CN115990580A

CN115990580A - Carrier, test board distribution method, test board distribution device and test system

Info

Publication number: CN115990580A
Application number: CN202111208993.8A
Authority: CN
Inventors: 万涛; 杨虎
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2021-10-18
Filing date: 2021-10-18
Publication date: 2023-04-21

Abstract

The disclosure relates to a carrier, a method for distributing test boards used in a testing system, a device for distributing test boards used in a testing system, and a testing system. The carrier includes a first carrier plate with a first mold cavity; a second carrier plate, the second carrier plate is detachably installed in the first mold cavity; the second carrier plate has a second mold cavity , the second mold cavity is used to carry the board to be tested; wherein, the structural parameters of the second mold cavity of different second carrier plates are different. Through the cooperative installation of the first carrier board and the second carrier board, it can be realized that only the second carrier board can be replaced without replacing the first carrier board to realize the replacement of different types of boards to be tested on the carrier, especially When a plurality of boards to be tested are carried on the second carrier, the simultaneous replacement of multiple boards to be tested on the carrier can be realized. Compared with replacing the boards to be tested one by one, the replacement efficiency of the boards to be tested can be effectively improved, thereby effectively It is beneficial to improve the test efficiency of the whole test pipeline.

Description

Carrier, test board material distribution method, test board material distribution device and test system

Technical Field

The disclosure relates to the technical field of equipment testing, in particular to a carrier, a test board distributing method applied to a test system, a test board distributing device applied to the test system and the test system.

Background

When equipment is assembled on an equipment production line, performance test is performed on assembled hardware. When the assembled hardware performance test is unqualified, the hardware needs to be replaced and reassembled. When the hardware is subjected to flow test on the production line, the hardware is not directly placed on the production line for protection, but a carrier is needed to bear the test hardware, so that scratches of the hardware are reduced when the hardware is taken and placed at a test station.

Disclosure of Invention

The disclosure provides a carrier, a test board distributing method applied to a test system, a test board distributing device applied to the test system and the test system.

In a first aspect of embodiments of the present disclosure, there is provided a carrier, comprising:

the first carrier plate is provided with a first die cavity;

the second carrier plate is detachably arranged in the first die cavity; the second carrier plate is provided with a second die cavity which is used for bearing a plate to be tested; wherein, different the structural parameters of the second die cavity of the second carrier plate are different, wherein: the second die cavity at least comprises a plurality of slots symmetrically distributed along the center of the second carrier plate, and one slot is used for carrying one to-be-tested plate.

In some embodiments, the second carrier plate is provided with connecting grooves communicated with adjacent grooves, and the connecting grooves between the adjacent grooves are used for accommodating the connecting mechanisms of the jointed boards; the jointed boards are formed by connecting a plurality of boards to be tested through the connecting mechanism.

In some embodiments, a bearing platform for bearing the second carrier plate is arranged in the first mould groove of the first carrier plate, a clamping column is arranged on the surface of the bearing platform, a clamping hole is arranged at a position, corresponding to the clamping column, of the second carrier plate, and the clamping column is used for being inserted into the clamping hole;

or, the bearing platform of the first carrier plate is provided with a clamping hole, the position of the second carrier plate corresponding to the clamping hole is provided with a clamping column, and the clamping hole is used for clamping the clamping column.

In some embodiments, the edge of the first carrier plate has a mechanism for a robotic arm to grasp the first carrier plate; the second carrier plate is arranged on the first surface of the first carrier plate; wherein:

the mechanism for the mechanical arm to grasp the first carrier plate comprises:

a first notch located at an edge position of a second surface of the first carrier, the second surface being an opposite surface of the first surface; the depth of the first notch is smaller than the thickness of the first carrier plate;

Or,

and the second notch is positioned at the edge position of the first carrier plate, and the depth of the second notch is smaller than or equal to the thickness of the first carrier plate.

In some embodiments, the second carrier plate is provided with a clamping groove, the clamping groove is communicated with the groove, and the clamping groove is used for providing a clamping space for a mechanical arm to grab the board to be tested.

In some embodiments, the peripheral edge of the second carrier plate has an inward first recess, and the first recess of the second carrier plate is used for a mechanical arm to grasp the second carrier plate; wherein:

the second carrier plate has first sunken inwards in the edge all around, includes at least:

the opposite side of the second carrier plate is provided with the first recess; wherein,,

the first recess on the same side comprises at least: two concave regions, adjacent to each other, are provided with a protruding part.

In some embodiments, the groove wall of the first mold groove of the first carrier plate is provided with a second recess at a position corresponding to the first recess, wherein,

the area range of the first concave area extending along the side surface of the second carrier plate is included in the area range of the second concave area extending along the side surface of the second carrier plate.

In a second aspect of the embodiments of the present disclosure, there is provided a test board dispensing method applied to a test system, the method including:

determining test results of a plurality of boards to be tested in a set of carrier;

when the test result of at least one board to be tested in one set of carriers is that the board to be tested does not pass, controlling the carriers to flow into a sorting station;

and at the sorting station, sorting the to-be-tested boards with the test results not passing through to the buffer position for reassignment, and controlling the to-be-tested boards with the test results of all the test items passing through to flow into the next working procedure station.

In some embodiments, the method further comprises:

and after the test is finished, before the to-be-tested plates are redistributed, carrying out laser segmentation on jointed boards at the sorting station to obtain each independent to-be-tested plate.

