CN116106593A - Horizontal and pressure calibration mechanism for probe card - Google Patents

Abstract

The application relates to a probe card level and pressure calibration mechanism, which belongs to the technical field of display panel detection, including: a test bench, which includes an adsorption stage for positioning the electronic product under test, and the electronic product under test Connected to the probe card of the electronic product under test; the sensor is provided with at least two sensors, and the two sensors are respectively located on both sides of the adsorption carrier, and the two sensors are used to detect the two sides of the probe card respectively. side pressure. In this application, when the electronic product under test needs to plug in the probe card for electrical testing, the sensors located on both sides of the adsorption carrier can accurately detect the crimping force between the probe card and the electronic product under test. When the two sensors detect that the pressure on both sides of the probe card is consistent and reaches the set pressure value, it indicates that the connection between the probe card and the electronic product under test is reliable, otherwise it indicates that the crimping force is too large or the contact is poor, which improves the Test reliability of electronic products.

Description

A level and pressure calibration mechanism for probe cards

technical field

The present application relates to the technical field of display panel detection, in particular to a level and pressure calibration mechanism for a probe card.

Background technique

At present, before the display panel testing industry tests the display panel, it is necessary to connect the connector on the display panel with the test equipment to make the signal conduction, so as to achieve the purpose of testing. The current test method mainly uses the probe card to crimp the connector of the display panel. The stability of the crimp is a big factor affecting the test yield.

In the related art, during the crimping process between the probe card and the connector of the display panel, the crimping force detection of the probe card and the connector of the display panel is estimated by the crimping distance, which cannot be accurately quantified. The card tilt cannot be sensed, the crimping force is not enough to cause poor contact, and the crimping force is too large to cause damage to the probe.

Contents of the invention

The embodiment of the present application provides a probe card level and pressure calibration mechanism to solve the problem in the related art that the crimping force of the connector between the probe card and the display panel is difficult to quantify, which makes it difficult to control the crimping force and affects the quality of the display panel. The problem with test results.

The embodiment of the present application provides a probe card level and pressure calibration mechanism, including:

A test bench, the test bench includes an adsorption carrier for positioning the electronic product under test, and the electronic product under test is connected with a probe card that conducts the electronic product under test;

There are at least two sensors, the two sensors are respectively located on both sides of the adsorption carrier, and the two sensors are used to respectively detect the pressure on both sides of the probe card.

In some embodiments: the top of the adsorption carrier is provided with a positioning slot for positioning the electronic product under test, and the positioning slot is located between the two sensors.

In some embodiments: the adsorption stage is provided with several vacuum adsorption holes for adsorbing the electronic product under test, and the several vacuum adsorption holes are located between the two sensors.

In some embodiments: the adsorption carrier includes a ceramic plate and an aluminum support plate, several of the vacuum adsorption holes are located on the ceramic plate, the aluminum support plate is located at the bottom of the ceramic plate, and the aluminum support plate is opened with An adsorption tank communicated with several vacuum adsorption holes, the adsorption tank is connected with a vacuum generator through a pipeline.

In some embodiments: the two sides of the ceramic plate and the aluminum support plate are respectively provided with installation holes for accommodating sensors, the top surfaces of the two sensors are higher than the top surface of the ceramic plate, and the top surfaces of the two sensors are faces flush with each other.

In some embodiments: the test bench further includes a base, and the base is provided with a thermal insulation pad supporting the adsorption carrier, and a cooling device for cooling the electronic product under test is provided in the thermal insulation pad.

In some embodiments: the thermal insulation backing plate is provided with a positioning hole for accommodating a cooling device, the cooling device is located in the positioning hole of the thermal insulation backing plate, and the cooling device is a Peltier thermoelectric semiconductor cooling device The cold end of the refrigeration device is attached to the bottom surface of the adsorption carrier, and the hot end of the refrigeration device is attached to the top surface of the base.

In some embodiments: the base is an aluminum alloy plate, and the bottom of the base is provided with a plurality of cooling fins arranged in sequence.

