CN115954298A - A diode packaging device - Google Patents

Abstract

The invention relates to the technical field of diode processing, in particular to diode packaging equipment which comprises a continuous packaging device arranged on a workbench, wherein the continuous packaging device comprises a diode conveying device arranged on the workbench, a bidirectional ball screw sliding table is arranged below the diode conveying device, packaging tool conveying devices are symmetrically arranged on the bidirectional ball screw sliding table, a first packaging tool and a second packaging tool are distributed on the packaging tool conveying device, the first packaging tool and the second packaging tool are identical in structure and mutually fit, an injection molding device is arranged beside the packaging tool conveying device, a vibration material homogenizing device is arranged beside the injection molding device, and a guide separation device is further arranged on the diode conveying device. The packaging efficiency can be effectively ensured by continuously packaging, and the production quality is ensured simultaneously.

Description

A kind of diode packaging equipment

technical field

The invention relates to the technical field of diode processing, in particular to a diode packaging device.

Background technique

Chinese patent CN115064463A discloses a diode packaging device and its packaging method including: a bottom plate, the upper surface of the bottom plate is fixedly connected with a storage table; the diode packaging device and its packaging method provided by the present invention, when in use, start the drive motor, the first crawler conveyor belt and the second The two crawler conveyor belts rotate synchronously, and the square LEDs are placed in the storage slot. When the balls touch the trapezoidal block, the balls move upwards, causing the pistons to move upwards. The raw materials in the rubber tube are injected into the square LEDs through the glue outlet, and the balls and the When the trapezoidal block is separated, the piston returns to its original position through the second spring, so that the raw materials in the rubber box enter the interior of the rubber cartridge, and the raw materials are dispersed evenly through the vibration motor, so that the diode packaging equipment does not need to stop during the diode packaging process during use. , Packaging is carried out during the transportation process, which shortens the packaging time of the diode and improves the packaging efficiency of the diode.

Although the above-mentioned technical solution can continuously package and process the diode packaging equipment, after the device is packaged, the diode cannot ensure that it falls out of the storage slot and falls into the collection box through its own gravity, resulting in some diodes still being stuck in the storage slot. , affecting production efficiency, and even if the diodes fall into the collection box for collection, the diodes falling into the collection box will cause the pins of the diodes to bend, which will affect the production quality.

Contents of the invention

Aiming at the problems existing in the prior art, a diode packaging device is provided, which can effectively ensure automatic mold release and improve the stability of blanking through the continuous packaging device, while avoiding the continuous packaging device and improving production quality.

In order to solve the problems of the prior art, the technical solution adopted in the present invention is:

A diode packaging equipment, including a continuous packaging device installed on the workbench, the continuous packaging device includes a diode delivery device installed on the workbench, a two-way ball screw slide table is provided under the diode delivery device, and the two-way ball screw slide The package conveying device is symmetrically arranged on the table, and the first package and the second package are distributed on the package conveying device. The first package and the second package have the same structure and fit each other. There is an injection molding device, and a vibration leveling device is arranged on the side of the injection molding device, and a guiding and detaching device is also installed on the diode conveying device.

Preferably, the diode delivery device includes a first linear conveyor installed on the workbench, the first linear conveyor is covered with pin sockets, the first linear conveyor is also equipped with a first limit guide frame, the first Pin penetration slots are arranged on the limit guide frame.

Preferably, the pin socket includes an installation ferrule installed on the first linear conveyor, and several installation card slots are arranged inside the installation card sleeve, and the pin card rail is installed inside the installation card slot, and the axis position of the pin card rail is The jack that is provided with, the inner wall of the jack is covered with card strips.

Preferably, the package conveying device includes a second linear conveyor installed on the two-way ball screw slide table, the second linear conveyor is covered with mounting blocks, and the mounting blocks are provided with engaging grooves.

Preferably, a clamping block is provided on the first package, and splicing and shaping grooves are provided on the sides of the clamping block.

