CN115808428B - Silicon ring flaw detection equipment and silicon ring repair process - Google Patents
Silicon ring flaw detection equipment and silicon ring repair process Download PDFInfo
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- CN115808428B CN115808428B CN202211430315.0A CN202211430315A CN115808428B CN 115808428 B CN115808428 B CN 115808428B CN 202211430315 A CN202211430315 A CN 202211430315A CN 115808428 B CN115808428 B CN 115808428B
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 94
- 238000001514 detection method Methods 0.000 title claims abstract description 58
- 230000008439 repair process Effects 0.000 title claims description 21
- 238000000034 method Methods 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims abstract description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 238000000227 grinding Methods 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 9
- 238000011010 flushing procedure Methods 0.000 claims description 9
- 238000007689 inspection Methods 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 6
- 230000003247 decreasing effect Effects 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 4
- 238000003860 storage Methods 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 238000000861 blow drying Methods 0.000 claims description 3
- 238000009835 boiling Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000012797 qualification Methods 0.000 description 6
- 230000001105 regulatory effect Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 231100000241 scar Toxicity 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The invention relates to the field of silicon part processing, in particular to silicon ring flaw detection equipment and a silicon ring repairing process, which comprise a supporting seat for bearing a silicon ring and a base for arranging the supporting seat, wherein the supporting seat is rotationally connected with the base, a first detection component is arranged on the upper side of the supporting seat, a telescopic component for adjusting the horizontal distance between the first detection component and the base is arranged between the first detection component and the base, the first detection component comprises an upper support, a driving motor is arranged on the upper support, a cross beam is arranged on a driving shaft of the driving motor, the rotation plane of the cross beam is parallel to the bearing plane of the supporting seat, and an upper laser head and an upper receiver are arranged on the cross beam.
Description
Technical Field
The invention relates to the field of silicon part processing, in particular to silicon ring flaw detection equipment and a silicon ring repair process.
Background
With the high-speed development of the semiconductor industry, the improvement of the production efficiency and the qualification rate of the finished products becomes a serious problem in the development of the industry. The silicon product has higher production requirements, the disposable qualification rate of the product in the production process is gradually reduced, and the research and development of the product repair process are also urgent; in the production and transportation processes of the product, scratch and pit cannot be avoided, the product is reasonably repaired until the product is qualified, and technical support is needed; when scratches and pits are generated on the traditional silicon ring, the damage degree of the scratches and the pits is usually required to be manually inspected, the silicon ring with smaller damage degree is polished and polished, repackaged, and the silicon ring with larger damage degree is directly scrapped; because scratches and pits are usually small, people's efforts are required to be concentrated highly when the manual visual inspection is performed on the silicon ring, and as the working time increases, misjudgment is easy to occur as to whether the damage degree meets the condition, so that the silicon ring is wasted or unnecessary loss is caused to the grinding equipment. Therefore, how to design a silicon ring flaw detection device and cooperate with a silicon ring repair process, so that the flaw degree of the surface of a silicon product can be automatically detected to screen the silicon product meeting repair conditions becomes a technical problem to be solved urgently.
Disclosure of Invention
In view of the above, the present invention aims to overcome the defects of the prior art and provide a silicon ring flaw detection device and a silicon ring repair process, which can automatically detect the flaw degree of the surface of a silicon product to screen the silicon product meeting the repair conditions.
In order to solve the technical problems, the technical scheme of the invention is as follows:
The utility model provides a silicon ring scar check out test set, includes the supporting seat that is used for bearing the silicon ring and is used for setting the base of supporting seat, the supporting seat with the base rotates to be connected, the upside of supporting seat is equipped with first detection subassembly, first detection subassembly with be equipped with the flexible subassembly that is used for adjusting the horizontal interval of two between the base, first detection subassembly includes the upper bracket, be equipped with driving motor on the upper bracket, be equipped with the crossbeam in driving motor's the drive shaft, the plane of rotation of crossbeam with the plane of bearing of supporting seat is parallel, be equipped with laser head and last receiver on the crossbeam, go up laser head 43 the rotation center with driving motor 41's drive shaft is concentric, go up the laser head with the supporting seat interval sets up, go up the transmission path of laser head with the plane of bearing of supporting seat is perpendicular.
