CN116140158A - Dispensing control method and device, storage medium and electronic device - Google Patents

Dispensing control method and device, storage medium and electronic device Download PDF

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Publication number
CN116140158A
CN116140158A CN202211733282.7A CN202211733282A CN116140158A CN 116140158 A CN116140158 A CN 116140158A CN 202211733282 A CN202211733282 A CN 202211733282A CN 116140158 A CN116140158 A CN 116140158A
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China
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glue
dispensing
target
dispensed
dispenser
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CN202211733282.7A
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Chinese (zh)
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王毕
闫大鹏
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Wuhan Raycus Fiber Laser Technologies Co Ltd
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Wuhan Raycus Fiber Laser Technologies Co Ltd
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Priority to CN202211733282.7A priority Critical patent/CN116140158A/en
Publication of CN116140158A publication Critical patent/CN116140158A/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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Abstract

The application discloses a dispensing control method and device, a storage medium and an electronic device, wherein the dispensing control method comprises the following steps: acquiring a target bonding request; obtaining target point glue parameters, wherein the target point glue parameters are used for indicating target amounts and target distances, the target amounts represent the amounts of glue used for dispensing at each dispensing position on the area to be dispensed, and the target distances represent the distances between two adjacent dispensing positions; the control point gum machine carries out point gum on waiting the point gum region according to the target point gum parameter, wherein, the point gum machine carries out point gum every moving target distance, and the quantity of the glue that the point gum machine used is the target quantity in the point gum position of every department, has accomplished the glue on two adjacent point gum positions of point gum and has had the interval between the glue, adopts above-mentioned technical scheme, has solved among the relevant technique, the quantity of the glue that the point gum in-process used is more scheduling problem.

Description

Dispensing control method and device, storage medium and electronic device
Technical Field
The application relates to the field of dispensing, in particular to a dispensing control method and device, a storage medium and an electronic device.
Background
Dispensing using adhesives is widely used in the bonding of various products, such as: various types of adhesives are used in the bonding of optical fibers. In the prior art, the common dispensing modes mainly comprise manual dispensing and automatic dispensing, wherein the manual dispensing is to fill or drop the colloid on the surface of a product manually, and the manual dispensing is solidified in a certain mode to achieve the effects of bonding and fixing. The automatic dispensing is to use an automatic device to fill or drip on the surface of a product in a preset mode according to a set program, and then solidify the product so as to play a role in bonding and fixing. Whether manual dispensing or semi-automatic dispensing, the whole colloid is dripped on the surface of the product, and then solidification is carried out. Such dispensing may use a large amount of glue and the large amount of glue may have a large impact on the adhesion properties of the glue and the product.
Aiming at the problems of more glue used in the dispensing process and the like in the related art, an effective solution is not proposed yet.
Disclosure of Invention
The embodiment of the application provides a dispensing control method and device, a storage medium and an electronic device, which are used for at least solving the problems of more glue used in the dispensing process and the like in the related technology.
According to an embodiment of the present application, there is provided a dispensing control method, including: obtaining a target bonding request, wherein the target bonding request is used for requesting to point the glue on a to-be-dispensed area of the optical fiber; responding to the target bonding request, and acquiring target point glue parameters, wherein the target point glue parameters are used for indicating target amounts and target distances, the target amounts represent the amounts of glue used for dispensing at each dispensing position on the to-be-dispensed area, and the target distances represent the distances between two adjacent dispensing positions; and controlling the glue dispenser to dispense glue on the to-be-dispensed area according to the target point glue parameter, wherein the glue dispenser dispenses glue once every time the target distance is moved, the glue amount used by the glue dispenser to dispense glue on each glue dispensing position is the target amount, and a gap exists between the glue on two adjacent glue dispensing positions after the glue dispensing is completed.
Optionally, the acquiring the target point glue parameter includes: acquiring a predetermined target occupied area and a target height, wherein the target occupied area is used for representing the occupied area of glue after dispensing is performed at one position on the area to be dispensed; determining the target amount according to the occupied area of the target and the target height; and determining the target distance according to a predetermined target stress and the target quantity, wherein the target stress is the stress of the glue on the area to be dispensed, and the target stress has a mapping relation with the target quantity and the target distance.
Optionally, the controlling the dispensing machine performs dispensing on the to-be-dispensed area according to the target point glue parameter, including: determining a target glue dispensing time length and target air pressure according to the target quantity, wherein the target glue dispensing time length is the glue dispensing time length of the glue dispenser for dispensing at each glue dispensing position, and the target air pressure is the air pressure adopted when the glue dispenser is used for dispensing at each glue dispensing position, and is used for controlling the glue quantity of the glue dispensed in the unit time length of the glue dispenser; and controlling the dispensing machine to perform dispensing on each dispensing position according to the target dispensing time length and the target air pressure, wherein the distance between two adjacent dispensing positions is the target distance.
Optionally, the controlling the dispensing machine to perform dispensing on the dispensing positions according to the target dispensing duration and the target air pressure, further includes: controlling the dispensing machine to dispense according to the target point glue duration and the target air pressure at the current dispensing position; after the dispensing machine finishes dispensing according to the target point glue duration and the target air pressure at the current dispensing position, controlling the dispensing machine to move the target distance to reach the next dispensing position, and controlling the dispensing machine to perform dispensing according to the target point glue duration and the target air pressure at the next dispensing position.