Preferably, the injection molding device includes a mounting bracket installed on the side of the package conveying device, a linear drive is installed obliquely on the mounting bracket, and an injection head is provided at the output end of the linear drive.

Preferably, the vibration leveling device includes an elastic pressing seat installed under the first package and the second package, and a vibrator is also installed on the elastic pressing seat.

Preferably, the elastic pressure-resisting seat includes a fixed base installed on the workbench, several telescopic columns are arranged on the fixed base, a pressing bar is provided on the telescopic column, a guiding slant foot is provided on the pressing bar, and there is a gap between the pressing bar and the fixed base. With spring.

Preferably, the guide and disengagement device includes a second limit guide frame installed on the first linear conveyor, the second limit guide frame has the same structure as the first limit guide frame, and the side of the second limit guide frame is installed with The fixed mounting plate is provided with a separation lane changing device, and an infrared sensor is also installed on the fixed mounting plate.

Preferably, the separation and lane change device includes an inclined guide frame fixedly installed on the side of the fixed mounting plate, the inclined guide frame is provided with a pin threading slot, and the guiding and disengaging device also includes a skid bracket mounted on the fixed mounting plate, and the skid Pin penetration slots are provided on the board support, and the guiding and disengaging device also includes a rotary driver that drives the rotation of the pry board support.

The beneficial effect that the present application has compared with prior art is:

1. The staff inserts the pins of the diodes into the diode delivery device, and the diode delivery device drives the diodes to move. When the diodes are transported and moved, the package delivery device simultaneously drives the first package and the second package to rotate synchronously, and the diode moves When it is between the first package and the second package, the first package and the second package are spliced synchronously, so that the diode is kept between the first package and the second package, and the injection molding device injects the first package into the first package. Injection molding in the first packaging tool and the second packaging tool, the injection molding encapsulates the diodes in the first packaging tool and the second packaging tool, and when the first packaging tool and the second packaging tool move to the vibration leveling device, the vibration leveling device The packaging tool and the second packaging tool vibrate to quickly discharge the air in the injection molding compound and improve the packaging quality. After the package is injected and molded, the diode moves to the designated position and the packaging tool conveying device drives the first packaging tool and the second packaging tool to perform automatic sealing. Separation can effectively ensure automatic demoulding, improve the stability of blanking, and ensure production efficiency.

2. Drive the diode to move to the designated position through the diode conveying device, and then the package conveying device drives the first package and the second package to automatically separate, and the diode conveying device drives the packaged diode to move to the second limit guide frame, the second The second limit guide frame guides the packaged diodes to the skid bracket. When the infrared sensor detects that the diode stays on the skid bracket, the servo motor drives the skid bracket to rotate and adjust the angle so that the diodes extend through the pins of the skid bracket. The slot slides onto the inclined guide frame, and the inclined guide frame guides and transports the diodes to the area to be processed in sequence, effectively ensuring the integrity of the pins of the diodes, effectively avoiding damage to the diodes, and improving production quality.

Description of drawings

Fig. 1 is a perspective schematic diagram of a diode packaging device;

Fig. 2 is a side view of a diode packaging device;

Fig. 3 is a front view of a diode packaging device;

4 is a schematic perspective view of a diode delivery device in a diode packaging device;

Fig. 5 is a three-dimensional schematic diagram of a pin socket in a diode packaging device;

Fig. 6 is a schematic perspective view of a package conveying device in a diode packaging device;

7 is a schematic perspective view of a first package in a diode package device;

Fig. 8 is a schematic perspective view of an injection molding device in a diode packaging device;

Fig. 9 is a three-dimensional schematic diagram of a vibration leveling device in a diode packaging device;

Fig. 10 is a front view of a vibration leveling device in a diode packaging device;

Fig. 11 is a schematic perspective view of a separation lane changing device in a diode packaging device.