In some embodiments: the bottom of the base is provided with grooves for accommodating several of the heat sinks, the bottom of the base is provided with a bottom sealing plate for sealing the several heat sinks in the grooves, and the base is provided with There are air inlet holes and air outlet holes for feeding compressed air into the groove.

In some embodiments: a display unit for displaying the pressure values of each of the sensors is also included.

The beneficial effects brought by the technical solution provided by the application include:

The embodiment of the present application provides a probe card level and pressure calibration mechanism. Since the probe card level and pressure calibration mechanism of the present application is equipped with a test bench, the test bench includes a device for positioning the electronic product under test. Adsorption carrier, the electronic product under test is connected with a probe card that conducts the electronic product under test; there are at least two sensors, the two sensors are located on both sides of the adsorption carrier, and the two sensors are used to detect Pressure on both sides of the probe card.

Therefore, the test platform for the probe card level and pressure calibration mechanism of the present application is provided with an adsorption stage that absorbs the electronic product under test, and the adsorption stage can position the electronic product under test. When the electronic product under test needs to plug in the probe card for electrical testing, the sensors located on both sides of the adsorption carrier can accurately detect the crimping force between the probe card and the electronic product under test. When the two sensors detect that the pressure on both sides of the probe card is consistent and reaches the set pressure value, it indicates that the connection between the probe card and the electronic product under test is reliable, otherwise it indicates that the crimping force is too large or the contact is poor, which improves the Test reliability of electronic products.

The probe card level and pressure calibration mechanism of the present application is provided with a positioning slot on the top of the adsorption carrier for positioning the electronic product under test, and the positioning slot is located between the two sensors. Several vacuum adsorption holes for absorbing the electronic product to be tested are provided on the adsorption stage, and the several vacuum adsorption holes are located between the two sensors. The positioning groove on the top of the adsorption stage can quickly locate the electronic product under test, so that the electronic product under test can be quickly positioned on the adsorption stage. Several vacuum adsorption holes on the top of the adsorption stage can absorb the electronic product under test, prevent the electronic product under test from moving on the adsorption stage during the test, and improve the detection reliability of the electronic product under test.

The adsorption carrier used for the probe card level and pressure calibration mechanism of the present application includes a ceramic plate and an aluminum support plate. Several vacuum adsorption holes are located on the ceramic plate, and the aluminum support plate is located at the bottom of the ceramic plate. An adsorption tank communicated with a plurality of vacuum adsorption holes, and the adsorption tank is connected with a vacuum generator through a pipeline. Several vacuum adsorption holes are located on the ceramic plate, which not only ensures the smoothness of the contact between the ceramic plate and the tested product, but also avoids deep drilling on the ceramic plate and reduces the difficulty of processing. Adsorption grooves communicated with a plurality of vacuum adsorption holes are arranged on the aluminum support plate, which is convenient for processing and production and reduces production cost.

The leveling and pressure calibration mechanism for the probe card of the present application has installation holes for accommodating sensors on both sides of the ceramic plate and the aluminum support plate, the top surfaces of the two sensors are higher than the top surface of the ceramic plate, and the two sensors tops are flush with each other. The two sides of the ceramic board and the aluminum support board are provided with mounting holes for the sensors, which is convenient for installing and arranging the sensors, and the top surfaces of the two sensors are higher than the top surface of the ceramic board to prevent the pins of the probe card from colliding with the ceramic board. top contact. The top surfaces of the two sensors are flush with each other to ensure that the two sensors can be in contact with the pins of the probe card at the same time, thereby improving the detection accuracy.

The test bench for the probe card level and pressure calibration mechanism of the present application also includes a base, on which is provided a heat-insulating backing plate supporting the adsorption carrier, and a cooling device for cooling the electronic product under test is arranged in the heat-insulating backing plate. There is a positioning hole on the thermal insulation backing plate to accommodate the cooling device. The cooling device is located in the positioning hole of the thermal insulation backing plate. The cooling device is a Peltier thermoelectric semiconductor cooling device. The cold end of the cooling device is attached to the adsorption platform. The bottom surface of the refrigerating device is attached to the top surface of the base. The refrigerating device can cool down the electronic product under test in the process of testing, so that the electronic product under test can be tested within a set temperature range.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort.

