CN115981435A - Industrial control host supporting 5G and heat dissipation control method thereof - Google Patents

Abstract

The invention provides a 5G-supporting industrial control host, which relates to the technical field of industrial control hosts and comprises a host, a CPU (central processing unit) main board, a 5G module PCB (printed circuit board), a first heat dissipation device and a second heat dissipation device, wherein the CPU main board, the 5G module PCB, the first heat dissipation device and the second heat dissipation device are arranged in the host; the first heat dissipation device comprises a heat radiator and a heat dissipation layer arranged between the heat radiator and the 5G module PCB, the second heat dissipation device comprises a centrifugal fan, the centrifugal fan is provided with a first air outlet and a second air outlet, wherein the first air outlet blows to the first fins, and the second air outlet blows to the second fins and the 5G module PCB; a rotating door is arranged on a blowing path of the second air outlet, and the rotating door is configured to rotate towards the direction close to the second fins when the temperature of the 5G module PCB is higher than that of the CPU main board; or when the temperature of the CPU mainboard is higher than that of the 5G module PCB, the CPU mainboard rotates towards the direction close to the 5G module PCB, and therefore the heat dissipation problem of the industrial control host supporting 5G is solved. The application further provides a heat dissipation control method.

Description

A 5G-supporting industrial control host and heat dissipation control method thereof

technical field

The invention relates to the technical field of industrial control hosts, in particular to an industrial control host supporting 5G and a heat dissipation control method thereof.

Background technique

With the intelligentization of industrial production, the application of industrial control hosts is becoming more and more extensive. 4G communication modules can no longer meet the needs of the market. Compared with 4G communication modules, the power consumption of 5G module PCB boards increases, and traditional heat dissipation methods can no longer adapt. For industrial control hosts that support 5G, when the whole machine is in a relatively high temperature environment, it will be difficult for the industrial control host to reach the proper operating frequency, which will affect the performance of the industrial control host.

Contents of the invention

The invention discloses a 5G-supporting industrial control host and a heat dissipation method thereof, aiming at improving the heat dissipation problem of the 5G-supporting industrial control host.

The present invention has adopted following scheme:

An industrial control host supporting 5G, including a body and a CPU motherboard placed in the body, a 5G module PCB board, a first heat dissipation device, and a second heat dissipation device; the first heat dissipation device includes a radiator and a radiator placed in the radiator The heat dissipation layer between the 5G module PCB board, the second heat dissipation device includes a centrifugal fan, the centrifugal fan has a first air outlet and a second air outlet, and the first air outlet blows to the No. 1 fin , the second air outlet blows to the No. 2 fin and the 5G module PCB board; a revolving door is arranged on the blowing path of the second air outlet, and the revolving door is configured to be on the 5G module PCB board When the temperature is higher than the temperature of the CPU main board, turn towards the direction close to the No. 2 fin; or when the temperature of the CPU main board is higher than the 5G module PCB board, turn towards the direction close to the 5G module PCB board direction to turn.

As a further improvement, the heat dissipation layer is made of silicone grease or gel, and the heat dissipation layer accounts for at least 70% of the PCB area of the 5G module.

As a further improvement, a copper layer is laid on the bottom of the 5G module PCB, and the copper layer accounts for at least 50% of the area of the 5G module PCB. .

As a further improvement, an air guide cover is provided corresponding to the second air outlet, the air outlet of the air guide cover is facing the 5G module PCB board and the second fin, and the revolving door is arranged on the air guide cover superior.

As a further improvement, the bottom of the CPU motherboard is configured to connect heat pipes of the No. 1 fin and the No. 2 fin.

As a further improvement, the revolving door is driven to rotate through a rotating electromagnet.

As a further improvement, the rotation angle of the revolving door is 15° or 30° or 45° or 60° or 75° or 90°.

