CN115835595B - Heat dissipation device and electronic device - Google Patents
Heat dissipation device and electronic deviceInfo
- Publication number
- CN115835595B CN115835595B CN202211648629.8A CN202211648629A CN115835595B CN 115835595 B CN115835595 B CN 115835595B CN 202211648629 A CN202211648629 A CN 202211648629A CN 115835595 B CN115835595 B CN 115835595B
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Abstract
本申请公开了一种散热装置及电子装置。散热装置用于对设于散热装置内的电子器件散热，散热装置包括多个基板、密封件和弹性件。多个基板沿第一方向间隔设置，相邻两个基板中的一者为第一基板，另一者为第二基板，第一基板朝向第二基板的一侧设置有凹槽，凹槽用于收容电子器件；密封件连接于相邻两个基板之间并与相邻两个基板合围形成容纳空间，容纳空间用于收容散热介质；弹性件设于容纳空间，弹性件一端用于与位于凹槽的电子器件连接，另一端与第二基板连接。根据本申请实施例的散热装置及电子装置，能够提高散热效率。
This application discloses a heat dissipation device and an electronic device. The heat dissipation device is used to dissipate heat from electronic components disposed within it. The heat dissipation device includes multiple substrates, a sealing member, and an elastic member. The multiple substrates are spaced apart along a first direction. One of two adjacent substrates is a first substrate, and the other is a second substrate. A groove is provided on the side of the first substrate facing the second substrate, and the groove is used to accommodate the electronic component. The sealing member connects between two adjacent substrates and surrounds the two adjacent substrates to form a receiving space, which is used to accommodate a heat dissipation medium. The elastic member is disposed in the receiving space, with one end for connecting to the electronic component located in the groove and the other end for connecting to the second substrate. The heat dissipation device and electronic device according to the embodiments of this application can improve heat dissipation efficiency.
Description
Technical Field
The present application relates to a heat dissipating device, and more particularly to a heat dissipating device and an electronic device.
Background
During the operation of the electronic device, a large amount of heat is generated, the working performance of the electronic device is seriously affected by the accumulation of the heat, and the heat generated during the operation of the electronic device is generally absorbed by a heat dissipation device and then dissipated to the external environment. The connection between the electronic device and the heat dissipation device directly influences the heat transfer efficiency of the electronic device to the heat dissipation device, the connection between the existing heat dissipation device and the electronic device is usually direct lamination, and poor thermal contact between the heat dissipation device and the electronic device can cause unsmooth heat dissipation passage and influence the heat dissipation efficiency.
Disclosure of Invention
The embodiment of the application provides a heat dissipation device and an electronic device, which can improve heat dissipation efficiency.
An embodiment of a first aspect of the present application provides a heat dissipating device for dissipating heat from an electronic device disposed in the heat dissipating device, the heat dissipating device including a plurality of substrates, a sealing member, and an elastic member. The electronic device comprises a plurality of substrates, a sealing element, an elastic element and a second substrate, wherein the substrates are arranged at intervals along a first direction, one of the two adjacent substrates is a first substrate, the other substrate is a second substrate, a groove is formed in one side of the first substrate facing the second substrate and used for accommodating the electronic device, the sealing element is connected between the two adjacent substrates and surrounds the two adjacent substrates to form an accommodating space, the accommodating space is used for accommodating a heat dissipation medium, the elastic element is arranged in the accommodating space, one end of the elastic element is used for being connected with the electronic device positioned in the groove, and the other end of the elastic element is connected with the second substrate.
According to an embodiment of the first aspect of the application, the first substrate comprises an inner surface facing the second substrate and a first surface located on one side of itself in the second direction, the recess comprises a first opening located on the first surface and a second opening located on the inner surface, the first and second directions intersecting.
According to any of the foregoing embodiments of the first aspect of the present application, the heat dissipating device further includes a barrier layer for sealing the second opening, and the elastic member is for connecting with the electronic component through the barrier layer.
According to any one of the foregoing embodiments of the first aspect of the present application, the heat dissipating device further includes a heat conducting layer disposed on an inner wall of the groove.
According to any one of the foregoing embodiments of the first aspect of the present application, the heat dissipating device further includes a third substrate, the third substrate is located on a side of the first substrate facing away from the second substrate, a groove is disposed on a side of the third substrate facing the first substrate, and the projection of the groove of the first substrate and the projection of the groove of the third substrate along the first direction are dislocated.
According to any one of the foregoing embodiments of the first aspect of the present application, the first substrate is provided with a heat dissipation post, and the heat dissipation post is connected to a surface of the first substrate away from the groove.
