pressure plate 3.

The fixed inner door frame 1 is installed on the process cavity 001 outside the process cavity opening 0011, and the front side of the fixed inner door frame 1 on the lower side of the process cavity opening 0011 is provided with a guide flange 101, and the top surface of the guide flange 101 It is an inclined surface 102, and the inclined surface 102 gradually slopes downward from the side away from the process chamber 001 to the side close to the process chamber 001, and the inner side of the fixed inner door frame 1 is provided with a fixed opening corresponding to the process chamber opening 0011. Inner door frame opening.

The lower end of the movable outer door frame 2 is open, and the movable outer door frame 2 is positioned at the outside of the fixed inner door frame 1 and moves up and down under the drive of the driver 4 . The left and right sides of the movable outer door frame 2 are respectively provided with inclined grooves 201, and each inclined groove 201 is gradually inclined downward from the side close to the process chamber 001 to the side far away from the process chamber 001. In this embodiment, the included angle between the inclined direction of the inclined groove 201 and the horizontal plane is 72.54°.

The inner pressure plate 3 is arranged on the inner side of the movable outer door frame 2, and the inner pressure plate 3 is provided with a plurality of guide shafts 5, and each guide shaft 5 extends into the adjacent inclined groove 201 respectively.

When the movable outer door frame 2 descends to close the door, the movable outer door frame 2 and the inner pressure plate 3 first descend together; after the lower end of the inner pressure plate 3 abuts against the inclined surface 102, the movable outer door frame 2 continues to descend for a certain distance, and each inclined groove 201 moves correspondingly. The guide shaft 5 of the inner pressure plate 3 is moved inwardly along the inclined surface 102, and the rear side of the inner pressure plate 3 is covered from the front side to fix the inner door frame opening, so as to realize the self-sealing of the fixed inner door frame opening.

The movable outer door frame 2 rises to open the door, and at this time, the inner pressure plate 3 reversely moves and moves away from the opening of the fixed inner door frame.

Specifically, in this embodiment, the driving part 4 is a commercially available air cylinder, and its action is controlled by an external controller. The driving member 4 is installed on the process chamber 001 on the upper side of the process chamber opening 0011 through bolts. The driving end of the driver 4 is connected with an adapter plate 6, and the adapter plate 6 is connected with the top surface of the movable outer door frame 2 by screws. Driven by a cylinder, the structure is simple, and the use of an electric structure is avoided, and it can be used in any corrosive, harmful or flammable chemical liquid process.

Specifically, in this embodiment, a seal ring A7 is arranged between the rear side of the fixed inner door frame 1 and the process chamber 001, and the seal ring A7 surrounds the outside of the process chamber opening 0011, and is fixed on the rear side of the inner door frame 1. An inlay groove A for inlaying the seal ring A7 is opened, and the seal ring A7 is squeezed and deformed to fill the inlay groove A. The setting of the sealing ring A 7 further ensures the sealing effect between the rear side of the fixed inner door frame 1 and the process chamber 001 .

Specifically, in the present embodiment, the front side of the fixed inner door frame 1 is provided with a sealing ring B 8, and the sealing ring B 8 surrounds the outside of the opening of the fixed inner door frame, and the front side of the fixed inner door frame 1 is provided with a sealing ring B for inlaying. 8 inlay groove B 103. When closing the door, the inner pressure plate 3 compresses the sealing ring B 8 inwardly, so that the sealing ring B 8 is deformed, which can further ensure the sealing effect between the inner pressure plate 3 rear side and the fixed inner door frame 1 front side. In this embodiment, the sealing ring A 7 and the sealing ring B 8 are O-rings made of wear-resistant fluorine rubber, which can greatly increase the service life.

Specifically, in this embodiment, an outer protective plate 9 is installed on the front side of the movable outer door frame 2 to protect the inner structure of the movable outer door frame 2 .

Specifically, in this embodiment, two parallel guide shafts 5 are arranged on the front side of the inner pressure plate 3, and the left and right ends of each guide shaft 5 respectively extend into a corresponding inclined groove 201, and each guide shaft 5 The length direction of each is perpendicular to the moving direction of the movable outer door frame 2. The position corresponding to each guide shaft 5 on the front side of the inner pressure plate 3 is provided with several guide shaft mounts 10, and each guide shaft 5 passes through the corresponding guide shaft mounts 10 respectively; There are several snap rings 11 for resisting the guide shaft mounting seat 10 or the movable outer door frame 2, which play a role of horizontally limiting the guide shaft 5, and are easy to disassemble and maintain. In this embodiment, the buckle 11 is all commercially available E-shaped buckle. In this embodiment, the fixed inner door frame 1, the movable outer door frame 2 and the guide shaft 5 are all made of wear-resistant SUS316L stainless steel and electrolytically planed.

working principle:

Through the cooperation of the fixed inner door frame 1 provided with the guide flange 101, the movable outer door frame 2 provided with the inclined groove, and the inner pressure plate 3 provided with the guide shaft 5, and driven by the driver 4, the inclined groove 201 can be pressed Move the corresponding guide shaft 5 to make the inner pressure plate 3 move inwardly along the inclined surface 102, and make the rear side of the inner pressure plate 3 cover the opening of the fixed inner door frame from the front side, so as to realize the self-sealing of the opening of the fixed inner door frame; through the sealing ring A The setting of 7 can further ensure the sealing effect between the rear side of the fixed inner door frame 1 and the process cavity 001; the setting of the sealing ring B 8 can further ensure the rear side of the inner pressure plate 3 and the front side of the fixed inner door frame 1 The role of the sealing effect between.