Compared with the prior art, the invention has the advantages that:
When the laser head is used, the silicon ring is placed on the supporting seat, the upper laser head emits light to irradiate the silicon ring, the driving motor drives the cross beam to drive the upper laser head and the upper receiver to rotate, when the light emitted by the upper laser head irradiates the pit on the plane of the silicon ring, the slope of the pit is smaller when the pit is shallower, the light emitted by the upper laser head is reflected by the plane of the pit, the light reflection point irradiates the rotation plane of the upper receiver, and due to the rotation of the upper receiver, the light irradiates the upper receiver at a moment in the rotation process of the upper receiver, and the upper receiver receives a signal to indicate that the pit is shallower and is a repairable pit;
When the pit is deeper, the slope of the pit is larger, the light emitted by the upper laser head is reflected by the plane of the pit, the line reflection point irradiates outside the rotating plane of the upper receiver, and in the rotating process of the upper receiver, the light cannot irradiate on the upper receiver, and the upper receiver cannot receive a signal, so that the pit is deeper and is an unrepairable pit.
The distance between the first detection component and the base is controlled through the telescopic component, the angle of the silicon ring relative to the first detection component is controlled by the rotary supporting seat, and the flaw detection on the whole plane of the silicon ring is realized through the relative movement of the base and the first detection component.
Through setting up of last laser head and last receiver, utilize reflection and the receipt of light to according to the different principle of slope of pit that the difference of pit depth led to, thereby the effectual detection and the differentiation of pit flaw to silicon product surface that have realized of position of adjusting the receiver.
Preferably, the support base is provided with a support sliding groove, the support base is provided with a support sliding block for supporting the silicon ring, the support sliding block is in sliding connection with the support sliding groove, the support sliding block is in an annular array on the support base and is provided with a plurality of support sliding blocks, the support sliding block is connected with a first driving component for driving the support sliding block to move, the lower side of the support sliding block is provided with a second detection component, the second detection component comprises a lower laser head for irradiating the silicon ring plane and a lower receiver for receiving light reflected by the silicon ring plane, and when the support sliding block is positioned on an emergent path of the lower laser head, the first driving component drives the support sliding block to retract into the support sliding groove.
Preferably, the first driving assembly comprises a spring, a power assembly and a concave wheel;
The spring is used for applying a driving force to the supporting slide block, the direction of the driving force is directed at the circle center of the supporting seat, the spring is arranged in the supporting chute, and the power assembly is used for driving the supporting seat to rotate;
the concave wheel with base fixed connection, the lateral surface of concave wheel with support the slider and support the pressure, the concave epaxial recess that is used for holding of seting up of wheel support the slider, support the slider and include support state and storage state, during the support state, support the slider and support the silicon ring, along with the rotation of supporting seat, be located the second detects the subassembly upside support the slider slide in the inside of recess, support the slider and switch to storage state.
Preferably, a sliding rod and a lower support are arranged between the supporting seat and the upper support, the sliding rod is connected with the output end of the telescopic component, the mounting end of the telescopic component is fixedly connected with the base, the sliding rod is in vertical sliding connection with the lower support, a first locking component used for locking the relative position of the sliding rod and the lower support is arranged between the sliding rod and the lower support, the lower laser head and the lower receiver are arranged on the lower support, and an adjusting component used for adjusting the light emergent angle of the lower laser head is further arranged on the lower support.
Preferably, the adjusting component comprises an adjusting plate, the adjusting plate is fixedly connected with the lower laser head, the adjusting plate is hinged with the lower support, an adjusting chute is formed in the adjusting plate, an adjusting bolt is arranged on the adjusting plate and is in sliding connection with the adjusting chute, and the adjusting bolt is in threaded connection with the lower support.