Optionally, the method further comprises: and in the process of controlling the glue dispenser to dispense glue on the to-be-dispensed area according to the glue dispensing parameter of the target point, executing curing operation on the glue dispensed by the glue dispenser.
Optionally, in the controlling the dispensing machine to perform dispensing on the to-be-dispensed area according to the target dispensing parameter, the performing curing operation on the dispensed glue of the dispensing machine includes: and in the process of controlling the dispenser to perform dispensing on the ith dispensing position on the to-be-dispensed area according to the target dispensing parameter, performing the curing operation on the glue dispensed on the ith-j dispensing position of the dispenser, wherein i is a positive integer greater than or equal to 2, j is a positive integer greater than or equal to 1, and j is a predetermined value.
Optionally, in the controlling the dispensing machine to perform dispensing on the to-be-dispensed area according to the target dispensing parameter, the performing curing operation on the dispensed glue of the dispensing machine includes: and in the process of controlling the dispenser to dispense glue at the ith dispensing position on the to-be-dispensed area according to the target dispensing parameter, executing the curing operation on the glue dispensed at the p th dispensing position of the dispenser, wherein i is a positive integer greater than or equal to 2, p is a positive integer greater than or equal to 1, and the area occupied by the glue dispensed at the p th dispensing position on the to-be-dispensed area is greater than or equal to a preset area threshold.
According to another embodiment of the present application, there is also provided a dispensing control device, including:
the first acquisition module is used for acquiring a target bonding request, wherein the target adhesive request is used for requesting to point the adhesive on an area to be adhesive on the optical fiber;
the second obtaining module is used for responding to the target bonding request and obtaining target point glue parameters, wherein the target point glue parameters are used for indicating target amounts and target distances, the target amounts represent the amounts of glue used for dispensing at each dispensing position on the to-be-dispensed area, and the target distances represent the distances between two adjacent dispensing positions;
the control module is used for controlling the glue dispenser to perform glue dispensing on the to-be-dispensed area according to the glue dispensing parameter of the target point, wherein the glue dispenser performs glue dispensing once every time the target distance is moved, the amount of glue used by the glue dispenser for glue dispensing on each glue dispensing position is the target amount, and a gap exists between the glue at two adjacent glue dispensing positions after glue dispensing is completed.
According to still another aspect of the embodiments of the present application, there is also provided a computer-readable storage medium having a computer program stored therein, wherein the computer program is configured to execute the above-described dispensing control method when running.
According to still another aspect of the embodiments of the present application, there is further provided an electronic device including a memory, a processor, and a computer program stored on the memory and executable on the processor, wherein the processor executes the dispensing control method described above through the computer program.
In this application embodiment, under the condition that need carry out the point to optic fibre and glue, can control the point to glue the machine and glue the position and carry out the point to glue in each place on optic fibre intermittently, avoided with the whole on the optic fibre wait that the point glues the region and glue, when guaranteeing the bonding force, the glue volume that the in-process used has significantly reduced to glue. And the interval is reserved between the glues at the positions of all the positions, so that the volume shrinkage rate of the glues at all the positions in the aging process is greatly reduced, the volume shrinkage force generated by the glues in the aging process is greatly reduced, the influence of the volume shrinkage force on the bonding performance between the glues and the optical fibers is reduced, and the stability of the bonding performance between the glues and the optical fibers is improved. By adopting the technical scheme, the problems of more glue used in the dispensing process and the like in the related technology are solved, and the technical effect of reducing the glue used in the dispensing process is realized.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the description of the embodiments or the prior art will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a schematic diagram of a hardware environment of a dispensing control method according to an embodiment of the present application;
FIG. 2 is a flow chart of a method of dispensing control according to an embodiment of the present application;
FIG. 3 is a schematic illustration of dispensing according to target spot-size parameters according to an embodiment of the present application;
FIG. 4 is a schematic diagram of acquiring target spot size parameters according to an embodiment of the present application;
FIG. 5 is a schematic diagram showing a dispensing process performed by a dispenser according to an embodiment of the present application;
fig. 6 is a schematic diagram ii of controlling a dispensing machine to perform dispensing according to an embodiment of the present application;
FIG. 7 is a schematic illustration of curing glue at a spot of glue according to an embodiment of the application;
FIG. 8 is a schematic diagram of a dispensing control method according to an embodiment of the present application;
FIG. 9 is a schematic illustration of the impact of a high and low temperature impact on adhesion according to an embodiment of the present application;
FIG. 10 is a schematic illustration of the impact of a high and low temperature impact on adhesion according to an embodiment of the present application;
fig. 11 is a block diagram of a dispensing control device according to an embodiment of the present application.
Detailed Description
In order to make the present application solution better understood by those skilled in the art, the following description will be made in detail and with reference to the accompanying drawings in the embodiments of the present application, it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and the claims of the embodiments of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The method embodiments provided in the embodiments of the present application may be performed in a computer terminal, a device terminal, or a similar computing apparatus. Taking a computer terminal as an example, fig. 1 is a schematic diagram of a hardware environment of a dispensing control method according to an embodiment of the present application. As shown in fig. 1, the computer terminal may include one or more (only one is shown in fig. 1) processors 102 (the processor 102 may include, but is not limited to, a microprocessor MCU or a processing device such as a programmable logic device FPGA) and a memory 104 for storing data, and in one exemplary embodiment, may also include a transmission device 106 for communication functions and an input-output device 108. It will be appreciated by those skilled in the art that the configuration shown in fig. 1 is merely illustrative and is not intended to limit the configuration of the computer terminal described above. For example, a computer terminal may also include more or fewer components than shown in FIG. 1, or have a different configuration than the equivalent functions shown in FIG. 1 or more than the functions shown in FIG. 1.
