CN115847280A - Polishing pad with radial grooves - Google Patents

Abstract

The invention relates to a polishing pad with radial grooves, wherein a polishing surface is arranged on the polishing pad, a central circular area, a plurality of first ray grooves and a plurality of groove units are arranged on the polishing surface, the first ray grooves and the groove units are radially arranged at intervals around the circle center of the polishing surface, one end of each first ray groove is connected with the edge of the central circular area, and the other end of each first ray groove is connected with the edge of the polishing surface; a second ray groove is arranged in the groove unit, a certain gap is formed between one end of the second ray groove and the edge of the central circular area, and the other end of the second ray groove is connected with the edge of the polishing surface. Compared with the prior art, the polishing pad is provided with the first ray grooves which extend outwards from the central circular area, and the second ray grooves which extend outwards from the position which has a certain distance with the edge of the central circular area, so that more ray grooves can be accommodated on the polishing pad, the phenomenon that the strength of the central area of the polishing pad is damaged due to excessive ray grooves is avoided, and the liquid storage capacity and the polishing effect of the polishing pad are improved.

Description

Polishing pad with radial grooves

Technical Field

The present invention relates to a polishing apparatus, and more particularly, to a polishing pad having radial grooves.

Background

CMP (Chemical Mechanical Polishing), or "Chemical Mechanical Polishing", is a Polishing technique that combines abrasive Mechanical grinding and Polishing liquid Chemical etching to overcome the disadvantages of Chemical Polishing and Mechanical Polishing. The chemical mechanical polishing has the greatest advantage that the nanometer global planarization of the processed surface can be realized, and the ultra-precise non-damage surface processing of the integrated circuit with the characteristic dimension below 0.35 mu m can be met. Semiconductor devices typically require flatness on the order of nanometers, and the best technology currently uses a combination of polishing fluid (chemical) and polishing pad (mechanical). In addition to the application to integrated circuit chips, CMP is also frequently used in the processing of semiconductor discrete devices and electronic components, and also has been expanded to the surface processing fields of thin film memory disks, ceramics, sapphire, and the like.

The polishing pad has a rough surface for directly contacting with a semiconductor device to generate friction, mechanically removing a polishing layer on the surface of the semiconductor device, and uniformly throwing polishing liquid to the surface of the polishing pad under the action of centrifugal force, chemically removing the polishing layer on the surface of the semiconductor device, and simultaneously carrying reaction products out of the polishing pad. However, since the polishing liquid is present between the polishing pad and the semiconductor device, the polishing pad and the semiconductor device are easily completely attached to each other, and the frictional force between the polishing pad and the semiconductor device is lost. Therefore, in order to achieve a better polishing effect in the polishing operation, it is most common practice to form grooves on the surface of the polishing pad, so that the grooves can increase the friction between the polishing pad and the wafer, and ensure that the polishing solution is uniformly distributed on the surface of the polishing pad, and the polishing particles and polishing debris suspended in the polishing solution can flow out of the surface of the polishing pad through the grooves.

Therefore, the shape and distribution of the grooves greatly affect the polishing effect of the polishing pad.

Disclosure of Invention

The present invention is directed to a polishing pad having radial grooves, which overcomes the above-mentioned drawbacks of the prior art, and further improves the polishing effect of the polishing pad.

The purpose of the invention can be realized by the following technical scheme:

a polishing pad with radial grooves is provided with a polishing surface, the polishing surface is provided with a central circular area, a plurality of first ray grooves and a plurality of groove units, the first ray grooves and the groove units are radially arranged around the center of the polishing surface at intervals, one end of each first ray groove is connected with the edge of the central circular area, and the other end of each first ray groove is connected with the edge of the polishing surface; a second ray groove is arranged in the groove unit, a certain gap is formed between one end of the second ray groove and the edge of the central circular area, and the other end of the second ray groove is connected with the edge of the polishing surface.