Fig. 1 is the structure perspective view of the embodiment of the present application;

Fig. 2 is the structural plan view of the embodiment of the present application;

Fig. 3 is the perspective view of the structure of the test bench and the sensor of the embodiment of the present application;

Fig. 4 is the top view of the structure of the test bench and the sensor of the embodiment of the present application;

Fig. 5 is a sectional view along A-A direction in Fig. 4;

6 is a perspective view of the structure of the ceramic plate of the embodiment of the present application;

7 is a perspective view of the structure of the aluminum support plate of the embodiment of the present application;

Fig. 8 is a structural perspective view of the first viewing angle of the base of the embodiment of the present application;

FIG. 9 is a structural perspective view of a second viewing angle of a base according to an embodiment of the present application.

Reference signs:

1. Test bench; 2. Probe card; 3. Sensor; 11. Adsorption carrier; 12. Ceramic plate; 13. Aluminum support plate; 14. Base; 15. Insulation pad; 16. Cooling device; 17. Bottom seal plate; 121, positioning groove; 122, installation hole; 123, vacuum adsorption hole; 131, adsorption groove; 141, heat sink; 142, air inlet hole; 143, air outlet hole.

Detailed ways

In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, but not all of them. Based on the embodiments in this application, those of ordinary skill in the art

All other embodiments obtained under the premise of making creative work all belong to the protection scope of 5 of the present application.

The embodiment of the present application provides a probe card level and pressure calibration mechanism, which can solve the problem in the related art that the crimping force of the probe card and the connector of the display panel is difficult to quantify, which makes it difficult to control the crimping force and affects the display. The problem with the detection results of the panel.

Referring to Figure 1 and Figure 2, the embodiment of the present application provides a probe card level 0 and pressure calibration mechanism, including:

Test bench 1, the test bench 1 includes an adsorption carrier 11 for positioning the electronic product under test (not shown in the figure), the electronic product under test is connected with a probe card 2 conducting the electronic product under test, the tested electronic product The electronic product is specifically a display panel, and the electronic product under test and the probe card 2 pass through

The connector is connected, and the probes of the probe card 2 are inserted into the connector of the electronic product under test to provide test signals to the electronic product under test.

There are at least two sensors 3, and the specific number of sensors 3 is set according to actual needs. The probe card 2 of the embodiment of the present application is provided with a row of plug-in probes connected to the electronic product under test, so There are two sensors 3 in the embodiment of the present application. two sensors

The sensors 3 are respectively located on both sides of the adsorption carrier 11 (that is, the two ends of a row of insertion probes of the probe card 2), and the two sensors 3 are used to respectively detect the crimping of the two sides of the probe card 2 to be tested. Electronics stress. The pressure values of the two sensors 3 are displayed through the display unit, so that it is convenient to intuitively see the connection status between the probe card 2 and the electronic product under test.

The test bench 1 for the probe card level and pressure calibration mechanism of the embodiment of the present application is provided with

An adsorption stage 11 for absorbing the electronic product under test is arranged, and the adsorption stage 11 can locate the electronic product under test. When the electronic product under test needs to plug in the probe card 2 and power on for testing, the

The sensors 3 on both sides of the attached platform 11 can accurately detect the crimping force between the insertion probes of the probe card 2 and the electronic product under test.

When the two sensors 3 detect that the pressure on both sides of the plug-in probe of the probe card 2 is consistent and reaches the set pressure value, it indicates that the plug-in probe of the probe card 2 is connected to the electronic product under test reliably, otherwise It indicates that the crimping force is too large or the contact is poor, which improves the detection reliability of the electronic product under test. When both sides of the probe card 2 are horizontally crimped the electronic product under test to the set pressure, the electronic product under test will be in reliable contact with the probe card 2, preventing one end of the probe card 2 from warping or excessive crimping force Poor contact or damage caused by the problem.

