CN115958302A - LED panel repair method and LED panel repair equipment - Google Patents
LED panel repair method and LED panel repair equipment Download PDFInfo
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- CN115958302A CN115958302A CN202211729356.XA CN202211729356A CN115958302A CN 115958302 A CN115958302 A CN 115958302A CN 202211729356 A CN202211729356 A CN 202211729356A CN 115958302 A CN115958302 A CN 115958302A
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000003822 epoxy resin Substances 0.000 claims abstract description 87
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 87
- 230000002159 abnormal effect Effects 0.000 claims abstract description 72
- 238000001514 detection method Methods 0.000 claims abstract description 18
- 230000001678 irradiating effect Effects 0.000 claims abstract description 4
- 230000008016 vaporization Effects 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 9
- 239000004593 Epoxy Substances 0.000 claims description 6
- 230000000007 visual effect Effects 0.000 claims description 4
- 238000002309 gasification Methods 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The invention discloses an LED panel repair method and LED panel repair equipment, wherein the LED panel repair method comprises the following steps: lightening an LED panel and acquiring abnormal point LED coordinates of the LED panel; respectively detecting the thickness of the epoxy resin packaged on each abnormal point LED according to the abnormal point LED coordinates; and setting corresponding laser power according to the thickness of the epoxy resin on each abnormal point LED, irradiating the abnormal point LED area by laser, and gasifying the epoxy resin. According to the LED panel repair method, the abnormal point LEDs of the LED panel are searched and positioned in the step S1, then the thickness detection is respectively carried out on each abnormal point LED of the LED panel in the step S2, the corresponding laser power is set according to the thickness difference of the epoxy resin on each abnormal point LED in the step S3, the packaged epoxy resin is removed in a laser gasification mode, the follow-up repair is facilitated, and the epoxy resin is removed completely.
Description
Technical Field
The invention relates to the technical field of LED panels, in particular to an LED panel repair method and LED panel repair equipment.
Background
An LED is an abbreviation of Light emitting diode, a piece of electroluminescent semiconductor material. The internal structure is a PN junction and has unidirectional conductivity. The LED mainly comprises the following parts: LED chip (function: light source emitting), support: including substrate and heat dissipation base, pin etc. (effect: heat dissipation, electrical conduction), gold wires (function: electrical conduction), transparent epoxy resin (function: protection of crystal grains, light transmission).
The LED panel integrates a plurality of LEDs. In production, the LED panel needs to be subjected to lighting test, and because the LED is packaged with epoxy resin, if an abnormal LED which cannot be lighted or is abnormally lighted exists, the LED is difficult to repair.
Disclosure of Invention
The invention aims to provide an LED panel repair method and LED panel repair equipment, which are convenient for repairing LEDs at abnormal points.
The invention discloses a method for repairing an LED panel, which comprises the following steps:
lightening an LED panel and acquiring abnormal point LED coordinates of the LED panel;
respectively detecting the thickness of the epoxy resin packaged on each abnormal point LED according to the abnormal point LED coordinates;
and setting corresponding laser power according to the thickness of the epoxy resin on each abnormal point LED, irradiating the abnormal point LED area by laser, and gasifying the epoxy resin.
Optionally, the standard thickness of the epoxy resin is D, the measured thickness is D, and the fluctuation of the thickness is D-D; the laser windowing power of the epoxy resin with the thickness of D is p; if the measured thickness D1 is D + (D-D) max The laser windowing power of the epoxy resin is p1;
the step of setting the corresponding laser power according to the thickness of the epoxy resin on each abnormal point LED further comprises: when the thickness of the epoxy resin fluctuates around D, the actual output power required by laser windowing and the thickness change of the epoxy resin are in a linear relation, and the actual output power P = P + (D-D) × K, wherein K = (P1-P)/(D1-D).
Optionally, the laser irradiates the abnormal point LED, and the step of vaporizing the epoxy resin further includes: and (3) gasifying the abnormal point LED epoxy resin by laser, and reserving the LED chip of the abnormal point LED.
Optionally, the laser irradiates the abnormal point LED, and the step of vaporizing the epoxy resin further includes: laser gasifies the epoxy resin of the abnormal point LED, and laser falls off the LED chip of the abnormal point LED.
Optionally, the laser irradiates the abnormal point LED, and the step of vaporizing the epoxy resin further includes: and gasifying the residual epoxy resin in the LED welding area by laser.
Optionally, the LEDs comprise red LED chips, green LED chips, and blue LED chips; the step of laser shedding off the LED chip of the abnormal point LED further comprises the following steps: and a red light LED chip, a green light LED chip and a blue light LED chip of the one-time laser shedding abnormal point LED.