In some embodiments, the reassigning of the board to be tested to the buffer location for which the sorting test result does not pass in the carrier includes:

distributing a test board with a test result of a preset test item passing through to a first carrier; and/or the number of the groups of groups,

distributing a test board which does not pass the test result of the preset test item to a second carrier; wherein:

the first carrier after the test board is redistributed is used for reflowing to a test station of a next test item of the preset test items;

And the second carrier after the test board is redistributed is used for reflow to the test station of the preset test item.

In some embodiments, the method further comprises:

when the test board redistributed to the carrier occupies the slot position on the carrier, the carrier is reflowed to the test assembly line;

or, when the buffer position does not have the test board to be distributed on the carrier within a preset time period, reflowing the carrier distributed with the test board to a test assembly line.

In some embodiments, reassigning the board to be tested to the buffer bit, through which the sorting test result does not pass, includes:

if the number of times that the test result of the test item corresponding to the board to be tested is not passed is larger than a preset threshold value, sorting the board to be tested to a maintenance station; or (b)

And if the number of times that the test result of the test item corresponding to the board to be tested is not passed is smaller than or equal to a preset threshold value, sorting the board to be tested to the corresponding test station.

In some embodiments, the method further comprises:

recording a test result of the board to be tested based on a marking code on the board to be tested, wherein the test result at least comprises:

the test item which completes the test and the test result are the test times corresponding to the test item which does not pass;

Scanning a marking code on a board to be tested;

determining test items which are not passed by the test of the board to be tested based on a scanning result;

and sorting the board to be tested to a corresponding testing station for retesting the test items.

In a third aspect of embodiments of the present disclosure, there is provided a test plate dispensing apparatus for use in a test system, the apparatus comprising:

the first processing unit is used for determining test results of a plurality of boards to be tested in a set of carrier;

the second processing unit is used for controlling the carriers to flow into the sorting station when the test result of at least one board to be tested in one set of carriers is not passing;

and the third processing unit is used for sorting the test boards to be tested, which do not pass through the test results, to the buffer position for redistribution at the sorting station and controlling the test boards to be tested, which pass through the test results of all the test items, to flow into the next working procedure station.

In some embodiments, the third processing unit is specifically configured to

In some embodiments, the third processing unit is further configured to

In some embodiments, the third processing unit is specifically configured to:

In a fourth aspect of embodiments of the present disclosure, there is provided a test system comprising at least:

a loading machine for loading a board to be tested into the carrier of claims 1 to 7;

the test cabinet is positioned between the feeding machine and the discharging machine and is used for testing test items of the board to be tested in the carrier;

The transmission device is positioned between the feeding machine and the discharging machine and is used for transmitting the carrier which does not pass the test result of at least one board to be tested to the discharging machine;

the blanking machine comprises a sorting station, is used for sorting the to-be-tested boards, the test results of which do not pass through, to the buffer position at the sorting station to redistribute in the carrier, and controls the to-be-tested boards, the test results of which all test items pass through, to flow into the next working procedure station.

In some embodiments, the carrier comprises a first carrier and a second carrier;

the first carrier is used for distributing a test board with a passing test result of a preset test item and/or a test board with a non-passing test result of a next test item of the preset test item, and reflowing the test board to a test station of the next test item of the preset test item through a pipeline;

the second carrier is used for distributing test boards with test results of preset test items not passing through, and reflowing the test boards to the test stations of the preset test items through a pipeline.

The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects:

the carrier in the embodiment of the disclosure comprises: the first carrier plate is provided with a first die cavity; the second carrier plate is detachably arranged in the first die cavity; the second carrier plate is provided with a second die cavity which is used for bearing a board to be tested; the second mould grooves of different second carrier plates are different in structural parameters, and at least comprise a plurality of grooves symmetrically distributed along the center of the second carrier plates, and one groove is used for bearing one board to be tested. The carrier in this application can be applied to the test assembly line, and the first die cavity that first carrier plate had can be standardized die cavity, can be used to install the second carrier plate that various second die cavity structural parameter is different for a plurality of different second carrier plates share same first carrier plate. The second carrier plate can bear various types of to-be-tested plates according to different structural parameters of the second die cavity. The first carrier plate is arranged on the assembly line and can drive the board to be tested to move to the testing station along with the testing assembly line. Through the cooperation installation of first carrier plate and second carrier plate, can realize under the condition of not changing first carrier plate, only change the second carrier plate and can realize the change of different grade type board to be tested on the carrier, especially when bearing a plurality of boards to be tested on the second carrier plate, can realize changing a plurality of boards to be tested on the carrier simultaneously, for changing the board to be tested one by one, can effectively improve the change efficiency of board to be tested to be favorable to improving the test efficiency of whole test assembly line when playing the protection to hardware.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a schematic view of a carrier-board separation state in a carrier according to an exemplary embodiment.

Fig. 2 is a schematic structural diagram of a carrier in a carrier aggregation state according to an exemplary embodiment.

Fig. 3 is a schematic diagram showing a loading state of a board to be tested on a carrier according to an exemplary embodiment.

Fig. 4 is a flow chart of a method of separating test boards according to an exemplary embodiment.

Fig. 5 is a schematic diagram illustrating a reassignment of a board to be tested according to an exemplary embodiment.

Fig. 6 is a schematic structural view of a test board distributing device according to an exemplary embodiment.

Fig. 7 is a schematic diagram of a test system architecture according to an exemplary embodiment.

Fig. 8 is a schematic structural diagram of a loader in a test system according to an exemplary embodiment.

Fig. 9 is a schematic structural view of a blanking machine in a test system according to an exemplary embodiment.

Fig. 10 is a schematic diagram illustrating a structure of a test cabinet in a test system according to an exemplary embodiment.