According to any one of the foregoing embodiments of the first aspect of the present application, at least one of the substrates includes a through hole provided therethrough, the through hole communicating two accommodation spaces adjacent in the first direction.
According to any one of the foregoing embodiments of the first aspect of the present application, the heat dissipating device further includes a medium inlet and a medium outlet, each of which communicates with the accommodating space.
According to any one of the foregoing embodiments of the first aspect of the present application, the plurality of substrates includes a first end plate and a second end plate, and the medium inlet and the medium outlet are provided on the first end plate, on the second end plate, or on the first end plate and the second end plate, respectively.
An embodiment of a second aspect of the application provides an electronic device comprising an electronic component and a heat sink as in any of the preceding first aspects, the electronic component being disposed in a recess.
The heat dissipation device comprises a plurality of substrates, wherein the substrates are arranged at intervals along a first direction, a groove is formed in the first substrate and used for accommodating electronic devices, two adjacent substrates and a sealing element arranged between the two substrates are surrounded to form an accommodating space, cooling medium is injected into the accommodating space to take away heat generated by the electronic devices, one end of an elastic element is connected with the second substrate, and the other end of the elastic element is connected with the electronic devices in the groove. Through setting up recess and elastic component, place electronic device in the recess, the recess plays certain limiting displacement to electronic device to utilize elastic deformation of elastic component, the elastic component of compression tightly sticis electronic device in the recess, make the inner wall of electronic device and recess closely laminate, and then make the better transmission of heat that electronic device work produced to first base plate, improve radiating efficiency.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present application, the drawings that are needed to be used in the embodiments of the present application will be briefly described, and it is possible for a person skilled in the art to obtain other drawings according to these drawings without inventive effort.
FIG. 1 is a top view of a heat dissipating device according to an embodiment of the first aspect of the present application;
FIG. 2 is a schematic cross-sectional view of A-A of FIG. 1;
Fig. 3 is a front view of a heat dissipating device according to an embodiment of the first aspect of the present application;
Fig. 4 is a schematic cross-sectional view of B-B of fig. 3.
Reference numerals:
10. The heat dissipation device comprises a heat dissipation device, 1, a substrate, 11, a first substrate, 111, a first surface, 112, an inner surface, 113, a heat dissipation column, 12, a second substrate, 13, a groove, 131, a first opening, 132, a second opening, 14, a third substrate, 15, a first end plate, 16, a second end plate, 17, a through hole, 2, a sealing element, 3, an elastic element, 4, an accommodating space, 5, a bolt, 6, a medium inlet, 7, a medium outlet, 8, a barrier layer, X, a first direction, Y and a second direction.
Detailed Description
Features and exemplary embodiments of various aspects of the present application will be described in detail below, and in order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be described in further detail below with reference to the accompanying drawings and the detailed embodiments. It should be understood that the particular embodiments described herein are meant to be illustrative of the application only and not limiting. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the application by illustrating examples of the application, in which at least some well-known structures and techniques are not shown in order to avoid unnecessarily obscuring the application, and the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
It should be noted that, unless otherwise indicated herein, the meaning of "plurality" is two or more, and the terms "upper", "lower", "left", "right", "inner", "outer", and the like indicate orientations or positional relationships merely to facilitate describing the present application and simplify the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the present application. Moreover, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising" does not exclude the presence of additional identical elements in a process, method, article, or apparatus that comprises the element.
The directional terms appearing in the following description are all directions shown in the drawings and do not limit the specific structure of the embodiment of the present application. In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "mounted" and "connected" are to be construed broadly, and may be fixedly connected, detachably connected, integrally connected, directly connected, or indirectly connected, for example. It will be understood that when a layer, an area, or a structure is described as being "on" or "over" another layer, another area, it can be referred to as being directly on the other layer, another area, or another layer or area can be included between the layer and the other layer, another area. And if the component is turned over, that layer, one region, will be "under" or "beneath" the other layer, another region. The specific meaning of the above terms in the present application can be understood as appropriate by those of ordinary skill in the art.
During the operation of the electronic device, a large amount of heat is generated, and the accumulation of heat can seriously affect the operation performance of the electronic device. Such as power semiconductor modules, which are semiconductor components used in power electronic circuits, are commonly used in vehicles, solar energy and industrial fields, such as inverters and rectifiers. When the power semiconductor module works, a chip of the power semiconductor can generate a large amount of heat, and the working performance of the power semiconductor module can be seriously affected by heat accumulation. With the development of chips to high power and high integration, the heat generation problem of the chips is increasingly prominent, and the heat dissipation requirement is higher.