The labels in the figure are:

A1-diode;

1 - workbench;

2-diode delivery device;

21 - the first linear conveyor;

22-pin socket; 221-installation sleeve; 222-pin card rail; 223-card strip;

23-the first limit guide frame;

3- Package delivery device;

31 - the second linear conveyor;

32-Installing the card block;

4-Two-way ball screw slide table;

5 - the first package;

51-clip block;

52- splicing and shaping groove;

6 - the second package;

7-Injection molding device;

71 - mounting bracket;

72 - linear drive;

73-glue injection head;

8- Vibration leveling device;

81-elastic pressure seat; 811-fixed base; 812-resistance bar 813-telescopic column; 814-spring;

82 - vibrator;

9-Guided disengagement device;

91-the second limit guide frame;

92 - fixed mounting plate;

93 - infrared sensor;

94-separation lane change device; 941-skid plate support; 942-rotary drive; 943-tilt guide frame.

Detailed ways

In order to further understand the features, technical means, and specific objectives and functions achieved by the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

As shown in Figure 1 to Figure 11:

A diode packaging device, comprising a continuous packaging device installed on a workbench 1, the continuous packaging device includes a diode delivery device 2 installed on the workbench 1, a bidirectional ball screw slide 4 is provided below the diode delivery device 2, The two-way ball screw slide table 4 is symmetrically provided with a package conveying device 3, and the package conveying device 3 is distributed with a first package 5 and a second package 6, and the first package 5 and the second package 6 have the same structure And mutually compatible, the injection molding device 7 is provided on the side of the package conveying device 3 , the vibrating leveling device 8 is provided on the side of the injection molding device 7 , and the guiding and detaching device 9 is also installed on the diode conveying device 2 .

When the diode needs to be packaged, the staff will install the first package 5 and the second package 6 on the package delivery device 3 in sequence, and the staff will pass the two-way ball screw according to the size of the first package 5 and the second package 6 The slide table 4 adjusts the position of the package conveying device 3 so that the first package 5 and the second package 6 on the package conveying device 3 are in contact with each other and can maintain a splicing fit state when rotating. The staff inserts the pins of the diodes into the diode conveying device 2, and the diode conveying device 2 drives the diodes to carry out conveying movement. When the diodes are conveying and moving, the package conveying device 3 simultaneously drives the first package 5 and the second package 6 to rotate synchronously. When the diode moves between the first package 5 and the second package 6, the first package 5 and the second package 6 are synchronously engaged and spliced, so that the diode remains between the first package 5 and the second package 6 , the injection molding device 7 injects into the first package 5 and the second package 6, and the injection molding encapsulates the diodes in the first package 5 and the second package 6, and the first package 5 and the second package 6 move When on the vibrating leveling device 8, the vibrating leveling device 8 vibrates the first packaging tool 5 and the second packaging tool 6, so that the air in the injection plastic can be quickly discharged, and the packaging quality is improved. After the packaging injection molding, the diode moves to After specifying the position, the package delivery device 3 drives the first package 5 and the second package 6 to automatically separate, and the diode delivery device 2 drives the packaged diodes to move to the guide and detachment device 9, and the guide and detachment device 9 sequentially separates the packaged diodes. The materials are arranged and delivered to the area to be processed. This application can be continuously packaged to effectively ensure the packaging efficiency and ensure the production quality at the same time.

As shown in Figure 3 and Figure 4:

The diode conveying device 2 includes a first linear conveyor 21 installed on the workbench 1, the first linear conveyor 21 is covered with pin sockets 22, and the first linear conveyor 21 is also equipped with a first limit The guide frame 23, the first limit guide frame 23 is provided with a pin threading slot.

The staff inserts the pins of the diodes into the pin sockets 22, the pin sockets 22 fix the diodes in a limited position, the first linear conveyor 21 drives the inserted diodes to move, and the diodes pass through the first limit guide frame when moving The pins on the 23 pass through the slots, and the diodes can be corrected and positioned when passing through the pins and slots when the diodes move, effectively ensuring the accuracy and stability of the diode delivery.

