CN116026479A - Data processing method and device suitable for infrared temperature measurement system - Google Patents
Data processing method and device suitable for infrared temperature measurement system Download PDFInfo
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- 238000009529 body temperature measurement Methods 0.000 title claims abstract description 34
- 238000003672 processing method Methods 0.000 title claims abstract description 15
- 238000012544 monitoring process Methods 0.000 claims abstract description 149
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 41
- 229910002804 graphite Inorganic materials 0.000 claims description 41
- 239000010439 graphite Substances 0.000 claims description 41
- 238000001931 thermography Methods 0.000 claims description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 35
- 229910052802 copper Inorganic materials 0.000 claims description 35
- 239000010949 copper Substances 0.000 claims description 35
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- 238000004861 thermometry Methods 0.000 claims description 10
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- 238000005516 engineering process Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
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- 238000013528 artificial neural network Methods 0.000 description 1
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- 238000004364 calculation method Methods 0.000 description 1
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Abstract
The application provides a data processing method and device suitable for an infrared temperature measurement system. According to the method, real-time temperatures of all positions to be measured in the high-voltage cabinet are obtained through all infrared sensors, all the infrared sensors generate monitoring data according to the obtained real-time temperatures and upload the monitoring data to the controller, so that the controller generates a monitoring data set according to the monitoring data uploaded by all the infrared sensors, and the temperature state of all the positions to be measured is determined according to a preset temperature monitoring model and the monitoring data set, so that the temperature state of all the positions to be measured is sent to an upper computer through the controller, corresponding temperature characterization elements are displayed at all the positions to be measured of a high-voltage cabinet model of a graphical interface of the upper computer, and accurate monitoring and visual display of the real-time temperatures of all the positions to be measured in the high-voltage cabinet are achieved.
Description
Technical Field
The present disclosure relates to data processing technologies, and in particular, to a data processing method and apparatus suitable for an infrared temperature measurement system.
Background
With the rapid development of high-voltage transmission technology in China, the number of high-voltage cabinets used in power supply offices and power substations is increased, and the automatic safety monitoring of the high-voltage cabinets is also becoming urgent.
The existing temperature measuring devices in the high-voltage cabinets are all wired devices, the sensors are arranged on two sides of the cabinet body and can only measure the room temperature of the cabinet body, and the copper bar bus-bar chamber of the high-voltage cabinets is normally airtight because of high voltage, and the bus-bar chamber cannot be opened and checked at will during normal operation.
It can be seen how a method for precisely measuring the temperature inside a high-voltage cabinet is needed.
Disclosure of Invention
The application provides a data processing method and device suitable for an infrared temperature measurement system, which are used for accurately measuring the temperature inside a high-voltage cabinet.
In a first aspect, the present application provides a data processing method applicable to an infrared temperature measurement system, where the data processing method is applied to the infrared temperature measurement system, and the infrared temperature measurement system includes: the infrared sensor cluster comprises a plurality of infrared sensors, wherein the infrared sensors are used for measuring real-time temperature of temperature positions to be measured in the high-voltage cabinet, the controllers are respectively connected with the infrared sensors in the infrared sensor cluster, and the controllers are connected with the upper computer, and the method comprises the following steps of:
Acquiring real-time temperature of each position to be measured in the high-voltage cabinet through each infrared sensor, wherein each position to be measured at least corresponds to one infrared sensor;
each infrared sensor generates monitoring data according to the acquired real-time temperature and uploads the monitoring data to the controller, wherein the monitoring data comprises the real-time temperature and position information, and each infrared sensor corresponds to unique position information;
the controller generates a monitoring data set according to the monitoring data uploaded by each infrared sensor, and determines the temperature state of each position to be measured according to a preset temperature monitoring model and the monitoring data set, wherein the temperature state is used for representing the deviation degree of the real-time temperature and the safe working temperature of the corresponding position to be measured;
the controller sends the temperature state of each temperature position to be detected to the upper computer so as to display corresponding temperature characterization elements at each temperature position to be detected of the high-voltage cabinet model of the graphical interface of the upper computer, wherein the temperature characterization elements correspond to the temperature state.
Optionally, the infrared temperature measurement system further includes: the ammeter is used for measuring a real-time current value of the input end of the high-voltage cabinet; correspondingly, the determining the temperature state of each position to be measured according to the preset temperature monitoring model and the monitoring data set includes:
acquiring the real-time current value of each time node in a first preset time length, and determining a first average current value corresponding to the preset time length, wherein the first preset time length is the time length from a first time point to a current time point;
determining a temperature monitoring table according to the first average current value and a preset calibration database, wherein the preset calibration database is used for establishing a mapping relation between each average current value interval and each temperature monitoring table, and the temperature monitoring table is used for establishing a mapping relation between each position to be measured and a preset normal working temperature interval;
determining the temperature state of each position to be measured according to the temperature monitoring table and the real-time temperature, wherein if the real-time temperature is in the working temperature interval, the temperature state is a normal temperature state; and if the real-time temperature is greater than the upper limit value of the working temperature interval, the temperature state is an abnormal temperature state.
Optionally, the determining the temperature state of each position to be measured according to the temperature monitoring table and the real-time temperature includes:
acquiring the real-time current values of all time nodes in a second preset time period, and determining a second average current value corresponding to the preset time period, wherein the second preset time period is the time period from a second time point to the first time point;
determining a weighting parameter according to the second average current value and a preset weighting parameter corresponding table, wherein the preset weighting parameter corresponding table is used for establishing a mapping relation between each average current value interval and the weighting parameter, and the weighting parameter and the upper limit value of each average current value interval are positively correlated;
determining a change temperature monitoring table according to the temperature monitoring table and the weighting parameters, wherein the change temperature monitoring table is used for establishing a mapping relation between each position to be measured and a weighted working temperature interval, and the weighted working temperature interval is determined according to the preset normal working temperature interval and the weighting parameters;
determining the temperature state of each position to be measured according to the change temperature monitoring table and the real-time temperature, wherein if the real-time temperature is in the weighted working temperature interval, the temperature state is a normal temperature state; and if the real-time temperature is greater than the upper limit value of the weighted working temperature interval, the temperature state is an abnormal temperature state.