In one embodiment, the groove unit comprises a plurality of second ray grooves, and gaps between one ends of the second ray grooves and the edge of the central circular area have a plurality of numerical levels.

In one embodiment, the polishing surface is provided with a plurality of virtual parabolas which are gradually far away from the central circular area around the center of the polishing pad, and one ends of the plurality of second ray grooves are sequentially distributed along the virtual parabolas.

In one embodiment, gaps between one end of the second ray grooves and the edge of the central circular area are sequentially increased in an equal difference mode.

In one embodiment, the diameter of the central circular region satisfies: 0.01D ₁ ≤D ₂ ≤0.1D ₁ Wherein D is ₁ Is the diameter of the polishing surface, D ₂ Is the diameter of the central circular area.

In one embodiment, the difference between two adjacent numerical levels of the gap satisfies: 0.1D ₂ ≤W≤0.5D ₂ Where W is the difference between two adjacent levels of the gap.

In one embodiment, an included angle between two adjacent second ray grooves is greater than or equal to 5 °.

In one embodiment, the number of the first ray grooves is set to satisfy: a. The ₁ ≤δπD ₂ /d ₁ Wherein A is ₁ Number of first ray grooves, d ₁ Is the width of the first ray groove, D ₂ δ is a constant, which is the diameter of the central circular region, and satisfies: delta is more than or equal to 0.6 and less than or equal to 0.8.

In one embodiment, the edge of the central circular area is provided with annular grooves, and the annular grooves are respectively communicated with a plurality of first ray grooves.

In one embodiment, the polishing pad includes a polishing layer, the polishing surface is disposed on the polishing layer, and the depth of the first ray groove satisfies: 0.25h ₁ ≤h ₂ ≤0.5h ₁ Wherein h is ₁ Is the thickness of the polishing layer, h ₂ Is the depth of the first ray groove.

Compared with the prior art, the invention has the following advantages:

1. the polishing pad is provided with the first ray grooves and the second ray grooves which are arranged at intervals, polishing liquid is stored through the ray grooves, and waste residues generated by polishing are discharged; meanwhile, the first ray grooves are formed and extend outwards from the central circular area, and the second ray grooves extend outwards from the position with a certain distance away from the edge of the central circular area, so that more ray grooves can be contained in the polishing pad, the phenomenon that the ray grooves are too many to damage the strength of the central area of the polishing pad is avoided, and the liquid storage capacity and the polishing effect of the polishing pad are improved.

2. The polishing pad is further provided with the second ray grooves with different gaps in the same groove unit, the starting points of the second ray grooves in the same groove unit are prevented from being too concentrated, therefore, more second ray grooves can be accommodated in the same groove unit, the strength of the central area of the polishing pad is prevented from being damaged due to too many ray grooves, and the polishing effect of the polishing pad is further improved.

3. The polishing pad is provided with a central circular area, the diameter of the central circular area is less than 10% of the diameter of the polishing pad, and the number of first ray grooves is set according to the diameter of the central circular area. The intensity of polishing pad central region can be guaranteed when setting up a plurality of first ray grooves in central circular region on the one hand, and then improves polishing pad bulk strength, and on the other hand can increase the quantity that sets up of first ray groove through the size that enlarges central circular region, improves the ability that polishing pad stored polishing solution.

4. This polishing pad is gone up and is set up annular groove, and annular groove is with a plurality of first ray slot intercommunications for the polishing solution can circulate between a plurality of first ray slots, further improves the renewal circulation speed of polishing solution in the first ray slot, thereby improves polishing effect.

Drawings

FIG. 1 is a schematic diagram of a polishing pad having radial grooves according to the present invention.

FIG. 2 is a front view of a polishing pad having radial grooves according to the present invention.

FIG. 3 is an enlarged view of a portion of the polishing pad at A in FIG. 2.

FIG. 4 is a front view of a polishing pad having radial grooves in accordance with another embodiment of the present invention.

FIG. 5 is a side view of a polishing pad of the present invention having radial grooves.