Fig. 11 is a schematic diagram showing a structure of a transmission device in a test system according to an exemplary embodiment.

Fig. 12 is a test board test flow diagram according to an exemplary embodiment.

Fig. 13 is a block diagram of a terminal device according to an exemplary embodiment.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus consistent with some aspects of the disclosure as detailed in the accompanying claims.

When equipment is assembled on an equipment production line, performance test is performed on assembled hardware. When the assembled hardware performance test is unqualified, the hardware needs to be replaced and reassembled. When the hardware is tested in a production line, a carrier is needed to bear the test hardware so as to facilitate the taking and placing of the hardware.

The embodiment of the disclosure provides a carrier, which can be applied to a test assembly line. Fig. 1 is a schematic view of a carrier-board separation state in a carrier according to an exemplary embodiment. As shown in fig. 1, the carrier includes:

a first carrier plate 11 having a first cavity 12;

the second carrier plate 13 is detachably arranged in the first die cavity; the second carrier plate 13 is provided with a second die cavity 14, and the second die cavity 14 is used for carrying a board to be tested; wherein, different the structural parameters of the second die cavity of the second carrier plate are different, wherein: the second die cavity at least comprises a plurality of slots symmetrically distributed along the center of the second carrier plate, and one slot is used for carrying one to-be-tested plate.

In the embodiment of the disclosure, the first carrier plate may be polygonal or circular, and may be a general carrier plate with a shape and a configuration suitable for a current production line. The first carrier plate has a standardized die cavity, and can be used for mounting various second carrier plates with different second die cavity structural parameters, so that a plurality of different second carrier plates share the same first carrier plate.

In one embodiment, the second carrier plate may be a standardized carrier plate that mates with the first mold cavity, and the profile of the different second carrier plates is identical.

In another embodiment, the second carrier plate may have a plurality of standards, for example, in some embodiments, a first cavity on the first carrier plate may receive a second carrier plate of a first standard of a first size. For another example, in another writing embodiment, a first mold cavity may mount a plurality of second standard second carrier plates of a second size. In this case, the second cavities on the plurality of second carrier plates mounted in one first cavity may be the same or different.

In embodiments of the present disclosure, the second die cavity may be used to carry different types of boards to be tested. The profile of the different types of boards to be tested may be different, and accordingly, the second cavities may have different structural parameters. Wherein the structural parameter is indicative of a groove profile characteristic of the second cavity.

The structural parameters may include:

a second die cavity shape;

the depth of the second die cavity;

the width of the second die cavity;

the length of the second die cavity;

the distribution position of the second mould grooves on the second carrier plate;

the second mould grooves are positioned on the same second carrier plate.

In the embodiment of the disclosure, the board to be tested can be various device hardware including a main board, a sound card and the like.

The carrier in the embodiment of the disclosure can be applied to a test assembly line, and the first carrier plate is arranged on the assembly line and can drive the board to be tested to move to a test station along with the test assembly line. Through the cooperation installation of first carrier plate and second carrier plate, can realize under the condition of not changing first carrier plate, only change the second carrier plate and can realize the change of different grade type board to be tested on the carrier, especially when bearing a plurality of boards to be tested on the second carrier plate, can realize the change to a plurality of boards to be tested on the carrier simultaneously, for changing the board to be tested one by one, can effectively improve the change efficiency of board to be tested to be favorable to improving the efficiency of software testing of whole test assembly line.

In some embodiments, the second die cavity includes at least a plurality of slots symmetrically distributed along a center of the second carrier, and one slot is used for carrying one board to be tested.

In an embodiment of the disclosure, fig. 2 is a schematic structural diagram of a carrier in a carrier aggregation state according to an exemplary embodiment. As shown in fig. 2, in order to improve the testing efficiency, the second mold cavity may include a plurality of slots 21 for carrying boards to be tested. One slot 21 may be used to carry one board to be tested. The plurality of slots 21 may be symmetrically distributed with respect to a center point of the second carrier. The number of the boards to be tested borne by the second carrier plate can be effectively improved through the distribution of the plurality of slots, and the boards to be tested can be conveniently and simultaneously taken and placed for subsequent testing, so that the overall testing efficiency of the testing assembly line is effectively improved.

In some embodiments, the slots 21 distributed on the same second carrier plate have the same structure.

In the embodiment of the disclosure, the structures of the slots on the same second carrier plate may be the same. The slots with the same structure can be used for bearing the same type of to-be-tested boards. The second carrier plate simultaneously carries a plurality of to-be-tested boards of the same type, so that the plurality of to-be-tested boards at the same testing station can be taken and placed at the same time, and the same test item test can be simultaneously carried out.

In the embodiment of the disclosure, fig. 3 is a schematic diagram showing a carrying state of a board to be tested on a carrier according to an exemplary embodiment. As shown in fig. 3, the second carrier plate has a connecting slot 35, and the connecting slot 35 can be used for accommodating the connecting mechanism 33 of each board to be tested in the jointed board 32, so as to facilitate the jointed board to be placed on the second carrier plate. Meanwhile, the connecting grooves 35 are positioned between the grooves, so that the placement of the single board to be tested 31 is not affected, and therefore, the second carrier plate with the connecting grooves can realize compatible bearing of the single board to be tested 31 and the jointed board 32.

In the embodiment of the present disclosure, the second carrier plate 13 is detachably mounted in the first mold cavity, and includes:

the second carrier plate is installed in the first die cavity in a pluggable mode or is detachably installed in the first die cavity through the matching of bolts and threaded holes.