Optionally, the temperature to be detected is a copper bar overlapping position in the high-voltage cabinet, and the copper bar overlapping position is a position where at least two copper bars are overlapped through screws; correspondingly, after displaying the corresponding temperature characterization elements at the temperature positions to be detected of the high-voltage cabinet model of the graphical interface of the upper computer, the method further comprises:
displaying corresponding real-time temperatures at the temperature positions to be detected of the high-voltage cabinet model of the graphical interface;
if the real-time temperature exceeds the preset alarm temperature, generating an alarm signal, wherein the alarm signal is used for prompting the inspection of loops where all copper bars are overlapped at the corresponding temperature to be detected;
if the real-time temperature exceeds the preset breaking temperature, a breaking signal is generated, and the breaking signal is used for cutting off loops where all copper bars are located, which are overlapped at the corresponding temperature positions to be detected.
Optionally, after the generating the alarm signal or the generating the disconnection signal, the method further includes:
the controller records the loop numbers of loops where all copper bars are located, which are overlapped at the corresponding temperature positions to be detected, so as to generate a historical fault record table, wherein the loop numbers of all loops, the fault types and the fault occurrence time are recorded in the historical fault record;
The controller uploads the historical fault record table to the upper computer so as to be stored in the upper computer;
and responding to an overhaul instruction acted on the upper computer, displaying a priority overhaul list by the upper computer, wherein the priority overhaul list is used for showing that the historical fault record list records the loop numbers of the fault loops in a preset period, and the loop numbers in the priority overhaul list are ordered according to the fault times of the corresponding loops in the preset period.
Optionally, a graphite identification layer is arranged on an end face of each screw, far from the thread, of the nut, each graphite identification layer comprises a base body part and an identification part, the identification part is at least one concave part or convex part arranged in the circumferential direction of the base body part, and the characteristics of the identification parts are used for representing the screw number of the screw corresponding to the graphite identification layer; the infrared temperature measurement system further comprises: the thermal infrared imager is connected with the controller;
correspondingly, before the generating of the open circuit signal, the method further comprises:
acquiring an infrared thermal imaging image of the high-voltage cabinet through the infrared thermal imager, extracting thermal imaging ranges of all graphite identification layers in the infrared thermal imaging image according to a preset graphic feature extraction model, and determining screw numbers corresponding to outline features of all the thermal imaging ranges;
Determining the temperature deviation of each position to be measured according to the following formula
The formula is as follows:
determining the temperature deviation
Less than or equal to a preset deviation threshold.
Optionally, the extracting the thermal imaging range of each graphite identification layer in the infrared thermal imaging image according to the preset graphic feature extraction model includes:
establishing a feature training set according to the outer contour features of the graphite identification layers on all screws in the high-voltage cabinet and corresponding screw numbers;
and training the model to be trained established based on the MobileNetV2 by utilizing the feature training set so as to generate the preset graphic feature extraction model.
In a second aspect, the present application provides a data processing apparatus adapted for use in an infrared thermometry system, comprising: the system comprises an infrared sensor cluster, a controller and an upper computer, wherein the infrared sensor cluster comprises a plurality of infrared sensors, the infrared sensors are used for measuring real-time temperature of a temperature position to be measured in a high-voltage cabinet, the controller is respectively connected with each infrared sensor in the infrared sensor cluster, and the controller is connected with the upper computer;
Acquiring real-time temperature of each position to be measured in the high-voltage cabinet through each infrared sensor, wherein each position to be measured at least corresponds to one infrared sensor;
each infrared sensor generates monitoring data according to the acquired real-time temperature and uploads the monitoring data to the controller, wherein the monitoring data comprises the real-time temperature and position information, and each infrared sensor corresponds to unique position information;
the controller generates a monitoring data set according to the monitoring data uploaded by each infrared sensor, and determines the temperature state of each position to be measured according to a preset temperature monitoring model and the monitoring data set, wherein the temperature state is used for representing the deviation degree of the real-time temperature and the safe working temperature of the corresponding position to be measured;
the controller sends the temperature state of each temperature position to be detected to the upper computer so as to display corresponding temperature characterization elements at each temperature position to be detected of the high-voltage cabinet model of the graphical interface of the upper computer, wherein the temperature characterization elements correspond to the temperature state.
Optionally, the infrared temperature measurement system further includes: the ammeter is used for measuring a real-time current value of the input end of the high-voltage cabinet;
the ammeter is used for acquiring the real-time current values of all time nodes in a first preset time length and determining a first average current value corresponding to the preset time length, wherein the first preset time length is the time length from a first time point to a current time point;
the controller is used for determining a temperature monitoring table according to the first average current value and a preset calibration database, the preset calibration database is used for establishing a mapping relation between each average current value interval and each temperature monitoring table, and the temperature monitoring table is used for establishing a mapping relation between each position to be measured and a preset normal working temperature interval;
the controller is used for determining the temperature state of each position to be measured according to the temperature monitoring table and the real-time temperature, wherein if the real-time temperature is in the working temperature interval, the temperature state is a normal temperature state; and if the real-time temperature is greater than the upper limit value of the working temperature interval, the temperature state is an abnormal temperature state.
Optionally, the ammeter is configured to obtain the real-time current values of each time node in a second preset duration, and determine a second average current value corresponding to the preset duration, where the second preset duration is a duration from a second time point to the first time point;
the controller is configured to determine a weighting parameter according to the second average current value and a preset weighting parameter correspondence table, where the preset weighting parameter correspondence table is used to establish a mapping relationship between each average current value interval and the weighting parameter, and the weighting parameter and an upper limit value of each average current value interval are positively correlated;
the controller is used for determining a change temperature monitoring table according to the temperature monitoring table and the weighting parameters, the change temperature monitoring table is used for establishing a mapping relation between each position to be measured and a weighted working temperature interval, and the weighted working temperature interval is determined according to the preset normal working temperature interval and the weighting parameters;
the controller is configured to determine a temperature state of each position to be measured according to the change temperature monitoring table and the real-time temperature, where if the real-time temperature is within the weighted working temperature interval, the temperature state is a normal temperature state; and if the real-time temperature is greater than the upper limit value of the weighted working temperature interval, the temperature state is an abnormal temperature state.