As shown in Figure 4 and Figure 5:

The pin socket 22 includes an installation ferrule 221 installed on the first linear conveyor 21, the interior of the installation ferrule 221 is provided with several installation card slots, and the interior of the installation card slot is equipped with a pin card connecting rail 222, and the pin card connecting rail 222 The axis position of the socket is provided with a socket, and the inner wall of the socket is covered with clip strips 223.

The staff adjusts the position of the pin card connecting rail 222 inside the installation ferrule 221 according to the distance of the diode pin. Workers insert the pins of the diodes into the axial jacks of the pin clamp rails 222, and the clamping strips 223 inside the jacks are used to squeeze the inserted diode pins, which can improve the adaptability and stability of the diode pin insertion. .

As shown in Figure 1 and Figure 6:

The package conveying device 3 includes a second linear conveyor 31 installed on the two-way ball screw slide 4 , the second linear conveyor 31 is covered with mounting blocks 32 , and the mounting blocks 32 are provided with engaging grooves.

The worker symmetrically installs the first package 5 and the second package 6 respectively on the package conveying device 3 , and the snap-in groove on the installation block 32 is used to clip and fix the first package 5 or the second package 6 , After the first packaging tool 5 and the second packaging tool 6 are installed, the second linear conveyor 31 drives the first packaging tool 5 or the second packaging tool 6 to move circularly, and the first packaging tool 5 and the second packaging tool 6 move to When they are in the same position, they will be spliced together to form injection grooves.

As shown in Figure 1 and Figure 7:

The first package 5 is provided with a clamping block 51 , and the side of the clamping block 51 is provided with a splicing and shaping groove 52 .

The clamping block 51 on the first packaging device 5 is used for limit clamping on the clamping groove of the installation clamping block 32, and the splicing and shaping groove 52 is used to cooperate with the second packaging device 6 for splicing and matching to form an injection molding groove. Fill the injection molding liquid at the limited position to make the package shape.

As shown in Figure 1 and Figure 8:

The injection molding device 7 includes a mounting bracket 71 installed on the side of the package conveying device 3 , a linear driver 72 is obliquely mounted on the mounting bracket 71 , and an injection head 73 is provided at the output end of the linear driver 72 .

The linear driver 72 is preferably an electric push rod. The staff inserts the pins of the diodes into the diode conveying device 2, and the diode conveying device 2 drives the diodes to carry out conveying movement. When the diodes are conveying and moving, the package conveying device 3 simultaneously drives the first package 5 Rotate synchronously with the second package 6, when the diode moves between the first package 5 and the second package 6, the first package 5 and the second package 6 are synchronously engaged and spliced, so that the diode remains in the first package 5 and the second package 6, the electric push rod pushes the glue injection head 73 to extend to the first package 5 and the second package 6, the glue injection head 73 is connected with the glue injection equipment, and the glue injection head 73 moves to the designated position Finally, the glue injection equipment injects a specified amount of glue into the first package 5 and the second package 6 through the glue injection head 73, and the injected glue encapsulates the diode.

As shown in Figure 3 and Figure 9:

The vibration leveling device 8 includes an elastic pressing seat 81 installed under the first package 5 and the second package 6 , and a vibrator 82 is installed on the elastic pressing seat 81 .

The vibrator 82 is preferably a vibrating motor. After the glue head injects a specified amount of glue into the first package 5 and the second package 6, the injected glue encapsulates the diode, and the first package 5 and the second package 6 move to When the elastic pressure seat 81 is on, the elastic pressure seat 81 is in conflict with the first package 5 and the second package 6, and the vibration motor vibrates, and the elastic pressure seat 81 transmits the vibration force to the first package 5 and the second package 6. On the second packaging device 6, the first packaging device 5 and the second packaging device 6 are vibrated to effectively remove the air in the injection molding compound and improve the packaging effect.

As shown in Figure 9 and Figure 10:

The elastic resisting seat 81 includes a fixed base 811 installed on the workbench 1. The fixed base 811 is provided with several telescopic columns 813, and the telescopic column 813 is provided with a resisting bar 812. A spring 814 is provided between 812 and the fixed base 811 .

