CN116013883A - A chip thermoelectric cooling device - Google Patents

Abstract

The invention discloses a chip thermoelectric cooling device, which comprises a heat conducting plate, wherein a thermoelectric module is arranged above the heat conducting plate, and an upper radiating fin is arranged above the thermoelectric module; a cooling fan is fixedly arranged at the ventilation position of the upper cooling fin through a screw; the thermoelectric module is electrically connected with the cooling fan through a wire, and is externally connected with a power supply and a control switch. The chip thermoelectric cooling device adopts the thermoelectric sheet to supply power to the cooling fan for forced convection cooling, so that the limitation of natural heat conduction can be overcome, the cooling effect can be generated by supplying power to the thermoelectric sheet, the heat dissipation capacity can be increased, the effect of accurate temperature control can be realized by adjusting the input voltage, and the chip thermoelectric cooling device has the characteristics of no noise, flexibility and high reliability.

Description

A chip thermoelectric cooling device

technical field

The invention relates to the technical field of integrated circuit chip heat dissipation, in particular to a chip thermoelectric cooling device.

Background technique

At present, the thermoelectric self-cooling device mainly places the thermoelectric module above the heat source, and the heat dissipation module is arranged above the thermoelectric module and connected to the thermoelectric module. The thermoelectric module absorbs heat from the heat source and converts part of the heat into electrical energy to supply power to the drive element of the heat dissipation module, and Transfer the rest of the heat to the heat dissipation module; thus, on the one hand, the present invention realizes the combination of active heat dissipation and passive heat dissipation, and does not require external power supply during the active heat dissipation process, which reduces the energy consumption of the power generation system for itself, and simplifies The power supply circuit of the cooling system is simplified, which saves construction costs and is easy to maintain; on the other hand, the self-cooling structure can automatically adjust the cooling effect on the heat source according to the working conditions of the heat source to achieve the purpose of efficient heat dissipation.

Existing thermoelectric self-cooling devices usually connect and combine heat sources, thermoelectric modules, and heat dissipation modules in sequence. Since the thermoelectric module forms a large thermal resistance between the heat source and the heat dissipation module, the heat dissipation efficiency is greatly affected. Therefore, the present invention proposes a novel thermoelectric cooling structure scheme, by adding a heat dissipation module between the heat source and the thermoelectric module, and at the same time connecting the thermoelectric module with an external power supply, so as to achieve the purpose of enhancing the heat dissipation of the cooling device.

Contents of the invention

The purpose of the present invention is to provide a chip thermoelectric cooling device, which adopts thermoelectric sheet for forced convection heat dissipation, which can overcome the limitation of natural heat conduction, and at the same time, supplying power to the thermoelectric sheet can produce a cooling effect, increase the heat dissipation capacity, and through the adjustment of the input voltage It can realize the effect of precise temperature control, and has the characteristics of no noise, flexibility and high reliability.

In order to achieve the above object, the present invention provides a chip thermoelectric cooling device, comprising a heat conduction plate, a thermoelectric module is arranged above the heat conduction plate, and an upper cooling fin is installed above the thermoelectric module; the ventilation position of the upper cooling fin is A heat dissipation fan is installed and fixed by screws; the thermoelectric module is electrically connected to the heat dissipation fan through wires, and the thermoelectric module is externally connected with a power supply and a control switch.

Preferably, a lower heat dissipation fin is provided between the heat conduction plate and the thermoelectric module, and the bottom of the heat dissipation fan is fixed to the bottom of the ventilation position of the lower heat dissipation fin by screws.

Preferably, the thermoelectric module includes several pieces of thermoelectric sheets, which are tiled between the upper heat dissipation fins and the lower heat dissipation fins, and completely cover the entire upper surface of the lower heat dissipation fins; each of the thermoelectric sheets Positive and negative terminals are arranged on the outer end surfaces; installation holes are arranged on the left and right sides of the ventilation positions of the lower heat dissipation fins and the upper heat dissipation fins.