Optionally, the temperature to be detected is a copper bar overlapping position in the high-voltage cabinet, and the copper bar overlapping position is a position where at least two copper bars are overlapped through screws;
the upper computer is used for displaying corresponding real-time temperatures at the temperature positions to be detected of the high-voltage cabinet model of the graphical interface;
if the real-time temperature exceeds the preset alarm temperature, generating an alarm signal, wherein the alarm signal is used for prompting the inspection of loops where all copper bars are overlapped at the corresponding temperature to be detected;
if the real-time temperature exceeds the preset breaking temperature, a breaking signal is generated, and the breaking signal is used for cutting off loops where all copper bars are located, which are overlapped at the corresponding temperature positions to be detected.
Optionally, the controller records the loop numbers of loops where all copper bars are located, which are overlapped at the corresponding temperature positions to be detected, so as to generate a history fault record table, wherein the loop numbers of each loop, the fault types and the fault occurrence time are recorded in the history fault record;
the controller uploads the historical fault record table to the upper computer so as to be stored in the upper computer;
And responding to an overhaul instruction acted on the upper computer, displaying a priority overhaul list by the upper computer, wherein the priority overhaul list is used for showing that the historical fault record list records the loop numbers of the fault loops in a preset period, and the loop numbers in the priority overhaul list are ordered according to the fault times of the corresponding loops in the preset period.
Optionally, a graphite identification layer is arranged on an end face of each screw, far from the thread, of the nut, each graphite identification layer comprises a base body part and an identification part, the identification part is at least one concave part or convex part arranged in the circumferential direction of the base body part, and the characteristics of the identification parts are used for representing the screw number of the screw corresponding to the graphite identification layer; the infrared temperature measurement system further comprises: the thermal infrared imager is connected with the controller;
acquiring an infrared thermal imaging image of the high-voltage cabinet through the infrared thermal imager, extracting thermal imaging ranges of all graphite identification layers in the infrared thermal imaging image according to a preset graphic feature extraction model, and determining screw numbers corresponding to outline features of all the thermal imaging ranges;
Determining the temperature deviation of each position to be measured according to the following formula
The formula is as follows:
wherein,,
for the real-time temperature corresponding to the temperature position to be measured,/->
The average temperature value corresponding to the thermal imaging range of the graphite identification layer of the screw end face at the position to be measured is obtained;
determining the temperature deviation
Less than or equal to a preset deviation threshold.
Optionally, the controller is configured to establish a feature training set according to the outer contour features of the graphite identification layer on each screw in the high-voltage cabinet and the corresponding screw number;
and the controller is used for training the model to be trained established based on the MobileNetV2 by utilizing the characteristic training set so as to generate the preset graphic characteristic extraction model.
In a third aspect, the present application provides an electronic device, comprising:
a processor; the method comprises the steps of,
a memory for storing executable instructions of the processor;
wherein the processor is configured to perform any one of the possible methods described in the first aspect via execution of the executable instructions.
In a fourth aspect, the present application provides a computer-readable storage medium having stored therein computer-executable instructions which, when executed by a processor, are adapted to carry out any one of the possible methods described in the first aspect.
According to the data processing method and device suitable for the infrared temperature measurement system, the real-time temperature of each position to be measured in the high-voltage cabinet is obtained through each infrared sensor, each infrared sensor generates monitoring data according to the obtained real-time temperature and uploads the monitoring data to the controller, so that the controller generates a monitoring data set according to the monitoring data uploaded by each infrared sensor, and the temperature state of each position to be measured is determined according to the preset temperature monitoring model and the monitoring data set, so that the temperature state of each position to be measured is sent to the upper computer through the controller, and corresponding temperature characterization elements are displayed at each position to be measured of the high-voltage cabinet model of the graphical interface of the upper computer. Therefore, accurate monitoring of real-time temperature of each position to be measured in the high-voltage cabinet can be realized by utilizing point-to-point temperature measurement of the infrared sensor, and the monitored real-time temperature is displayed in a graphical interface of an upper computer after data processing, so that visual display of temperature states of each position to be measured in the high-voltage cabinet is realized.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
FIG. 1 is a flow chart of a data processing method for an infrared thermometry system according to an exemplary embodiment of the present application;
FIG. 2 is a flow chart of a data processing method for an infrared thermometry system according to another exemplary embodiment of the present application;
FIG. 3 is a schematic view of the structure of the graphite marking layer in the embodiment shown in FIG. 2;
FIG. 4 is a schematic diagram of a data processing apparatus suitable for use in an infrared thermometry system according to an exemplary embodiment of the present application;
fig. 5 is a schematic structural diagram of an electronic device according to an example embodiment of the present application.
Specific embodiments thereof have been shown by way of example in the drawings and will herein be described in more detail. These drawings and the written description are not intended to limit the scope of the inventive concepts in any way, but to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments.
Detailed Description
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present application as detailed in the accompanying claims.
FIG. 1 is a flow chart of a data processing method for an infrared thermometry system according to an exemplary embodiment of the present application. As shown in fig. 1, the method provided in this embodiment includes:
s101, acquiring real-time temperature of each temperature-measuring position in the high-voltage cabinet through each infrared sensor, wherein each temperature-measuring position at least corresponds to one infrared sensor.
In this embodiment, the applied infrared temperature measurement system includes: the infrared sensor cluster comprises a plurality of infrared sensors, wherein the infrared sensors are used for measuring real-time temperature of temperature positions to be measured in the high-voltage cabinet, the controllers are respectively connected with the infrared sensors in the infrared sensor cluster, and the controllers are connected with the upper computer.
In this step, the real-time temperature of each position to be measured in the high-voltage cabinet may be obtained through each infrared sensor, where each position to be measured corresponds to at least one infrared sensor.
Specifically, can directly fix infrared sensor on the high-voltage board inner support, as long as aim at a certain temperature measurement position with infrared temperature measurement hole, just can measure the actual temperature of this point, need not pass through air conduction, even more need not with copper bar direct contact.
S102, each infrared sensor generates monitoring data according to the acquired real-time temperature, and the monitoring data are uploaded to the controller.
Each infrared sensor generates monitoring data according to the acquired real-time temperature and uploads the monitoring data to the controller, wherein the monitoring data comprises the real-time temperature and position information, and each infrared sensor corresponds to the unique position information. For example, 6 infrared sensors can be installed on a serial bus, and can be connected with a programmable controller in an RS485 communication way.
And S103, the controller generates a monitoring data set according to the monitoring data uploaded by each infrared sensor, and determines the temperature state of each position to be measured according to a preset temperature monitoring model and the monitoring data set.