The existing heat dissipation devices are various, for example, stacked heat dissipation devices, and can set different numbers of heat dissipation units to expand or reduce heat dissipation areas so as to adapt to different electronic devices, or can simultaneously dissipate heat of a plurality of electronic devices, so that integration and miniaturization are realized. However, the conventional stacked heat sink only considers the heat dissipation structure of the heat sink itself, and does not consider the heat path connection between the heat sink and the electronic device. The connection between the electronic device and the heat dissipating device directly affects the heat transfer efficiency of the electronic device to the heat dissipating device, the connection between the existing heat dissipating device and the electronic device is usually direct bonding, and poor thermal contact between the heat dissipating device and the electronic device can cause unsmooth heat dissipating passage and affect the heat dissipating efficiency.
In order to solve the above problems, embodiments of the present application provide a heat dissipation device and an electronic device, which can improve heat dissipation efficiency, and each embodiment of the heat dissipation device and the electronic device will be described below with reference to the accompanying drawings.
Referring to fig. 1 to 4, an embodiment of the present application provides a heat dissipating device 10 for dissipating heat from an electronic device disposed in the heat dissipating device 10, wherein the heat dissipating device 10 includes a plurality of substrates 1, a sealing member 2 and an elastic member 3. The electronic device comprises a plurality of substrates 1, wherein the substrates 1 are arranged at intervals along a first direction X, one of the two adjacent substrates 1 is a first substrate 11, the other substrate is a second substrate 12, a groove 13 is formed in one side of the first substrate 11 facing the second substrate 12, the groove 13 is used for accommodating the electronic device, a sealing element 2 is connected between the two adjacent substrates 1 and surrounds the two adjacent substrates 1 to form an accommodating space 4, the accommodating space 4 is used for accommodating a heat dissipation medium, an elastic element 3 is arranged in the accommodating space 4, one end of the elastic element 3 is used for being connected with the electronic device positioned in the groove 13, and the other end of the elastic element 3 is connected with the second substrate 12.
A heat dissipation medium is communicated between two adjacent substrates 1 to take away heat transferred to the substrates 1 by the electronic devices, the heat conduction performance of the substrates 1 is good, and optionally, copper is selected as a material of the substrates 1. The heat dissipation medium is water or a mixed solution of water and glycol. Illustratively, a heat dissipation channel is further provided between the two substrates 1, along which a heat dissipation medium flows. The plurality of base plates 1 are fastened and connected through bolts 5, alternatively, the number of the bolts 5 is 4, the shape of the base plate 1 is rectangular, and the 4 bolts 5 are respectively arranged at four corners of the base plate 1.
One of the two adjacent substrates 1 is a first substrate 11, the other is a second substrate 12, and a groove 13 is formed in one side of the first substrate 11 facing the second substrate 12. It should be understood that the same substrate 1 may be either the first substrate 11 or the second substrate 12 with respect to its adjacent substrate 1. Specifically, two substrates 1 adjacent to the same substrate 1 are respectively located at two sides of the substrate 1, one of the two adjacent substrates 1 of the substrate 1 is a first substrate 11, and the other substrate may be the first substrate 11 or a second substrate 12. That is, on adjacent two surfaces of adjacent two substrates 1, the substrate 1 having the grooves 13 is the first substrate 11, and the other substrate 1 is the second substrate 12.
The sealing member 2 may be connected to the edges of the substrates 1 to form a closed accommodating space 4 with the adjacent two substrates 1 to prevent leakage of the heat dissipation medium from damaging external circuits or other structures. One end of the elastic piece 3 is connected with the second substrate 12, after the electronic device is placed in the groove 13, one end of the elastic piece 3, which is far away from the first substrate 11, is abutted against the electronic device, and the compressed elastic piece 3 enables the electronic device to be tightly attached to the bottom wall of the groove 13, so that contact thermal resistance is reduced, and heat dissipation efficiency is improved. Alternatively, the elastic member 3 is a spring.
The heat dissipation device 10 of the embodiment of the application comprises a plurality of substrates 1, wherein the substrates 1 are arranged at intervals along a first direction X, a groove 13 is formed in a first substrate 11 and used for accommodating electronic devices, two adjacent substrates 1 and a sealing element 2 arranged between the two substrates 1 are surrounded to form an accommodating space 4, cooling medium is injected into the accommodating space 4 to take away heat generated by the electronic devices, one end of an elastic element 3 is connected with a second substrate 12, and the other end of the elastic element 3 is connected with the electronic devices positioned in the groove 13. Through setting up recess 13 and elastic component 3, place the electron device in recess 13, recess 13 plays certain limiting displacement to the electron device to utilize elastic deformation of elastic component 3, the elastic component 3 of compression tightly sticis the electron device in recess 13, make the inner wall of electron device and recess 13 closely laminate, and then make the better transmission of heat that the electron device work produced to first base plate 11, improve radiating efficiency.