In addition, a heat dissipation control method of the above-mentioned industrial control host supporting 5G is provided, and generating the rotation instruction of the revolving door includes:

When the temperature of the CPU motherboard is <45°C, the revolving door rotates clockwise by 60°;

When the temperature of the CPU motherboard is ≥50°C, the revolving door rotates counterclockwise by 30°;

When the temperature of the CPU motherboard is ≥60°C, the revolving door rotates counterclockwise by 45°;

When the temperature of the CPU motherboard is ≥75°C, the revolving door rotates 60° counterclockwise;

or,

When the temperature of the 5G module PCB board is <30°C, the revolving door rotates 60° counterclockwise;

When the temperature of the 5G module PCB board is ≥35°C, the revolving door rotates 30° clockwise;

When the temperature of the 5G module PCB board is ≥45°C, the revolving door rotates 45° clockwise;

When the temperature of the 5G module PCB board is ≥50°C, the revolving door rotates 60° clockwise;

If the temperature of the CPU main board or the 5G module PCB board meets the trigger conditions at the same time, the trigger condition with the highest temperature is given priority.

As a further improvement, it also includes a No. 1 temperature sensor built into the CPU motherboard and a No. 2 temperature sensor configured on the 5G module PCB, the centrifugal fan is electrically connected to the CPU motherboard, and the No. 1 temperature sensor or The No. 2 temperature sensor transmits the detected temperature signal to the CPU main board, and the instructions for generating and adjusting the rotating speed of the centrifugal fan include:

When the temperature of the CPU motherboard is less than 40°C and the temperature of the 5G module PCB is less than 30°C, the centrifugal fan stops rotating;

When the temperature of the CPU motherboard rises to 42°C or the temperature of the 5G module PCB board rises to 32°C, the speed of the centrifugal fan is adjusted to 2750r/min;

When the temperature of the CPU motherboard rises to 47°C or the temperature of the 5G module PCB board rises to 35°C, the speed of the centrifugal fan is triggered to be adjusted to 3000r/min;

When the temperature of the CPU motherboard rises to 50°C or the temperature of the 5G module PCB board rises to 38°C, the speed of the centrifugal fan is triggered to be adjusted to 3250r/min;

When the temperature of the CPU motherboard rises to 58°C or the temperature of the 5G module PCB board rises to 45°C, the speed of the centrifugal fan is adjusted to 3900r/min;

When the temperature of the CPU motherboard rises to 60°C or the temperature of the 5G module PCB board rises to 45°C, the speed of the centrifugal fan is adjusted to 4200r/min;

When the temperature of the CPU motherboard rises to 70°C or the temperature of the 5G module PCB board rises to 55°C, the speed of the centrifugal fan is adjusted to 4500r/min;

If the temperature of the CPU main board or the 5G module PCB board meets the trigger conditions of the two speeds respectively, execute the command with a high speed.

As a further improvement, when the temperature of the CPU main board and the 5G module PCB board drops, the rotation speed corresponding to the current temperature is commanded to be reduced by one speed every two seconds.

By adopting the above technical solution, the present invention can achieve the following technical effects:

1. Set the first heat dissipation device including the heat sink and the heat dissipation layer to reduce the temperature of the 5G module PCB board from the source and the propagation path.

2. Set up a centrifugal fan and use the double air outlets to blow out the heat source of the whole machine from different directions to reduce heat accumulation. At the same time, the air outlet path of the second air outlet can sweep across the 5G module PCB board to enhance the heat dissipation of the 5G module PCB board .

3. There is a revolving door on the blowing path of the second air outlet. By judging the temperature of the CPU motherboard and the 5G module PCB board, the rotation of the revolving door is controlled so that the air volume of the second air outlet can be reasonably distributed to improve the centrifugal fan. cooling efficiency.

4. There are two heat pipes connected to the No. 1 fin and No. 2 fin under the CPU mainboard. The heat pipes are welded on the fins to direct the heat of the CPU main board to the air outlet direction of the two fins, thereby further improving the performance of the CPU mainboard. cooling efficiency.

This application ensures the operation of the whole machine by setting multiple heat dissipation and reasonably controlling the air volume distribution so that the whole machine is in an appropriate temperature environment.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore do not It should be regarded as a limitation on the scope, and those skilled in the art can also obtain other related drawings based on these drawings without creative work.