In this step, the controller may generate a monitoring data set according to the monitoring data uploaded by each infrared sensor, and determine a temperature state of each position to be measured according to the preset temperature monitoring model and the monitoring data set, where the temperature state is used to characterize a deviation degree of the real-time temperature corresponding to the position to be measured from the safe working temperature. For example, when the deviation between the real-time temperature of the temperature to be measured and the safe working temperature is large, the corresponding temperature to be measured is displayed as a red area, and when the deviation between the real-time temperature of the temperature to be measured and the safe working temperature is small, the corresponding temperature to be measured is displayed as a green area, so that the temperature states of the temperature to be measured are intuitively displayed.
Optionally, the infrared temperature measurement system may further include: an ammeter. The ammeter is used for measuring a real-time current value of the input end of the high-voltage cabinet; correspondingly, determining the temperature state of each position to be measured according to the preset temperature monitoring model and the monitoring data set, including: acquiring real-time current values of all time nodes in a first preset time period, and determining a first average current value corresponding to the preset time period, wherein the first preset time period is the time period from a first time point to a current time point. Determining a temperature monitoring table according to the first average current value and a preset calibration database, wherein the preset calibration database is used for establishing a mapping relation between each average current value interval and each temperature monitoring table, and the temperature monitoring table is used for establishing a mapping relation between each position to be measured and a preset normal working temperature interval. Determining the temperature state of each position to be measured according to the temperature monitoring table and the real-time temperature, wherein if the real-time temperature is in a working temperature interval, the temperature state is a normal temperature state; if the real-time temperature is greater than the upper limit value of the working temperature interval, the temperature state is an abnormal temperature state. The method comprises the steps of determining a first average current value corresponding to a preset duration by combining a real-time current value, determining a corresponding temperature monitoring table by the first average current value, and determining the temperature state of each position to be measured by the temperature monitoring table, wherein the temperature monitoring table is changed according to the change of the first average current value corresponding to the preset duration, so that accurate judgment of the temperature state of each position to be measured under various different working currents is adapted.
In addition, the determining the temperature state of each position to be measured according to the temperature monitoring table and the real-time temperature may include: acquiring real-time current values of all time nodes in a second preset time period, and determining a second average current value corresponding to the preset time period, wherein the second preset time period is the time period from the second time point to the first time point. And determining a weighting parameter according to the second average current value and a preset weighting parameter corresponding table, wherein the preset weighting parameter corresponding table is used for establishing a mapping relation between each average current value interval and the weighting parameter, and the weighting parameter and the upper limit value of each average current value interval are positively correlated. And determining a change temperature monitoring table according to the temperature monitoring table and the weighting parameters, wherein the change temperature monitoring table is used for establishing a mapping relation between each position to be measured and a weighted working temperature interval, and the weighted working temperature interval is determined according to a preset normal working temperature interval and the weighting parameters. Determining the temperature state of each position to be measured according to the changed temperature monitoring table and the real-time temperature, wherein if the real-time temperature is in the weighted working temperature interval, the temperature state is a normal temperature state; if the real-time temperature is greater than the upper limit value of the weighted working temperature interval, the temperature state is an abnormal temperature state. And determining a second average current value corresponding to a second preset duration, wherein a second time point corresponding to the second preset duration is earlier than a first time point corresponding to the first preset duration, so that the influence of the current state of the previous duration on the real-time temperature of the latter duration is comprehensively considered, and the accurate judgment of the temperature state of each position to be measured under various different working currents is dynamically adapted.
And S104, the controller sends the temperature state of each position to be measured to the upper computer so as to display the corresponding temperature characterization element at each position to be measured of the high-voltage cabinet model of the graphical interface of the upper computer.
The controller sends the temperature state of each position to be measured to the upper computer so as to display corresponding temperature characterization elements at each position to be measured of the high-voltage cabinet model of the graphical interface of the upper computer, wherein the temperature characterization elements correspond to the temperature states.
In this embodiment, the real-time temperature of each position to be measured in the high-voltage cabinet is obtained through each infrared sensor, each infrared sensor generates monitoring data according to the obtained real-time temperature, and the monitoring data are uploaded to the controller, so that the controller generates a monitoring data set according to the monitoring data uploaded by each infrared sensor, and the temperature state of each position to be measured is determined according to a preset temperature monitoring model and the monitoring data set, so that the temperature state of each position to be measured is sent to the upper computer through the controller, and corresponding temperature characterization elements are displayed at each position to be measured of the high-voltage cabinet model of the graphical interface of the upper computer. Therefore, accurate monitoring of real-time temperature of each position to be measured in the high-voltage cabinet can be realized by utilizing point-to-point temperature measurement of the infrared sensor, and the monitored real-time temperature is displayed in a graphical interface of an upper computer after data processing, so that visual display of temperature states of each position to be measured in the high-voltage cabinet is realized.
FIG. 2 is a flow chart of a data processing method for an infrared thermometry system according to another exemplary embodiment of the present application;
s201, acquiring real-time temperature of each temperature-measuring position in the high-voltage cabinet through each infrared sensor, wherein each temperature-measuring position at least corresponds to one infrared sensor.
In this embodiment, the applied infrared temperature measurement system includes: the infrared sensor cluster comprises a plurality of infrared sensors, wherein the infrared sensors are used for measuring real-time temperature of temperature positions to be measured in the high-voltage cabinet, the controllers are respectively connected with the infrared sensors in the infrared sensor cluster, and the controllers are connected with the upper computer.
In this step, the real-time temperature of each position to be measured in the high-voltage cabinet may be obtained through each infrared sensor, where each position to be measured corresponds to at least one infrared sensor.
Specifically, can directly fix infrared sensor on the high-voltage board inner support, as long as aim at a certain temperature measurement position with infrared temperature measurement hole, just can measure the actual temperature of this point, need not pass through air conduction, even more need not with copper bar direct contact.
S202, each infrared sensor generates monitoring data according to the acquired real-time temperature, and the monitoring data are uploaded to the controller.
Each infrared sensor generates monitoring data according to the acquired real-time temperature and uploads the monitoring data to the controller, wherein the monitoring data comprises the real-time temperature and position information, and each infrared sensor corresponds to the unique position information. For example, 6 infrared sensors can be installed on a serial bus, and can be connected with a programmable controller in an RS485 communication way.
