CN116069142A - Full-sealed reinforcement machine case with high-efficient heat dissipation - Google Patents

Abstract

The invention discloses a fully sealed and reinforced cabinet with high-efficiency heat dissipation. The cabinet includes a box-shaped main body, and the box-shaped main body includes a heat dissipation cabin and a card sealing cabin that are independent of each other; The equipment boards, and several of the electronic equipment boards are all connected to the heat dissipation compartment, so as to transfer the heat generated by the heat dissipation source on the electronic equipment boards to the heat dissipation compartment. The box-shaped main body of the case adopts an independent heat dissipation compartment and board card sealing compartment. The heat dissipation compartment is designed with an independent fan accommodation part and an air duct part to increase the air flow around the outer shell, thereby improving the convection heat dissipation performance. The entire heat dissipation process is in It is carried out outside the sealed cabin, which will not affect the electromagnetic compatibility, waterproof and dustproof ability, humidity heat and salt spray ability of the equipment.

Description

A fully sealed and reinforced chassis with efficient heat dissipation

technical field

The invention relates to the technical field of electronic equipment, in particular to a fully sealed and reinforced chassis with excellent heat dissipation capability and high-efficiency heat dissipation.

Background technique

With the development of electronic technology, the integration of electronic equipment is getting higher and higher, and the power consumption per unit volume of electronic equipment is continuously increasing, resulting in a rapid rise in the temperature of electronic equipment. There is an exponential law between temperature and component failure rate. As the temperature rises, the failure rate increases rapidly. For example, if the temperature of a single semiconductor component rises by 10°C, the reliability of the device will decrease by 50%. And there are statistical statistics that more than 55% of the failures of electronic equipment are caused by the temperature exceeding the specified value.

As a part of computer accessories, the chassis is mainly used to place and fix various electronic equipment accessories, and to play a role of support and protection. The current heat dissipation methods of fully sealed and reinforced chassis generally adopt two forms:

One is to transfer the heat to the chassis shell directly through the built-in fan of the board card through heat conduction, heat convection and heat radiation. Air convection in the inner cavity does not improve heat dissipation efficiency.

The second is that by adding a fluid cooling system, the heat dissipation efficiency of the chassis can be greatly improved. The disadvantage is that the system has a complex structure, lower reliability, and will increase the overall size of the chassis, which is costly and difficult to maintain.

Therefore, how to improve the heat dissipation capability of the electronic equipment integrated in the case is an urgent technical problem to be solved by those skilled in the art.

Contents of the invention

In view of the above problems, the present invention provides a fully sealed and reinforced chassis with high-efficiency heat dissipation for overcoming the above problems or at least partially solving the above problems. The chassis can be used as a fully sealed and reinforced chassis with high-efficiency heat dissipation. The outer shell of the box-shaped main body is not only the outer packaging of the equipment, but also the main radiator of the equipment.

The present invention provides following scheme:

A fully sealed and reinforced chassis with efficient heat dissipation, including:

A box-shaped main body, the box-shaped main body includes mutually independent heat dissipation cabins and board sealing cabins; the board sealing cabin is used to set a number of electronic equipment boards, and several of the electronic equipment boards are connected to the heat dissipation cabin , so as to transfer the heat generated by the heat dissipation source on the electronic equipment board to the heat dissipation cabin;

Wherein, the heat dissipation cabin includes a fan accommodating portion and an air duct portion, the fan accommodating portion communicates with the air duct portion, and an air duct outlet is formed at an end of the air duct portion away from the fan accommodating portion. An air outlet; the fan accommodating part is used for setting a fan, and the fan is used for providing cooling airflow to the air duct part.

Preferably: the box-shaped main body includes several air deflector assemblies, and the air deflector assembly includes an air deflector and an air deflector cover that are arranged separately from each other. to form the air duct.

Preferably, the air deflector is connected to the air deflector cover through several connecting ribs, and an air duct is formed between two adjacent connecting ribs.

Preferably: several of the air deflector assemblies include a pair of first air deflector assemblies and a pair of second air deflector assemblies; several of the electronic equipment boards include several first electronic equipment boards and several second electronic equipment boards board, the first electronic equipment board includes a first heat dissipation source, the second electronic equipment board includes a second heat dissipation source, and the heat generated by the first heat dissipation source is greater than the heat generated by the second heat dissipation source ;

The side surface of the first electronic equipment board is connected to the first air deflector assembly through a thermally conductive insulating pad, and the respective end faces of the first electronic equipment board and the second electronic equipment board are connected to each other through locking strips. The second wind deflector assembly is connected.

