CN115903300A - Backlight plate and manufacturing method thereof - Google Patents
Backlight plate and manufacturing method thereof Download PDFInfo
- Publication number
- CN115903300A CN115903300A CN202110947878.6A CN202110947878A CN115903300A CN 115903300 A CN115903300 A CN 115903300A CN 202110947878 A CN202110947878 A CN 202110947878A CN 115903300 A CN115903300 A CN 115903300A
- Authority
- CN
- China
- Prior art keywords
- circuit substrate
- transparent film
- solder mask
- backlight
- mask layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 229910000679 solder Inorganic materials 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000004806 packaging method and process Methods 0.000 claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- 230000001070 adhesive effect Effects 0.000 claims abstract description 15
- 238000005538 encapsulation Methods 0.000 claims abstract description 6
- 238000005253 cladding Methods 0.000 claims abstract description 3
- 230000005611 electricity Effects 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 6
- 239000002120 nanofilm Substances 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 4
- -1 polyethylene terephthalate Polymers 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 4
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 238000002834 transmittance Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 52
- 239000000463 material Substances 0.000 description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000002310 reflectometry Methods 0.000 description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000001579 optical reflectometry Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Planar Illumination Modules (AREA)
Abstract
The utility model provides a backlight board, includes circuit board, packaging adhesive and at least a light emitting component, the circuit board include circuit substrate with set up in circuit substrate's solder mask, circuit substrate includes the connecting pad, solder mask corresponds the connecting pad is equipped with windowing in order to expose the connecting pad, light emitting component corresponds windowing sets up and with the connecting pad electricity is connected, backlight board still includes the transparent film, the transparent film cladding and bond in prevent deviating from of solder mask the surface of circuit substrate and the inner wall of windowing, the packaging adhesive covers transparent film and encapsulation light emitting component. The backlight plate can avoid the Mura phenomenon. The application also provides a manufacturing method of the backlight plate.
Description
Technical Field
The application relates to a backlight plate and a manufacturing method thereof.
Background
In the field of Light Emitting Diode (LED) backlight plates, due to the rise of sub-millimeter light emitting diodes (Mini LEDs) and micron light emitting diodes (mircoLEDs), the LEDs are smaller and smaller in size and more in quantity, welding-proof windowing in the backlight plates is driven to be smaller and smaller in the same way, the distance is also smaller, and therefore the existing welding-proof small windowing (< 500 um) cannot be met by other non-developing welding-proof types such as covering films and white thermosetting ink used by previous welding-proof layers, and therefore white developing welding-proof materials are required to be used. In the commonly used white developing type solder mask material in the prior art, substances such as photoinitiators containing P, S and N, curing agents and the like are usually added, and when the LED packaging adhesive is arranged, the substances often cause incomplete curing of the LED packaging adhesive, so that the LED emits light unevenly, and finally, the Mura phenomenon, which is the phenomenon that the brightness of a display is uneven, is generated.
Disclosure of Invention
Accordingly, there is a need for a backlight panel that can avoid the Mura phenomenon.
Also provides a method for manufacturing the backlight plate capable of avoiding Mura phenomenon.
The utility model provides a backlight board, includes circuit board, packaging adhesive and at least a light emitting component, the circuit board include circuit substrate with set up in circuit substrate's solder mask, circuit substrate includes the connecting pad, solder mask corresponds the connecting pad is equipped with windowing in order to expose the connecting pad, light emitting component corresponds windowing sets up and with the connecting pad electricity is connected, backlight board still includes the transparent film, the transparent film cladding and bond in prevent deviating from of solder mask the surface of circuit substrate and the inner wall of windowing, the packaging adhesive covers transparent film and encapsulation light emitting component.
A method for manufacturing a backlight plate comprises the following steps:
providing a circuit substrate, wherein the circuit substrate comprises a connecting pad;
arranging a solder mask layer on the circuit substrate, wherein the solder mask layer is provided with a window corresponding to the connecting pad to expose the connecting pad;
arranging a transparent film to cover and adhere to the surface of the solder mask layer, which is deviated from the circuit substrate, and the inner wall of the window so as to form an opening corresponding to the window; and
and arranging a light-emitting element corresponding to the opening to be electrically connected with the connecting pad, covering the transparent film by packaging glue and packaging the light-emitting element.
In the backlight board and the manufacturing method thereof, the transparent film can also isolate the solder mask layer from the packaging adhesive on the premise of not influencing the reflectivity of the solder mask layer, so that the packaging adhesive is prevented from being incompletely cured due to the problem of the solder mask layer material, and the Mura phenomenon is avoided.