Optionally, the thickness of the epoxy resin on each abnormal point LED is detected by a thickness detection mechanism, the working distance of the thickness detection mechanism is 10mm ± 0.5mm, the measurement range is 0-600um, the measurement precision is ± 2um, the diameter of the light spot is 3.5um, and the light source is 440-780 nm multiband laser.
Optionally, the standard thickness of the epoxy resin is set to be 250um, the power of the laser windowing power is 13.5w, the frequency is 25khz, the speed is 1000mm/s, the filling mode is unidirectional filling, the filling distance is 0.02mm, the light-on delay is 200 μ s, the light-off delay is 150 μ s, and the processing times are 1.
Optionally, the laser power of the residual epoxy resin in the laser gasified LED welding area is 2.1w, the frequency is 25khz, the speed is 1000mm/s, the filling mode is unidirectional filling, the filling distance is 0.02mm, the on-light delay is 200 μ s, the off-light delay is 150 μ s, and the processing times are 2.
The invention also discloses an LED panel, and the LED panel repair method is applied.
According to the LED panel repair method, the abnormal point LEDs of the LED panel are searched and positioned in the step S1, then the thickness detection is respectively carried out on each abnormal point LED of the LED panel in the step S2, the corresponding laser power is set according to the thickness difference of the epoxy resin on each abnormal point LED in the step S3, the packaged epoxy resin is removed in a laser gasification mode, the follow-up repair is facilitated, and the epoxy resin is removed completely.
Drawings
The accompanying drawings, which are included to provide a further understanding of embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
FIG. 1 is a schematic diagram of an LED panel with outlier LEDs;
FIG. 2 is a schematic diagram of an LED panel and a lighting fixture according to an embodiment of the invention;
fig. 3 is a schematic diagram of a laser mechanism and a thickness detection mechanism according to an embodiment of the invention.
Wherein, 1, LED panel; 2. lighting the jig; 3. a thickness detection mechanism; 4. a laser mechanism.
Detailed Description
It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present invention may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
The invention is described in detail below with reference to the figures and alternative embodiments.
As an embodiment of the present invention, a method for repairing an LED panel is disclosed, which includes:
s1: lightening an LED panel and acquiring abnormal point LED coordinates of the LED panel;
s2: respectively detecting the thickness of the epoxy resin packaged on each abnormal point LED according to the abnormal point LED coordinates;
s3: and setting corresponding laser power according to the thickness of the epoxy resin on each abnormal point LED, irradiating the abnormal point LED area by laser, and gasifying the epoxy resin.
Referring to fig. 1, white schematic dots in each square in fig. 1 indicate abnormal LEDs (white for convenience of viewing) that cannot be lit on the LED panel 1, and other gray-white schematic dots around the abnormal LEDs indicate LEDs that can be normally lit. According to the LED panel repair method, the abnormal point LEDs for locating the LED panel 1 are searched through the step S1, then the thickness detection is respectively carried out on the abnormal point LEDs of each LED panel 1 through the step S2, the corresponding laser power is set according to the thickness difference of the epoxy resin on each abnormal point LED in the step S3, and the packaged epoxy resin is removed through a laser gasification mode, so that the follow-up repair is facilitated.
Specifically, in step S1, as shown in fig. 2, after the LED panel 1 is turned on, coordinates of the outlier LED can be obtained through visual detection, so as to obtain a location of the outlier LED. Specifically, the LED panel 1 can be lightened by adopting the lightening jig 2, the LED panel 1 is placed on the lightening jig 2, the LED panel 1 and the lightening jig 2 are connected through a connecting interface, and the lightening of the LED panel 1 is realized after the LED panel is electrified. Further, because the thickness of the encapsulating epoxy resin may have a certain difference due to factors such as a process, in step S2, the thickness of the epoxy resin encapsulated on each abnormal point LED is detected, and after the thickness of the epoxy resin of each abnormal point LED is obtained, a corresponding laser power is set for each thickness for laser vaporization, so that the epoxy resin is removed cleanly, and damage to the nearby intact LED or other components of the LED panel 1 is not easily caused. Namely, the LED panel repair method realizes the removal of the packaging epoxy resin through the mutual matching and cooperation among the steps S1-S3, is convenient for subsequent repair, can cleanly remove the epoxy resin, and is not easy to damage the side intact LED or other parts of the LED panel 1.
Specifically, the abnormal point LED region includes an LED chip of the abnormal point LED and a peripheral region thereof. In the invention, the epoxy resin can be removed independently, and the LED chip which can not be lightened is assembled with a new LED chip after being removed; or the epoxy resin is removed by laser, the LED chip is removed by laser vaporization, and then the new LED chip is directly assembled.
