CN115971366B - Processing equipment for semiconductor production - Google Patents
Processing equipment for semiconductor productionInfo
- Publication number
- CN115971366B CN115971366B CN202211628519.5A CN202211628519A CN115971366B CN 115971366 B CN115971366 B CN 115971366B CN 202211628519 A CN202211628519 A CN 202211628519A CN 115971366 B CN115971366 B CN 115971366B
- Authority
- CN
- China
- Prior art keywords
- belt mechanism
- frame
- transmission
- concave
- chip semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses processing equipment for semiconductor production, which relates to the technical field of semiconductor production, and comprises a conveying device, wherein the conveying device comprises a feeding conveying belt mechanism and a discharging conveying belt mechanism, a die holder is fixedly arranged on the conveying device, a motor enables the feeding conveying belt mechanism and the discharging conveying belt mechanism to synchronously rotate through a synchronous belt, a driven gear is driven to rotate through a driving gear, a rocker arm drives a concave frame to repeatedly slide through a brace, then a chip semiconductor is conveyed to a concave block in a follow-up mode through a concave frame, the concave frame simultaneously enables a pressing bar to press a plurality of pins to be in an L shape through a connecting rod mechanism, when the concave frame reversely slides, a first gear is driven to rotate through a rack, a pushing frame is driven to upwards move along a transverse plate through a screw rod, the chip semiconductor can be overturned and removed, and the chip semiconductor is rapidly discharged through the discharging conveying belt mechanism, so that pin high-efficiency processing of the chip semiconductor is realized.
Description
Technical Field
The invention relates to the technical field of semiconductor production, in particular to processing equipment for semiconductor production.
Background
When processing a packaged chip semiconductor, the pins of the chip semiconductor need to be bent before the chip semiconductor and the substrate are fixedly mounted, and when the conventional bending processing is performed, the pins of the chip semiconductor are usually clamped with the mounting clamping seats of the chip semiconductor after the bending processing, so that the chip semiconductor finished product is difficult to discharge, and therefore, the chip semiconductor cannot be effectively discharged in the processing process, so that the production efficiency of the chip semiconductor is difficult to improve.
Disclosure of Invention
The invention aims to solve the problem that a drainage structure needs to occupy a large space of a fish pond (simply described problem), and provides processing equipment for semiconductor production.
In order to solve the technical problems, the processing equipment for semiconductor production comprises a conveying device, wherein the conveying device comprises a feeding conveying belt mechanism and a discharging conveying belt mechanism, a die holder is fixedly arranged on the conveying device, a chip semiconductor is placed on the die holder, the feeding conveying belt mechanism and the discharging conveying belt mechanism are in transmission connection with a power assembly, the power assembly is in transmission connection with a linkage assembly, the linkage assembly is in transmission connection with a feeding assembly, the feeding assembly is in transmission connection with a stripping assembly, the stripping assembly is in transmission connection with a pressing assembly, the bottom end of the pressing assembly is in lamination connection with the upper surface of the chip semiconductor, the stripping assembly is in lamination connection with the bottom surface of the chip semiconductor, the chip semiconductor is placed by the feeding conveying belt mechanism, then the power assembly works through the transmission feeding assembly, the chip semiconductor is conveyed to the die holder, and meanwhile, the feeding assembly works through the pressing assembly, after the chip semiconductor is processed by the pressing assembly, the chip semiconductor can be stripped through the stripping assembly, and then the chip semiconductor is conveyed by the conveying belt mechanism.
The die seat comprises a concave block, the upper surface of the concave block is provided with a chip semiconductor, the bottom surface of the concave block is fixedly provided with a plurality of L-shaped blocks, the L-shaped blocks are fixedly connected with the inner wall of the mounting frame, the chip semiconductor can be conveyed to the concave block, the plurality of L-shaped blocks are arranged to enable the concave block to be fixedly installed, so that the chip semiconductor is pressed and processed, the power assembly comprises a motor, the motor is fixedly connected with the mounting frame, the output end of the motor is rotatably connected with the mounting frame, the output end of the motor is in transmission connection with a first belt mechanism, one end of the first belt mechanism is in transmission connection with a second belt mechanism, the first belt mechanism, the second belt mechanism and the feeding belt mechanism are fixedly connected, the chip semiconductor can be conveyed to the concave block, the plurality of L-shaped blocks can enable the concave block to be fixedly installed, so that the chip semiconductor is in compression-processed, the power assembly comprises a motor, the motor is fixedly connected with the mounting frame, the output end of the motor is in transmission connection with the output end of the motor, the first belt mechanism is in transmission connection with a second belt mechanism, the first belt mechanism is in transmission connection with a transmission shaft, the second belt mechanism is in transmission connection with a transmission shaft, the transmission shaft is fixedly connected with a transmission shaft of a transmission belt, the transmission shaft is in transmission shaft is fixedly connected with the transmission shaft, the transmission shaft is in transmission connection with the transmission shaft, and is in transmission connection with a transmission shaft, and the transmission shaft is in transmission connection with a transmission shaft, the driving gear drives the driven gear to rotate, then the rocker arm is rotated on the support through the rotating shaft, and the feeding component works through the rocker arm.