Drawings
Fig. 1 is a schematic cross-sectional view of a backlight panel according to an embodiment of the present application.
Fig. 2 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.
Fig. 3 is a schematic cross-sectional view of a solder resist layer formed on the circuit board shown in fig. 2.
Fig. 4 is a schematic cross-sectional view of a transparent film provided on the solder mask layer shown in fig. 3.
Description of the main elements
The following detailed description will further illustrate the present application in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Referring to fig. 1, a backlight panel 100 according to an embodiment of the present disclosure includes a circuit board 10, a transparent film 30, a packaging adhesive 50, and at least one light emitting device 70. The circuit board 10 includes a circuit substrate 11 and a solder mask layer 13 disposed on the circuit substrate 11. The circuit substrate 11 includes a connecting pad 110, and the solder mask layer 13 has a window 130 corresponding to the connecting pad 110 to expose the connecting pad 110. The light emitting element 70 is disposed corresponding to the window 130 and electrically connected to the connection pad 110. The transparent film 30 covers and adheres to the surface of the solder mask layer 13 away from the circuit substrate 11 and the inner wall of the window 130. The encapsulation adhesive 50 covers the transparent film 30 and encapsulates the light emitting element 70.
The circuit substrate 11 may be a single-layer circuit substrate, a double-layer circuit substrate or a multi-layer circuit substrate. In the present embodiment, the circuit board 11 is described as an example of a double-layered circuit board.
Specifically, the circuit board 11 includes a first circuit layer 111, a dielectric layer 113, and a second circuit layer 115, which are sequentially stacked. The first circuit layer 111 includes a connecting pad 110. The solder mask layer 13 is bonded to a side of the dielectric layer 113 away from the second circuit layer 115 and covers the first circuit layer 111. The connecting pads 110 are exposed from the windows 130 of the solder mask layer 13.
In some embodiments, the width of the window 130 may gradually increase from a side away from the dielectric layer 113 to a side close to the dielectric layer 113.
The solder mask layer 13 can be formed by, but not limited to, coating white developing solder mask ink and baking for curing. The white developing solder resist ink includes a solder resist ink and a light diffusing material (such as titanium dioxide particles or barium titanate particles) mixed in the solder resist ink. The light diffusion material is used for increasing the light reflectivity of the white developing solder resist ink.
Preferably, the light transmittance of the transparent film 30 is greater than or equal to 95.8%, thereby further reducing the influence on the reflectance of the backlight. In some embodiments, the transparent film 30 may be, but is not limited to, a polyimide film, a polyethylene terephthalate film, or a surface low reflection nano-film (SLR nano-film).
The transparent film 30 forms an opening 31 corresponding to the window 130. In some embodiments, the openings 31 are uniform in width at different depths. When the width of the window 130 can gradually increase from the side away from the dielectric layer 113 to the side close to the dielectric layer 113, and the widths of the openings 31 at different depths are all the same, the adhesion force of the transparent film 30 on the solder mask layer 13 can be effectively increased.
Preferably, the light emitting element 70 does not extend beyond the opening 31 in the depth direction of the opening 31. More preferably, the light emitting element 70 does not extend beyond the window 130 in the depth direction of the window 130.
The light emitting element 70 may be, but is not limited to, an LED.
Referring to fig. 1 to 4, a method for manufacturing a backlight plate according to an embodiment of the present disclosure includes the following steps:
in step S1, referring to fig. 2, a circuit substrate 11 is provided. The circuit substrate 11 includes a connection pad 110.
The circuit substrate 11 may be a single-layer circuit substrate, a double-layer circuit substrate or a multi-layer circuit substrate. In the present embodiment, the circuit board 11 is described as an example of a double-layered circuit board.
Specifically, the circuit substrate 11 includes a first circuit layer 111, a dielectric layer 113, and a second circuit layer 115, which are sequentially stacked. The first circuit layer 111 includes a connecting pad 110.
Step S2, referring to fig. 3, a solder mask layer 13 is disposed on the circuit substrate 11, and the solder mask layer 13 is disposed with a window 130 corresponding to the connecting pad 110 to expose the connecting pad 110, so as to obtain the circuit board 10.
In this embodiment, the solder mask layer 13 is bonded to a side of the dielectric layer 113 away from the second circuit layer 115 and covers the first circuit layer 111. The connecting pads 110 are exposed from the windows 130 of the solder mask layer 13.
In some embodiments, the width of the window 130 may gradually increase from a side away from the dielectric layer 113 to a side close to the dielectric layer 113.