Fig. 1 is a schematic structural view of one of the embodiments of the present invention;

Fig. 2 is a cross-sectional view of Fig. 1 along one of the sections;

Fig. 3 is a cross-sectional view of Fig. 1 along another section;

Figure 4 is an enlarged view of A in Figure 3;

Fig. 5 is a structural schematic diagram after hiding the bottom cover of the body;

6 is a schematic structural view of a first heat dissipation device and a second heat dissipation device according to one embodiment of the present invention;

Fig. 7 is a schematic structural view of one embodiment of the present invention with the body and the centrifugal fan hidden;

FIG. 8 is a schematic diagram of the connection between the No. 1 fin and the No. 2 fin and the heat pipe according to one embodiment of the present invention.

icon:

1-body; 2-CPU motherboard; 3-5G module PCB board; 4-radiator; 5-heat dissipation layer; 6-centrifugal fan; 601-first air outlet; 602-second air outlet; 8-No. 2 fin; 9-revolving door; 10-heat pipe; 11-wind guide cover; 12-rotating electromagnet.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is some embodiments of the present invention, but not all of them. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

Example

1 to 8, this embodiment provides a 5G-supporting industrial control host, including a body 1, a CPU motherboard 2 placed in the body 1, a 5G module PCB board 3, a first heat sink, and a second heat sink. Wherein, the bottom and the side of the body 1 are provided with a number of ventilation holes for the airflow to enter and exit. The CPU mainboard 2 is arranged close to the top inner wall of the body 1, and the 5G module PCB board 3 is placed under the CPU mainboard 2. The first heat dissipation device is disposed near the bottom of the body 1 and includes a heat sink 4 and a heat dissipation layer 5 placed between the heat sink 4 and the 5G module PCB board 3. The heat sink 4 is preferably an aluminum extruded profile with fins to increase effective heat dissipation Area, enhance the exchange of radiator 4 and air. The heat dissipation layer 5 occupies at least 70% of the area of the PCB 3 of the 5G module, and uses silicone grease or gel with a thermal conductivity ≥ 4.5W/m ² *K to ensure heat dissipation. The bottom of the 5G module PCB board 3 is laid with a copper layer. The copper layer accounts for at least 50% of the area of the 5G module PCB board 3 to disperse the heat of the 5G module PCB board 3. In addition, increasing the copper content can also reduce the current consumption thermal resistance and improve Thermal conductivity. To reduce the temperature of the 5G module PCB board 3 from the source and the transmission path.

The second heat dissipation device includes a centrifugal fan 6, and the centrifugal fan 6 has a first air outlet 601 and a second air outlet 602, the first air outlet 601 blows to the No. 1 fin 7, and the second air outlet 602 blows to the No. 2 fin sheet 8 and the 5G module PCB board 3; and a revolving door 9 is provided on the blowing path of the second air outlet 602, and the revolving door 9 is configured to move towards the 5G module PCB board 3 when the temperature is higher than the temperature of the CPU main board 2 Rotate in the direction close to the second fin 8 so that more air volume blows to the 5G module PCB board 3; or when the temperature of the CPU motherboard 2 is higher than the 5G module PCB board 3, turn in the direction close to the 5G module PCB board 3 , so that more air volume blows to No. 2 fin 8. Preferably, the angle between the first air outlet 601 and the second air outlet 602 is 90°, which is not limited thereto and is not specifically limited.

In this embodiment, dual air outlets are used to blow out the heat source of the whole machine from different directions to reduce heat accumulation. At the same time, the air outlet path of the second air outlet 602 can sweep the 5G module PCB board 3 to strengthen the 5G module PCB board 3 heat dissipation. In addition, by judging the temperature of the CPU main board 2 and the 5G module PCB board 3 , the rotation of the revolving door 9 is controlled, so that the air volume of the second air outlet 602 can be reasonably distributed, so as to improve the heat dissipation efficiency of the centrifugal fan 6 . Preferably, two heat pipes 10 for connecting the No. 1 fin 7 and the No. 2 fin 8 are disposed below the CPU motherboard 2, and the heat pipe 10 is welded to the fins to guide the heat to the air outlet direction of the two fins respectively. Thereby, the heat dissipation efficiency of the CPU motherboard 2 is further improved.