When the first packaging tool 5 and the second packaging tool 6 move, they collide with the pressing bar 812, so that the pressing bar 812 is pressed downward. When the pressing bar 812 is pressed down, the spring 814 is squeezed, and the pressing force of the spring 814 can effectively The pressure bar 812 is made to be in contact with the first package 5 and the second package 6 to effectively ensure the transmission of vibration force.

As shown in Figure 1 and Figure 3:

The guide and disengagement device 9 includes a second limit guide frame 91 installed on the first linear conveyor 21, the second limit guide frame 91 is identical in structure with the first limit guide frame 23, and the second limit guide frame 91 has the same structure as the first limit guide frame 91. A fixed mounting plate 92 is installed on the side, and a separation lane changing device 94 is installed on the fixed mounting plate 92, and an infrared sensor 93 is also installed on the fixed mounting plate 92.

The diode conveying device 2 drives the diode to move to the specified position, and after the package conveying device 3 drives the first package 5 and the second package 6 to automatically separate, the diode conveying device 2 drives the packaged diode to move to the second limit guide frame 91 Above, the second limit guide frame 91 guides the packaged diodes to the separation lane changing device 94, and the infrared sensor 93 is used to detect whether the diode moves to the separation lane change device 94, and the separation lane change device 94 is used to package the Also the diode leads out of the diode delivery device 2 . Effective automatic unloading.

As shown in Figure 3 and Figure 11:

The separation and lane change device 94 includes an inclined guide frame 943 fixedly installed on the side of the fixed installation plate 92, the inclined guide frame 943 is provided with pin insertion slots, and the guide and disengagement device 9 also includes a skid mounted on the fixed installation plate 92 The bracket 941 and the crowbar bracket 941 are provided with a pin threading slot, and the guiding and disengaging device 9 also includes a rotary driver 942 that drives the crowbar bracket 941 to rotate.

The rotary driver 942 is preferably a servo motor. The second limit guide frame 91 guides the packaged diode to the skid bracket 941. When the infrared sensor 93 detects that the diode stays on the skid bracket 941, the servo motor drives the skid bracket 941. Rotate and adjust the angle so that the pins of the diode extension pry plate bracket 941 slide through the slots onto the inclined guide frame 943, and the inclined guide frame 943 guides and transports the diodes to the area to be treated in sequence, effectively ensuring the integrity of the pins of the diodes. Effectively avoid diode damage.

working principle:

The worker installs the first package 5 and the second package 6 on the package conveying device 3 in sequence, and the worker adjusts the package through the two-way ball screw slide 4 according to the size of the first package 5 and the second package 6 The position of the tool delivery device 3 is such that the first packaging tool 5 and the second packaging tool 6 on the packaging tool delivery device 3 are in contact with each other when they are rotated so as to maintain the splicing fit state. The staff inserts the pins of the diodes into the diode conveying device 2, and the diode conveying device 2 drives the diodes to carry out conveying movement. When the diodes are conveying and moving, the package conveying device 3 simultaneously drives the first package 5 and the second package 6 to rotate synchronously. When the diode moves between the first package 5 and the second package 6, the first package 5 and the second package 6 are synchronously engaged and spliced, so that the diode remains between the first package 5 and the second package 6 , the injection molding device 7 injects into the first package 5 and the second package 6, and the injection molding encapsulates the diodes in the first package 5 and the second package 6, and the first package 5 and the second package 6 move When on the vibrating leveling device 8, the vibrating leveling device 8 vibrates the first packaging tool 5 and the second packaging tool 6, so that the air in the injection plastic can be quickly discharged, and the packaging quality is improved. After the packaging injection molding, the diode moves to After specifying the position, the package delivery device 3 drives the first package 5 and the second package 6 to automatically separate, and the diode delivery device 2 drives the packaged diodes to move to the guide and detachment device 9, and the guide and detachment device 9 sequentially separates the packaged diodes. Arrange the blanks and transport them to the area to be processed.