Claims (10)

1. A semiconductor technology self-sealing switch door structure is characterized in that: comprises a fixed inner door frame (1), a movable outer door frame (2) and an inner pressure plate (3);

the fixed inner door frame (1) is arranged on a process cavity outside the process cavity opening, a guide flange (101) is convexly arranged on the front side surface of the fixed inner door frame (1) at the lower side of the process cavity opening, the top surface of the guide flange (101) is an inclined surface (102), the inclined surface (102) gradually inclines downwards from one side far away from the process cavity to one side close to the process cavity, and a fixed inner door frame opening corresponding to the process cavity opening is formed in the inner side of the fixed inner door frame (1);

the lower end of the movable outer door frame (2) is provided with an opening, and the movable outer door frame (2) is positioned at the outer side of the fixed inner door frame (1) and moves up and down under the driving of the driving piece (4); the left side and the right side of the movable outer door frame (2) are respectively provided with an inclined groove (201), and each inclined groove (201) gradually inclines downwards from one side close to the process cavity to one side far away from the process cavity;

the inner pressure plate (3) is arranged on the inner side of the movable outer door frame (2), a plurality of guide shafts (5) are arranged on the inner pressure plate (3), and each guide shaft (5) extends into the adjacent inclined groove (201) respectively;

when the movable outer door frame (2) descends to close the door, the movable outer door frame (2) and the inner pressure plate (3) firstly descend together; after the lower end of the inner pressure plate (3) is abutted against the inclined surface (102), the movable outer door frame (2) continuously descends for a certain distance, the corresponding guide shaft (5) is pressed by each inclined groove (201), the inner pressure plate (3) moves inwards along the inclined surface (102), and the rear side surface of the inner pressure plate (3) covers the opening of the fixed inner door frame from the front side cover;

the movable outer door frame (2) rises to open the door, and the inner pressure plate (3) moves reversely and is far away from the opening of the fixed inner door frame.

2. The semiconductor process self-sealing switch door structure of claim 1, wherein: the driving piece (4) adopts an air cylinder.

3. The semiconductor process self-sealing switch door structure of claim 1, wherein: the driving end of the driving piece (4) is connected with an adapter plate (6), and the adapter plate (6) is connected with the top surface of the movable outer door frame (2).

4. The semiconductor process self-sealing switch door structure of claim 1, wherein: the driving piece (4) is arranged on the process cavity at the upper side of the process cavity opening.

5. The semiconductor process self-sealing switch door structure of claim 1, wherein: a sealing ring A (7) is arranged between the rear side surface of the fixed inner door frame (1) and the process cavity, the sealing ring A (7) is enclosed outside the process cavity, and an embedding groove A for embedding the sealing ring A (7) is formed in the rear side surface of the fixed inner door frame (1).

6. The semiconductor process self-sealing switch door structure of claim 1, wherein: the novel door frame is characterized in that a sealing ring B (8) is arranged on the front side surface of the fixed inner door frame (1), the sealing ring B (8) is enclosed outside the opening of the fixed inner door frame, and an embedding groove B (103) for embedding the sealing ring B (8) is formed in the front side surface of the fixed inner door frame (1).

7. The semiconductor process self-sealing switch door structure of claim 1, wherein: an outer protection plate (9) is arranged on the front side surface of the movable outer door frame (2).

8. The semiconductor process self-sealing switch door structure of claim 1, wherein: at least two guide shafts (5) which are arranged in parallel are arranged on the inner pressure plate (3), the left end and the right end of each guide shaft (5) respectively extend into a corresponding inclined groove (201), and the length direction of each guide shaft (5) is perpendicular to the moving direction of the movable outer door frame (2).

9. The semiconductor process self-sealing switch door structure of claim 8, wherein: a plurality of guide shaft mounting seats (10) are arranged on the front side surface of the inner pressure plate (3) at positions corresponding to the guide shafts (5), and each guide shaft (5) respectively penetrates through the corresponding guide shaft mounting seat (10).

10. The semiconductor process self-sealing switch door structure of claim 9, wherein: each guide shaft (5) is respectively provided with a plurality of buckles (11) for propping against the guide shaft mounting seat (10) or the movable outer door frame (2).

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