Description of the drawings: 100. a polishing pad; 10. a polishing layer; 11. a first ray trench; 12. a trench cell; 121. a second ray trench; 1211. a first sub-trench; 1212. a second sub-trench; 1213. a third sub-trench; 13. an annular groove; 14. a central circular region; 15. a first annular region; 16. a second annular region; 17. a third annular region; 20. an adhesive layer; 30. a buffer layer; 40. a back glue layer.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will recognize without departing from the spirit and scope of the present invention.

A polishing pad 100 having radial grooves according to an embodiment will be described in detail with reference to the accompanying drawings.

As shown in fig. 1 to 5, in one embodiment, a polishing pad 100 having radial grooves is provided, the polishing pad 100 is provided with a polishing surface, the polishing surface is provided with a central circular area 14, a plurality of first ray grooves 11 and a plurality of groove units 12, the first ray grooves 11 and the groove units 12 are radially spaced around the center of the polishing surface, one end of each first ray groove 11 is connected with the edge of the central circular area 14, and the other end is connected with the edge of the polishing surface; a second ray groove 121 is formed in the groove unit 12, a gap is formed between one end of the second ray groove 121 and the edge of the central circular region 14, and the other end is connected to the edge of the polishing surface. Namely, the plurality of first radial grooves 11 are radially arranged around the center of the polishing surface, the plurality of groove units 12 are radially arranged around the center of the polishing surface, and the first radial grooves 11 and the groove units 12 are arranged at intervals around the center of the polishing surface. Since the second radial grooves 121 are formed in the groove unit 12, the first radial grooves 11 and the second radial grooves 121 are radially spaced around the center of the polishing surface.

The polishing pad 100 is provided with the first ray grooves 11 and the second ray grooves 121 which are arranged at intervals, polishing liquid is stored through the ray grooves, and waste residues generated by polishing are discharged; meanwhile, the first ray grooves 11 are formed to extend outwards from the central circular area 14, and the second ray grooves 121 extend outwards from a position away from the edge of the central circular area 14, so that more ray grooves can be accommodated in the polishing pad 100, the phenomenon that the central area of the polishing pad 100 is damaged due to excessive ray grooves is avoided, and the liquid storage capacity and the polishing effect of the polishing pad 100 are improved.

Specifically, as shown in fig. 1 and 2, in one embodiment, the diameter of the central circular region 14 satisfies: 0.01D ₁ ≤D ₂ ≤0.1D ₁ Wherein D is ₁ Is the diameter of the polished surface in mm, D ₂ Is the diameter of the central circular region 14 in mm. The central circular area 14 is provided with no groove and is a non-polishing area, and the outside of the central circular area 14 is polishedThe larger the light region, the central circular region 14, the larger the number of ray grooves that can be provided, while resulting in a smaller area of the polishing region, affecting the polishing efficiency of the polishing pad 100. The diameter of the central circular area 14 should therefore be set within a reasonable range, neither too large nor too small, which would affect the number of ray channels and too large the area of the polished area.

Further, as shown in fig. 1 and 2, in an embodiment, the number of the first ray grooves 11 is set to satisfy: a. The ₁ ≤δπD ₂ /d ₁ Wherein A is ₁ Number of first ray grooves 11, d ₁ Is the width of the first ray groove 11, D ₂ Is the diameter of the central circular region 14, δ is a constant and satisfies: delta is more than or equal to 0.6 and less than or equal to 0.8.

Wherein, polishing pad 100 includes polishing layer 10, and the polishing face is located polishing layer 10, and the degree of depth of first ray groove 11 satisfies: 0.25h ₁ ≤h ₂ ≤0.5h ₁ Wherein h is ₁ Thickness of the polishing layer 10, h ₂ Is the depth of the first ray groove 11. According to the invention, the depth of the first ray groove 11 is set to be less than or equal to 50% of the thickness of the polishing layer 10, so that the influence of the excessive depth of the first ray groove 11 on the overall strength of the polishing pad 100 is avoided, the mechanical property of the polishing pad 100 is improved, and the service life of the polishing pad 100 is further ensured. Meanwhile, the depth of the first ray groove 11 is set to be more than or equal to 25% of the thickness of the polishing layer 10, and the phenomenon that the ray groove is too shallow to affect the capability of storing polishing liquid is avoided.