Preferably: the heat conducting insulating pad has high flexibility and low thermal resistance characteristics.

Preferably: the box-shaped main body also includes a fan compartment cover and a connector cover;

A pair of the first air deflector assembly, a pair of the second air deflector assembly, the fan compartment cover and the connector cover are assembled and connected by screws to form the box-shaped main body.

Preferably, the fan compartment cover is provided with an air inlet, and the connector cover is provided with an opening opposite to the air outlet of the air duct.

Preferably, the joints of the pair of first air deflector assemblies, the pair of second air deflector assemblies, the fan compartment cover and the connector cover are all provided with notches and sealing strips.

Preferably: the inner and outer surfaces of the box-shaped main body are provided with a blackened layer formed by a blackening process.

According to the specific embodiments provided by the invention, the invention discloses the following technical effects:

The embodiment of the present application provides a fully sealed and reinforced chassis with high-efficiency heat dissipation. The box-shaped main body adopts an independent heat dissipation cabin and board card sealing cabin. The air flow improves the convection heat dissipation performance. The entire heat dissipation process is carried out outside the sealed cabin, which does not affect the electromagnetic compatibility, waterproof and dustproof ability, damp heat and salt spray ability of the equipment.

In addition, in a preferred embodiment, the inner and outer surfaces of the box-shaped main body are ribbed as much as possible, which can ensure the maximum increase of the heat dissipation area under the limited equipment size, thereby improving the heat dissipation capacity of the chassis, and the design structure is simple, suitable for Broad and easy to promote. The inner and outer surfaces of the box-shaped main body are all blackened, thereby improving the radiation and heat dissipation of the chassis, and the surface treatment process is simple, low in cost, and widely applicable.

Of course, any product implementing the present invention does not necessarily need to achieve all the above-mentioned advantages at the same time.

Description of drawings

In order to illustrate the embodiments of the present invention or the technical solutions in the prior art more clearly, the following will briefly introduce the drawings required in the embodiments. Apparently, the drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other drawings according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a fully sealed and reinforced chassis with high-efficiency heat dissipation provided by an embodiment of the present invention;

Fig. 2 is a schematic diagram of an air duct and subdivision of a fully sealed and reinforced chassis with high-efficiency heat dissipation provided by an embodiment of the present invention.

In the figure: box-shaped main body 1, heat dissipation compartment 11, fan accommodation part 111, air duct part 112, air duct air outlet 113, air inlet 114, card sealing compartment 12, first air deflector assembly 13, second air guide Wind panel assembly 14 , fan compartment cover 15 , connector cover 16 , electronic equipment board 2 , first electronic equipment board 21 , second electronic equipment board 22 , fan 3 , heat conduction insulation pad 4 , and locking bar 5 .

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention.

Referring to Fig. 1 and Fig. 2, it is a fully sealed and reinforced chassis with high-efficiency heat dissipation provided by the embodiment of the present invention. As shown in Fig. 1 and Fig. 2, the chassis may include:

A box-shaped main body 1, the box-shaped main body 1 includes a heat dissipation cabin 11 and a board sealing cabin 12 that are independent of each other; All are connected with the heat dissipation cabin 11, so that the heat generated by the heat dissipation source on the electronic equipment board 2 is transferred to the heat dissipation cabin 11;

Wherein, the heat dissipation cabin 11 includes a fan accommodating portion 111 and an air duct portion 112, the fan accommodating portion 111 communicates with the air duct portion 112, and the air duct portion 112 is far away from the fan accommodating portion 111 An air duct air outlet 113 is formed at one end of the air duct; the fan accommodating portion 111 is used for arranging a fan 3 , and the fan 3 is used for providing cooling airflow to the air duct portion 112 .