The memory 104 may be used to store a computer program, for example, a software program of application software and a module, such as a computer program corresponding to a dispensing control method in an embodiment of the present invention, and the processor 102 executes the computer program stored in the memory 104 to perform various functional applications and data processing, that is, implement the method described above. Memory 104 may include high-speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 104 may further include memory remotely located relative to the processor 102, which may be connected to the computer terminal via a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The transmission means 106 is arranged to receive or transmit data via a network. Specific examples of the network described above may include a wireless network provided by a communication provider of a computer terminal. In one example, the transmission device 106 includes a network adapter (Network Interface Controller, simply referred to as NIC) that can connect to other network devices through a base station to communicate with the internet. In one example, the transmission device 106 may be a Radio Frequency (RF) module, which is used to communicate with the internet wirelessly.
In this embodiment, a dispensing control method is provided and applied to the computer terminal, and fig. 2 is a flowchart of a dispensing control method according to an embodiment of the present application, as shown in fig. 2, where the flowchart includes the following steps:
step S202, a target bonding request is obtained, wherein the target bonding request is used for requesting glue to be dispensed on a region to be dispensed on an optical fiber;
step S204, responding to the target bonding request, and obtaining target point glue parameters, wherein the target point glue parameters are used for indicating target amounts and target distances, the target amounts represent the amounts of glue used for dispensing at each dispensing position on the to-be-dispensed area, and the target distances represent the distances between two adjacent dispensing positions;
Step S206, controlling the dispenser to dispense glue on the to-be-dispensed area according to the target point glue parameter, wherein the dispenser dispenses glue once every time the dispenser moves the target distance, and the amount of glue used for dispensing glue on each dispensing position of the dispenser is the target amount, and a gap exists between the glue on two adjacent dispensing positions where the dispensing is completed.
Through the steps, under the condition that the optical fiber is required to be subjected to dispensing, the dispensing machine can be controlled to intermittently dispense the adhesive at all the dispensing positions on the optical fiber, the whole area to be dispensed on the optical fiber is prevented from being subjected to dispensing, the adhesive force is ensured, and meanwhile, the amount of the adhesive used in the dispensing process is greatly reduced. And the interval is reserved between the glues at the positions of all the positions, so that the volume shrinkage rate of the glues at all the positions in the aging process is greatly reduced, the volume shrinkage force generated by the glues in the aging process is greatly reduced, the influence of the volume shrinkage force on the bonding performance between the glues and the optical fibers is reduced, and the stability of the bonding performance between the glues and the optical fibers is improved. By adopting the technical scheme, the problems of more glue used in the dispensing process and the like in the related technology are solved, and the technical effect of reducing the glue used in the dispensing process is realized.
Fig. 3 is a schematic diagram of dispensing according to target dispensing parameters according to an embodiment of the present application, and as shown in fig. 3, the optical fiber 104 may include, but is not limited to, a dispensing position p_1, a dispensing position p_2, a dispensing position p_3, and a dispensing position p_4. The volume of glue at each dispensing position in the dispensing position P_1, the dispensing position P_2, the dispensing position P_3 and the dispensing position P_4 is the target amount, and the distance between two adjacent dispensing positions is the target distance. And the dispensing position P_1 and the dispensing position P_2 are already in dispensing, and when the dispensing position P_3 is in dispensing, the dispensing machine 102 moves the target distance to perform dispensing at the dispensing position P_4.
In the technical solution provided in step S202, when the target bonding request is obtained, it may indicate that the glue is desired to be dispensed on the surface of the wire such as the optical fiber, the cable, and the like. The glue may include, but is not limited to, photosensitive glue, instant glue, epoxy adhesive, anaerobic glue, UV (Ultraviolet) glue, hot melt glue, pressure sensitive adhesive, and the like.
In the technical solution provided in step S204, in the case that the target bonding request is obtained, it may indicate that the glue is desired to be dispensed on the optical fiber surface in the area to be dispensed, and in this case, the amount of glue used for dispensing at each dispensing position on the area to be dispensed and the distance between two adjacent dispensing positions may be obtained.
Alternatively, in the present embodiment, the target amount may be, but not limited to, the volume or mass or weight of the glue used at each dispensing position, and the target distance may be, but not limited to, the distance between each dispensing position.
In one exemplary embodiment, the target spot size parameter may be obtained, but is not limited to, by: acquiring a predetermined target occupied area and a target height, wherein the target occupied area is used for representing the occupied area of glue after dispensing is performed at one position on the area to be dispensed; determining the target amount according to the occupied area of the target and the target height; and determining the target distance according to a predetermined target stress and the target quantity, wherein the target stress is the stress of the glue on the area to be dispensed, and the target stress has a mapping relation with the target quantity and the target distance.
Alternatively, in this embodiment, the target occupied area and the target height of each dispensing position on the region to be dispensed on the optical fiber may be acquired, but are not limited to, previously determined. Fig. 4 is a schematic diagram of acquiring parameters of a target spot glue according to an embodiment of the present application, as shown in a top view a in fig. 4, the area occupied by the target may be, but is not limited to, the area occupied by the glue at the dispensing position p_n after the dispensing of the glue at the dispensing position p_n on the optical fiber 104 is completed. As shown in side view b of fig. 4, the target height may be, but is not limited to, the height of glue at the dispensing position p_n after dispensing is completed at the dispensing position p_n on the optical fiber 104.