Preferably, the feeding assembly comprises a brace, one end of the brace is rotationally connected with a rocker arm, the other end of the brace is rotationally connected with a concave frame, the bottom end of the concave frame is in sliding connection with a mounting frame, the concave frame is in transmission connection with a stripping assembly, the bottom end of the concave frame is fixedly connected with a concave frame, the bottom surface of the concave frame is attached and connected with a feeding conveyor belt mechanism, the rocker arm rotates to enable the brace to repeatedly move, then the concave frame repeatedly slides along the mounting frame, the stripping assembly is enabled to work through the concave frame, the repeatedly moved concave frame enables a chip semiconductor to be carried to a concave block, the stripping assembly comprises a strip-shaped plate and a rack, one end of the strip-shaped plate is in transmission connection with a pressing assembly, the other end of the strip-shaped plate is rotationally connected with an L-shaped plate, one end of the L-shaped plate is rotationally connected with the concave frame, the rack is fixedly connected with a first carriage and a second carriage, the second carriage is in sliding connection with the mounting frame, the rack is in sliding connection with a first gear, the first gear is fixedly connected with the first carriage, the first gear is enabled to slide along the mounting frame, the chip is enabled to work, the chip semiconductor is enabled to be carried by the sliding frame through the sliding frame, the pin is enabled to be fixedly connected with the sliding frame, the pin is enabled to slide along the L-shaped plate, the pin is enabled to be pushed down, the sliding frame is simultaneously, the pin is enabled to be fixedly connected with the sliding frame, and the chip is enabled to be pushed down, and the carrier is enabled to be fixedly and the chip carrier is connected with the chip carrier through the sliding assembly through the sliding frame, the pressing component comprises two connecting rods, one end of each connecting rod is rotationally connected with the support, a shaft in one end of each connecting rod is fixedly connected with the strip-shaped plate, the other ends of the two connecting rods are rotationally connected with the vertical plates, the bottom ends of the vertical plates are fixedly connected with pressing plates, the bottom surfaces of the pressing plates are in fit connection with the upper surface of the chip semiconductor, a plurality of arc-shaped arms are fixedly arranged on the surfaces of the two sides of the pressing plates, pressing strips are fixedly arranged at the bottom ends of the arc-shaped arms, the bottom surfaces of the pressing strips are in fit connection with the connecting pins, the strip-shaped plate swings, the vertical plates can move in an arc shape through the two connecting rods, the vertical plates can keep a vertical flat state, and then the plurality of pins on the chip semiconductor are simultaneously pressed and held in the L shape through the two pressing strips on the two sides of the pressing plates.
Compared with the prior art, the invention has the beneficial effects that:
1. The motor makes feeding conveyer belt mechanism and ejection of compact conveyer belt mechanism synchronous rotation through the hold-in range to rotate through the driven gear of driving gear drive, make the rocking arm drive concave frame through the brace and slide repeatedly, then make the chip semiconductor follow one through concave frame and carry to concave piece department, and the concave frame makes the layering press and hold a plurality of pins to be L shape through link mechanism simultaneously, when concave frame slides in opposite directions, can pass through the first gear rotation of rack drive, push away the frame through the lead screw drive and follow the diaphragm and upwards remove, make chip semiconductor can overturn and take off the material, and pass through ejection of compact conveyer belt mechanism quick ejection of compact, realize the pin high efficiency processing of chip semiconductor.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of the whole of the present invention.
FIG. 2 is a schematic view of a structural power unit according to the present invention.
FIG. 3 is a schematic view of a stripping assembly according to the present invention.
FIG. 4 is a schematic view of a press-holding assembly according to the present invention.
FIG. 5 is an enlarged schematic view of the structure of the present invention at A in FIG. 4.