The solder mask layer 13 can be formed by, but not limited to, coating white developing solder mask ink and baking for curing. The white developing solder resist ink includes a solder resist ink and a light diffusing material (such as titanium dioxide particles or barium titanate particles) mixed in the solder resist ink. The light diffusion material is used for increasing the light reflectivity of the white developing solder resist ink.
Step S3, referring to fig. 4, a transparent film 30 is disposed to cover and adhere to the surface of the solder mask layer 13 away from the circuit substrate 11 and the inner wall of the window 130, so as to form an opening 31 corresponding to the window 130.
Preferably, the light transmittance of the transparent film 30 is greater than or equal to 95.8%, thereby further reducing the influence on the reflectance of the backlight. In some embodiments, the transparent film 30 may be, but is not limited to, a polyimide film, a polyethylene terephthalate film, or a surface low reflection nano-film (SLR nano-film).
In some embodiments, the openings 31 are uniform in width at different depths.
Step S4, referring to fig. 1, a light emitting device 70 is disposed corresponding to the opening 31 to be electrically connected to the connecting pad 110, and the transparent film 30 is covered by a packaging adhesive 50 to package the light emitting device 70.
Preferably, the light emitting element 70 does not extend beyond the opening 31 in the depth direction of the opening 31. More preferably, the light emitting element 70 does not extend beyond the window 130 in the depth direction of the window 130.
The light emitting element 70 may be, but is not limited to, an LED.
In the backlight board and the manufacturing method thereof, the transparent film 30 can also isolate the solder mask layer 13 from the packaging adhesive 50 on the premise of not influencing the reflectivity of the solder mask layer 13, so that the packaging adhesive 50 is avoided because the problem of the solder mask layer 13 is caused by incomplete curing, and the Mura phenomenon is avoided.
Although the present application has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. The utility model provides a backlight board, includes circuit board, packaging adhesive and at least a light emitting component, the circuit board include circuit substrate with set up in circuit substrate's solder mask layer, circuit substrate includes the connection pad, solder mask layer corresponds the connection pad is equipped with windowing in order to expose the connection pad, light emitting component corresponds windowing setting and with the connection pad electricity is connected, a serial communication port, backlight board still includes the transparent film, the transparent film cladding and bond in prevent deviating from of solder mask layer circuit substrate's surface and the inner wall of windowing, the packaging adhesive covers transparent film and encapsulation light emitting component.
2. The backlight panel of claim 1, wherein the transparent film has a light transmission of 95.8% or greater.
3. The backlight plate of claim 2, wherein the transparent film is a polyimide film, a polyethylene terephthalate film, or an SLR nano-film.
4. The backlight of claim 1, wherein the fenestrations have a width that gradually increases from a side away from the circuit substrate to a side proximate to the circuit substrate.
5. The backlight panel of claim 4, wherein the transparent film forms openings corresponding to the fenestrations, the openings having uniform width at different depths.
6. A method for manufacturing a backlight plate comprises the following steps:
providing a circuit substrate, wherein the circuit substrate comprises a connecting pad;
arranging a solder mask layer on the circuit substrate, wherein the solder mask layer is provided with a window corresponding to the connecting pad to expose the connecting pad;
arranging a transparent film to cover and adhere to the surface of the solder mask layer, which is far away from the circuit substrate, and the inner wall of the window so as to form an opening corresponding to the window; and
and arranging a light-emitting element corresponding to the opening to be electrically connected with the connecting pad, covering the transparent film by packaging glue and packaging the light-emitting element.
7. The method of claim 6, wherein the transparent film has a light transmittance of 95.8% or more.
8. The method of manufacturing a backlight plate according to claim 7, wherein the transparent film is a polyimide film, a polyethylene terephthalate film, or an SLR nano-film.
9. The method of claim 6, wherein the window has a width that gradually increases from a side away from the circuit substrate to a side closer to the circuit substrate.
10. The method of making a backlight panel of claim 9, wherein the openings have uniform width at different depths.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110947878.6A CN115903300B (en) | 2021-08-18 | 2021-08-18 | Backlight plate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110947878.6A CN115903300B (en) | 2021-08-18 | 2021-08-18 | Backlight plate and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115903300A true CN115903300A (en) | 2023-04-04 |
| CN115903300B CN115903300B (en) | 2024-06-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110947878.6A Active CN115903300B (en) | 2021-08-18 | 2021-08-18 | Backlight plate and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115903300B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119383845A (en) * | 2023-07-25 | 2025-01-28 | 鹏鼎控股(深圳)股份有限公司 | Circuit board processing technology, circuit board and battery module using the circuit board |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN115903300B (en) | 2024-06-07 |
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