Alternatively, in this embodiment, the distance between two adjacent dispensing positions may be determined according to predetermined internal stress (including, but not limited to, volumetric stress and thermal stress) of each glue and the usage amount of glue at each dispensing position, but not limited to, when the predetermined target occupied area and target height are obtained. By the mode, the influence of stress corresponding to the glue on each part of the optical fiber on the bonding performance between the glue and the optical fiber is controlled under the condition that dispensing is completed, and the stability of the bonding performance between the glue and the optical fiber is improved.
In the technical solution provided in step S206, in the case that the target bonding request is obtained, it may indicate that the glue is desired to be dispensed on the optical fiber surface in the area to be dispensed, in this case, the amount of glue used for dispensing at each dispensing position on the area to be dispensed and the distance between two adjacent dispensing positions may be obtained, and the dispenser may be controlled to intermittently dispense the target amount of glue at each dispensing position. By the mode, stress generated after the glue is solidified is greatly reduced, the influence of the stress on the bonding performance between the glue and the optical fiber is greatly reduced, and the stability of the bonding performance between the glue and the optical fiber is improved.
Optionally, in this embodiment, there is a space between the glue at two adjacent dispensing positions where the dispensing is completed on the optical fiber, so that the glue at different dispensing positions is prevented from being connected into a sheet before the curing is completed, and further, the stress generated by volume shrinkage is greatly reduced in the process of curing the glue at different dispensing positions. Compared with the method of directly dispensing the whole to-be-bonded area on the optical fiber, the amount of the glue used by intermittent dispensing is greatly reduced, the stress generated by volume shrinkage is further reduced, the influence of the stress generated by volume shrinkage on the bonding force and ageing performance of the product is further reduced, and the bonding quality between the glue and the bonding force is improved.
In one exemplary embodiment, dispensing on the area to be dispensed may be controlled by, but is not limited to, controlling the dispenser to dispense on the area to be dispensed according to the target dispensing parameters by: determining a target glue dispensing time length and target air pressure according to the target quantity, wherein the target glue dispensing time length is the glue dispensing time length of the glue dispenser for dispensing at each glue dispensing position, and the target air pressure is the air pressure adopted when the glue dispenser is used for dispensing at each glue dispensing position, and is used for controlling the glue quantity of the glue dispensed in the unit time length of the glue dispenser; and controlling the dispensing machine to perform dispensing on each dispensing position according to the target dispensing time length and the target air pressure, wherein the distance between two adjacent dispensing positions is the target distance.
Alternatively, in this embodiment, the duration of dispensing performed by the dispenser at each dispensing position and the air pressure used for dispensing may be determined, but not limited to, according to the amount of glue used at each dispensing position. Fig. 5 is a schematic diagram of dispensing performed by a control dispensing machine according to an embodiment of the present application, as shown in fig. 5, the optical fiber 104 may include, but is not limited to, a dispensing position p_1, a dispensing position p_2, a dispensing position p_3, and a dispensing position p_4. The volume of glue at each dispensing position in the dispensing position P_1, the dispensing position P_2, the dispensing position P_3 and the dispensing position P_4 is the target amount, and the distance between two adjacent dispensing positions is the target distance. The time for dispensing at each dispensing position can be determined to be 1s according to the volume of the glue dispensed at each dispensing position, and the air pressure adopted for dispensing is 10Pa. The dispensing machine 102 may be controlled to continue to dispense glue at each dispensing location at 10Pa for 10s, but is not limited to.
In one exemplary embodiment, the dispenser may be controlled to dispense at each dispensing location according to the target dispensing time period and the target air pressure by, but not limited to: controlling the dispensing machine to dispense according to the target point glue duration and the target air pressure at the current dispensing position; after the dispensing machine finishes dispensing according to the target point glue duration and the target air pressure at the current dispensing position, controlling the dispensing machine to move the target distance to reach the next dispensing position, and controlling the dispensing machine to perform dispensing according to the target point glue duration and the target air pressure at the next dispensing position.
Optionally, in this embodiment, in the process of dispensing, the dispensing machine may be controlled to move the target distance to the next dispensing position and to dispense the next dispensing position, without being limited to the case where dispensing is completed at the current dispensing position. Fig. 6 is a schematic diagram of a second embodiment of controlling a dispensing machine to perform dispensing, as shown in fig. 6, on an optical fiber 104, which may include, but is not limited to, a plurality of dispensing positions including a dispensing position p_3 and a dispensing position p_4. Dispensing is carried out on the current dispensing position P_3 of the dispensing machine 102 according to the dispensing time length 1s and the air pressure 10 Pa; after the dispensing machine 102 finishes dispensing at the current dispensing position P_3 according to the dispensing time length 1s and the air pressure 10Pa, the dispensing machine 102 is controlled to move the target distance to reach the next dispensing position P_4, and the dispensing machine 102 is controlled to perform dispensing at the next dispensing position P_4 according to the dispensing time length 1s and the air pressure 10 Pa.
In one exemplary embodiment, the spot-gluing locations may be cured, but are not limited to, by: and in the process of controlling the glue dispenser to dispense glue on the to-be-dispensed area according to the glue dispensing parameter of the target point, executing curing operation on the glue dispensed by the glue dispenser.