The device comprises a conveying device 1, a mounting frame 12, a feeding conveying belt mechanism 13, a discharging conveying belt mechanism 2, a die holder 21, a concave block 22, an L-shaped block 3, a chip semiconductor 31, a pin 4, a linkage assembly 41, a driven gear 42, a rotating shaft 43, a rocker arm 44, a bracket 5, a feeding assembly 51, a brace 52, a concave frame 53, a concave frame 6, a pressing assembly 61, a vertical plate 62, a pressing plate 63, an arc-shaped arm 64, a pressing bar 65, a connecting rod 7, a stripping assembly 71, a strip plate 72, an L-shaped plate 73, a first sliding frame 74, a rack 75, a second sliding frame 76, a first gear 77, a lead screw 78, a transverse plate 79, a pushing frame 791, a connecting block 8, a power assembly 81, a motor 82, a first belt mechanism 83, a second belt mechanism 84 and a driving gear.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1-5, the invention provides processing equipment for semiconductor production, which comprises a conveying device 1, wherein the conveying device 1 comprises a feeding conveying belt mechanism 12 and a discharging conveying belt mechanism 13, a die holder 2 is fixedly arranged on the conveying device 1, a chip semiconductor 3 is placed on the die holder 2, the feeding conveying belt mechanism 12 and the discharging conveying belt mechanism 13 are in transmission connection with a power component 8, the power component 8 is in transmission connection with a linkage component 4, the linkage component 4 is in transmission connection with a feeding component 5, the feeding component 5 is in transmission connection with a stripping component 7, the stripping component 7 is in transmission connection with a pressing component 6, the bottom end of the pressing component 6 is in lamination connection with the upper surface of the chip semiconductor 3, and the stripping component 7 is in lamination connection with the bottom surface of the chip semiconductor 3.
Through adopting above-mentioned technical scheme, chip semiconductor 3 is placed by feeding conveyor belt mechanism 12, then power component 8 is through transmission pay-off subassembly 5 work, makes chip semiconductor 3 carry to mould seat 2 department, and pay-off subassembly 5 makes to take off material subassembly 7 and hold subassembly 6 work simultaneously, makes to hold subassembly 6 behind the processing of chip semiconductor 3, can take off the material through taking off material subassembly 7, then chip semiconductor 3 is carried the ejection of compact by ejection of compact conveyor belt mechanism 13.
The feeding conveyer belt mechanism 12 and the discharging conveyer belt mechanism 13 are rotationally connected with a mounting frame 11, a fixed connection type die holder 2 is arranged between the inner walls of the mounting frame 11, and the mounting frame 11 is rotationally connected with the power assembly 8.
By adopting the technical scheme, the power assembly 8 drives the feeding conveying belt mechanism 12 and the discharging conveying belt mechanism 13 to rotate in the mounting frame 11, so that the conveying work of the chip semiconductor 3 is realized.
The die holder 2 comprises a concave block 21, a chip semiconductor 3 is placed on the upper surface of the concave block 21, a plurality of L-shaped blocks 22 are fixedly arranged on the bottom surface of the concave block 21, and the L-shaped blocks 22 are fixedly connected with the inner wall of the mounting frame 11.
By adopting the above-described technical scheme, the chip semiconductor 3 can be conveyed to the concave block 21, and the provision of the plurality of L-shaped blocks 22 enables the concave block 21 to be fixedly mounted, so that the chip semiconductor 3 is subjected to the holding process.
The power assembly 8 comprises a motor 81, the motor 81 is fixedly connected with the mounting frame 11, the output end of the motor 81 is rotationally connected with the mounting frame 11, the output end of the motor 81 is in transmission connection with a first belt mechanism 82, one end of the first belt mechanism 82 is in transmission connection with a second belt mechanism 83, the first belt mechanism 82 and the second belt mechanism 83 are in transmission connection with the feeding conveying belt mechanism 12 and the discharging conveying belt mechanism 13, one end of the second belt mechanism 83 is in transmission connection with a driving gear 84, and the driving gear 84 is in transmission connection with the linkage assembly 4.
By adopting the above technical scheme, the output end of the motor 81 drives the first belt mechanism 82 and the second belt mechanism 83 to rotate, and then the feeding conveyor belt mechanism 12 and the discharging conveyor belt mechanism 13 are synchronously rotated in the mounting frame 11.
The linkage assembly 4 comprises a driven gear 41, the driven gear 41 is meshed with a driving gear 84, a rotating shaft 42 is fixedly arranged in the driven gear 41, the rotating shaft 42 is rotatably connected with a support 44, the bottom end of the support 44 is fixedly connected with the mounting frame 11, the rotating shaft 42 is fixedly connected with a rocker arm 43, and the rocker arm 43 is in transmission connection with the feeding assembly 5.