On the basis of the above embodiments, in an optional embodiment of the present invention, an air guide cover 11 is provided corresponding to the second air outlet 602, and the air outlet of the air guide cover 11 is facing the 5G module PCB board 3 and the second fin 8. Specifically, the 5G module PCB board 3 is arranged side by side with the second fin 8 and separated by a partition, the rotation center of the revolving door 9 is located on the center line of the partition, and the initial position of the revolving door 9 is parallel to the partition .

Exemplarily, the revolving door 9 is driven to rotate through the rotating electromagnet 12, one end of the rotating electromagnet 12 is fixed on the wind guide cover 11, and the other end is fitted and connected with the revolving door 9 through a rotating shaft, and the height of the revolving door 9 is the same as that of the second outlet. The tuyere 602 has the same height, and the rotation angle can be set to 15°, 30°, 45°, 60°, 75°, 90°, etc. What needs to be mentioned is that the rotating electromagnet 12 rotates to a fixed angle after being energized, and is reset by a self-contained spring when the power is turned off, and can only rotate within a fixed angle. It can be divided into clockwise and counterclockwise rotation. When the coil is energized, the iron core and the armature are magnetized to become two magnets with opposite polarities, and electromagnetic attraction is generated between them. When the suction force is greater than the reaction force of the spring, the armature begins to move toward the iron core. When the current in the coil is less than a certain value or the power supply is interrupted, the electromagnetic attraction force is less than the reaction force of the spring, and the armature will return to the original release position under the action of the reaction force.

The present invention also provides a heat dissipation control method, which is applied to the above-mentioned industrial control host supporting 5G. The rotating electromagnet 12 is electrically connected to the CPU main board 2, and the rotation command for generating the revolving door 9 includes:

When the temperature of the CPU motherboard 2 is <45°C, the revolving door 9 rotates 60° clockwise;

When the temperature of the CPU motherboard 2 is greater than or equal to 50°C, the revolving door 9 rotates counterclockwise by 30°;

When the temperature of the CPU motherboard 2 is greater than or equal to 60°C, the revolving door 9 rotates counterclockwise by 45°;

When the temperature of the CPU motherboard 2 is ≥75°C, the revolving door 9 rotates 60° counterclockwise;

or,

When the temperature of the 5G module PCB board 3 is <30°C, the revolving door 9 rotates 60° counterclockwise;

When the temperature of the 5G module PCB board 3 is ≥35°C, the revolving door 9 rotates 30° clockwise;

When the temperature of the 5G module PCB board 3 is ≥45°C, the revolving door 9 rotates 45° clockwise;

When the temperature of the PCB board 3 of the 5G module is ≥50° C., the revolving door 9 rotates 60° clockwise.

If the temperature of the CPU mainboard 2 or the temperature of the 5G module PCB board 3 satisfies the trigger conditions at the same time, the trigger condition with the highest temperature is given priority. For example, the temperature of the CPU main board 2 is 60°C, and the temperature of the 5G module PCB board 3 is 35°C. At this time, the temperature of the CPU main board 2 is high. The temperature of the CPU main board 2 is used as the trigger condition, and the revolving door 9 rotates counterclockwise by 45° .