The embodiment of the present application provides a fully sealed and reinforced chassis with high-efficiency heat dissipation. The box-shaped main body is not only the outer packaging of the equipment, but also the main heat sink of the equipment. The board card sealing compartment can seal the board card of the electronic equipment inside to meet the sealing requirements of the board card of the electronic equipment. At the same time, since the heat dissipation cabin forms several air ducts, the heat generated by the electronic equipment board can be transferred to the box-shaped main body, and the heat can be released to the surrounding air along with the flow of the airflow provided by the fan in the fan accommodating part. The box-shaped main body can dissipate heat based on three basic ways of heat transfer: conduction, radiation, and convection, and can effectively exert the maximum heat dissipation potential of the box-shaped main body.

The air duct part included in the box-shaped main body provided by the embodiment of the present application can dissipate the heat generated by the heat dissipation source to the surrounding air during the airflow process, because the hot air in the air duct part can be discharged from the air outlet of the air duct, Therefore, there will be no problems such as insufficient wind power of the traditional air-cooled board with its own fan, and the sealed inner cavity of the chassis is full of hot air. Only by improving the air convection in the inner cavity, the heat dissipation efficiency cannot be improved.

Specifically, in order to further improve heat dissipation efficiency, the embodiment of the present application can also provide that the box-shaped main body 1 includes several air deflector assemblies, and the air deflector assemblies include air deflectors and air deflector cover plates arranged separately from each other, The air channel portion 112 is formed between the air guide plate and the air guide cover plate. Specifically, the air deflector is connected to the air deflector cover through several connecting ribs, and an air duct is formed between two adjacent connecting ribs. The inner and outer surfaces of the shell of the box-shaped main body are ribbed as much as possible to ensure that the heat dissipation area is maximized under the limited structural size, thereby improving the conduction heat dissipation performance. The functions of the ribs provided on the wind deflector assembly are as follows: 1. It can increase the heat dissipation area of the chassis; 2. The rib grooves formed between the ribs can be used as forced convection air ducts.

The box-shaped main body provided by the embodiment of the present application adopts an independent heat dissipation compartment and a board sealing compartment, and is designed with an independent fan compartment and four-sided rib groove air ducts to increase the air flow around the outer shell, thereby improving the convection heat dissipation efficiency, and the entire heat dissipation process is stable. It is carried out outside the airtight cabin without affecting the electromagnetic compatibility, waterproof and dustproof ability, humidity heat and salt spray ability of the equipment.

In practical applications, in order to facilitate the assembly of the box-shaped main body and further improve the heat dissipation effect, the embodiment of the present application can also provide several air deflector assemblies including a pair of first air deflector assemblies 13 and a pair of second air deflector assemblies. Air deflector assembly 14; several said electronic equipment boards 2 include several first electronic equipment boards 21 and several second electronic equipment boards 22, said first electronic equipment boards 21 include a first heat dissipation source, said The second electronic device board 22 includes a second heat dissipation source, and the heat generated by the first heat dissipation source is greater than the heat generated by the second heat dissipation source.

The side surfaces of the first electronic equipment board 21 are connected to the first air deflector assembly 13 through the heat conduction insulating pad 4, and the respective end surfaces of the first electronic equipment board 21 and the second electronic equipment board 22 are It is connected with the second wind deflector assembly 14 through the locking strip 5 .

Further, the heat conducting and insulating pad 4 has high flexibility and low thermal resistance. The thermally conductive insulating pad has the characteristics of high softness and low thermal resistance, and is filled in the irregular gaps between the main heat dissipation sources, so that the heat from the heat dissipation source can be effectively transferred to the first air deflector assembly.

The fan accommodating part provided in the embodiment of the present application is used to install a fan. Specifically, the box-shaped main body 1 further includes a fan compartment cover 15 and a connector cover 16;

A pair of the first air deflector assembly 13 , a pair of the second air deflector assembly 14 , the fan compartment cover 15 and the connector cover 16 are assembled and connected by screws to form the box-shaped main body 1 .

The fan compartment cover 15 is provided with an air inlet 114 , and the connector cover 16 is provided with an opening opposite to the air outlet 113 of the air duct.

In order to further improve the airtightness of the card sealing compartment provided by the embodiment of the present application, the embodiment of the present application may provide a pair of the first wind deflector assembly 13, a pair of the second wind deflector assembly 14, the Joints between the fan compartment cover 15 and the connector cover 16 are provided with notches and sealing strips.