The above examples only represent one or several implementations of the present invention, and the descriptions thereof are more specific and detailed, but should not be construed as limiting the patent scope of the present invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (10)

1. a kind of diode encapsulation equipment, comprise the continuous encapsulation device installed on the workbench (1), it is characterized in that, the continuous encapsulation device comprises the diode delivery device (2) that is installed on the workbench (1), the diode delivery device ( 2) is provided with a two-way ball screw slide (4), and the package delivery device (3) is symmetrically arranged on the two-way ball screw slide (4), and the package delivery device (3) is distributed with the first package Tool (5) and the second packaging tool (6), the first packaging tool (5) and the second packaging tool (6) have the same structure and fit each other, and the side of the packaging tool delivery device (3) is provided with an injection molding device (7 ), the side of the injection molding device (7) is provided with a vibrating leveling device (8), and a guide and disengagement device (9) is also installed on the diode delivery device (2). 2. A kind of diode packaging equipment according to claim 1, characterized in that, the diode delivery device (2) comprises a first linear conveyor (21) installed on the workbench (1), the first linear conveyor The machine (21) is covered with pin sockets (22), and the first limit guide frame (23) is also installed on the first linear conveyor (21), and the first limit guide frame (23) is provided with a lead guide frame (23). Foot wear slots. 3. A kind of diode packing equipment according to claim 2, is characterized in that, pin socket (22) comprises the ferrule (221) that is installed on the first linear conveyor (21), and ferrule (221) that installs ( 221) inside is provided with several installation draw-in slots, and pin card connecting rail (222) is installed inside the installation card slot, the jack that the axis position of pin card connecting rail (222) is provided with, and the inwall of jack is covered with clip bar ( 223). 4. A diode packaging device according to claim 3, characterized in that the package conveying device (3) includes a second linear conveyor (31) installed on the two-way ball screw slide (4), the second The two linear conveyors (31) are covered with mounting blocks (32), and the mounting blocks (32) are provided with snap-in grooves. 5. A diode packaging device according to claim 4, characterized in that, the first package (5) is provided with a clamping block (51), and the side of the clamping block (51) is provided with splicing and shaping grooves (52). 6. A diode packaging device according to claim 5, characterized in that the injection molding device (7) includes a mounting bracket (71) installed on the side of the package delivery device (3), and the mounting bracket (71) is inclined A linear driver (72) is installed, and the output end of the linear driver (72) is provided with a glue injection head (73). 7. A diode packaging device according to claim 6, characterized in that the vibratory leveling device (8) includes an elastic pressure seat installed under the first package (5) and the second package (6) (81), and vibrator (82) is also installed on the elastic pressure seat (81). 8. A diode packaging device according to claim 7, characterized in that the elastic pressing seat (81) includes a fixed base (811) installed on the workbench (1), and the fixed base (811) is provided with several A telescopic post (813), telescopic post (813) is provided with pressing bar (812), is provided with guiding slanted foot on pressing bar (812), is provided with spring (811) between pressing bar (812) and fixed base (811) 814). 9. A diode packaging device according to claim 8, characterized in that the guiding and detaching device (9) comprises a second limit guide frame (91) installed on the first linear conveyor (21), the second The second limit guide frame (91) is identical in structure with the first limit guide frame (23), and a fixed mounting plate (92) is installed on the side of the second limit guide frame (91), and a fixed mounting plate (92) is installed on the fixed mounting plate (92). Separation lane changing device (94) is arranged, and infrared sensor (93) is also installed on the fixed mounting plate (92). 10. A kind of diode encapsulation equipment according to claim 9, it is characterized in that, separation lane changing device (94) comprises the inclined guide frame (943) that is fixedly installed on the side of fixed mounting plate (92), and the inclined guide frame (943) 943) is provided with pin-through slots, and the guide and disengagement device (9) also includes a skid support (941) installed on the fixed mounting plate (92), and the skid support (941) is provided with a pin-through slot The guiding and disengaging device (9) also includes a rotary driver (942) that drives the crowbar bracket (941) to rotate.

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