CN115989456A - 光固化性热固化性树脂组合物、干膜、固化物和具有该固化物的电子部件 - Google Patents

光固化性热固化性树脂组合物、干膜、固化物和具有该固化物的电子部件 Download PDF

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Publication number
CN115989456A
CN115989456A CN202180052677.8A CN202180052677A CN115989456A CN 115989456 A CN115989456 A CN 115989456A CN 202180052677 A CN202180052677 A CN 202180052677A CN 115989456 A CN115989456 A CN 115989456A
Authority
CN
China
Prior art keywords
resin composition
resin
thermosetting resin
composition
photocurable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180052677.8A
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English (en)
Chinese (zh)
Inventor
福田晋一朗
内山强
德光香代子
宫部英和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of CN115989456A publication Critical patent/CN115989456A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
CN202180052677.8A 2020-09-04 2021-09-03 光固化性热固化性树脂组合物、干膜、固化物和具有该固化物的电子部件 Pending CN115989456A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020148967 2020-09-04
JP2020-148967 2020-09-04
PCT/JP2021/032395 WO2022050372A1 (ja) 2020-09-04 2021-09-03 光硬化性熱硬化性樹脂組成物、ドライフィルム、硬化物および当該硬化物を有する電子部品

Publications (1)

Publication Number Publication Date
CN115989456A true CN115989456A (zh) 2023-04-18

Family

ID=80492239

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180052677.8A Pending CN115989456A (zh) 2020-09-04 2021-09-03 光固化性热固化性树脂组合物、干膜、固化物和具有该固化物的电子部件

Country Status (4)

Country Link
JP (2) JP7781759B2 (https=)
KR (2) KR20260003441A (https=)
CN (1) CN115989456A (https=)
WO (1) WO2022050372A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118981145A (zh) * 2024-08-01 2024-11-19 韶关市远望涂料厂有限公司 一种感光性干膜材料及其制备方法
WO2025066478A1 (zh) * 2023-09-28 2025-04-03 太阳油墨（苏州）有限公司 无三聚氰胺碱性显影型树脂组合物、干膜、固化物和具有该固化物的电子部件
WO2025124047A1 (zh) * 2023-12-15 2025-06-19 太阳油墨（苏州）有限公司 感光性热固性树脂组合物、干膜、固化物和具有该固化物的电子部件

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117820559B (zh) * 2022-09-29 2025-12-30 苏州铼赛智能科技有限公司 辐射可固化的树脂组合物及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200417294A (en) * 2002-11-28 2004-09-01 Taiyo Ink Mfg Co Ltd Photo- and thermo-setting resin composition and printed wiring boards made by using the same
JP5043516B2 (ja) 2007-06-04 2012-10-10 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びそれを用いて得られるプリント配線
JP5147820B2 (ja) 2009-12-24 2013-02-20 株式会社タムラ製作所 スプレー塗装用白色ソルダーレジスト組成物
JP5688116B2 (ja) 2013-05-13 2015-03-25 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP6359814B2 (ja) 2013-09-17 2018-07-18 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP5722418B1 (ja) * 2013-12-02 2015-05-20 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6788372B2 (ja) * 2015-06-05 2020-11-25 太陽インキ製造株式会社 アルカリ現像可能な樹脂組成物、ドライフィルム、硬化物およびプリント配線板
WO2018123695A1 (ja) 2016-12-28 2018-07-05 太陽インキ製造株式会社 硬化性組成物、主剤および硬化剤、ドライフィルム、硬化物、および、プリント配線板
JP6759323B2 (ja) * 2018-03-28 2020-09-23 太陽インキ製造株式会社 感光性樹脂組成物、２液型感光性樹脂組成物、ドライフィルムおよびプリント配線板
CN111868628B (zh) * 2018-03-30 2024-09-03 太阳控股株式会社 碱显影型光固化性热固化性树脂组合物

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025066478A1 (zh) * 2023-09-28 2025-04-03 太阳油墨（苏州）有限公司 无三聚氰胺碱性显影型树脂组合物、干膜、固化物和具有该固化物的电子部件
WO2025124047A1 (zh) * 2023-12-15 2025-06-19 太阳油墨（苏州）有限公司 感光性热固性树脂组合物、干膜、固化物和具有该固化物的电子部件
CN118981145A (zh) * 2024-08-01 2024-11-19 韶关市远望涂料厂有限公司 一种感光性干膜材料及其制备方法
CN118981145B (zh) * 2024-08-01 2025-03-21 韶关市远望涂料厂有限公司 一种感光性干膜材料及其制备方法

Also Published As

Publication number Publication date
TW202219169A (zh) 2022-05-16
JP2026035670A (ja) 2026-03-04
KR20260003441A (ko) 2026-01-06
KR102907739B1 (ko) 2026-01-05
JPWO2022050372A1 (https=) 2022-03-10
KR20230061448A (ko) 2023-05-08
WO2022050372A1 (ja) 2022-03-10
JP7781759B2 (ja) 2025-12-08

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TA01 Transfer of patent application right
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Effective date of registration: 20230922

Address after: Saitama Prefecture, Japan

Applicant after: TAIYO HOLDINGS Co.,Ltd.

Address before: Saitama Prefecture, Japan

Applicant before: TAIYO INK MFG. Co.,Ltd.

CB02 Change of applicant information
CB02 Change of applicant information

Address after: Saitama Prefecture, Japan

Applicant after: TAIYO HOLDINGS Co.,Ltd.

Address before: Saitama Prefecture, Japan

Applicant before: TAIYO HOLDINGS Co.,Ltd.