On the basis of the above embodiments, in an optional embodiment of the present invention, it also includes a No. 1 temperature sensor built into the CPU main board 2 (that is, the temperature sensor that comes with the CPU main board 2) and a second temperature sensor configured on the 5G module PCB. No. temperature sensor, centrifugal fan 6 is electrically connected to CPU main board 2, and No. 1 temperature sensor or No. 2 temperature sensor transmits the detected temperature signal to CPU main board 2, and the instructions for generating and adjusting the speed of centrifugal fan 6 include:

When the temperature of the CPU motherboard 2 is less than 40°C and the temperature of the 5G module PCB board 3 is less than 30°C, the centrifugal fan 6 stops rotating;

When the temperature of the CPU motherboard 2 rises to 42°C or the temperature of the 5G module PCB board 3 rises to 32°C, the speed of the centrifugal fan 6 is adjusted to 2750r/min;

When the temperature of the CPU motherboard 2 rises to 47°C or the temperature of the 5G module PCB board 3 rises to 35°C, the speed of the centrifugal fan 6 is adjusted to 3000r/min;

When the temperature of the CPU main board 2 rises to 50°C or the temperature of the 5G module PCB board 3 rises to 38°C, the speed of the centrifugal fan 6 is triggered to be adjusted to 3250r/min;

When the temperature of the CPU motherboard 2 rises to 58°C or the temperature of the 5G module PCB board 3 rises to 45°C, the speed of the centrifugal fan 6 is adjusted to 3900r/min;

When the temperature of the CPU motherboard 2 rises to 60°C or the temperature of the 5G module PCB board 3 rises to 45°C, the speed of the centrifugal fan 6 is adjusted to 4200r/min;

When the temperature of the CPU motherboard 2 rises to 70°C or the temperature of the 5G module PCB board 3 rises to 55°C, the speed of the centrifugal fan 6 is adjusted to 4500r/min;

When the temperature of the CPU main board 2 or the 5G module PCB board 3 respectively meets the trigger conditions of the two speeds, the command with a high speed is executed. For example, the temperature of the CPU motherboard 2 is 60°C, and the temperature of the 5G module PCB board 3 is 55°C. At this time, the temperature of the 5G module PCB board 3 corresponds to the high speed of the centrifugal fan 6. Therefore, the speed of the centrifugal fan 6 is adjusted to 4500r /min command.

Preferably, when the temperature of the CPU main board 2 and the 5G module PCB board 3 drops, the rotation speed corresponding to the current temperature is commanded to drop to a speed of one speed every two seconds. For example, if the temperature of the CPU main board 2 drops from 70°C to 47°C, and the temperature of the 5G module PCB board 3 is 30°C, the speed of the centrifugal fan 6 is changed from 4500r/min to 4200r/min and 3900r/min every two seconds. min, 3250r/min command until the speed drops to 3000r/min.

It should be noted that, in this embodiment, the rotation angle of the revolving door 9 is controlled by temperature, so that the air volume of the second air outlet 602 can be reasonably distributed to achieve the best heat dissipation efficiency. In addition, by controlling the rotational speed of the centrifugal fan 6 to prevent the fan from being at the maximum rotational speed all the time, thereby reducing noise and ensuring the service life of the fan.

The above are only preferred implementations of the present invention, and the protection scope of the present invention is not limited to the above-mentioned embodiments, and all technical solutions under the idea of the present invention belong to the protection scope of the present invention.

Claims (10)