And, the width of the first ray groove 11 satisfies: d is not less than 1mm ₁ The included angle between two adjacent first ray grooves 11 is larger than or equal to 10 degrees. When the polishing pad 100 has a diameter of 500mm, the diameter of the central circular region 14 may be set to 50mm, the width of the first ray groove 11 is 5mm, and the constant δ is 0.8 according to a ₁ ≤δπD ₂ /d ₁ At most, 25 first ray grooves 11 may be provided, and according to the fact that the included angle between two adjacent first ray grooves 11 is greater than or equal to 10 °, at most, 36 first ray grooves 11 may be provided, where the number of first ray grooves 11 should beThe number is less than 25.

Specifically, as shown in fig. 2 and 3, in one embodiment, the edge of the central circular region 14 is provided with an annular groove 13, and the annular grooves 13 are respectively communicated with the plurality of first ray grooves 11. The diameter of the outer ring of the annular groove 13 is equal to the diameter of the central circular area 14, the annular groove 13 communicates the plurality of first radial grooves 11, so that the polishing liquid can flow among the plurality of first radial grooves 11, the renewal circulation speed of the polishing liquid in the first radial grooves 11 is further increased, and the polishing effect is improved.

Wherein the depth of the annular groove 13 is 0.25h ₁ ～0.5h ₁ The width of the annular groove 13 is 1 mm-10 mm, the depth and the width of the annular groove 13 and the depth and the width of the first radial groove 11 can be set to be equal, and by setting the same groove depth and width, the liquid storage capacities of the polishing liquid in different radial grooves and different annular grooves 13 are the same, the flow speeds are the same, and the polishing capacities of different areas on the polishing pad 100 are guaranteed to be the same.

Specifically, as shown in fig. 1 and 2, in an embodiment, the groove unit 12 includes a plurality of second ray grooves 121, and a gap between one end of the plurality of second ray grooves 121 and an edge of the central circular region 14 has a plurality of numerical levels. That is, by setting the gaps between the plurality of second radial grooves 121 in the same groove unit 12 and the edge of the central circular area 14 to be unequal, the lengths of the plurality of second radial grooves 121 in the same groove unit 12 are unequal, so that the starting points of the second radial grooves 121 are arranged step by step in the same groove unit 12, and the polishing pad 100 is prevented from being hollowed out due to too concentrated starting points of the second radial grooves 121, thereby ensuring the overall strength of the polishing pad 100.

The polishing pad 100 is provided with the second ray grooves 121 with different gaps in the same groove unit 12, that is, the second ray grooves 121 with different lengths are arranged at intervals, so that the number of the second ray grooves 121 in the groove unit 12 is gradually increased along the direction away from the center of a circle, and the number of the ray grooves (including the first ray grooves 11 and the second ray grooves 121) on the polishing pad 100 is gradually increased along the direction away from the center of a circle, so that more ray grooves can be accommodated on the polishing pad 100, the strength of the central area of the polishing pad 100 caused by excessive ray grooves is avoided, and the polishing effect of the polishing pad 100 is further improved.

Further, with continued reference to fig. 1 and 2, in one embodiment, the gaps between one end of the plurality of second ray grooves 121 and the edge of the central circular region 14 are sequentially increased in equal difference. That is, the lengths of the second radial grooves 121 in the same groove unit 12 decrease in a sequential equal-difference manner, the starting points of the second radial grooves 121 with the same length in different groove units 12 form a virtual circle concentric with the polishing surface, and the virtual circles form a plurality of annular regions around the central circular region 14.