In some alternative embodiments, the first substrate 11 includes an inner surface 112 facing the second substrate 12 and a first surface 111 on one side of itself in the second direction Y, and the recess 13 includes a first opening 131 on the first surface 111 and a second opening 132 on the inner surface 112, the first direction X and the second direction Y intersecting. That is, the groove 13 communicates with the outside in both the first direction X and the second direction Y, and the elastic member 3 can abut against the electronic device located in the groove 13 through the second opening 132. The electronic device can be inserted into the recess 13 via the first opening 131 when mounted. Meanwhile, after the electronic device is mounted into the recess 13, the lead terminal can connect the electronic device and an external circuit via the first opening 131. Optionally, the first openings 131 of the grooves 13 on the plurality of first substrates 11 face in the same direction, and the lead terminals are located on the same side of the substrate 1, so that the plurality of electronic devices are directly connected with an external circuit.
In these alternative embodiments, the recess 13 has a first opening 131 and a second opening 132, facilitating the mounting of the electronic device into the recess 13, and the abutment of the elastic member 3 with the electronic device.
In some alternative embodiments, the heat sink 10 further comprises a barrier layer 8, the barrier layer 8 being adapted to seal the second opening 132, the elastic member 3 being adapted to be connected to the electronic device through the barrier layer 8. The barrier layer 8 serves to separate the recess 13 from the accommodation space 4. The barrier layer 8 may be sized to cover only the second opening 132 of the recess 13, or may cover the inner surface 112 of the first substrate 11 completely, to better separate the receiving space 4 from the recess 13. Optionally, the barrier layer 8 is made of a flexible material, and an end of the elastic member 3 away from the second substrate 12 abuts against the barrier layer 8, so as to tightly press the electronic device in the groove 13. Optionally, the barrier layer 8 is a water-resistant layer.
In these alternative embodiments, after the electronic device is mounted in the recess 13 and the heat dissipation medium is passed through the accommodating space 4, the barrier layer 8 isolates the electronic device from the heat dissipation medium, so as to avoid damage to the electronic device by the heat dissipation medium. The elastic member 3 is connected to the electronic device via the barrier layer 8, pressing the electronic device tightly into the recess 13.
In some alternative embodiments, the heat sink 10 further includes a heat conductive layer (not shown) disposed on the inner wall of the recess 13. Optionally, the heat conducting layer is heat conducting silicone grease, and the heat conducting silicone grease has high heat conductivity and is an insulating material. The heat conducting layer is provided on the inner wall of the recess 13, it being understood that the heat conducting layer is provided at least on the bottom wall of the recess 13, so that heat generated by the electronic device can be transferred from the bottom wall of the recess 13 to the first substrate 11. The shape of the recess 13 can be adapted to the electronic device, the heat conducting layer being arranged on the bottom wall and the side walls of the recess 13, the heat dissipating layer being in full contact with the electronic device.
In these alternative embodiments, a heat conducting layer is provided between the electronic device and the groove 13, so that contact thermal resistance is reduced, heat generated by the electronic device can be transferred to the first substrate 11 more quickly, and heat dissipation efficiency is improved.
In some alternative embodiments, as shown in fig. 3, the heat dissipating device 10 further includes a third substrate 14, the third substrate 14 is located on a side of the first substrate 11 facing away from the second substrate 12, a groove 13 is disposed on a side of the third substrate 14 facing toward the first substrate 11, and the grooves 13 of the first substrate 11 and the grooves 13 of the third substrate 14 are offset in projection along the first direction X. It should be understood that the same substrate may be the first substrate 11, the second substrate 12, or the third substrate 14 with respect to the different substrates 1. The number of the substrates 1 may be plural, and three substrates 1 arranged in arbitrary succession are the third substrate 14, the first substrate 11, and the second substrate 12, respectively.
In these alternative embodiments, the grooves 13 of the first substrate 11 and the grooves 13 of the third substrate 14 are offset in the projection along the first direction X, in other words, the grooves 13 on the adjacent two substrates 1 are offset in the projection along the first direction X, the heat generated by the electronic devices located in the grooves 13 is not concentrated in a certain area, and the mutual influence of the electronic devices between the adjacent substrates 1 is small, which is more beneficial to heat dissipation.