In order to further improve the heat dissipation capability of the box-shaped main body, an embodiment of the present application may provide that both inner and outer surfaces of the box-shaped main body are provided with blackened layers formed by a blackening process.

The device provided by the embodiment of the present application will be described in detail below by taking a case structure formed in the form of an air deflector assembly as an example.

The first air deflector assembly 13 provided in the embodiment of the present application may be a side air deflector assembly, and the second air deflector assembly 14 may be an upper and lower air deflector assembly, and the high power consumption or the main heat dissipation source (first heat dissipation source) A thermally conductive insulating pad with high softness and bottom thermal resistance is directly attached to the inner wall of the outer casing (the first air deflector assembly 13 ), thereby improving conduction and heat dissipation performance. For a low-power or general heat dissipation source (second heat dissipation source), it is only necessary to use locking strips to connect with the second air deflector assembly 14 to meet heat dissipation requirements.

In practical application, the side air deflector assembly, the upper and lower air deflector assemblies, the fan hatch cover 15, and the connector cover 16 are spliced to form a box-shaped main body, which belongs to the main radiator of the chassis. The side air deflector assembly and the upper and lower air deflector assemblies are respectively composed of air deflectors and air deflector cover plates, which are assembled with screws, and the joint gap can be filled with sealant around them to form a closed four-sided rib groove air duct.

The thermally conductive insulating pad has the characteristics of high softness and low thermal resistance. It is filled in the irregular gaps between the main heat dissipation sources and can effectively transfer the heat from the heat dissipation sources to the left and right air deflector components.

The fan assembly includes an independent fan compartment cover and is designed with an air duct inlet.

The connector cover is designed with an opening opposite to the air outlet of the air duct. The locking bar not only has the function of locking the board, but also has high thermal conductivity, which can transfer the heat from the heat dissipation source to the upper and lower air deflector components.

The main body design of this box is composed of six-sided splicing, and there are notches and sealing strips designed between the splicing of each side to ensure that the card compartment of the chassis is completely sealed.

The overall design of the box-shaped main body is divided into two independent cabins: the cooling cabin and the board sealing cabin.

Turn on the power of the device, and the boards of the device start to work, and the heat generated by the heating components on the boards is transferred to the box-shaped main body through the locking strip and the heat-conducting insulating pad respectively. The heat of the box-shaped main body is transferred to the surrounding environment in three ways:

①The box-shaped main body and the surrounding environment transfer part of the heat to the surrounding environment through natural conduction and heat dissipation.

②The surface of the box-shaped main body has been blackened, and part of the heat is transferred to the surrounding environment through radiation heat dissipation.

③The chassis power is turned on, and the fan assembly starts to work. The fan assembly draws the cold air in the environment into the fan cabin through the air extraction method, and then transmits the cold air to the rib grooves (equivalent to the air duct) of the outer shell through the fan air inlet. Through the inner and outer surfaces of the entire chassis, the heat on the outer shell is taken away, and finally the hot air is discharged through the air outlet of the connector cover, thereby reducing the temperature of the box-type main body.

It can be seen that the entire heat dissipation mode of the protective device provided by the embodiment of the present application includes three types: conduction heat dissipation, radiation heat dissipation, and forced convection heat dissipation.

In short, this application provides a fully sealed and reinforced chassis with high-efficiency heat dissipation. The box-shaped main body adopts an independent heat dissipation cabin and board card sealing cabin. The heat dissipation cabin is designed with an independent fan accommodation part and an air duct part to increase the air flow around the outer shell. , so as to improve the efficiency of convection heat dissipation. The entire heat dissipation process is carried out outside the sealed cabin, which does not affect the electromagnetic compatibility, waterproof and dustproof ability, damp heat and salt spray ability of the equipment.

At the same time, the inner and outer surfaces of the box-shaped main body are ribbed as much as possible, which can ensure the maximum heat dissipation area under the limited equipment size, thereby improving the heat dissipation capacity of the chassis, and the design structure is simple, widely applicable, and easy to promote.

In addition, the inner and outer surfaces of the box-shaped main body are all blackened, thereby improving the radiation heat dissipation of the chassis, and the surface treatment process is simple, low in cost, and widely applicable.

The embodiment of the present application may also provide an electronic device, including several electronic device boards, and the several electronic device boards are arranged in the above-mentioned fully sealed and reinforced chassis with high-efficiency heat dissipation.