S203, the controller generates a monitoring data set according to the monitoring data uploaded by each infrared sensor, and determines the temperature state of each position to be measured according to a preset temperature monitoring model and the monitoring data set
In this step, the controller may generate a monitoring data set according to the monitoring data uploaded by each infrared sensor, and determine a temperature state of each position to be measured according to the preset temperature monitoring model and the monitoring data set, where the temperature state is used to characterize a deviation degree of the real-time temperature corresponding to the position to be measured from the safe working temperature. For example, when the deviation between the real-time temperature of the temperature to be measured and the safe working temperature is large, the corresponding temperature to be measured is displayed as a red area, and when the deviation between the real-time temperature of the temperature to be measured and the safe working temperature is small, the corresponding temperature to be measured is displayed as a green area, so that the temperature states of the temperature to be measured are intuitively displayed.
Optionally, the infrared temperature measurement system may further include: an ammeter. The ammeter is used for measuring a real-time current value of the input end of the high-voltage cabinet; correspondingly, determining the temperature state of each position to be measured according to the preset temperature monitoring model and the monitoring data set, including: acquiring real-time current values of all time nodes in a first preset time period, and determining a first average current value corresponding to the preset time period, wherein the first preset time period is the time period from a first time point to a current time point. Determining a temperature monitoring table according to the first average current value and a preset calibration database, wherein the preset calibration database is used for establishing a mapping relation between each average current value interval and each temperature monitoring table, and the temperature monitoring table is used for establishing a mapping relation between each position to be measured and a preset normal working temperature interval. Determining the temperature state of each position to be measured according to the temperature monitoring table and the real-time temperature, wherein if the real-time temperature is in a working temperature interval, the temperature state is a normal temperature state; if the real-time temperature is greater than the upper limit value of the working temperature interval, the temperature state is an abnormal temperature state. The method comprises the steps of determining a first average current value corresponding to a preset duration by combining a real-time current value, determining a corresponding temperature monitoring table by the first average current value, and determining the temperature state of each position to be measured by the temperature monitoring table, wherein the temperature monitoring table is changed according to the change of the first average current value corresponding to the preset duration, so that accurate judgment of the temperature state of each position to be measured under various different working currents is adapted.
In addition, the determining the temperature state of each position to be measured according to the temperature monitoring table and the real-time temperature may include: acquiring real-time current values of all time nodes in a second preset time period, and determining a second average current value corresponding to the preset time period, wherein the second preset time period is the time period from the second time point to the first time point. And determining a weighting parameter according to the second average current value and a preset weighting parameter corresponding table, wherein the preset weighting parameter corresponding table is used for establishing a mapping relation between each average current value interval and the weighting parameter, and the weighting parameter and the upper limit value of each average current value interval are positively correlated. And determining a change temperature monitoring table according to the temperature monitoring table and the weighting parameters, wherein the change temperature monitoring table is used for establishing a mapping relation between each position to be measured and a weighted working temperature interval, and the weighted working temperature interval is determined according to a preset normal working temperature interval and the weighting parameters. Determining the temperature state of each position to be measured according to the changed temperature monitoring table and the real-time temperature, wherein if the real-time temperature is in the weighted working temperature interval, the temperature state is a normal temperature state; if the real-time temperature is greater than the upper limit value of the weighted working temperature interval, the temperature state is an abnormal temperature state. And determining a second average current value corresponding to a second preset duration, wherein a second time point corresponding to the second preset duration is earlier than a first time point corresponding to the first preset duration, so that the influence of the current state of the previous duration on the real-time temperature of the latter duration is comprehensively considered, and the accurate judgment of the temperature state of each position to be measured under various different working currents is dynamically adapted.
S204, the controller sends the temperature state of each position to be measured to the upper computer so as to display the corresponding temperature characterization element at each position to be measured of the high-voltage cabinet model of the graphical interface of the upper computer
The controller sends the temperature state of each position to be measured to the upper computer so as to display corresponding temperature characterization elements at each position to be measured of the high-voltage cabinet model of the graphical interface of the upper computer, wherein the temperature characterization elements correspond to the temperature states.
S205, displaying corresponding real-time temperatures at each temperature to be detected position of the high-voltage cabinet model of the graphical interface.
Because the copper bar and the screw overlap joint of the copper bar are easy to generate heat and various accidents caused by the heat, the position to be measured can be the copper bar overlap joint position in the high-voltage cabinet, and the copper bar overlap joint position is the position where at least two copper bars are overlapped through the screws. Correspondingly, after displaying the corresponding temperature characterization elements at each temperature to be detected position of the high-voltage cabinet model of the graphical interface of the upper computer, the method further comprises the steps of: and displaying corresponding real-time temperatures at each temperature position to be detected of the high-voltage cabinet model of the graphical interface. Alternatively, the temperature to be measured may be set only as a screw having a radius larger than a preset size.
S206, if the real-time temperature exceeds the preset alarm temperature, an alarm signal is generated.
If the real-time temperature exceeds the preset alarm temperature, generating an alarm signal which is used for prompting the inspection of loops where all copper bars are located, which are overlapped at the corresponding temperature positions to be detected.
S207, if the real-time temperature exceeds the preset breaking temperature, a breaking signal is generated
If the real-time temperature exceeds the preset breaking temperature, a breaking signal is generated, and the breaking signal is used for cutting off loops where all copper bars are located, which are overlapped at the corresponding temperature positions to be detected.
Specifically, a graphite marking layer is arranged on the end face, far away from the threads, of the nut of each screw. Fig. 3 is a schematic view of the structure of the graphite marking layer in the embodiment shown in fig. 2. As shown in fig. 3, each graphite marking layer includes a base portion and a marking portion, the marking portion being at least one recess or protrusion provided in a circumferential direction of the base portion, and a characteristic of the marking portion being used to characterize a screw number of a screw corresponding to the graphite marking layer. Through setting up different quantity of identification portion and different shape's identification portion on base member portion, establish mapping with the outline of each shape graphite identification layer and screw number, can confirm corresponding screw number through the outline of follow-up discernment graphite identification layer. And the marking layer is made of graphite, so that the overall temperature of the marking layer is uniform, and the marking layer is more obviously distinguished from other elements in the image, and further, the follow-up accurate and rapid identification of each graphite marking layer in an infrared thermal imaging image is improved.