1. An industrial control host supporting 5G, comprising a body and a CPU motherboard and a 5G module PCB board placed in the body, characterized in that, It also includes a first heat dissipation device and a second heat dissipation device; The first heat dissipation device includes a heat sink and a heat dissipation layer placed between the heat sink and the 5G module PCB board, The second heat dissipation device includes a centrifugal fan, and the centrifugal fan has a first air outlet and a second air outlet, wherein the first air outlet blows to the No. 1 fin, and the second air outlet blows to the No. 2 fin. Fins and 5G module PCB board; and a revolving door is provided on the blowing path of the second air outlet, and the revolving door is configured to be higher than the temperature of the CPU motherboard when the temperature of the 5G module PCB board , turn toward the direction of the No. 2 fin; or turn toward the direction of the 5G module PCB when the temperature of the CPU motherboard is higher than that of the 5G module PCB. 2. The industrial control host supporting 5G according to claim 1, wherein the heat dissipation layer is made of silicone grease or gel, and the heat dissipation layer accounts for at least 70% of the PCB area of the 5G module. 3. The industrial control host supporting 5G according to claim 1, wherein a copper layer is laid on the bottom of the 5G module PCB, and the copper layer accounts for at least 50% of the area of the 5G module PCB. 4. The industrial control host supporting 5G according to claim 1, wherein an air guide cover is provided corresponding to the second air outlet, and the air outlet of the air guide cover is facing the 5G module PCB board and the second air outlet. No. fins, the revolving door is arranged on the wind guide hood. 5 . The industrial control host supporting 5G according to claim 1 , wherein a heat pipe for connecting the No. 1 fin and the No. 2 fin is arranged under the CPU motherboard. 6. The industrial control host supporting 5G according to claim 1, wherein the revolving door is driven to rotate by a rotating electromagnet. 7. The industrial control host supporting 5G according to claim 1, wherein the rotation angle of the revolving door is 15° or 30° or 45° or 60° or 75° or 90°. 8. A heat dissipation control method applied to the 5G-supporting industrial control host as claimed in claim 1, wherein generating the rotation instruction of the revolving door comprises: When the temperature of the CPU motherboard is <45°C, the revolving door rotates clockwise by 60°; When the temperature of the CPU motherboard is ≥50°C, the revolving door rotates counterclockwise by 30°; When the temperature of the CPU motherboard is ≥60°C, the revolving door rotates counterclockwise by 45°; When the temperature of the CPU motherboard is ≥75°C, the revolving door rotates 60° counterclockwise; or, When the temperature of the 5G module PCB board is <30°C, the revolving door rotates 60° counterclockwise; When the temperature of the 5G module PCB board is ≥35°C, the revolving door rotates 30° clockwise; When the temperature of the 5G module PCB board is ≥45°C, the revolving door rotates 45° clockwise; When the temperature of the 5G module PCB board is ≥50°C, the revolving door rotates 60° clockwise; If the temperature of the CPU main board or the 5G module PCB board meets the trigger conditions at the same time, the trigger condition with the highest temperature is given priority. 9. The heat dissipation control method according to claim 8, further comprising a No. 1 temperature sensor built into the CPU motherboard and a No. 2 temperature sensor configured on the 5G module PCB, the centrifugal fan and The main board of the CPU is electrically connected, and the No. 1 temperature sensor or the No. 2 temperature sensor transmits the detected temperature signal to the main board of the CPU, and generating an instruction for adjusting the rotational speed of the centrifugal fan includes: When the temperature of the CPU motherboard is less than 40°C and the temperature of the 5G module PCB is less than 30°C, the centrifugal fan stops rotating; When the temperature of the CPU motherboard rises to 42°C or the temperature of the 5G module PCB board rises to 32°C, the speed of the centrifugal fan is adjusted to 2750r/min; When the temperature of the CPU motherboard rises to 47°C or the temperature of the 5G module PCB board rises to 35°C, the speed of the centrifugal fan is triggered to be adjusted to 3000r/min; When the temperature of the CPU motherboard rises to 50°C or the temperature of the 5G module PCB board rises to 38°C, the speed of the centrifugal fan is triggered to be adjusted to 3250r/min; When the temperature of the CPU motherboard rises to 58°C or the temperature of the 5G module PCB board rises to 45°C, the speed of the centrifugal fan is adjusted to 3900r/min; When the temperature of the CPU motherboard rises to 60°C or the temperature of the 5G module PCB board rises to 45°C, the speed of the centrifugal fan is adjusted to 4200r/min; When the temperature of the CPU motherboard rises to 70°C or the temperature of the 5G module PCB board rises to 55°C, the speed of the centrifugal fan is adjusted to 4500r/min; If the temperature of the CPU main board or the 5G module PCB board meets the trigger conditions of the two speeds respectively, the command with a high speed is executed. 10 . The heat dissipation control method according to claim 9 , wherein when the temperature of the CPU main board and the 5G module PCB board drops, the speed corresponding to the current temperature is reduced to a speed command every two seconds. 11 .

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