It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is a relationship between these entities or operations. There is no such actual relationship or order between them. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include elements inherent in such a process, method, article, or device. Without further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article or apparatus comprising said element.

It can be known from the above description of the implementation manners that those skilled in the art can clearly understand that the present application can be implemented by means of software plus a necessary general hardware platform. Based on this understanding, the essence of the technical solution of this application or the part that contributes to the prior art can be embodied in the form of software products, and the computer software products can be stored in storage media, such as ROM/RAM, disk , CD, etc., including several instructions to make a computer device (which may be a personal computer, server, or network device, etc.) execute the methods described in various embodiments or some parts of the embodiments of the present application.

Each embodiment in this specification is described in a progressive manner, the same and similar parts of each embodiment can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system or the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and for related parts, please refer to the part of the description of the method embodiment. The systems and system embodiments described above are only illustrative, and the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is It can be located in one place, or it can be distributed to multiple network elements. Part or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment. It can be understood and implemented by those skilled in the art without creative effort.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present invention are included in the protection scope of the present invention.

Claims (9)

1. A fully sealed and reinforced chassis with efficient heat dissipation, characterized in that it comprises: A box-shaped main body, the box-shaped main body includes mutually independent heat dissipation cabins and board sealing cabins; the board sealing cabin is used to set a number of electronic equipment boards, and several of the electronic equipment boards are connected to the heat dissipation cabin , so as to transfer the heat generated by the heat dissipation source on the electronic equipment board to the heat dissipation cabin; Wherein, the heat dissipation cabin includes a fan accommodating portion and an air duct portion, the fan accommodating portion communicates with the air duct portion, and an air duct outlet is formed at an end of the air duct portion away from the fan accommodating portion. An air outlet; the fan accommodating part is used for setting a fan, and the fan is used for providing cooling airflow to the air duct part. 2. The fully sealed and reinforced chassis with high-efficiency heat dissipation according to claim 1, wherein the box-shaped main body includes several air deflector assemblies, and the air deflector assemblies include air deflectors and air deflectors arranged separately from each other. The wind cover, the air guide plate and the air guide cover are used to form the air duct. 3. The fully-sealed and reinforced chassis with high-efficiency heat dissipation according to claim 2, wherein the air guide plate and the air guide cover are connected by several connecting ribs, and the space between two adjacent connecting ribs is Form the air duct. 4. The fully-sealed and reinforced chassis with high-efficiency heat dissipation according to claim 2, wherein the several air deflector assemblies include a pair of first air deflector assemblies and a pair of second air deflector assemblies; The electronic equipment board includes several first electronic equipment boards and several second electronic equipment boards, the first electronic equipment board includes a first heat dissipation source, and the second electronic equipment board includes a second heat dissipation source, The heat generated by the first heat dissipation source is greater than the heat generated by the second heat dissipation source; The side surface of the first electronic equipment board is connected to the first air deflector assembly through a thermally conductive insulating pad, and the respective end faces of the first electronic equipment board and the second electronic equipment board are connected to each other through locking strips. The second wind deflector assembly is connected. 5. The fully-sealed and reinforced chassis with high-efficiency heat dissipation according to claim 4, wherein the heat-conducting insulating pad has characteristics of high flexibility and low thermal resistance. 6. The fully sealed and reinforced chassis with high-efficiency heat dissipation according to claim 4, wherein the box-shaped main body further includes a fan hatch cover and a connector cover; A pair of the first air deflector assembly, a pair of the second air deflector assembly, the fan compartment cover and the connector cover are assembled and connected by screws to form the box-shaped main body. 7 . The fully sealed and reinforced chassis with efficient heat dissipation according to claim 6 , wherein the fan compartment cover is provided with an air inlet, and the connector cover is provided with an opening opposite to the air outlet of the air duct. 8. The fully-sealed and reinforced chassis with high-efficiency heat dissipation according to claim 6, wherein a pair of the first air deflector assembly, a pair of the second air deflector assembly, the fan compartment cover and Joints of the connector covers are provided with notches and sealing strips. 9. The fully sealed and reinforced chassis with high-efficiency heat dissipation according to claim 1, characterized in that, the inner and outer surfaces of the box-shaped main body are provided with a blackened layer formed by a blackening process.

Images