In this disclosure, as shown in fig. 1, when the second carrier plate 13 is installed in the first mold cavity 12, connection may be performed by fixing a clamping post and a clamping hole, where the clamping post 15 may be disposed on a carrying platform of the first carrier plate 11, the clamping hole 16 is disposed on the second carrier plate 13, or the clamping post is disposed on the second carrier plate, and the clamping hole is disposed on the carrying platform of the first carrier plate. When the clamping column is inserted into the clamping hole for interference connection, the second carrier plate is fixed in the first die groove.

In this embodiment of the disclosure, the carrying platform of the first carrier plate may have a card slot, and the position of the second carrier plate corresponding to the card slot has an insertion card, where the insertion card may be snapped into the card slot.

In this disclosed embodiment, the bearing platform of the first carrier plate may have a threaded hole, the second carrier plate has a through hole at a position corresponding to the threaded hole, and the bolt may be screwed into the threaded hole of the first carrier plate through the through hole of the second carrier plate, so as to realize that the second carrier plate is detachably mounted in the first mold cavity.

In some embodiments, the edge of the first carrier plate has a mechanism for a robotic arm to grasp the first carrier plate.

In the embodiment of the disclosure, as shown in fig. 2, to facilitate the robotic arm to grasp the first carrier, the edge of the first carrier may have a mechanism 25 for the robotic arm to grasp.

In some embodiments, the second carrier plate is mounted on the first surface of the first carrier plate;

or,

In an embodiment of the disclosure, when the second carrier is mounted on the first surface of the first carrier, the edge position of the second surface of the first carrier may have a first notch. The depth of the first notch is smaller than the thickness of the first carrier plate. Or a second notch at the edge of the first carrier plate, wherein the depth of the second notch is smaller than or equal to the thickness of the first carrier plate, and when the carrier is on the assembly line or the testing station of the testing station, the mechanical gripper of the mechanical arm can grasp the first carrier plate through the first notch or the second notch, so that the whole carrier is grasped.

In the embodiment of the disclosure, as shown in fig. 3, the second carrier plate has a clamping groove 34 that communicates with the slot. The clamping grooves 34 can be positioned on two sides of the groove and communicated with the groove, so that a clamping space for the mechanical arm to grab the board to be tested is provided. The mechanical gripper of the mechanical arm can contact with the board to be tested through the clamping groove 34 to clamp the board to be tested, so that the board to be tested is gripped.

In the embodiment of the disclosure, the periphery edge of the second carrier plate is provided with a first inward recess, and the second carrier plate can be grabbed by the first recess mechanical arm.

In the embodiment of the disclosure, as shown in fig. 2, opposite sides of the second carrier plate have first recesses, and the first recesses on the same side at least include: the two concave areas 22 are provided with the protruding part 23 between the two adjacent concave areas 22, so that the mechanical grabbing of the mechanical arm is facilitated to four concave areas on the opposite sides, four grabbing points are formed, and the second carrier plate is grabbed more stably and safely.

In the embodiment of the disclosure, as shown in fig. 2, a second recess 24 is provided at a position corresponding to the first recess on the groove wall of the first mold cavity of the first carrier. The area range of the second recess 24 extending along the side surface of the second carrier plate is larger than the area range of the recess area 22 of the first recess extending along the side surface of the second carrier plate, and the area range of the first recess is included in the area range of the second recess 24 extending along the side surface of the second carrier plate, so that the mechanical gripper of the mechanical arm can extend into two sides of the second carrier plate through the recess space of the second recess, and then the mechanical gripper moves to the four recess area 22 positions of the first recess to grip the second carrier plate. Through the sunken setting of second, the condition of easy fish tail second carrier plate when accessible directly stretches into from the sunken concave region top of first is grabbed to the reducible machinery to improve the security.

In a second aspect of the disclosed embodiments, a test board dispensing method for use in a test system is provided. Fig. 4 is a flow chart of a method of separating test boards according to an exemplary embodiment. As shown in fig. 4, the method includes:

step 40, determining test results of a plurality of boards to be tested in a set of carriers;

step 41, when the test result of at least one board to be tested in a set of carriers is failed, controlling the carriers to flow into a sorting station;

and 42, sorting the to-be-tested boards with the test results not passing through to a buffer position at the sorting station, redistributing the to-be-tested boards in the carrier, and controlling the to-be-tested boards with the test results of all the test items to pass through to flow into a next working procedure station.

In the embodiment of the disclosure, a carrier applied in a test system can carry a plurality of boards to be tested.

In the embodiment of the disclosure, after the test of the preset test item, the board to be tested in the carrier is controlled to flow into the sorting station as long as all the boards to be tested do not pass the test. At the sorting station, the boards with the test results passing and the boards with the test results not passing are separated, so that the boards to be tested with the test results not passing are subjected to buffer position for redistribution in the carrier. Meanwhile, the to-be-tested board passing through all the test items flows into the next working procedure station.

In an embodiment of the present disclosure, fig. 4 is a flow chart illustrating a method of separating test boards according to an exemplary embodiment. As shown in fig. 4, each test item includes at least:

the first test item, namely MBT test as shown in the figure, is used for executing the version software task of the downloading manufacturer at a first test workstation;

the second test item, namely the CAL test as shown in the figure, is used for executing the communication signal frequency band calibration task at the second test station;

the third test item, namely the RFT test as shown in the figure, is used for executing the comprehensive test of the communication signal at the third test station, and at least comprises a signal communication quality test;

and the fourth test item is a WIFI test and is used for executing wireless WIFI and Bluetooth function tests at a fourth test station.