Preferably, the covered area of the heat conducting copper plate is larger than that of the heat source chip.

Preferably, the outer side of the cooling fan is a square protective frame with openings at the four corners, and the inner side of the cooling fan is a circular fan blade.

Therefore, the present invention adopts the above-mentioned chip thermoelectric cooling device, and compared with the prior art, the beneficial effects are:

(1) In the present invention, when the power of the chip reaches a certain level, the thermoelectric chip can generate electricity by itself, drive the cooling fan to rotate, enhance air convection, improve the cooling effect, have no noise, be flexible and have high reliability.

(2) When the power of the chip is relatively high, the present invention can actively turn on the power supply to cool the electric heating sheet and supply power to the cooling fan at the same time, and use the thermoelectric sheet for forced convection heat dissipation, which overcomes the limitation of natural heat conduction. At the same time, because the thermoelectric module can The cooling capacity is controlled by adjusting the input voltage, so the precise temperature control of the surface temperature of the chip can be realized in the thermoelectric cooling working mode, so that the chip can maintain a stable temperature under high power to give full play to the performance of the chip.

(3) The present invention embeds cooling fins between the heat source and the thermoelectric module, and can use forced convection to dissipate part of the heat while using the thermoelectric sheet to transfer heat to the hot side of the thermoelectric sheet, thereby achieving the purpose of enhancing thermoelectric cooling.

The technical solutions of the present invention will be described in further detail below with reference to the accompanying drawings and embodiments.

Description of drawings

Fig. 1 is a schematic structural view of Embodiment 1 of the present invention;

Fig. 2 is a schematic structural diagram of Embodiment 2 of the present invention;

Fig. 3 is a schematic side view of the second embodiment of the present invention;

Fig. 4 is a connection diagram of a thermoelectric module according to Embodiment 1 of the present invention;

Fig. 5 is a thermal resistance comparison diagram of a chip thermoelectric cooling device according to the present invention.

reference sign

1. Heat source chip; 2. Heat conduction copper plate; 3. Lower cooling fin; 4. Thermoelectric module; 5. Cooling fan; 6. Upper cooling fin; 7. Power supply; 8. Control switch.

Detailed ways

The technical solutions of the present invention will be further described below through the accompanying drawings and embodiments.

Unless otherwise defined, the technical terms or scientific terms used in the present invention shall have the usual meanings understood by those skilled in the art to which the present invention belongs. "First", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. "Comprising" or "comprising" and similar words mean that the elements or items appearing before the word include the elements or items listed after the word and their equivalents, without excluding other elements or items. Words such as "connected" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "Down", "Left", "Right" and so on are only used to indicate the relative positional relationship. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

Embodiment one

As shown in Figure 1, the present invention provides a chip thermoelectric cooling device, including a heat conduction copper plate 2, the heat conduction copper plate 2 is closely attached to the heat source chip 1, and the coverage area of the heat conduction copper plate 2 is larger than the heat source chip 1, so that the heat source chip 1 emits heat. The heat generated can be quickly transferred out through the heat-conducting copper plate 2.

A thermoelectric module 4 is arranged above the heat-conducting copper plate 2, and the thermoelectric module 4 includes four thermoelectric sheets, which are tiled on the heat-conducting copper plate 2 and completely cover the entire upper surface of the heat-conducting copper plate 2, ensuring that each piece of thermoelectric sheet can be heated evenly and can Fully accept the heat transferred by the heat conduction copper plate 2. An upper cooling fin 6 is installed above the thermoelectric module 4, and mounting holes are arranged on the left and right sides of the ventilation position of the upper cooling fin 6, and a cooling fan 5 is installed and fixed by screws. The outer side of the cooling fan 5 is a square protective frame, and the four corners are provided with openings, and the inside of the cooling fan 5 is a circular fan blade.