In addition, the infrared temperature measurement system further includes: the thermal infrared imager is connected with the controller. Correspondingly, before the disconnection signal is generated, an infrared thermal imaging image of the high-voltage cabinet can be obtained through an infrared thermal imager, the thermal imaging range of each graphite identification layer in the infrared thermal imaging image is extracted according to a preset graphic feature extraction model, and the corresponding screw number is determined by determining the outline features of each thermal imaging range.
Specifically, the extracting the thermal imaging range of each graphite identification layer in the infrared thermal imaging image according to the preset graphic feature extraction model may include:
establishing a feature training set according to the outer contour features of the graphite identification layers on all screws in the high-voltage cabinet and corresponding screw numbers;
and training the model to be trained established based on the MobileNetV2 by using the feature training set to generate a preset graphic feature extraction model. In this embodiment, since the outer contour features of the graphite identification layers on the screws are fixed, and the neural network only needs to distinguish between different fixed contours, the lightweight model MobileNetV2 can be used for training, and thus, the calculation amount can be reduced when the thermal imaging range of each graphite identification layer is identified. After the thermal imaging range is determined, the thermal imaging range can be compared with the outline features in the feature training set, so that the corresponding screw number is further determined.
Then, determining the temperature deviation of each position to be measured according to the following formula
The formula is:
wherein,,
for the real-time temperature corresponding to the temperature position to be measured, < + >>
The average temperature value corresponding to the thermal imaging range of the graphite identification layer of the screw end face at the position to be measured.
Because infrared sensor sets up in the high-voltage cabinet, and it is in the high-pressure environment for a long time and when inside temperature rises, its operational environment is more abominable, in addition, because the maintenance is usually opened to the high-voltage cabinet not often, consequently also not in time to infrared sensor's later maintenance, consequently, infrared sensor has the possibility that presets before life failure great. In the present embodiment, however, the above formula is combined with the measurement of the external infrared thermal imaging image when determining the temperature deviation
And the power-off signal is sent out when the power-off signal is smaller than or equal to a preset deviation threshold value, so that the false power-off caused by the early failure of the infrared sensor is further avoided.
In addition, on the basis of the above embodiment, the controller may further record the loop numbers of the loops where all the copper bars overlap at the corresponding temperature positions to be tested, so as to generate a history fault record table, where the loop numbers of each loop, the types of faults occurring and the time of occurrence of the faults are recorded. The controller uploads the history fault record table to the upper computer for storage in the upper computer. When responding to the overhaul instruction acted on the upper computer, the upper computer displays a priority overhaul list, wherein the priority overhaul list is used for displaying that the historical fault record list records the loop numbers of the fault loops in a preset period, and the loop numbers in the priority overhaul list are ordered according to the number of faults of the corresponding loop in the preset period.
Fig. 4 is a schematic structural diagram of a data processing apparatus suitable for an infrared temperature measurement system according to an exemplary embodiment of the present application, where the apparatus 300 provided in this embodiment includes:
the infrared sensor cluster comprises a plurality of infrared sensors 330, wherein the infrared sensors 330 are used for measuring the real-time temperature of a temperature position to be measured in the high-voltage cabinet, the controllers 310 are respectively connected with each infrared sensor in the infrared sensor cluster, and the controllers 310 are connected with the upper computer 320;
acquiring real-time temperature of each position to be measured in the high-voltage cabinet through each infrared sensor 330, wherein each position to be measured corresponds to at least one infrared sensor;
each infrared sensor 330 generates monitoring data according to the acquired real-time temperature, and uploads the monitoring data to the controller 310, wherein the monitoring data comprises the real-time temperature and position information, and each infrared sensor 330 corresponds to unique position information;
the controller 310 generates a monitoring data set according to the monitoring data uploaded by each infrared sensor 330, and determines a temperature state of each position to be measured according to a preset temperature monitoring model and the monitoring data set, where the temperature state is used for representing a deviation degree of a real-time temperature corresponding to the position to be measured from a safe working temperature;
The controller 310 sends the temperature state of each temperature position to be measured to the upper computer 320, so as to display a corresponding temperature characterization element at each temperature position to be measured of the high-voltage cabinet model of the graphical interface of the upper computer 320, where the temperature characterization element corresponds to the temperature state.
Optionally, the infrared temperature measurement system further includes: the ammeter 340, the ammeter 340 is used for measuring the real-time current value of the input end of the high-voltage cabinet;
the ammeter 340 is configured to obtain the real-time current values of each time node in a first preset duration, and determine a first average current value corresponding to the preset duration, where the first preset duration is a duration from a first time point to a current time point;
the controller 310 is configured to determine a temperature monitoring table according to the first average current value and a preset calibration database, where the preset calibration database is configured to establish a mapping relationship between each average current value interval and each temperature monitoring table, and the temperature monitoring table is configured to establish a mapping relationship between each position to be measured and a preset normal working temperature interval;
the controller 310 is configured to determine a temperature state of each position to be measured according to the temperature monitoring table and the real-time temperature, where if the real-time temperature is within the working temperature interval, the temperature state is a normal temperature state; and if the real-time temperature is greater than the upper limit value of the working temperature interval, the temperature state is an abnormal temperature state.
Optionally, the ammeter 340 is configured to obtain the real-time current values of each time node within a second preset duration, and determine a second average current value corresponding to the preset duration, where the second preset duration is a duration from a second time point to the first time point;
the controller 310 is configured to determine a weighting parameter according to the second average current value and a preset weighting parameter correspondence table, where the preset weighting parameter correspondence table is used to establish a mapping relationship between each average current value interval and the weighting parameter, and the weighting parameter is positively correlated with an upper limit value of each average current value interval;
the controller 310 is configured to determine a change temperature monitoring table according to the temperature monitoring table and the weighting parameter, where the change temperature monitoring table is configured to establish a mapping relationship between each to-be-measured position and a weighted working temperature interval, and the weighted working temperature interval is determined according to the preset normal working temperature interval and the weighting parameter;
the controller 310 is configured to determine a temperature state of each position to be measured according to the change temperature monitoring table and the real-time temperature, where if the real-time temperature is within the weighted working temperature interval, the temperature state is a normal temperature state; and if the real-time temperature is greater than the upper limit value of the weighted working temperature interval, the temperature state is an abnormal temperature state.