In the embodiment of the disclosure, each test item is sequentially performed from the first test item to the fourth test item. After all the four tests pass, the tested plate flows into the next working procedure station.

The next working procedure station can be a station for executing the next working procedure on the board to be tested. The next process station may include: the next testing procedure, the packaging procedure, the shipment procedure or the repair procedure, etc.

In an embodiment of the present disclosure, determining a test result of a plurality of boards to be tested in a set of carriers includes:

And determining test results of a plurality of boards to be tested in a set of carriers tested by the test items. In the testing process, the testing result of the board to be tested after each test item is tested can be determined, and when the testing result of at least one board to be tested in the carrier is not passed, the carrier is controlled to flow into the sorting center. For example, when the board to be tested on the carrier 2 is tested by the first test item and the carrier has the board to be tested with the test result not passing, the carrier 2 is flowed into the sorting station.

In an embodiment of the present disclosure, reassigning the board to be tested, through which the sorting test result does not pass, to the buffer position in the carrier includes:

and distributing the to-be-tested boards to be tested by the same test item to the same carrier.

For example, the board to be tested passing the test of the first test item is distributed to the same carrier 1, and the carrier 1 can flow back to the test station of the next test item of the first test item, namely the second test item; and/or distributing the board to be tested which does not pass the test of the first test item to the same carrier 2, wherein the carrier 2 can flow back to the test station of the first test item; and/or distributing the board to be tested, which is tested by the first test item, and the board to be tested, which is not tested by the second test item, into the same carrier 4, and reflowing the carrier 4 to a testing station of the next test item of the first test item, namely the second test item.

In the embodiment of the disclosure, after the board to be tested is tested by the test item, a two-dimensional code can be generated on the board to be tested and used for recording the test result of the board to be tested on the test item, the assembly line stops scanning the code at each station, and the MES judges whether the board to be tested is tested or not, so that the next test item test is not required to be carried out on the board to be tested. And determining that each test board on the carrier passes the last test item through code scanning, and carrying out the test item test on each board to be tested on the carrier, or else, not carrying out the test.

In the embodiment of the disclosure, the carriers which do not pass through the test result of the at least one board to be tested flow into the sorting station to redistribute the board to be tested, so that the boards to be tested which need to be tested for the same test item flow back in the same carrier at the same time, and the test efficiency of the whole test assembly line can be effectively improved.

In some embodiments, the method further comprises:

In the embodiment of the disclosure, when the board to be tested is a jointed board formed by connecting a plurality of single boards, after the testing is completed, the jointed board needs to be subjected to laser cutting to obtain each independent single board, so that the single boards serving as the board to be tested can be conveniently sorted at a sorting station.

The first carrier and the second carrier may be any of the aforementioned carriers.

In the embodiment of the present disclosure, the preset test item may be any one of the first test item to the third test item; the next test item of the preset test items may be any one of the second test item to the fourth test item. When the preset test item is the first test item, the next test item of the preset test item is the second test item. After redistribution, the to-be-tested boards needing to be reflowed to the same test can be distributed to the same carrier, so that the to-be-tested boards are reflowed to a testing station of the same test item together for testing, and thus the testing efficiency of the whole testing assembly line can be effectively improved relative to the respective reflow of the single testing boards.

In some embodiments, the method further comprises:

In the embodiment of the disclosure, when the carrier to be tested is reflowed after the board to be tested is allocated again, the carrier can be reflowed when the slot position on the carrier is occupied by the board to be tested, or when the test board to be allocated to the carrier is not required on the buffer position within the preset time period. For example, the slot position on the carrier 1 is already occupied by the board to be tested passing the test of the first test item, and the carrier 1 can be reflowed to the test station of the second test item for the next test item test; or, when the buffer memory position has no board to be tested which needs to be distributed on the carrier 1, the carrier 1 carrying the board to be tested is reflowed to the test station of the second test item.

In the embodiment of the disclosure, when the board to be tested is sorted, when the number of times that the test result of one test item of the board to be tested fails exceeds a preset threshold value, the board to be tested is proved to have obvious defects in the aspect of realizing the function of the test item, so that the board to be tested is not tested for the test item any more, but is sorted to a maintenance station for maintenance;

when the number of times that the test result of the board to be tested in one test item does not pass is smaller than or equal to a preset threshold value, sorting the board to be tested to a corresponding test station to perform retesting of the test item, so as to further determine whether the board to be tested has obvious defects in the function implementation aspect of the test item. The preset threshold value can be set according to different test items according to requirements. The preset thresholds corresponding to the test items can be set identically or differently.

In some embodiments, the method further comprises:

scanning a marking code on a board to be tested;

In the embodiment of the disclosure, the marking code used for recording the test result may be a two-dimensional code or a bar code. When the test is completed, the test results may be recorded in the tag code. When the board to be tested carries out the next test station, the test station can sweep the marking code, the MES system can judge the sweeping code, and the test item which does not pass the test and the test times of the test item which does not pass the test are determined. And when the number of times of failed test is smaller than or equal to a preset threshold value, sorting the board to be tested to a corresponding test station for retesting the test item. After the test is completed, the flow continues to the next test station until the blanking machine sorts.

In some embodiments, the method further comprises:

and distributing a test board with a test result of a preset test item passing through and a test board with a test result of a next test item of the preset test item not passing through to the first carrier.

In the embodiment of the disclosure, when the test result of the preset test item on the cache bit is insufficient to meet the requirement of the slot bit on one carrier, the test board with the test result of the preset test item passing and the test board with the test result of the next test item of the preset test item failing may be allocated to the same carrier, so as to perform the reflow test of the same test item.