The electric heater can generate electricity when the temperature difference between the upper and lower sides reaches a certain value, so each thermoelectric sheet is provided with positive and negative terminals on the outer end surface, and the thermoelectric sheets can be connected in series by wires, and the thermoelectric module 4 and the cooling fan 5 can be connected through the wires at the same time. Electrically connected, when the thermoelectric sheet generates power, it provides electric energy for the cooling fan 5, thereby driving the fan blades to rotate, enhancing air circulation, and improving heat dissipation capacity. The thermoelectric module 4 is also externally connected with a power supply 7 and a control switch 8. When the thermoelectric module 4 is connected to the power supply 7, one side can be cooled and the other side can be heated. With the increase of the power of the heat source chip 1 or when the heat source chip 1 is in an extreme working environment, the thermoelectric module 4 and the cooling fan 5 can be connected to the power supply 7 by operating the control switch 8, so that the thermoelectric module 4 starts the cooling working mode, and at the same time, the heat dissipation The fan 5 rotates.

The thermoelectric module 4 is directly in contact with the heat-conducting copper plate 2, and cools down the heat source chip 1 through active cooling. Through the collected temperature data of the heat source chip 1, the adjustment of the access voltage is automatically controlled, thereby realizing real-time adjustment of the temperature of the thermoelectric module 4. The cooling effect realizes precise temperature control of the heat source chip 1. After many experiments and tests, the temperature error can be controlled within plus or minus 1°C. At the same time, the upper cooling fins 6 dissipate the generated heat quickly under the action of the cooling fan 5 .

Embodiment two

As shown in Figure 2, the present invention provides a chip thermoelectric cooling device, including a heat conduction copper plate 2, the heat conduction copper plate 2 is closely attached to the heat source chip 1, and the coverage area of the heat conduction copper plate 2 is larger than the heat source chip 1, so that the heat source chip 1 emits heat. The heat generated can be quickly transferred out through the heat-conducting copper plate 2.

The lower heat dissipation fin 3 is connected above the heat conduction copper plate 2, and the thermoelectric module 4 is arranged above the lower heat dissipation fin 3. The thermoelectric module 4 includes four thermoelectric sheets, which are tiled on the lower heat dissipation fin 3 and completely cover the entire lower heat dissipation unit. The upper surface of the fins 3 ensures that each thermoelectric sheet can be heated evenly and can fully receive the heat transferred by the lower cooling fins 3 . An upper heat dissipation fin 6 is installed above the thermoelectric module 4, and mounting holes are arranged on the left and right sides of the ventilation positions of the lower heat dissipation fin 3 and the upper heat dissipation fin 6, and a heat dissipation fan 5 is installed and fixed by screws. The outer side of the cooling fan 5 is a square protective frame, and the four corners are provided with openings, and the inside of the cooling fan 5 is a circular fan blade.

The electric heater can generate electricity when the temperature difference between the upper and lower sides reaches a certain value, so each thermoelectric sheet is provided with positive and negative terminals on the outer end surface, and the thermoelectric sheets can be connected in series by wires, and the thermoelectric module 4 and the cooling fan 5 can be connected through the wires at the same time. The electrical connection provides electric energy for the cooling fan 5, thereby driving the fan blades to rotate, enhancing air circulation, and further improving the cooling capacity. The thermoelectric module 4 is also externally connected with a power supply 7 and a control switch 8. When the thermoelectric module 4 is connected to the power supply 7, one side can be cooled and the other side can be heated. With the increase of the power of the heat source chip 1 or when the heat source chip 1 is in an extreme working environment, the thermoelectric module 4 and the cooling fan 5 can turn on the power supply 7 by operating the control switch 8 to start the cooling mode, and the heat source chip 1 passes through the lower cooling fins. 3 and the thermoelectric module 4 cool and dissipate heat, and at the same time, the upper heat dissipation fin 6 dissipates heat for the hot side of the thermoelectric sheet.