Wherein the difference between two adjacent numerical levels of the gap satisfies: 0.1D ₂ ≤W≤0.5D ₂ Where W is the difference between two adjacent levels of the gap.

In the present embodiment, each of the groove units 12 is provided with a first sub groove 1211, a second sub groove 1212, and a third sub groove 1213, which have lengths that are decreased in an equal difference, that is, gaps between starting points of the first sub groove 1211, the second sub groove 1212, and the third sub groove 1213 and an edge of the central circular region 14 are sequentially increased, the starting points of the plurality of first sub grooves 1211 form a first virtual circle concentric with the polishing surface, the starting points of the plurality of second sub grooves 1212 form a second virtual circle concentric with the polishing surface, and the starting points of the plurality of third sub grooves 1213 form a third virtual circle concentric with the polishing surface, and the first radial groove 11, the first sub groove 1211, the second sub groove 1212, and the third sub groove 1213 are sequentially spaced around the center of the polishing surface.

And, the region between the first virtual circle and the central circular region 14 is a first annular region 15, the region between the second virtual circle and the first virtual circle is a second annular region 16, and the region between the third virtual circle and the second virtual circle is a third annular region 17, the width of the annular regions satisfying: 0.1D ₂ ≤W≤0.5D ₂ Wherein W is the width of the annular region in mm. The outer ring diameter of the annular region, D, can be obtained according to the width of the annular region ₃ ＝D ₂ +2W, so the outer ring diameter of the annular region is 1.2D ₂ ≤D ₃ ≤2D ₂ I.e. byThe diameter of the outer ring of the annular region cannot be too large or too small, so that more ray grooves are conveniently formed in the outer edge of the annular region, the length of the ray grooves is ensured, and the area of a polishing region is enlarged. When the annular regions are provided with the first annular region 15, the second annular region 16, and the third annular region 17, the width of each annular region satisfies: 0.1D ₂ ≤W≤0.5D ₂ Thus, it is possible to obtain an outer ring diameter of the first annular region 15 of 1.2D ₂ ～2D ₂ The outer ring diameter of the second annular region 16 is 1.4D ₂ ～3D ₂ The outer ring diameter of the third annular region 17 is 1.6D ₂ ～4D ₂ . As the number of the annular regions is gradually increased, the number of the radial grooves which can be accommodated in each annular region is larger, and the larger the number of the radial grooves in the polishing pad 100 is, the stronger the liquid storage capacity is, and the better the polishing effect is without damaging the strength of the central region of the polishing pad 100. Meanwhile, the widths of the first annular region 15, the second annular region 16, and the third annular region 17 may be equal or unequal as long as 0.1D is satisfied ₂ ≤W≤0.5D ₂ And are not intended to be limiting herein.

Further, in an embodiment, the number of the second radial grooves 121 disposed on the same phantom circle satisfies: a. The ₂ ≤δπD ₃ /d ₂ Wherein A is ₂ The number of the second ray grooves 121 on the same virtual circle, d ₂ The width of the second radial groove 121 on the same virtual circle is in mm, D ₃ Is the diameter of the virtual circle in mm, δ is a constant, and satisfies: delta is more than or equal to 0.6 and less than or equal to 0.8. That is, the number of the second ray grooves 121 on each of the same virtual circles is determined by the diameter of the virtual circle, and the larger the diameter of the virtual circle is, the larger the number of the second ray grooves 121 is.

In this embodiment, the second radial grooves 121 on the same imaginary circle are uniformly distributed around the center of the polishing surface, and the included angle between two adjacent second radial grooves 121 on the same imaginary circle is greater than or equal to 5 °.