In a third aspect of the disclosed embodiments, a test board dispensing apparatus for use in a test system is provided. Fig. 6 is a schematic structural view of a test board distributing device according to an exemplary embodiment. As shown in fig. 6, the apparatus includes:

a first processing unit 61, configured to determine test results of a plurality of boards to be tested in a set of carriers;

a second processing unit 62, configured to control the carriers to flow into the sorting station when a test result of at least one board to be tested in a set of the carriers is failed;

and the third processing unit 63 is configured to, at the sorting station, sort the boards to be tested that the test results do not pass to the buffer position for redistribution, and control the boards to be tested that the test results of each test item pass to flow into the next process station.

In the embodiment of the disclosure, after the test of the preset test item, the board to be tested in the carrier is controlled to flow into the sorting station as long as all the boards to be tested do not pass the test. At the sorting station, the sorting test results do not pass the test board to be tested to the buffer position for redistribution in the carrier. Meanwhile, the to-be-tested board passing through all the test items flows into the next working procedure station.

In some embodiments, the apparatus further comprises:

and the fourth processing unit is used for carrying out laser segmentation on jointed boards at the sorting station to obtain each independent board to be tested after the testing is finished and before the board to be tested is redistributed.

In some embodiments, the third processing unit is specifically configured to

In some embodiments, the third processing unit is further configured to

In some embodiments, the third processing unit is specifically configured to:

In some embodiments, the third processing unit is further configured to:

scanning a marking code on a board to be tested;

the loading machine is used for loading the board to be tested into the carrier described in the embodiment;

In the embodiment of the disclosure, the carrier applied in the test system may bear a plurality of boards to be tested, where the boards to be tested are test boards tested by a preset test item.

the first test item, namely MBT test as shown in FIG. 4, is used for executing the version software task of the downloading manufacturer at the first test workstation;

the second test item is a CAL test as shown in fig. 4, and is used for performing a communication signal frequency band calibration task at the second test station;

the third test item, i.e. the RFT test shown in fig. 4, is used for performing a comprehensive test of the communication signal at the third test station, and at least includes a signal communication quality test;

Fig. 7 is a schematic diagram of a test system architecture according to an exemplary embodiment. As shown in FIG. 7, the whole test system mainly comprises a loading machine, a test cabinet corresponding to each test item, a blanking machine and a transmission device forming a production line. The test cabinet corresponding to each test item at least comprises: the first test item is a first cabinet corresponding to the MBT test, the second test item is a second cabinet corresponding to the CAL test, the third test item is a third cabinet corresponding to the RFT test, and the fourth test item is a fourth cabinet corresponding to the WIFI test.

Fig. 8 is a schematic structural diagram of a loader in a test system according to an exemplary embodiment. As shown in figure 8 of the drawings,

the material loading machine includes at least: feeding the tank bit, taking the material level, discharging the tank bit and discharging the tank bit; specifically, the whole feeding process is as follows, an AGV trolley pulls materials to a material level to be detected, and the material level to be detected moves the materials to a material taking position;

the loading level loads material to the pipeline loading level. After the tank is empty, the tank is transferred to an empty tank position, finally moved to an empty tank discharging position, and then pulled out of the line by the AGV for processing.

Fig. 9 is a schematic structural view of a blanking machine in a test system according to an exemplary embodiment. As shown in the figure 9 of the drawings,

The blanking machine at least comprises: the full level of the tank disk, the empty tank disk loading level, the OK tank level, the NG tank level, the empty tank level and the retest buffer level; the OK tray is used for storing a board to be tested which passes the test result; and the NG tray is used for storing the to-be-tested plates which cannot pass the test result. OK indicates that the test result passes, NG indicates that the test result does not pass.

The blanking machine intensively classifies the mainboards in the assembly line loading tool, NG times=3 are placed on an NG charging tray, and an OK charging tray is placed on the testing OK mainboards; and the number of NG times is less than 3, the device is placed in the retest buffer position, and when the buffer number of the same station NG main board is more than 4 (the capacity of one carrier), the main board flows back into the device along with the carrier for retest.

Fig. 10 is a schematic diagram illustrating a structure of a test cabinet in a test system according to an exemplary embodiment. As shown in fig. 10, the jig for testing the motherboard is integrated inside the cabinets, and each cabinet can be designed with 4 layers for motherboard testing. The rack tool lower mould designs into the carrier that can dismantle fast and can guarantee the fine positioning to make things convenient for the carrier to flow along with the mainboard, can effectively protect the mainboard, by can entering the inside mainboard test of carrying out of rack along with the mainboard. Therefore, the main board imposition state and the board separation state are tested by the line body.

Fig. 11 is a schematic diagram showing a structure of a transmission device in a test system according to an exemplary embodiment. As shown in FIG. 11, the assembly line stops scanning codes at each station, and the MES judges whether to test or not, so that the main board is judged to need no equipment test; the double-layer backflow design can meet the requirement that the empty carrier continuously flows back to the feeding machine for feeding after the test is completed. The carrier completes carrier horizontal direction transmission through upper and lower double-layer pipelines, and the line head and the line tail complete carrier up-down direction transmission through a lifter, so that carrier circulation flow is realized. The front lifter is in butt joint with the feeding machine for feeding, and the rear lifter is in butt joint with the discharging machine, so that logistics of the main board in the testing process is completed.