Optionally, the temperature to be detected is a copper bar overlapping position in the high-voltage cabinet, and the copper bar overlapping position is a position where at least two copper bars are overlapped through screws;
the upper computer 320 is configured to display a corresponding real-time temperature at each temperature position to be measured of the high-voltage board model of the graphical interface;
if the real-time temperature exceeds the preset alarm temperature, generating an alarm signal, wherein the alarm signal is used for prompting the inspection of loops where all copper bars are overlapped at the corresponding temperature to be detected;
if the real-time temperature exceeds the preset breaking temperature, a breaking signal is generated, and the breaking signal is used for cutting off loops where all copper bars are located, which are overlapped at the corresponding temperature positions to be detected.
Optionally, the controller 310 records the loop numbers of the loops where all the copper bars overlapped at the corresponding temperature positions to be tested are located, so as to generate a history fault record table, wherein the loop numbers of each loop, the fault types and the fault occurrence time are recorded in the history fault record;
the controller 310 uploads the history fault record table to the upper computer 320 to store in the upper computer 320;
In response to the overhaul instruction applied to the upper computer 320, the upper computer 320 displays a priority overhaul list, where the priority overhaul list is used for displaying that the historical fault record table records the loop numbers of the fault loops in a preset period, and the loop numbers in the priority overhaul list are ordered according to the number of faults of the corresponding loop in the preset period.
Optionally, a graphite identification layer is arranged on an end face of each screw, far from the thread, of the nut, each graphite identification layer comprises a base body part and an identification part, the identification part is at least one concave part or convex part arranged in the circumferential direction of the base body part, and the characteristics of the identification parts are used for representing the screw number of the screw corresponding to the graphite identification layer; the infrared temperature measurement system further comprises: a thermal infrared imager 350 connected to the controller 310;
acquiring an infrared thermal imaging image of the high-voltage cabinet through the infrared thermal imager 350, extracting thermal imaging ranges of all graphite identification layers in the infrared thermal imaging image according to a preset graphic feature extraction model, and determining corresponding screw numbers of outline features of all the thermal imaging ranges;
Determining the temperature deviation of each position to be measured according to the following formula
The formula is as follows:
wherein,,
for the real-time temperature corresponding to the temperature position to be measured,/->
The average temperature value corresponding to the thermal imaging range of the graphite identification layer of the screw end face at the position to be measured is obtained;
determining the temperature deviation
Less than or equal to a preset deviation threshold.
Optionally, the controller 310 is configured to establish a feature training set according to the outer profile features of the graphite identification layer on each screw in the high-voltage cabinet and the corresponding screw number;
the controller 310 is configured to train a model to be trained, which is built based on MobileNetV2, by using the feature training set, so as to generate the preset graphic feature extraction model.
Fig. 5 is a schematic structural diagram of an electronic device according to an example embodiment of the present application. As shown in fig. 5, an electronic device 400 provided in this embodiment includes: a processor 401 and a memory 402; wherein:
a memory 402 for storing a computer program, which memory may also be a flash memory.
A processor 401 for executing the execution instructions stored in the memory to implement the steps in the above method. Reference may be made in particular to the description of the embodiments of the method described above.
Alternatively, the memory 402 may be separate or integrated with the processor 401.
When the memory 402 is a device separate from the processor 401, the electronic apparatus 400 may further include:
a bus 403 for connecting the memory 402 and the processor 401.
The present embodiment also provides a readable storage medium having a computer program stored therein, which when executed by at least one processor of an electronic device, performs the methods provided by the various embodiments described above.
The present embodiment also provides a program product comprising a computer program stored in a readable storage medium. The computer program may be read from a readable storage medium by at least one processor of an electronic device, and executed by the at least one processor, causes the electronic device to implement the methods provided by the various embodiments described above.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It is to be understood that the present application is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (10)
1. The data processing method suitable for the infrared temperature measurement system is characterized by being applied to the infrared temperature measurement system, and the infrared temperature measurement system comprises the following steps: the infrared sensor cluster comprises a plurality of infrared sensors, wherein the infrared sensors are used for measuring real-time temperature of temperature positions to be measured in the high-voltage cabinet, the controllers are respectively connected with the infrared sensors in the infrared sensor cluster, and the controllers are connected with the upper computer, and the method comprises the following steps of:
acquiring real-time temperature of each position to be measured in the high-voltage cabinet through each infrared sensor, wherein each position to be measured at least corresponds to one infrared sensor;
each infrared sensor generates monitoring data according to the acquired real-time temperature and uploads the monitoring data to the controller, wherein the monitoring data comprises the real-time temperature and position information, and each infrared sensor corresponds to unique position information;
The controller generates a monitoring data set according to the monitoring data uploaded by each infrared sensor, and determines the temperature state of each position to be measured according to a preset temperature monitoring model and the monitoring data set, wherein the temperature state is used for representing the deviation degree of the real-time temperature and the safe working temperature of the corresponding position to be measured;
the controller sends the temperature state of each temperature position to be detected to the upper computer so as to display corresponding temperature characterization elements at each temperature position to be detected of the high-voltage cabinet model of the graphical interface of the upper computer, wherein the temperature characterization elements correspond to the temperature state.
2. The method of claim 1, wherein the infrared thermometry system further comprises: the ammeter is used for measuring a real-time current value of the input end of the high-voltage cabinet; correspondingly, the determining the temperature state of each position to be measured according to the preset temperature monitoring model and the monitoring data set includes:
acquiring the real-time current value of each time node in a first preset time length, and determining a first average current value corresponding to the preset time length, wherein the first preset time length is the time length from a first time point to a current time point;
Determining a temperature monitoring table according to the first average current value and a preset calibration database, wherein the preset calibration database is used for establishing a mapping relation between each average current value interval and each temperature monitoring table, and the temperature monitoring table is used for establishing a mapping relation between each position to be measured and a preset normal working temperature interval;
determining the temperature state of each position to be measured according to the temperature monitoring table and the real-time temperature, wherein if the real-time temperature is in the working temperature interval, the temperature state is a normal temperature state; and if the real-time temperature is greater than the upper limit value of the working temperature interval, the temperature state is an abnormal temperature state.