When the polishing pad 100 has a diameter of 500mm and the central circular region 14 has a diameter of 50mm, the diameter of the first virtual circle may be set to 60mm,that is, the distance between one end of the first sub-groove 1211 and the edge of the central circular region 14 is 10mm, the width of the first sub-groove 1211 is 5mm, and the constant δ is 0.8 according to A ₂ ≤δπD ₃ /d ₂ At most, 30 first sub-grooves 1211 can be provided, and 72 first sub-grooves 1211 can be provided according to an included angle between two adjacent first sub-grooves 1211 being greater than or equal to 5 °, where at most 30 first sub-grooves 1211 are provided; it may be set that the diameter of the second imaginary circle may be set to 70mm, i.e., the distance from one end of the second sub-groove 1212 to the edge of the central circular region 14 is 20mm, and the width of the second sub-groove 1212 is 5mm according to a ₂ ≤δπD ₃ /d ₂ At most, 35 second sub-grooves 1212 can be provided, and according to an included angle between two adjacent second sub-grooves 1212 being greater than or equal to 5 °, 72 second sub-grooves 1212 can be provided at most, and at this time, 35 second sub-grooves 1212 are provided at most; it may be set that the diameter of the third virtual circle may be set to 80mm, i.e., the distance of one end of the third sub-groove 1213 from the edge of the central circular area 14 is 30mm, and the width of the third sub-groove 1213 is 5mm according to a ₂ ≤δπD ₃ /d ₂ At most, 40 third sub-grooves 1213 may be provided, and at most 72 third sub-grooves 1213 may be provided according to an included angle between two adjacent third sub-grooves 1213 being equal to or greater than 5 °, where 40 third sub-grooves 1213 are provided. Therefore, the first radial grooves 11 may be provided with 25 grooves at the maximum, the first sub-grooves 1211 may be provided with 30 grooves at the maximum, the second sub-grooves 1212 may be provided with 35 grooves at the maximum, and the third sub-grooves 1213 may be provided with 40 grooves at the maximum, on the entire polishing pad 100.

Alternatively, the gaps between one end of the second ray groove 121 in different groove cells 12 and the edge of the central circular region 14 are different, i.e., the lengths of the second ray grooves 121 between different groove cells 12 may not be equal. Assuming that the first, second, and third groove units 12, 12 are provided on the polishing pad 100, the lengths of the second ray groove 121 in the first groove unit 12, the second ray groove 121 in the second groove unit 12, and the second ray groove 121 in the third groove unit 12 are not equal. The above-described scheme thus achieves the step-wise arrangement of the starting points of the second ray grooves 121 throughout the polishing pad 100, so that more second ray grooves 121 are provided on the polishing pad 100, and the starting points of the second ray grooves 121 are prevented from being excessively concentrated.

Further, in an embodiment, the polishing surface is provided with a plurality of virtual parabolas gradually far away from the central circular region 14 around the center of the polishing pad 100, and one ends of the plurality of second ray grooves 121 are sequentially distributed along the virtual parabolas.

Specifically, in one embodiment, the second ray grooves 121 are uniformly distributed around the center of the polishing pad 100, an included angle between two adjacent second ray grooves 121 is greater than or equal to 5 °, and the depth of the second ray grooves 121 is 0.25h ₁ ～0.5h ₁ The width of the second ray groove 121 is 1mm to 10mm, and the second ray groove 121 may be provided to have the same depth and the same width as the first ray groove 11. By setting the same depth and width of the grooves, the liquid storage capacities of the polishing liquid in the grooves of different radial lines are the same, the flow rates are the same, and the polishing capacities of different areas on the polishing pad 100 are guaranteed to be the same.

Specifically, as shown in fig. 4, in one embodiment, one second ray groove 121 is disposed in each groove unit 12, and the plurality of second ray grooves 121 are equal to the edge gap of the central circular region 14.

Specifically, as shown in fig. 5, in an embodiment, the polishing pad 100 includes a polishing layer 10, a buffer layer 30, and a backing layer 40, which are sequentially disposed, the polishing layer 10 and the buffer layer 30 are connected by an adhesive layer 20, the backing layer 40 is used to adhesively mount the polishing pad 100 to a polishing apparatus, and a polishing surface is disposed on a surface of the polishing layer 10 away from the buffer layer 30.