Optionally, in this embodiment, the ultraviolet curing may be performed on the positions of the spot gluing on the optical fiber where the spot gluing is to be performed, and so on, in the process of controlling the spot gluing machine to perform the intermittent spot gluing on the spot gluing area according to the target spot gluing parameters. On one hand, the glue at each dispensing position can be timely cured in a mode of dispensing and curing at the same time, so that the bonding efficiency is greatly improved; on the other hand, the occupied area of the glue at each position is prevented from being larger than the preset area of the glue at each position on the area to be bonded, and the accuracy of bonding is improved.
In an exemplary embodiment, in the process of controlling the dispenser to perform dispensing on the area to be dispensed according to the target dispensing parameter, performing a curing operation on the dispensed glue of the dispenser, including: and in the process of controlling the dispenser to perform dispensing on the ith dispensing position on the to-be-dispensed area according to the target dispensing parameter, performing the curing operation on the glue dispensed on the ith-j dispensing position of the dispenser, wherein i is a positive integer greater than or equal to 2, j is a positive integer greater than or equal to 1, and j is a predetermined value.
Optionally, in this embodiment, in the process of controlling the dispenser to perform dispensing on the ith dispensing position on the area to be dispensed according to the target dispensing parameter, the number of dispensing positions where the dispenser performs dispensing in the time when the glue on the ith dispensing position before the ith dispensing position reaches the extent that the curing is allowed may be determined, and the number may be determined as j according to the time when the glue on the ith dispensing position before the ith dispensing position reaches the extent that the curing is allowed. The curing operation may be performed, but is not limited to, on glue dispensed at the dispensing location at i-j (i.e., i minus j).
Fig. 7 is a schematic diagram of curing glue at dispensing locations according to an embodiment of the present application, as shown in fig. 7, the areas to be dispensed on the optical fiber 104 may include, but are not limited to, dispensing locations p_1, p_2, … …, p_ (i-2), p_ (i-1), p_ (i), … …. The dispensing positions p_1, p_2, … …, p_ (i-2), p_ (i-1) have completed dispensing, and the current control dispenser 102 performs dispensing at the dispensing position p_ (i) (i.e., the i-th dispensing position) according to the dispensing duration of 1s and the air pressure of 10 Pa. j may be, but is not limited to, 2 (or 3, or 4, etc.), that is, the curing operation may be, but is not limited to, performed by the ultraviolet lamp 106 on the glue at the dispensing position at p_ (i-2).
In one exemplary embodiment, the curing operation may be performed on the glue dispensed by the dispenser, but is not limited to, by: and in the process of controlling the dispenser to dispense glue at the ith dispensing position on the to-be-dispensed area according to the target dispensing parameter, executing the curing operation on the glue dispensed at the p th dispensing position of the dispenser, wherein i is a positive integer greater than or equal to 2, p is a positive integer greater than or equal to 1, and the area occupied by the glue dispensed at the p th dispensing position on the to-be-dispensed area is greater than or equal to a preset area threshold.
Optionally, in this embodiment, it may be, but not limited to, detecting whether the area occupied by the dispensing position where the dispensing has been completed on the area to be dispensed is greater than or equal to the preset area threshold in the process of controlling the dispenser to dispense according to the ith dispensing position on the area to be dispensed. Such as: the spread of glue at the dispensing location where dispensing has been completed can be detected and can be, but is not limited to, 3 to 5mm. And under the condition that the occupied area of the dispensing position with the dispensing completed on the area to be dispensed is larger than or equal to a preset area threshold value, immediately executing the curing operation by adopting an ultraviolet lamp.
In order to better understand the above-mentioned process of dispensing control, the following description of the above-mentioned dispensing control flow in combination with the alternative embodiment is provided, but is not intended to limit the technical solution of the embodiment of the present application.
In an embodiment of the present application, a dispensing control method is provided, fig. 8 is a schematic diagram of a dispensing control method according to an embodiment of the present application, and as shown in fig. 8, an optical fiber 104 is placed on a substrate 108 to be fixed, where the optical fiber 104 may include, but is not limited to, dispensing positions p_1, p_2, … …, p_ (i-2), p_ (i-1), p_ (i), … …. The dispensing positions p_1, p_2, … …, p_ (i-2), p_ (i-1) have completed dispensing, and the current control dispenser 102 performs dispensing at the dispensing position p_ (i) (i.e., the i-th dispensing position) according to the dispensing duration of 1s and the air pressure of 10 Pa.
The glue amount used for dispensing the glue at each dispensing position of the dispenser can be controlled by, but not limited to, controlling the dispensing time (i.e., the target glue duration) and the air pressure (i.e., the target air pressure) of the dispenser 102. The thickness of the glue dropping amount is controlled to be 0.5-1 mm (namely the target height) above the upper surface of the optical fiber, the length of the glue at each glue dispensing position is controlled to be about 3-5 mm (namely the target occupied area), and the interval between the glue at the adjacent glue dispensing positions after the glue dispensing is finished is controlled to be 2-4 mm (namely the interval between the glue at the two adjacent glue dispensing positions after the glue dispensing is finished).