By adopting the technical scheme, the driving gear 84 drives the driven gear 41 to rotate, then the rocker arm 43 is rotated on the bracket 44 through the rotating shaft 42, and the feeding assembly 5 is operated through the rocker arm 43.
The feeding assembly 5 comprises a brace 51, one end of the brace 51 is rotationally connected with the rocker arm 43, the other end of the brace 51 is rotationally connected with a concave frame 52, the bottom end of the concave frame 52 is slidably connected with the mounting frame 11, the concave frame 52 is in transmission connection with the stripping assembly 7, the bottom end of the concave frame 52 is fixedly connected with a concave frame 53, and the bottom surface of the concave frame 53 is in fit connection with the feeding conveyor mechanism 12.
By adopting the technical scheme, the rotation of the rocker arm 43 can realize the repeated movement of the brace 51, so that the concave frame 52 repeatedly slides along the mounting frame 11, the stripping assembly 7 works through the concave frame 52, and the repeatedly moved concave frame 53 can enable the chip semiconductor 3 to be conveyed to the concave block 21 in a follow-up way.
The stripping assembly 7 comprises a strip-shaped plate 71 and a rack 74, one end of the strip-shaped plate 71 is in transmission connection with the pressing assembly 6, the other end of the strip-shaped plate 71 is rotationally connected with an L-shaped plate 72, one end of the L-shaped plate 72 is rotationally connected with a concave frame 52, the rack 74 is fixedly connected with a first sliding frame 73 and a second sliding frame 75, the first sliding frame 73 is fixedly connected with the concave frame 52, the second sliding frame 75 is in sliding connection with the mounting frame 11, the rack 74 is in meshed connection with a first gear 76, the first gear 76 is fixedly connected with a screw rod 77, the screw rod 77 is rotationally connected with a transverse plate 78, a pushing frame 79 is in sliding connection with the transverse plate 78, a connecting block 791 is fixedly arranged in the pushing frame 79, the connecting block 791 is in threaded connection with the screw rod 77, and the upper surface of the pushing frame 79 is in fitting connection with the bottom surface of the chip semiconductor 3.
Through adopting above-mentioned technical scheme, the repeated removal of concave frame 52 can make L shaped plate 72 drive strip shaped plate 71 follow the swing of support 44, makes the pressure hold subassembly 6 work then, and the concave frame 52 makes rack 74 transmission first gear 76 rotate simultaneously, can push away frame 79 and reciprocate along diaphragm 78 through the transmission of lead screw 77 then, realizes that the chip semiconductor 3 that is held by pressure can take off the material.
The chip semiconductor 3 is fixedly provided with a plurality of pins 31, and the pins 31 are in fit connection with the pressing component 6.
By adopting the above technical scheme, the plurality of pins 31 on the chip semiconductor 3 can be pressed and held in an L shape.
The pressing component 6 comprises two connecting rods 65, one ends of the two connecting rods 65 are rotatably connected with the bracket 44, one shaft in one end of each connecting rod 65 is fixedly connected with a strip-shaped plate 71, the other ends of the two connecting rods 65 are rotatably connected with a vertical plate 61, the bottom end of the vertical plate 61 is fixedly connected with a pressing plate 62, the bottom surfaces of the pressing plates 62 are attached to the upper surface of the chip semiconductor 3, a plurality of arc-shaped arms 63 are fixedly arranged on the surfaces of two sides of the pressing plate 62, pressing strips 64 are fixedly arranged at the bottom ends of the arc-shaped arms 63, and the bottom surfaces of the pressing strips 64 are attached to the connecting pins 31.
By adopting the above technical scheme, the strip-shaped plate 71 swings, the vertical plate 61 can move in an arc shape through the two connecting rods 65, and the vertical plate 61 can keep a vertical flat state, and then the plurality of pins 31 on the chip semiconductor 3 are simultaneously pressed and held in an L shape through the two pressing strips 64 on the two sides of the pressing plate 62.