Wherein the thickness of the polishing layer 10 satisfies: h is not less than 1mm ₂ Less than or equal to 4mm, the thickness of the buffer layer 30 is 0.5mm to 2.0mm, the thickness of the adhesive layer 20 is 0.1mm to 0.2mm, the thickness of the back glue layer 40 is 0.5mm to 2.0mm, and the diameter of the polishing pad 100 is 500mm to 900mm.

Further, in one embodiment, the polishing layer 10 comprises a polyurethane polishing layer 10 prepared from an isocyanate-terminated prepolymer, a curing agent, and hollow microspheres, and the cushioning layer 30 comprises a polyurethane-impregnated nonwoven fabric.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are for purposes of illustration only and do not denote a single embodiment.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

Claims (10)

1. A polishing pad with radial grooves is characterized in that a polishing surface is arranged on a polishing pad (100), a central circular area (16), a plurality of first ray grooves (11) and a plurality of groove units (12) are arranged on the polishing surface, the first ray grooves (11) and the groove units (12) are radially arranged around the center of the polishing surface at intervals, one end of each first ray groove (11) is connected with the edge of the central circular area (16), and the other end of each first ray groove is connected with the edge of the polishing surface; a second ray groove (121) is arranged in the groove unit (12), a certain gap is formed between one end of the second ray groove (121) and the edge of the central circular area (16), and the other end of the second ray groove is connected with the edge of the polishing surface.

2. The polishing pad having radial grooves according to claim 1, wherein the groove unit (12) includes a plurality of the second ray grooves (121), and a gap between one end of the plurality of the second ray grooves (121) and an edge of the central circular region (16) has a plurality of numerical levels.

3. A polishing pad having radial grooves according to claim 2, wherein a plurality of virtual parabolas are provided on the polishing surface, which are gradually distant from the central circular region (16) around the center of the polishing pad, and one ends of the plurality of second ray grooves (121) are sequentially distributed along the virtual parabolas.

4. A polishing pad having radial grooves according to claim 2, wherein gaps between one end of a plurality of the second radial grooves (121) and the edge of the central circular region (16) are sequentially increased in an equal difference manner.

5. A polishing pad with radial grooves according to claim 2, characterized in that the diameter of the central circular area (16) is such that: 0.01D ₁ ≤D ₂ ≤0.1D ₁ Wherein D is ₁ Is the diameter of the polishing surface, D ₂ Is the diameter of the central circular area (16).

6. The polishing pad having radial grooves according to claim 5, wherein the difference between two adjacent numerical levels of said gap satisfies: 0.1D ₂ ≤W≤0.5D ₂ Where W is the difference between two adjacent levels of the gap.

7. The polishing pad having radial grooves according to claim 2, wherein an angle between adjacent two of the second radial grooves (121) is 5 ° or more.

8. The polishing pad having radial grooves according to claim 1, whereinThe number of the first ray grooves (11) is as follows: a. The ₁ ≤δπD ₂ /d ₁ Wherein A is ₁ The number of the first ray grooves (11), d ₁ Is the width, D, of the first ray groove (11) ₂ Is the diameter of the central circular area (16), δ is a constant and satisfies: delta is more than or equal to 0.6 and less than or equal to 0.8.

9. The polishing pad with radial grooves according to any one of claims 1 to 8, wherein the edge of the central circular region (16) is provided with annular grooves (15), and the annular grooves (15) are respectively communicated with the plurality of first radial grooves (11).

10. The polishing pad with radial grooves according to any one of claims 1 to 8, wherein the polishing pad (100) comprises a polishing layer (10), the polishing surface is provided on the polishing layer (10), and the depth of the first radial grooves (11) satisfies the following condition: 0.25h ₁ ≤h ₂ ≤0.5h ₁ Wherein h is ₁ Is the thickness of the polishing layer (10), h ₂ Is the depth of the first ray groove (11).

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