The materials used in thermoelectric sheets are mainly semiconductor materials, and the thermal conductivity of semiconductor materials is much smaller than that of metal materials such as copper and aluminum. In the traditional self-cooling method, direct contact between the heat source chip 1 and the thermoelectric module 4 will increase the thermal resistance between the chip and the environment. When the voltage of the thermoelectric module 4 is insufficient to drive the cooling fan 5 , the thermal resistance of the thermoelectric module 4 will reduce the heat dissipation effect of the heat source chip 1 to a certain extent compared with that of natural convection. Even when the heat dissipation fan 5 is activated, the thermal resistance of the thermoelectric module 4 will limit the self-cooling heat dissipation effect compared with natural convection.

In order to reduce the thermal resistance of the thermoelectric module 4, the present invention embeds the lower heat dissipation fins 3 between the heat source chip 1 and the thermoelectric module 4. This method can strengthen natural convection heat dissipation when the heat dissipation fan 5 is not activated, and can be activated when the heat dissipation fan 5 is started. When further improving the heat dissipation capacity of self-cooling. When the heat flow continues to increase, the thermoelectric module 4 can further dissipate heat for the heat source chip 1 through the cooling operation mode. At this time, the heat source chip 1 can not only dissipate heat through the lower cooling fins 3 embedded between the heat source chip 1 and the thermoelectric module 4, but also through the cooling. The thermoelectric effect further dissipates heat, which greatly enhances the heat dissipation capacity of the system. At the same time, the effect of precise temperature control can be achieved by adjusting the input voltage of the thermoelectric module 4, so that the heat dissipation effect is significantly improved compared with the natural convection method.

The following table is the relevant geometric parameters of a chip thermoelectric cooling device of the present invention:

The overall size of a single thermoelectric module is 40×40×3.7mm ³ , the size of the pn semiconductor unit is 1.4×1.4×1.7mm ³ , the thickness of the ceramic substrate is 0.8mm, the thickness of the copper conductive strip is 0.2mm, and the number of thermocouple pairs is 242.

Therefore, the present invention adopts the above-mentioned chip thermoelectric cooling device, uses the thermoelectric sheet to supply power to the cooling fan for forced convection heat dissipation, which can overcome the limitation of natural heat conduction, and at the same time, supplying power to the thermoelectric sheet can produce a cooling effect and enhance the heat dissipation capability. The adjustment of voltage can realize the effect of precise temperature control, and has the characteristics of no noise, flexibility and high reliability.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that: it still Modifications or equivalent replacements can be made to the technical solutions of the present invention, and these modifications or equivalent replacements cannot make the modified technical solutions deviate from the spirit and scope of the technical solutions of the present invention.

Claims (5)

1. A chip thermoelectric cooling device, characterized in that: it comprises a heat conduction plate, a thermoelectric module is arranged above the heat conduction plate, and an upper cooling fin is installed above the thermoelectric module; the ventilation position of the upper cooling fin is passed through a screw A cooling fan is installed and fixed; the thermoelectric module is electrically connected to the cooling fan through wires, and the thermoelectric module is externally connected with a power supply and a control switch. 2. A chip thermoelectric cooling device according to claim 1, characterized in that: a lower heat dissipation fin is arranged between the heat conduction plate and the thermoelectric module, and the lower part of the heat dissipation fan is fixed on the The bottom of the lower cooling fin ventilation location. 3. A chip thermoelectric cooling device according to claim 2, characterized in that: the thermoelectric module comprises several pieces of thermoelectric chips, which are tiled between the upper heat dissipation fins and the lower heat dissipation fins, and completely cover The entire upper surface of the lower heat dissipation fin; each of the thermoelectric sheets is provided with positive and negative terminals on the outer end surface; the left and right sides of the ventilation position of the lower heat dissipation fin and the upper heat dissipation fin are provided with installation holes . 4 . The chip thermoelectric cooling device according to claim 1 , wherein the covered area of the heat conducting copper plate is larger than that of the heat source chip. 5 . 5. A chip thermoelectric cooling device according to claim 1, characterized in that: the outer side of the cooling fan is a square protective frame, and openings are provided at the four corners, and the inside of the cooling fan is a circular fan blade .

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