After the glue at the previous dispensing position is cured by dispensing and curing, a certain length (6 to 8mm, namely the target distance) is left between the glue and the glue, j can be, but not limited to, 2, namely, after the glue at the P (i-2) th dispensing position is naturally spread for a section (3 to 5mm, namely the preset area threshold value), the glue at the P (i-2) th dispensing position is immediately cured by using the ultraviolet lamp 102, so that the glue is quickly cured, and the adhesive force between the glue and the optical fiber can be ensured while the stress of volume shrinkage is greatly reduced by adjusting the curing process.
By intermittently dispensing small doses of glue on the area to be dispensed of the optical fiber, the stress generated by volume shrinkage is greatly reduced, and the adhesive force and ageing performance of the glue and the optical fiber due to the stress generated by volume shrinkage are further reduced. Fig. 9 is a schematic diagram of an impact of high-low temperature on an adhesive force according to an embodiment of the present application, as shown in fig. 9, a dispensing mode 1 and a dispensing mode 2 are respectively adopted to dispense an optical fiber, where the dispensing mode 1 is a discontinuous small-dose dispensing mode for dispensing positions of each position on a region to be dispensed on the optical fiber in the embodiment of the present application, and the dispensing mode 2 is a conventional dispensing mode for directly performing large-dose dispensing on the whole region to be dispensed on the optical fiber. Before the dispensing mode 1 and the dispensing mode 2 perform high-low temperature impact (high temperature is 85 ℃ for 1 hour in one cycle, low temperature is-40 ℃ for 1 hour, and total 4 cycles), the adhesive force of the dispensing mode 1 and the dispensing mode 2 to the optical fiber is basically the same, after the high-low temperature impact, the adhesive force of the dispensing mode 1 to the optical fiber is less reduced, and the adhesive force of the dispensing mode 2 to the optical fiber is more reduced, so that the adhesive performance is greatly damaged. Therefore, the mode of intermittently dispensing small doses on the to-be-dispensed area of the optical fiber in the embodiment of the application is adopted, so that the stability of the adhesive property is greatly improved.
Fig. 10 is a schematic diagram of an impact of high-low temperature on an adhesive force according to an embodiment of the present application, as shown in fig. 10, a dispensing mode 1 and a dispensing mode 2 are respectively used for dispensing an optical fiber, where the dispensing mode 1 is a discontinuous small-dose dispensing mode for dispensing positions of each spot on a to-be-dispensed area on the optical fiber in the embodiment of the present application, and the dispensing mode 2 is a conventional dispensing mode for directly performing large-dose dispensing on the whole to-be-dispensed area on the optical fiber. Before the low-temperature aging (the temperature is minus 40 ℃ for 3 days), the adhesive force of the adhesive dispensing mode 1 and the adhesive dispensing mode 2 to the optical fiber is basically the same, after the high-low temperature impact, the adhesive force of the adhesive dispensing mode 1 to the optical fiber is less reduced, the adhesive force of the adhesive dispensing mode 2 to the optical fiber is more reduced, and the adhesive property is greatly damaged. Therefore, the mode of intermittently dispensing small doses on the to-be-dispensed area of the optical fiber in the embodiment of the application is adopted, so that the stability of the adhesive property is greatly improved.
From the description of the above embodiments, it will be clear to a person skilled in the art that the method according to the above embodiments may be implemented by means of software plus the necessary general hardware platform, but of course also by means of hardware, but in many cases the former is a preferred embodiment. Based on such understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art in the form of a software product stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk), comprising several instructions for causing a terminal device (which may be a mobile phone, a computer, a server, or a network device, etc.) to perform the method of the embodiments of the present application.
Fig. 11 is a block diagram of a dispensing control device according to an embodiment of the present application; as shown in fig. 11, includes:
a first obtaining module 1102, configured to obtain a target bonding request, where the target bonding request is used to request that glue be dispensed on a region to be dispensed on an optical fiber;
a second obtaining module 1104, configured to obtain a target glue parameter in response to the target bonding request, where the target glue parameter is used to indicate a target amount and a target distance, the target amount indicates an amount of glue used for dispensing at each dispensing position on the to-be-dispensed area, and the target distance indicates a distance between two adjacent dispensing positions;
the control module 1106 is configured to control the dispenser to perform dispensing on the to-be-dispensed area according to the target dispensing parameter, where each time the dispenser moves by the target distance, the amount of glue used for dispensing on each dispensing position by the dispenser is the target amount, and there is a space between the glue on two adjacent dispensing positions where dispensing is completed.
Through the embodiment, under the condition that the optical fiber is required to be subjected to dispensing, the dispensing machine can be controlled to intermittently dispense the adhesive at all the dispensing positions on the optical fiber, so that the whole area to be dispensed on the optical fiber is prevented from being subjected to dispensing, the adhesive force is ensured, and meanwhile, the amount of the adhesive used in the dispensing process is greatly reduced. And the interval is reserved between the glues at the positions of all the positions, so that the volume shrinkage rate of the glues at all the positions in the aging process is greatly reduced, the volume shrinkage force generated by the glues in the aging process is greatly reduced, the influence of the volume shrinkage force on the bonding performance between the glues and the optical fibers is reduced, and the stability of the bonding performance between the glues and the optical fibers is improved. By adopting the technical scheme, the problems of more glue used in the dispensing process and the like in the related technology are solved, and the technical effect of reducing the glue used in the dispensing process is realized.