Optionally, the standard thickness of the epoxy resin is D, the measured thickness is D, and the fluctuation of the thickness is D-D; the laser windowing power of the epoxy resin with the thickness of D is p; the measured thickness D1 is D + (D-D) max The laser windowing power of the epoxy resin is p1; the step of setting the corresponding laser power according to the thickness of the epoxy resin on each abnormal point LED further comprises: when the thickness of the epoxy resin fluctuates around D, the actual output power required by laser windowing and the thickness change of the epoxy resin are in a linear relation, and the actual output power P = P + (D-D) × K, wherein K = (P1-P)/(D1-D).
Since there is a certain difference in the thickness of the encapsulating epoxy resin, the thickness fluctuates around the standard thickness D, and the fluctuation of the thickness is D-D. According to the scheme, the corresponding actual output power is actually determined according to the relation between the actual output power required by laser windowing and the thickness change of the epoxy resin through the actually detected thickness of the epoxy resin, so that the epoxy resin is accurately removed, and the laser control is accurate.
Specifically, the set standard thickness of the epoxy resin is 250um, and the fluctuation D-D of the thickness is +/-30 um; laser windowing power p =13.5w for epoxy resin of 250um thickness; if the measured thickness D1 is 250um +30um =280um (i.e., (D-D) max 30 um), the laser windowing power of the epoxy resin P1=15.75w, i.e. the actual output power P = P + (D-D) × K =13.5+ (D-250) × 0.075, wherein K = (P1-P)/(D1-D) = (15.75-13.5)/30 =0.075.
Optionally, the laser irradiates the abnormal point LED in step S3, and the step of vaporizing the epoxy resin further includes: laser gasifies the epoxy resin of the abnormal point LED, and the LED chip of the abnormal point LED is reserved. In the scheme, only the epoxy resin is removed by laser gasification, and the corresponding LED chip is reserved. The LED chips that are not removed may additionally be removed by other physical means. In another embodiment, the laser irradiates the abnormal point LED in step S3, and the step of vaporizing the epoxy resin further includes: and gasifying the epoxy resin of the abnormal point LED by laser, and enabling the laser to fall off the LED chip of the abnormal point LED. In this scheme, when laser gasification got rid of epoxy, the LED chip that will correspond drops through laser, and the LED chip drops in the epoxy recess after from laser beam machining, practices thrift the process, raises the efficiency. Specifically, the size of the LED chip is 0.1mil by 0.2mil.
Optionally, the laser irradiates the abnormal point LED in step S3, and the step of vaporizing the epoxy resin further includes: and gasifying the residual epoxy resin in the LED welding area by laser. In the scheme, the step S3 is a step of gasifying the epoxy resin by laser for the first time, and on the basis, the residual epoxy resin in the LED welding area is further removed, so that the epoxy resin is further cleaned, and the follow-up new LED assembly is ensured. Specifically, when laser gasification is used for removing, different laser powers are adopted on two sides of the LED welding area, different laser powers can be set according to different sizes of the LED welding area, and the efficiency and the effect of secondary laser removal are improved.
Specifically, the power of the residual epoxy resin in the laser gasification LED welding area is 2.1w, the frequency is 25khz, the speed is 1000mm/s, the filling mode is unidirectional filling, the filling distance is 0.02mm, the on-light delay is 200 mus, the off-light delay is 150 mus, and the processing times are 2.
Optionally, the LEDs comprise red LED chips, green LED chips and blue LED chips; the step of dropping the LED chip of the abnormal point LED by laser further comprises the following steps: and a red light LED chip, a green light LED chip and a blue light LED chip of the one-time laser shedding abnormal point LED. In this scheme, disposable laser drops ruddiness LED chip, green glow LED chip and the blue light LED chip of abnormal point LED, practices thrift the process, and is efficient.
Specifically, the thickness of the epoxy resin on each abnormal point LED is detected by a thickness detection mechanism, the working distance of the thickness detection mechanism is 10mm +/-0.5 mm, the measuring range is 0-600um, the measuring precision is +/-2 um, the diameter of a light spot is 3.5um, and the light source is 440-780 nm multiband laser. The laser projected by the thickness detection mechanism can reflect on the surfaces of the epoxy resin board and the PCB board to different degrees, the distances from the thickness detection mechanism to the surfaces of the epoxy resin board and the PCB board are respectively calculated through the reflection difference, and the distance difference is the thickness of the epoxy resin board.
Specifically, the set standard thickness of the epoxy resin is 250um, the power of the corresponding laser windowing power is 13.5w, the frequency is 25khz, the speed is 1000mm/s, the filling mode is unidirectional filling, the filling distance is 0.02mm, the light-on delay is 200 mus, the light-off delay is 150 mus, and the processing times are 1.