3. The method for processing data applicable to an infrared temperature measurement system according to claim 2, wherein determining the temperature state of each of the locations to be measured according to the temperature monitoring table and the real-time temperature comprises:
acquiring the real-time current values of all time nodes in a second preset time period, and determining a second average current value corresponding to the preset time period, wherein the second preset time period is the time period from a second time point to the first time point;
Determining a weighting parameter according to the second average current value and a preset weighting parameter corresponding table, wherein the preset weighting parameter corresponding table is used for establishing a mapping relation between each average current value interval and the weighting parameter, and the weighting parameter and the upper limit value of each average current value interval are positively correlated;
determining a change temperature monitoring table according to the temperature monitoring table and the weighting parameters, wherein the change temperature monitoring table is used for establishing a mapping relation between each position to be measured and a weighted working temperature interval, and the weighted working temperature interval is determined according to the preset normal working temperature interval and the weighting parameters;
determining the temperature state of each position to be measured according to the change temperature monitoring table and the real-time temperature, wherein if the real-time temperature is in the weighted working temperature interval, the temperature state is a normal temperature state; and if the real-time temperature is greater than the upper limit value of the weighted working temperature interval, the temperature state is an abnormal temperature state.
4. The data processing method suitable for an infrared temperature measurement system according to claim 1, wherein the temperature to be measured is a copper bar overlapping position in the high-voltage cabinet, and the copper bar overlapping position is a position where at least two copper bars are overlapped by screws; correspondingly, after displaying the corresponding temperature characterization elements at the temperature positions to be detected of the high-voltage cabinet model of the graphical interface of the upper computer, the method further comprises:
Displaying corresponding real-time temperatures at the temperature positions to be detected of the high-voltage cabinet model of the graphical interface;
if the real-time temperature exceeds the preset alarm temperature, generating an alarm signal, wherein the alarm signal is used for prompting the inspection of loops where all copper bars are overlapped at the corresponding temperature to be detected;
if the real-time temperature exceeds the preset breaking temperature, a breaking signal is generated, and the breaking signal is used for cutting off loops where all copper bars are located, which are overlapped at the corresponding temperature positions to be detected.
5. The method for processing data suitable for use in an infrared thermometry system of claim 4, further comprising, after said generating an alarm signal or said generating a shutdown signal:
the controller records the loop numbers of loops where all copper bars are located, which are overlapped at the corresponding temperature positions to be detected, so as to generate a historical fault record table, wherein the loop numbers of all loops, the fault types and the fault occurrence time are recorded in the historical fault record;
the controller uploads the historical fault record table to the upper computer so as to be stored in the upper computer;
And responding to an overhaul instruction acted on the upper computer, displaying a priority overhaul list by the upper computer, wherein the priority overhaul list is used for showing that the historical fault record list records the loop numbers of the fault loops in a preset period, and the loop numbers in the priority overhaul list are ordered according to the fault times of the corresponding loops in the preset period.
6. The data processing method suitable for the infrared temperature measurement system according to claim 4 or 5, wherein a graphite identification layer is arranged on an end face of a nut of each screw far from a thread, each graphite identification layer comprises a base body part and an identification part, the identification part is at least one concave part or convex part arranged in the circumferential direction of the base body part, and the characteristics of the identification part are used for representing the screw number of the screw corresponding to the graphite identification layer; the infrared temperature measurement system further comprises: the thermal infrared imager is connected with the controller;
correspondingly, before the generating of the open circuit signal, the method further comprises:
acquiring an infrared thermal imaging image of the high-voltage cabinet through the infrared thermal imager, extracting thermal imaging ranges of all graphite identification layers in the infrared thermal imaging image according to a preset graphic feature extraction model, and determining screw numbers corresponding to outline features of all the thermal imaging ranges;
Determining the temperature deviation of each position to be measured according to the following formula
The formula is as follows:
determining the temperature deviation
Less than or equal to a preset deviation threshold.
7. The method for processing data applicable to an infrared thermometry system according to claim 6, wherein the extracting the thermal imaging range of each graphite identification layer in the infrared thermal imaging image according to a preset graphic feature extraction model comprises:
establishing a feature training set according to the outer contour features of the graphite identification layers on all screws in the high-voltage cabinet and corresponding screw numbers;
and training the model to be trained established based on the MobileNetV2 by utilizing the feature training set so as to generate the preset graphic feature extraction model.
8. A data processing apparatus adapted for use with an infrared thermometry system, comprising: the system comprises an infrared sensor cluster, a controller and an upper computer, wherein the infrared sensor cluster comprises a plurality of infrared sensors, the infrared sensors are used for measuring real-time temperature of a temperature position to be measured in a high-voltage cabinet, the controller is respectively connected with each infrared sensor in the infrared sensor cluster, and the controller is connected with the upper computer;
Acquiring real-time temperature of each position to be measured in the high-voltage cabinet through each infrared sensor, wherein each position to be measured at least corresponds to one infrared sensor;
each infrared sensor generates monitoring data according to the acquired real-time temperature and uploads the monitoring data to the controller, wherein the monitoring data comprises the real-time temperature and position information, and each infrared sensor corresponds to unique position information;
the controller generates a monitoring data set according to the monitoring data uploaded by each infrared sensor, and determines the temperature state of each position to be measured according to a preset temperature monitoring model and the monitoring data set, wherein the temperature state is used for representing the deviation degree of the real-time temperature and the safe working temperature of the corresponding position to be measured;
the controller sends the temperature state of each temperature position to be detected to the upper computer so as to display corresponding temperature characterization elements at each temperature position to be detected of the high-voltage cabinet model of the graphical interface of the upper computer, wherein the temperature characterization elements correspond to the temperature state.
9. An electronic device, comprising:
a processor; the method comprises the steps of,
a memory for storing executable instructions of the processor;
wherein the processor is configured to perform the method of any one of claims 1 to 7 via execution of the executable instructions.
10. A computer readable storage medium having stored therein computer executable instructions which when executed by a processor are adapted to carry out the method of any one of claims 1 to 7.
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| CN114812833A (en) * | 2022-03-11 | 2022-07-29 | 国网江苏省电力有限公司南京供电分公司 | Distribution network switch temperature online monitoring and predicting system and method |
| CN115695734A (en) * | 2022-11-04 | 2023-02-03 | 烟台艾睿光电科技有限公司 | Infrared thermal imaging protection monitoring method, device, equipment, system and medium |
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| CN119164494A (en) * | 2024-11-20 | 2024-12-20 | 依米康科技集团股份有限公司 | Data center computer room temperature monitoring method and system |
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