In some alternative embodiments, the first substrate 11 is provided with heat dissipation pillars 113, and the heat dissipation pillars 113 are connected to a surface of the first substrate 11 remote from the grooves 13. The heat dissipation post 113 extends in the first direction X, and the shape of the heat dissipation post 113 may be a cylinder, an elliptic cylinder, a quadrangular prism, a water drop shape, or the like. In these alternative embodiments, the heat dissipation post 113 is connected to the surface of the first substrate 11 far away from the groove 13, the heat generated by the electronic device is transferred from the bottom wall of the groove 13 to the first substrate 11, the heat of the area of the first substrate 11 located near the groove 13 is higher, and the heat dissipation post 113 is provided, so that the contact area with the heat dissipation medium is increased, and the heat dissipation efficiency is further improved.
Referring to fig. 3 and 4 in combination, in some alternative embodiments, the heat dissipation device 10 further includes a medium inlet 6 and a medium outlet 7, where the medium inlet 6 and the medium outlet 7 are both in communication with the accommodating space 4.
The number of medium inlets 6 and medium outlets 7 may be the same as the number of accommodation spaces 4, that is, one medium inlet 6 and one medium outlet 7 for each accommodation space 4. In this embodiment, the electronic devices between two adjacent layers of substrates 1 have their own heat dissipation medium, and the heat dissipation between the electronic devices located in different layers is independent of each other, and does not affect each other, so that the heat dissipation phase ratio is high.
Alternatively, the number of medium inlets 6 and medium outlets 7 may be one, and at least one of the substrates 1 includes a through hole 17 provided therethrough, the through hole 17 communicating with two accommodation spaces 4 adjacent in the first direction X.
In these alternative embodiments, through holes 17 are formed on the substrate 1 to connect adjacent accommodating spaces 4, so that the heat dissipation medium can flow through all the accommodating spaces 4 in sequence after entering through the medium inlet 6, and finally flows out from the medium outlet 7, so as to play a role in heat dissipation for all the electronic devices in the heat dissipation device 10. And after the plurality of accommodating spaces 4 are communicated, only one medium inlet 6 and one medium outlet 7 are needed to be arranged, so that the processing is convenient.
In some alternative embodiments, the plurality of substrates 1 comprises a first end plate 15 and a second end plate 16, the medium inlet 6 and the medium outlet 7 being provided in both the first end plate 15, in both the second end plate 16, or in both the first end plate 15 and the second end plate 16. The first end plate 15 and the second end plate 16 are the substrates 1 located at both ends in the first direction X among the plurality of substrates 1.
In these alternative embodiments, whether the medium inlet 6 and the medium outlet 7 are provided on the first end plate 15 or the second end plate 16 or are provided separately on the first end plate 15 and the second end plate 16, the heat dissipation medium entering from the medium inlet 6 needs to flow through all the accommodating spaces 4 before flowing out from the medium outlet 7, so as to achieve the heat dissipation effect on all the electronic devices in the heat dissipation device 10.
An embodiment of the second aspect of the present application provides an electronic device comprising an electronic component and a heat sink 10 as in any of the previous embodiments of the first aspect, the electronic component being disposed within the recess 13. The number of substrates 1 of the heat sink 10 is set according to the number of electronic devices.
The electronic device has the related structure of the heat dissipating device 10 of the first embodiment, and the heat dissipating device 10 provided in each of the above embodiments has the beneficial effects of the heat dissipating device 10, and is not repeated here.
In some alternative embodiments, the surface of the electronic device facing the recess 13 is provided with a second heat conducting layer, which connects the electronic device and the inner wall of the recess 13, reducing the contact thermal resistance, so that the heat generated by the electronic device is transferred to the heat dissipating device 10 more quickly.
In accordance with the above embodiments of the application, these embodiments are not exhaustive of all details, nor are they intended to limit the application to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the application and the practical application, to thereby enable others skilled in the art to best utilize the application and various modifications as are suited to the particular use contemplated. It should be understood that the scope of the present application is not limited thereto, and any equivalent modifications or substitutions can be easily made by those skilled in the art within the technical scope of the present application, and they should be included in the scope of the present application.
Claims (10)
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| CN106445037B (en) * | 2016-11-29 | 2023-10-24 | 广东西江数据科技有限公司 | A partially immersed liquid-cooled server cooling system |
| CN111243980B (en) * | 2018-11-29 | 2022-10-28 | 成都辰显光电有限公司 | Transfer piece, transfer method and preparation method of transfer piece |
| CN111430317A (en) * | 2020-04-08 | 2020-07-17 | 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) | Phase-change radiator for forced contact reinforced heat transfer |
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| CN113645817A (en) * | 2021-09-14 | 2021-11-12 | Oppo广东移动通信有限公司 | Circuit module and electronic equipment with liquid cooling structure |
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