Fig. 12 is a test board test flow diagram according to an exemplary embodiment. As shown in fig. 12, the test flow mainly includes four test items, namely, MBT test, which are respectively first test items, for executing the software version task of the downloading manufacturer at the first test station; the second test item is CAL test, which is used for executing the communication signal frequency band calibration task at the second test station; the third test item, namely RFT test, is used for executing the comprehensive test of the communication signal at the third test station, and at least comprises a signal communication quality test; and the fourth test item is a WIFI test and is used for executing wireless WIFI and Bluetooth function tests at a fourth test station.

The test items are tested sequentially from the first test item to the fourth test item, and when all the four test items pass the test, the board to be tested can enter the next process. After all the test items of the test boards in the carrier pass the test, the to-be-tested boards in the carrier can be transmitted to the next test station through the transmission device to carry out the test of the next test item. When at least one board to be tested in the carrier does not pass the test in one of the test items, the carrier flows to the sorting station for sorting. And distributing the to-be-tested boards passing the test of the same test item in each carrier to the same carrier at the sorting station, and refluxing the to-be-tested boards to the feeding machine for the next test item test. And distributing the to-be-tested boards which do not pass the same test item and do not pass the test item for less than 3 times to the same carrier, and refluxing the to-be-tested boards to the feeding machine for testing the test item. And determining the board to be tested, which does not pass the test for 3 times or more, of the same test item as bad, and sending the board to a maintenance station for maintenance.

Fig. 13 is a block diagram of a terminal device according to an exemplary embodiment. For example, the terminal device may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, an exercise device, a personal digital assistant, and the like.

Referring to fig. 13, the terminal device may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input/output (I/O) interface 812, a sensor component 814, and a communication component 816.

The processing component 802 generally controls overall operation of the terminal device, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing component 802 may include one or more processors 820 to execute instructions to perform all or part of the steps of the methods described above. Further, the processing component 802 can include one or more modules that facilitate interactions between the processing component 802 and other components. For example, the processing component 802 can include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.

The memory 804 is configured to store various types of data to support operations at the terminal device. Examples of such data include instructions for any application or method operating on the terminal device, contact data, phonebook data, messages, pictures, video, etc. The memory 804 may be implemented by any type or combination of volatile or nonvolatile memory devices such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disk.

The power component 806 provides power to the various components of the terminal device. The power components 806 may include a power management system, one or more power sources, and other components associated with generating, managing, and distributing power for the terminal devices.

The multimedia component 808 includes a screen between the terminal device and the user that provides an output interface. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from a user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensor may sense not only the boundary of a touch or sliding action, but also the duration and pressure associated with the touch or sliding operation. In some embodiments, the multimedia component 808 includes a front camera and/or a rear camera. The front camera and/or the rear camera may receive external multimedia data when the terminal device is in an operation mode, such as a photographing mode or a video mode. Each front camera and rear camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

The audio component 810 is configured to output and/or input audio signals. For example, the audio component 810 includes a Microphone (MIC) configured to receive external audio signals when the terminal device is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals may be further stored in the memory 804 or transmitted via the communication component 816. In some embodiments, audio component 810 further includes a speaker for outputting audio signals.

The I/O interface 812 provides an interface between the processing component 802 and peripheral interface modules, which may be a keyboard, click wheel, buttons, etc. These buttons may include, but are not limited to: homepage button, volume button, start button, and lock button.

The sensor assembly 814 includes one or more sensors for providing status assessment of various aspects for the terminal device. For example, the sensor assembly 814 may detect an on/off state of the terminal device, a relative positioning of the assemblies, such as a display and keypad of the terminal device, the sensor assembly 814 may also detect a change in position of the terminal device or one of the assemblies of the terminal device, the presence or absence of user contact with the terminal device, an orientation or acceleration/deceleration of the terminal device, and a change in temperature of the terminal device. The sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an acceleration sensor, a gyroscopic sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

The communication component 816 is configured to facilitate communication between the terminal device and other devices, either wired or wireless. The terminal device may access a wireless network based on a communication standard, such as WiFi,4G or 5G, or a combination thereof. In one exemplary embodiment, the communication component 816 receives broadcast signals or broadcast related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, the communication component 816 further includes a Near Field Communication (NFC) module to facilitate short range communications. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, infrared data association (IrDA) technology, ultra Wideband (UWB) technology, bluetooth (BT) technology, and other technologies.

In an exemplary embodiment, the terminal device may be implemented by one or more Application Specific Integrated Circuits (ASICs), digital Signal Processors (DSPs), digital Signal Processing Devices (DSPDs), programmable Logic Devices (PLDs), field Programmable Gate Arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic elements for executing the methods described above.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any adaptations, uses, or adaptations of the disclosure following the general principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A carrier, characterized in that the carrier at least comprises:

a first carrier plate having a first mold cavity;

A second carrier plate, the second carrier plate is detachably installed in the first mold cavity; the second carrier plate has a second mold cavity, and the second mold cavity is used to carry the board to be tested; wherein , the structural parameters of the second mold grooves of different second carrier plates are different, wherein: the second mold grooves at least include a plurality of slots symmetrically distributed along the center of the second carrier plate, one of the slots is used To carry one of the boards to be tested.

2. The carrier according to claim 1, characterized in that, the second carrier has connecting grooves communicating with adjacent grooves, and the connecting grooves between adjacent grooves are used to accommodate A connection mechanism; wherein, the jigsaw board is formed by connecting a plurality of the boards to be tested through the connection mechanism.