The working principle is that the output end of a motor 81 drives a first belt mechanism 82 and a second belt mechanism 83 to rotate, so that when the feeding belt mechanism 12 and the discharging belt mechanism 13 synchronously rotate in a mounting frame 11 and bend pins 31 of chip semiconductors 3, a plurality of chip semiconductors 3 are placed at a concave frame 53 one by one, one end of the second belt mechanism 83 drives a driving gear 84 to drive a driven gear 41 to rotate, a rocker arm 43 is driven to rotate through a rotating shaft 42, a brace 51 drives a concave frame 52 to repeatedly slide along the mounting frame 11, the chip semiconductors 3 are conveyed to a concave block 21, when the chip semiconductors 3 are conveyed to the concave block 21, the concave frame 52 drives an L-shaped plate 72 to drive a strip-shaped plate 71 to rotate along a bracket 44, a vertical plate 61 moves downwards in an arc shape through two connecting rods 65, the vertical plate 61 can keep a vertical flat state, then the plurality of pins 31 are pressed to be in an L shape through two pressing bars 64 on two sides of a pressing plate 62, then the concave frame 52 reversely slides, the first gear 76 can rotate through a rack 74, then the lead screw 77 drives a pushing frame 79 to move upwards along a plate 78, the chip semiconductors 3 can be conveyed to the concave block 21, and then the chip semiconductors 3 can be conveyed out of the concave frame 13 from the concave frame through the concave frame, and the chip semiconductors 3 can be processed, and the chip semiconductors 3 can be conveyed to the discharging belt mechanism 13 after the chip semiconductors are conveyed to the concave frame 13, and the chip semiconductors are conveyed to the chip semiconductors 13, and the chip semiconductors are processed.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211628519.5A CN115971366B (en) | 2022-12-17 | 2022-12-17 | Processing equipment for semiconductor production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211628519.5A CN115971366B (en) | 2022-12-17 | 2022-12-17 | Processing equipment for semiconductor production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115971366A CN115971366A (en) | 2023-04-18 |
| CN115971366B true CN115971366B (en) | 2025-08-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211628519.5A Active CN115971366B (en) | 2022-12-17 | 2022-12-17 | Processing equipment for semiconductor production |
Country Status (1)
| Country | Link |
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| CN (1) | CN115971366B (en) |
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| CN106180447A (en) * | 2016-08-24 | 2016-12-07 | 舟山市新龙电子设备有限公司 | A kind of band material conveying device |
| CN112775672A (en) * | 2020-12-16 | 2021-05-11 | 瑞安市古风网络科技有限公司 | Punching machine for producing special-shaped street lamp side plate and using method thereof |
| CN216461371U (en) * | 2021-12-28 | 2022-05-10 | 曲阜市巨力铁路轨道工程股份有限公司 | Wetland grip-pad mould convenient to drawing of patterns |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100212394B1 (en) * | 1996-10-09 | 1999-08-02 | 김규현 | Trim / Foaming Equipment for Semiconductor Package Manufacturing |
| JP5396576B2 (en) * | 2009-04-09 | 2014-01-22 | ホソダクリエイティブ株式会社 | Conveying device and processing device |
| DE102017124148A1 (en) * | 2017-10-17 | 2019-04-18 | Schuler Pressen Gmbh | Embossing press and method for embossing a blank |
| DE202019106561U1 (en) * | 2019-11-26 | 2019-12-11 | Zhejiang JinaoLan Machine Tools Co | Coupling mechanism on a punching machine |
| CN113000710A (en) * | 2021-04-20 | 2021-06-22 | 杨柏 | Efficient stamping die for machining automobile sheet metal parts and using method thereof |
| CN113751566A (en) * | 2021-09-08 | 2021-12-07 | 六安华科电机有限公司 | Forming device convenient for machining motor shell |
| CN114029397B (en) * | 2021-11-05 | 2023-05-05 | 江西伟德智能电气有限公司 | Pressing device for switch socket |
| CN216461075U (en) * | 2021-11-12 | 2022-05-10 | 大连加士佳科技发展有限公司 | A stripping mechanism for sheet metal stamping |
| CN114985954A (en) * | 2022-07-07 | 2022-09-02 | 牟向晖 | Clothing manufacturing is with laser marking auxiliary device who prevents skew |
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2022
- 2022-12-17 CN CN202211628519.5A patent/CN115971366B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106180447A (en) * | 2016-08-24 | 2016-12-07 | 舟山市新龙电子设备有限公司 | A kind of band material conveying device |
| CN112775672A (en) * | 2020-12-16 | 2021-05-11 | 瑞安市古风网络科技有限公司 | Punching machine for producing special-shaped street lamp side plate and using method thereof |
| CN216461371U (en) * | 2021-12-28 | 2022-05-10 | 曲阜市巨力铁路轨道工程股份有限公司 | Wetland grip-pad mould convenient to drawing of patterns |
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| Publication number | Publication date |
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| CN115971366A (en) | 2023-04-18 |
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