Optionally, the second obtaining module includes:
the device comprises an acquisition unit, a control unit and a control unit, wherein the acquisition unit is used for acquiring a predetermined target occupied area and a target height, and the target occupied area is used for representing the occupied area of glue after dispensing is performed at one position on the area to be dispensed; determining the target amount according to the occupied area of the target and the target height;
and the first determining unit is used for determining the target distance according to the predetermined target stress and the target quantity, wherein the target stress is the stress of the glue on the area to be glued, and the target stress has a mapping relation with the target quantity and the target distance.
Optionally, the control module includes:
the second determining unit is used for determining a target glue time length and target air pressure according to the target quantity, wherein the target glue time length is the glue dispensing time length of the glue dispenser for dispensing at each glue dispensing position, the target air pressure is the air pressure adopted when the glue dispenser is used for dispensing at each glue dispensing position, and the target air pressure is used for controlling the glue quantity of the glue dispenser in the unit time length;
and the first control unit is used for controlling the dispensing machine to perform dispensing on each dispensing position according to the target dispensing time length and the target air pressure, wherein the distance between two adjacent dispensing positions is the target distance.
Optionally, the control module further includes:
the second control unit is used for controlling the dispensing machine to perform dispensing according to the target dispensing time length and the target air pressure at the current dispensing position;
and the third control unit is used for controlling the dispenser to move the target distance to the next dispensing position after the dispenser finishes dispensing according to the target dispensing time length and the target air pressure at the current dispensing position, and controlling the dispenser to dispense according to the target dispensing time length and the target air pressure at the next dispensing position.
Optionally, the apparatus further includes:
and the execution module is used for executing curing operation on the glue dispensed by the dispenser in the process of controlling the dispenser to dispense the glue on the to-be-dispensed area according to the target point glue parameter.
Optionally, the execution module includes:
and the first execution unit is used for executing the curing operation on the glue which is dispensed on the i-th dispensing position of the dispenser in the process of controlling the dispenser to dispense the glue on the i-th dispensing position of the to-be-dispensed area according to the target point glue parameter, wherein i is a positive integer greater than or equal to 2, j is a positive integer greater than or equal to 1, and j is a predetermined value.
Optionally, the execution module includes:
and the second execution unit is used for executing the curing operation on the glue which is dispensed on the p-th dispensing position of the dispenser in the process of controlling the dispenser to dispense the glue on the i-th dispensing position on the to-be-dispensed area according to the target dispensing parameter, wherein i is a positive integer greater than or equal to 2, p is a positive integer greater than or equal to 1, and the area occupied by the glue which is dispensed on the p-th dispensing position on the to-be-dispensed area is greater than or equal to a preset area threshold.
Embodiments of the present application also provide a storage medium including a stored program, wherein the program performs the method of any one of the above when run.
Alternatively, in the present embodiment, the above-described storage medium may be configured to store program code for performing the steps of:
s1, acquiring a target bonding request, wherein the target bonding request is used for requesting glue to be dispensed on a to-be-dispensed area of an optical fiber;
s2, responding to the target bonding request, and acquiring target point glue parameters, wherein the target point glue parameters are used for indicating target quantity and target distance, the target quantity represents the quantity of glue used for dispensing at each dispensing position on the to-be-dispensed area, and the target distance represents the distance between two adjacent dispensing positions;
S3, controlling the glue dispenser to dispense glue on the to-be-dispensed area according to the glue dispensing parameter of the target point, wherein the glue dispenser dispenses glue once every time the target distance is moved, the glue amount used by the glue dispenser to dispense glue on each glue dispensing position is the target amount, and a gap exists between the glue at two adjacent glue dispensing positions after the glue dispensing is completed.
Embodiments of the present application also provide an electronic device comprising a memory having a computer program stored therein and a processor arranged to run the computer program to perform the steps of any of the method embodiments described above.
Optionally, the electronic apparatus may further include a transmission device and an input/output device, where the transmission device is connected to the processor, and the input/output device is connected to the processor.
Alternatively, in the present embodiment, the above-described processor may be configured to execute the following steps by a computer program:
s1, acquiring a target bonding request, wherein the target bonding request is used for requesting glue to be dispensed on a to-be-dispensed area of an optical fiber;
s2, responding to the target bonding request, and acquiring target point glue parameters, wherein the target point glue parameters are used for indicating target quantity and target distance, the target quantity represents the quantity of glue used for dispensing at each dispensing position on the to-be-dispensed area, and the target distance represents the distance between two adjacent dispensing positions;
S3, controlling the glue dispenser to dispense glue on the to-be-dispensed area according to the glue dispensing parameter of the target point, wherein the glue dispenser dispenses glue once every time the target distance is moved, the glue amount used by the glue dispenser to dispense glue on each glue dispensing position is the target amount, and a gap exists between the glue at two adjacent glue dispensing positions after the glue dispensing is completed.
Alternatively, in the present embodiment, the storage medium may include, but is not limited to: a U-disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a removable hard disk, a magnetic disk, or an optical disk, or other various media capable of storing program codes.
Alternatively, specific examples in this embodiment may refer to examples described in the foregoing embodiments and optional implementations, and this embodiment is not described herein.
It will be appreciated by those skilled in the art that the modules or steps of the application described above may be implemented in a general purpose computing device, they may be centralized on a single computing device, or distributed across a network of computing devices, or they may alternatively be implemented in program code executable by computing devices, such that they may be stored in a memory device for execution by the computing devices and, in some cases, the steps shown or described may be performed in a different order than what is shown or described, or they may be implemented as individual integrated circuit modules, or as individual integrated circuit modules. Thus, the present application is not limited to any specific combination of hardware and software.