In some optional embodiments: referring to Fig. 3 to Fig. 7, the embodiment of the present application provides a level and pressure calibration mechanism for probe cards, the top of the adsorption carrier 11 of the calibration mechanism is provided with a positioning device The positioning groove 121 of the electronic product is measured, and the positioning groove 121 is located between the two sensors 3 . Several vacuum adsorption holes 123 are opened on the adsorption carrier 11 to absorb the electronic product to be tested, and the plurality of vacuum adsorption holes 123 are located between the two sensors 3 .

The probe card level and pressure calibration mechanism in the embodiment of the present application is provided with a positioning groove 121 on the top of the adsorption carrier 11 for positioning the electronic product under test, and the positioning groove 121 is located between the two sensors 3 . Several vacuum adsorption holes 123 for absorbing the electronic product to be tested are opened on the adsorption carrier 11 , and the several vacuum adsorption holes 123 are located between the two sensors 3 .

The positioning groove 121 on the top of the adsorption carrier 11 can quickly locate the electronic product under test, so that the electronic product under test can be quickly positioned on the adsorption carrier 11 . Several vacuum suction holes 123 on the top of the adsorption stage 11 can absorb the electronic product under test, prevent the electronic product under test from moving on the adsorption stage 11 during the test, and improve the detection reliability of the electronic product under test.

In some optional embodiments: referring to Fig. 3 to Fig. 7, the embodiment of the present application provides a probe card level and pressure calibration mechanism, the adsorption stage 11 of the calibration mechanism includes a ceramic plate 12 and aluminum The support plate 13 and several vacuum suction holes 123 are located on the ceramic plate 12 . The aluminum support plate 13 is located at the bottom of the ceramic plate 12, and the aluminum support plate 13 is provided with an adsorption groove 131 communicating with a plurality of vacuum adsorption holes 123, and the adsorption groove 131 is connected with the vacuum generator through a pipeline.

The adsorption carrier for the probe card level and pressure calibration mechanism of the embodiment of the present application includes a ceramic plate 12 and an aluminum support plate 13, several vacuum adsorption holes 123 are located on the ceramic plate 12, and the aluminum support plate 13 is located on the ceramic plate 12. At the bottom, the aluminum support plate 13 is provided with an adsorption groove 131 communicating with a plurality of vacuum adsorption holes 123, and the adsorption groove 131 is connected to the vacuum generator through a pipeline.

Several vacuum suction holes 123 are located on the ceramic plate 12, which ensures the smoothness of the contact between the ceramic plate 12 and the tested product, prevents scratches or abrasion of the tested electronic product, and can avoid deep drilling on the ceramic plate 12, reducing the Processing difficulty. The aluminum support plate 13 is provided with adsorption grooves 131 communicating with a plurality of vacuum adsorption holes 123, which is convenient for processing and production and reduces production costs.

In some optional embodiments: referring to Fig. 6 and Fig. 7, the embodiment of the present application provides a level and pressure calibration mechanism for a probe card, the ceramic plate 12 and the aluminum support plate 13 of the calibration mechanism are two Mounting holes 122 for accommodating the sensors 3 are respectively opened on the sides. The top surfaces of the two sensors 3 are higher than the top surface of the ceramic plate 12 and the top surfaces of the two sensors 3 are flush with each other.

The level and pressure calibration mechanism for the probe card in the embodiment of the present application is provided with mounting holes 122 for accommodating the sensors 3 on both sides of the ceramic plate 12 and the aluminum support plate 13, which is convenient for installing and arranging the sensors 3, and the two sensors 3 The top surface of the probe card 2 is higher than the top surface of the ceramic board 12, preventing the pins of the probe card 2 from contacting the top surface of the ceramic board 12. The top surfaces of the two sensors 3 are flush with each other to ensure that the two sensors 3 can be in contact with the pins of the probe card 2 at the same time, thereby improving the detection accuracy.