3. The carrier according to claim 1, wherein the first cavity of the first carrier has a bearing platform for carrying the second carrier, and the surface of the bearing platform has clamping posts, so that The position of the second carrier board corresponding to the clamping post has a clamping hole, and the clamping post is used to be inserted into the clamping hole;

Alternatively, the carrying platform of the first carrier board has a clamping hole, and the position of the second carrier board corresponding to the clamping hole has a clamping post, and the clamping hole is used to clamp the clamping post.

4. The carrier according to claim 1, wherein the edge of the first carrier has a mechanism for the robotic arm to grab the first carrier; the second carrier is installed on the second carrier a first surface of a carrier board; wherein:

The structure for the robotic arm to grab the first carrier includes:

A first notch located at the edge of the second surface of the first carrier, the second surface being the opposite side of the first surface; the depth of the first notch is smaller than that of the first carrier thickness;

or,

A second notch located at the edge of the first carrier, the depth of the second notch is less than or equal to the thickness of the first carrier.

5. The carrier according to claim 2, wherein the second carrier has a clamping groove, the clamping groove communicates with the slot, and the clamping groove is used to provide the robot arm to grab the Clamping space for the board to be tested.

6. The carrier according to claim 1, wherein the peripheral edge of the second carrier has a first inward depression, and the first depression of the second carrier is used for the mechanical arm to grasp Take the second carrier plate; wherein:

The peripheral edge of the second carrier has a first inward depression, at least including:

The opposite side of the second carrier has the first recess; wherein,

The first depressions located on the same side at least include: two depression areas, and a protruding portion is provided adjacent to the two depression areas.

7. The carrier according to claim 6, wherein the position of the groove wall of the first cavity of the first carrier plate corresponding to the first depression has a second depression, wherein,

The area range of the concave area of the first depression extending along the side of the second carrier is included in the area of the second depression extending along the side of the second carrier.

8. A test board material distribution method applied in a test system, characterized in that the method comprises:

Determine the test results of multiple boards to be tested in a set of vehicles;

When the test result of at least one board to be tested in a set of said carriers is not passed, controlling said carriers to flow into a sorting station;

At the sorting station, the boards to be tested that fail the sorting test result are redistributed to the buffer position, and the boards to be tested that pass the test results of each test item are controlled to flow into the next process station.

9. The method of claim 8, further comprising:

After the test is completed, before the boards to be tested are redistributed, at the sorting station, laser segmentation is performed on the assembled boards to obtain independent boards to be tested.

10. The method according to claim 8, wherein the redistribution of the boards to be tested that fail the sorting test result to the buffer position in the carrier includes:

assigning the test boards whose test results of the preset test items are passed to the first carrier; and/or,

Allocate the test boards whose test results of the preset test items fail to pass to the second carrier; wherein:

The first carrier after reassigning the test board is used for reflowing to the test station of the next test item of the preset test item;

The second carrier after reassigning the test board is used for reflow to the test station of the preset test item.

11. The method of claim 10, further comprising:

When the test boards redistributed to the carrier occupy the slots on the carrier, reflow the carrier to the test assembly line;

Or, when there is no test board in the buffer position that needs to be allocated to the carrier within a preset time period, the carrier that is allocated with the test board is returned to the test line.

12. The method according to claim 8, characterized in that, reassigning the boards to be tested that fail the sorting test result to the buffer position, comprising:

Determining that the test result of the corresponding test item of the board to be tested is that the number of times of failure is greater than the preset threshold, then sorting the board to be tested to the maintenance station; or

It is determined that the number of failed tests of the corresponding test item of the board to be tested is less than or equal to a preset threshold, and sorting the board to be tested to a corresponding testing station.

13. The method of claim 12, further comprising:

Record the test result of the board to be tested based on the marking code on the board to be tested, wherein the test result at least includes:

The test items that have been tested and the number of tests corresponding to the test items whose test results fail;

Scan the marking code on the board to be tested;

Determining the test item that the board under test fails the test based on the scanning result;

Sorting the boards to be tested to corresponding test stations for retesting of the test items.

14. A test plate distribution device applied in a test system, characterized in that the device comprises:

The first processing unit is used to determine the test results of multiple boards to be tested in a set of carriers;

The second processing unit is used to control the carrier to flow into the sorting station when the test result of at least one board to be tested in a set of the carrier is not passed;

The third processing unit is used to redistribute the boards to be tested that fail to pass the sorting test results to the buffer position at the sorting station, and control the boards to be tested that pass the test results of each test item to flow into the next process Station.

15. The device according to claim 14, wherein the third processing unit is specifically used to

16. The device according to claim 15, wherein the third processing unit is further used for

17. The device according to claim 14, wherein the third processing unit is specifically configured to:

18. A test system, characterized in that the test system at least comprises:

Feeding machine, for feeding the plate to be tested into the carrier described in claims 1 to 7;

The test cabinet is located between the loading machine and the unloading machine, and is used to test the test items on the board to be tested in the carrier;

A transmission device, located between the loading machine and the unloading machine, for transmitting the carrier whose test result of at least one board to be tested is failed to the unloading machine;

The unloading machine includes a sorting station, which is used to sort the boards to be tested that fail the test results at the sorting station to the buffer position for redistribution in the carrier, and control the test results of each test item that pass The board to be tested flows into the next process station.

19. The test system according to claim 18, wherein the carrier comprises a first carrier and a second carrier;

The first carrier is used to distribute the test boards whose test results of the preset test items are passed, and/or, the test results of the next test item of the preset test items are failed test boards, and pass through the assembly line Return to the test station of the next test item of the preset test item;

The second carrier is used to distribute the test boards whose test results of the preset test items fail, and return them to the test stations of the preset test items through the assembly line.