The foregoing is merely a preferred embodiment of the present application and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present application and are intended to be comprehended within the scope of the present application.

Claims (10)

1. The dispensing control method is characterized by comprising the following steps of:
obtaining a target bonding request, wherein the target bonding request is used for requesting to point the glue on a to-be-dispensed area of the optical fiber;
responding to the target bonding request, and acquiring target point glue parameters, wherein the target point glue parameters are used for indicating target amounts and target distances, the target amounts represent the amounts of glue used for dispensing at each dispensing position on the to-be-dispensed area, and the target distances represent the distances between two adjacent dispensing positions;
and controlling the glue dispenser to dispense glue on the to-be-dispensed area according to the target point glue parameter, wherein the glue dispenser dispenses glue once every time the target distance is moved, the glue amount used by the glue dispenser to dispense glue on each glue dispensing position is the target amount, and a gap exists between the glue on two adjacent glue dispensing positions after the glue dispensing is completed.
2. The method of claim 1, wherein the obtaining the target spot size parameter comprises:
acquiring a predetermined target occupied area and a target height, wherein the target occupied area is used for representing the occupied area of glue after dispensing is performed at one position on the area to be dispensed; determining the target amount according to the occupied area of the target and the target height;
and determining the target distance according to a predetermined target stress and the target quantity, wherein the target stress is the stress of the glue on the area to be dispensed, and the target stress has a mapping relation with the target quantity and the target distance.
3. The method of claim 1, wherein the controlling the dispenser to dispense the glue on the area to be dispensed according to the target point glue parameter comprises:
determining a target glue dispensing time length and target air pressure according to the target quantity, wherein the target glue dispensing time length is the glue dispensing time length of the glue dispenser for dispensing at each glue dispensing position, and the target air pressure is the air pressure adopted when the glue dispenser is used for dispensing at each glue dispensing position, and is used for controlling the glue quantity of the glue dispensed in the unit time length of the glue dispenser;
And controlling the dispensing machine to perform dispensing on each dispensing position according to the target dispensing time length and the target air pressure, wherein the distance between two adjacent dispensing positions is the target distance.
4. The method of claim 3, wherein said controlling said dispenser to dispense at said each dispensing location according to said target dispensing duration and said target air pressure further comprises:
controlling the dispensing machine to dispense according to the target point glue duration and the target air pressure at the current dispensing position;
after the dispensing machine finishes dispensing according to the target point glue duration and the target air pressure at the current dispensing position, controlling the dispensing machine to move the target distance to reach the next dispensing position, and controlling the dispensing machine to perform dispensing according to the target point glue duration and the target air pressure at the next dispensing position.
5. The method according to claim 1, wherein the method further comprises:
and in the process of controlling the glue dispenser to dispense glue on the to-be-dispensed area according to the glue dispensing parameter of the target point, executing curing operation on the glue dispensed by the glue dispenser.
6. The method according to claim 5, wherein the step of performing a curing operation on the glue dispensed by the dispenser during the step of controlling the dispenser to dispense the glue on the area to be dispensed according to the target dispensing parameter comprises:
and in the process of controlling the dispenser to perform dispensing on the ith dispensing position on the to-be-dispensed area according to the target dispensing parameter, performing the curing operation on the glue dispensed on the ith-j dispensing position of the dispenser, wherein i is a positive integer greater than or equal to 2, j is a positive integer greater than or equal to 1, and j is a predetermined value.
7. The method according to claim 5, wherein the step of performing a curing operation on the glue dispensed by the dispenser during the step of controlling the dispenser to dispense the glue on the area to be dispensed according to the target dispensing parameter comprises:
and in the process of controlling the dispenser to dispense glue at the ith dispensing position on the to-be-dispensed area according to the target dispensing parameter, executing the curing operation on the glue dispensed at the p th dispensing position of the dispenser, wherein i is a positive integer greater than or equal to 2, p is a positive integer greater than or equal to 1, and the area occupied by the glue dispensed at the p th dispensing position on the to-be-dispensed area is greater than or equal to a preset area threshold.
8. A dispensing control device, comprising:
the first acquisition module is used for acquiring a target bonding request, wherein the target adhesive request is used for requesting to point the adhesive on an area to be adhesive on the optical fiber;
the second obtaining module is used for responding to the target bonding request and obtaining target point glue parameters, wherein the target point glue parameters are used for indicating target amounts and target distances, the target amounts represent the amounts of glue used for dispensing at each dispensing position on the to-be-dispensed area, and the target distances represent the distances between two adjacent dispensing positions;
the control module is used for controlling the glue dispenser to perform glue dispensing on the to-be-dispensed area according to the glue dispensing parameter of the target point, wherein the glue dispenser performs glue dispensing once every time the target distance is moved, the amount of glue used by the glue dispenser for glue dispensing on each glue dispensing position is the target amount, and a gap exists between the glue at two adjacent glue dispensing positions after glue dispensing is completed.
9. A computer-readable storage medium, characterized in that the computer-readable storage medium comprises a stored program, wherein the program when run performs the method of any one of claims 1 to 7.
10. An electronic device comprising a memory and a processor, characterized in that the memory has stored therein a computer program, the processor being arranged to execute the method according to any of claims 1 to 7 by means of the computer program.
CN202211733282.7A 2022-12-30 2022-12-30 Dispensing control method and device, storage medium and electronic device Pending CN116140158A (en)

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