The invention also discloses LED panel repair equipment, which applies the LED panel repair method, and as shown in figure 3, the LED panel 1 repair equipment comprises a visual detection mechanism, a thickness detection mechanism 3 and a laser mechanism 4. Visual detection mechanism is used for detecting and obtaining 1 abnormal point LED coordinate of LED panel, and thickness detection mechanism 3 is used for detecting the thickness of the epoxy of encapsulation on every abnormal point LED, and laser mechanism 4 is used for the regional epoxy of laser gasification abnormal point LED.
Specifically, as shown in fig. 2, the LED panel 1 repairing apparatus further includes a lighting fixture 2, and the lighting fixture 2 is used for lighting the LED panel 1. During operation, the LED panel 1 is placed on the lighting fixture 2, the LED panel 1 is connected with the lighting fixture 2 through the connecting interface, and the lighting of the LED panel 1 is achieved after the LED panel is electrified.
It should be noted that, the limitations of the steps involved in the present disclosure are not considered to limit the order of the steps without affecting the implementation of the specific embodiments, and the steps written in the foregoing may be executed first, or executed later, or even executed simultaneously, and as long as the present disclosure can be implemented, all should be considered to belong to the protection scope of the present disclosure.
The foregoing is a further detailed description of the invention in connection with specific alternative embodiments and is not intended to limit the invention to the specific embodiments described herein. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. A method for repairing an LED panel is characterized by comprising the following steps:
lightening an LED panel to obtain the coordinates of abnormal points LED of the LED panel;
respectively detecting the thickness of the epoxy resin packaged on each abnormal point LED according to the abnormal point LED coordinates;
and setting corresponding laser power according to the thickness of the epoxy resin on each abnormal point LED, irradiating the abnormal point LED area by laser, and gasifying the epoxy resin.
2. Such as rightThe LED panel repair method of claim 1, wherein the standard thickness of the epoxy resin is D, the actual measured thickness is D, and the fluctuation of the thickness is D-D; the laser windowing power of the epoxy resin with the thickness of D is p; if the measured thickness D1 is D + (D-D) max The laser windowing power of the epoxy resin is p1;
the step of setting the corresponding laser power according to the thickness of the epoxy resin on each abnormal point LED further comprises:
when the thickness of the epoxy resin fluctuates around D, the actual output power required by laser windowing and the thickness change of the epoxy resin are in a linear relation, and the actual output power P = P + (D-D) × K, wherein K = (P1-P)/(D1-D).
3. The LED panel rework method of claim 1, wherein the laser irradiates an outlier LED, and the step of vaporizing the epoxy further comprises:
and (3) gasifying the abnormal point LED epoxy resin by laser, and reserving the LED chip of the abnormal point LED.
4. The LED panel rework method of claim 1, wherein the laser irradiates an outlier LED, and the step of vaporizing the epoxy further comprises:
laser gasifies the epoxy resin of the abnormal point LED, and laser falls off the LED chip of the abnormal point LED.
5. The LED panel rework method of claim 3 or 4, wherein the laser irradiates an abnormal point LED, and the step of vaporizing the epoxy resin further comprises:
and gasifying the residual epoxy resin in the LED welding area by laser.
6. The LED panel rework method of claim 4, wherein the LEDs include red, green, and blue LED chips; the step of laser shedding abnormal point LED chip further comprises:
and a red light LED chip, a green light LED chip and a blue light LED chip of the abnormal point LED are detached by the aid of the laser at one time.
7. The LED panel repairing method according to any one of claims 1 to 4, wherein the thickness of the epoxy resin on each abnormal point LED is detected by a thickness detecting mechanism, the working distance of the thickness detecting mechanism is 10mm +/-0.5 mm, the measuring range is 0-600um, the measuring precision is +/-2 um, the diameter of the light spot is 3.5um, and the light source is 440-780 nm multiband laser.
8. The method of claim 2, wherein the standard thickness of the epoxy resin is set to 250um, the power of the laser windowing power is 13.5w, the frequency is 25khz, the speed is 1000mm/s, the filling mode is unidirectional filling, the filling pitch is 0.02mm, the on-light delay is 200 μ s, the off-light delay is 150 μ s, and the processing times are 1.
9. The LED panel repair method of claim 5, wherein the laser power of the residual epoxy resin in the laser gasified LED welding area is 2.1w, the frequency is 25khz, the speed is 1000mm/s, the filling mode is unidirectional filling, the filling distance is 0.02mm, the on-light delay is 200 μ s, the off-light delay is 150 μ s, and the processing times are 2.
10. An LED panel repair apparatus to which the LED panel repair method according to any one of claims 1 to 9 is applied, characterized by comprising a visual detection mechanism, a thickness detection mechanism, and a laser mechanism.
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| CN202211729356.XA CN115958302A (en) | 2022-12-30 | 2022-12-30 | LED panel repair method and LED panel repair equipment |
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| CN202211729356.XA CN115958302A (en) | 2022-12-30 | 2022-12-30 | LED panel repair method and LED panel repair equipment |
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