In some optional embodiments: referring to Fig. 3 to Fig. 5, the embodiment of the present application provides a level and pressure calibration mechanism for probe cards, the test bench 1 of the calibration mechanism also includes a base 14, on the base 14 is provided with a heat-insulating backing plate 15 supporting the adsorption carrier 11, and a cooling device 16 for cooling the electronic product under test is arranged in the heat-insulating backing plate 15.

A positioning hole for accommodating the cooling device 16 is provided on the heat insulating backing plate 15, and the cooling device 16 is located in the positioning hole of the heat insulating backing plate 15. The cooling device 16 is preferably but not limited to a Peltier thermoelectric semiconductor cooling device. The cold end of the cooling device 16 is attached to the bottom surface of the adsorption carrier 11 , and the hot end of the cooling device 16 is attached to the top surface of the base 14 .

The heat insulation backing plate 15 used for the level and pressure calibration mechanism of the probe card in the embodiment of the present application is provided with a positioning hole for accommodating the refrigeration device 16, and the refrigeration device 16 is located in the positioning hole of the heat insulation backing plate 15, and the refrigeration device 16 It is a Peltier thermoelectric semiconductor cooling device. The cold end of the cooling device 16 is attached to the bottom surface of the adsorption carrier 11 , and the hot end of the cooling device 16 is attached to the top surface of the base 14 . The refrigeration device 16 can cool down the electronic product under test, so that the electronic product under test can be tested within a set temperature range.

In some optional embodiments: as shown in Fig. 8 and Fig. 9, the embodiment of the present application provides a probe card level and pressure calibration mechanism, the base 14 of the calibration mechanism is an aluminum alloy plate, and the base 14 The bottom is provided with a number of heat sinks 141 arranged in sequence. The bottom of the base 14 is provided with grooves for accommodating several cooling fins 141, and the bottom of the base 14 is provided with a bottom sealing plate 17 that seals the plurality of cooling fins 141 in the grooves. The air inlet hole 142 and the air outlet hole 143.

The base 14 used for the probe card level and pressure calibration mechanism in the embodiment of the present application is an aluminum alloy plate, and a number of cooling fins 141 arranged in sequence are arranged at the bottom of the base 14, and the cooling fins 141 are used to transmit the cooling device 16 to The heat on the base 14 cools down quickly. The bottom of the base 14 is provided with grooves for accommodating a plurality of cooling fins 141, and is provided with a bottom sealing plate 17 which seals the plurality of cooling fins 141 in the grooves, and utilizes the air inlet 142 to pass compressed air into the grooves to accelerate heat dissipation. The heat dissipation efficiency of the sheet 141 is used to reduce the test temperature of the electronic product under test, so that the electronic product under test can complete the test at the set temperature.

working principle

The embodiment of the present application provides a probe card level and pressure calibration mechanism. Since the probe card level and pressure calibration mechanism of the present application is provided with a test bench 1, the test bench 1 includes a The adsorption carrier 11 of the product, the electronic product under test is connected with the probe card 2 that conducts the electronic product under test; the sensor 3, the sensor 3 is provided with at least two, and the two sensors 3 are respectively located on both sides of the adsorption carrier 11 , the two sensors 3 are used to respectively detect the pressure on both sides of the probe card 2 .

Therefore, the test bench 1 for the probe card level and pressure calibration mechanism of the present application is provided with an adsorption stage 11 that absorbs the electronic product under test, and the adsorption stage 11 can position the electronic product under test. When the electronic product under test needs to be plugged with the probe card 2 to be energized for testing, the sensors 3 located on both sides of the adsorption carrier 11 can accurately detect the crimping force between the probe card 2 and the electronic product under test. When the two sensors 3 detect that the pressure on both sides of the probe card 2 is consistent and reaches the set pressure value, it indicates that the connection between the probe card 2 and the electronic product under test is reliable, otherwise it indicates that the crimping force is too large or the contact is poor, and the The detection reliability of the electronic product under test is improved.

