CN115868252A - 光电混载基板 - Google Patents

光电混载基板 Download PDF

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Publication number
CN115868252A
CN115868252A CN202180049751.0A CN202180049751A CN115868252A CN 115868252 A CN115868252 A CN 115868252A CN 202180049751 A CN202180049751 A CN 202180049751A CN 115868252 A CN115868252 A CN 115868252A
Authority
CN
China
Prior art keywords
wiring
optical element
layer
insulating layer
metal reinforcement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180049751.0A
Other languages
English (en)
Chinese (zh)
Inventor
大川忠男
小田高司
山路正高
市川和志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN115868252A publication Critical patent/CN115868252A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12002—Three-dimensional structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
CN202180049751.0A 2020-07-29 2021-07-14 光电混载基板 Pending CN115868252A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020128012 2020-07-29
JP2020-128012 2020-07-29
PCT/JP2021/026405 WO2022024756A1 (ja) 2020-07-29 2021-07-14 光電気混載基板

Publications (1)

Publication Number Publication Date
CN115868252A true CN115868252A (zh) 2023-03-28

Family

ID=80036299

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180049751.0A Pending CN115868252A (zh) 2020-07-29 2021-07-14 光电混载基板

Country Status (5)

Country Link
US (1) US12366715B2 (https=)
JP (1) JP7682183B2 (https=)
CN (1) CN115868252A (https=)
TW (1) TW202208905A (https=)
WO (1) WO2022024756A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI884282B (zh) * 2020-06-22 2025-05-21 日商日東電工股份有限公司 光通訊模組基板
JP2024093387A (ja) * 2022-12-27 2024-07-09 新光電気工業株式会社 配線基板及びその製造方法
US12446149B2 (en) * 2023-09-26 2025-10-14 Cyntec Co., Ltd. Flexible printed circuit board with embedded optical waveguide structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103308995A (zh) * 2012-03-16 2013-09-18 日东电工株式会社 光电混装基板及其制造方法
CN105612446A (zh) * 2013-10-31 2016-05-25 日东电工株式会社 光电混载基板
CN107209324A (zh) * 2014-11-25 2017-09-26 日东电工株式会社 光电混合基板及其制法
WO2020090200A1 (ja) * 2018-10-30 2020-05-07 浜松ホトニクス株式会社 光検出装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5771568A (en) 1995-03-02 1998-06-30 Hutchinson Technology Incorporated Method for manufacturing a head suspension having electrical trace interconnects with reduced capacitance
JP4222882B2 (ja) 2003-06-03 2009-02-12 日東電工株式会社 配線回路基板
JP5055193B2 (ja) * 2008-04-24 2012-10-24 日東電工株式会社 光電気混載基板の製造方法
JP4796615B2 (ja) * 2008-11-26 2011-10-19 日東電工株式会社 光電気混載基板およびその製造方法
JP4754613B2 (ja) * 2008-11-27 2011-08-24 日東電工株式会社 光電気混載基板およびその製造方法
JP2010266598A (ja) 2009-05-13 2010-11-25 Hitachi Cable Ltd 光配線部材
JP5604840B2 (ja) 2009-09-29 2014-10-15 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンションおよびハードディスクドライブ
KR101067793B1 (ko) * 2009-11-13 2011-09-27 삼성전기주식회사 연성 광기판 및 그 제조방법
JP2012194401A (ja) * 2011-03-16 2012-10-11 Nitto Denko Corp 光電気混載基板およびその製法
JP5840988B2 (ja) * 2012-03-16 2016-01-06 日東電工株式会社 光電気混載基板およびその製法
JP5877749B2 (ja) * 2012-03-29 2016-03-08 日東電工株式会社 光電気混載基板の製法
JP5877756B2 (ja) * 2012-05-08 2016-03-08 日東電工株式会社 光電気混載基板およびその製法
JP6202662B2 (ja) * 2012-11-27 2017-09-27 日東電工株式会社 光電気混載基板およびその製法
JP6245569B2 (ja) * 2013-06-06 2017-12-13 日東電工株式会社 光電気混載基板
JP6414839B2 (ja) * 2013-09-27 2018-10-31 日東電工株式会社 光電気混載基板およびその製法
JP6202566B2 (ja) * 2013-10-29 2017-09-27 日東電工株式会社 光電気混載基板およびその製法
JP6319762B2 (ja) * 2013-10-31 2018-05-09 日東電工株式会社 光電気混載基板およびその製法
JP6376556B2 (ja) * 2014-06-10 2018-08-22 日東電工株式会社 光電気混載基板
JP6712742B2 (ja) * 2014-09-24 2020-06-24 日東電工株式会社 光電気混載基板およびその製法
JP6460515B2 (ja) * 2014-10-24 2019-01-30 日東電工株式会社 光電気混載基板およびその製法
JP6460516B2 (ja) * 2014-10-28 2019-01-30 日東電工株式会社 光電気混載基板
JP6674691B2 (ja) * 2014-12-10 2020-04-01 日東電工株式会社 光電気混載基板
JP6859136B2 (ja) * 2017-03-03 2021-04-14 日東電工株式会社 光導波路コア形成用感光性エポキシ樹脂組成物、光導波路コア形成用感光性フィルム、光導波路、光電気混載基板および光導波路の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103308995A (zh) * 2012-03-16 2013-09-18 日东电工株式会社 光电混装基板及其制造方法
CN105612446A (zh) * 2013-10-31 2016-05-25 日东电工株式会社 光电混载基板
CN107209324A (zh) * 2014-11-25 2017-09-26 日东电工株式会社 光电混合基板及其制法
US20170329093A1 (en) * 2014-11-25 2017-11-16 Nitto Denko Corporation Opto-electric hybrid board and method of manufacturing same
WO2020090200A1 (ja) * 2018-10-30 2020-05-07 浜松ホトニクス株式会社 光検出装置

Also Published As

Publication number Publication date
JP7682183B2 (ja) 2025-05-23
TW202208905A (zh) 2022-03-01
US20230258893A1 (en) 2023-08-17
JPWO2022024756A1 (https=) 2022-02-03
WO2022024756A1 (ja) 2022-02-03
US12366715B2 (en) 2025-07-22

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