In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower" and so on is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description. It is not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed, or operate in a particular orientation, and thus should not be construed as limiting the application. Unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be interpreted in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection, It can also be an electrical connection; it can be a direct connection, or an indirect connection through an intermediary, or an internal communication between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.

It should be noted that in this application, relative terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply There is no such actual relationship or order between these entities or operations. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include elements inherent in such a process, method, article, or device. Without further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article or apparatus comprising said element.

The above descriptions are only specific implementation manners of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the application. Therefore, the present application will not be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims (10)

1. A level and pressure calibration mechanism for a probe card, characterized in that it comprises: A test stand (1), the test stand (1) including an adsorption carrier (11) for positioning the electronic product under test, the electronic product under test is connected with a probe card (2) that conducts the electronic product under test ; Sensor (3), described sensor (3) is provided with at least two, and two described sensors (3) are respectively positioned at the both sides of adsorption stage (11), and two described sensors (3) are used for respectively detecting probe Pressure on both sides of the needle card (2). 2. A mechanism for calibration of probe card level and pressure as claimed in claim 1, characterized in that: The top of the adsorption carrier (11) is provided with a positioning groove (121) for positioning the electronic product under test, and the positioning groove (121) is located between the two sensors (3). 3. A mechanism for calibration of probe card level and pressure as claimed in claim 1, characterized in that: Several vacuum adsorption holes (123) are opened on the adsorption carrier (11) to absorb the electronic product under test, and the several vacuum adsorption holes (123) are located between the two sensors (3). 4. A mechanism for calibration of probe card level and pressure as claimed in claim 3, characterized in that: The adsorption carrier (11) includes a ceramic plate (12) and an aluminum support plate (13), several vacuum adsorption holes (123) are located on the ceramic plate (12), and the aluminum support plate (13) is located on the ceramic plate (13). the bottom of the plate (12); The aluminum support plate (13) is provided with an adsorption groove (131) communicated with several vacuum adsorption holes (123), and the adsorption groove (131) is connected with a vacuum generator through a pipeline. 5. A mechanism for calibration of probe card level and pressure as claimed in claim 4, characterized in that: Both sides of the ceramic plate (12) and the aluminum support plate (13) are respectively provided with mounting holes (122) for accommodating sensors (3), and the top surfaces of the two sensors (3) are higher than the ceramic plate (12) and the top surfaces of the two sensors (3) are flush with each other. 6. A mechanism for calibration of probe card level and pressure as claimed in claim 1, characterized in that: The test bench (1) also includes a base (14), the base (14) is provided with a thermal insulation pad (15) supporting the adsorption carrier (11), and the thermal insulation pad (15) is provided with There is a cooling device (16) for cooling the electronic product under test. 7. A mechanism for calibration of probe card level and pressure as claimed in claim 6, characterized in that: A positioning hole for accommodating a cooling device (16) is opened on the heat insulating backing plate (15), and the cooling device (16) is located in the positioning hole of the heat insulating backing plate (15), and the cooling device (16) It is a Peltier thermoelectric semiconductor cooling device, the cold end of the cooling device (16) is attached to the bottom surface of the adsorption carrier (11), and the hot end of the cooling device (16) is attached to the bottom surface of the base (14). top surface. 8. A level and pressure calibration mechanism for probe card as claimed in claim 6 or 7, characterized in that: The base (14) is an aluminum alloy plate, and the bottom of the base (14) is provided with a plurality of cooling fins (141) arranged in sequence. 9. A mechanism for calibrating probe card level and pressure as claimed in claim 8, characterized in that: The bottom of the base (14) is provided with a groove for accommodating some of the cooling fins (141), and the bottom of the base (14) is provided with a bottom seal for sealing the plurality of cooling fins (141) in the groove. A plate (17), the base (14) is provided with an air inlet (142) and an air outlet (143) for feeding compressed air into the groove. 10. A mechanism for calibration of probe card level and pressure as claimed in claim 1, characterized in that: It also includes a display unit for displaying the pressure value of each of the sensors (3).

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