Preferably, the upper receiver is provided with a plurality of upper laser heads and the upper receivers are sequentially and linearly arranged from left to right.
Preferably, a sliding rod is arranged between the base and the upper support, the sliding rod is connected with the output end of the telescopic component, the mounting end of the telescopic component is fixedly connected with the base, the upper support is vertically and slidably connected with the sliding rod, and a second locking component for locking the relative position of the upper support and the sliding rod is arranged between the upper support and the sliding rod.
Preferably, the telescopic assembly comprises a hydraulic cylinder, the output end of the hydraulic cylinder is fixedly connected with the first detection assembly, and the mounting end of the hydraulic cylinder is fixedly connected with the base.
A silicon ring repair process comprises the following steps:
flaw detection: selecting scratch and pit products through appearance inspection, detecting the thickness of the products and recording; wherein the appearance inspection is performed on the silicon ring using the silicon ring flaw detection apparatus according to one of claims 1 to 7;
Repairing: removing scratch pits on the surface of a product by adopting a double-sided LAP machine, and repeating the step a after the product is taken off, and checking whether the scratch pits are removed;
Cleaning: firstly, boiling and cleaning a product, then taking out the product, wiping the product by using dust-free cloth, then flushing the product, and finally placing the product in ultrasonic cleaning equipment for ultrasonic cleaning, flushing, overflowing and blow-drying by nitrogen;
Rechecking: repeating the step a, detecting the product size data and checking whether the product size data is qualified or not, and repeating the step c;
MAE: proportioning an oxide layer of an acid corrosion product, flushing, overflowing and drying with nitrogen;
Full-size measurement: repeating the step a, detecting product size data and detecting product roughness;
Po l ish: polishing the product, pouring in a machine, cleaning, showering and drying;
and (3) final inspection: before packaging, visually inspecting whether scratch and pit exist on the surface of the product.
Compared with the prior art, the invention has the advantages that:
The process is used when: ensuring the uniformity of the surface of the product when repairing scratches and pits of the product; when the equipment is processed, the flatness is still in the range of a client after the equipment is reworked with high probability; mechanical operation is increased, personnel operation is reduced, and the automation degree of production is improved;
The repair can ensure that the important dimension (flatness is less than 0.5) is still qualified, and if the repair qualification rate of the original repair process is 0%, the repair product of the invention is used at present, and the qualification is improved to 50% -60%;
the current situation that the original important dimension (flatness is less than 0.5) cannot be repaired is finished.
Preferably, in the step b, the concentration of the gravel mixture is 20% -25%, the grinding pressure is gradually increased in four stages, the grinding pressure is increased from 800N to 1500N and then is reduced to the base 1000N, the corresponding rotating speed is increased from 5 r/min to 20 r/min and then is reduced to 10 r/min, and the total grinding time is 4 min-8 min.
Drawings
FIG. 1 is a schematic structural view of a flaw detection apparatus;
FIG. 2 is a schematic diagram of a split structure of a flaw detection apparatus;
FIG. 3 is an enlarged schematic view of FIG. 2 at A;
FIG. 4 is a schematic cross-sectional view of a support base and a concave wheel;
FIG. 5 is a schematic cross-sectional view in the direction B-B of FIG. 4;
fig. 6 is a schematic cross-sectional view in the direction C-C of fig. 4.
Reference numerals: 10. a base; 11. a drive gear; 12. a driven gear; 13. a hollow shaft; 14. a hydraulic cylinder; 20. a support base; 21. a supporting chute; 22. a support slider; 23. a spring; 24. a circular groove; 25. a concave wheel; 26. a groove; 27. a limit groove; 28. a limit column; 30. a slide bar; 31. a lower support; 32. a lower laser head; 33. a lower receiver; 34. an adjusting plate; 35. adjusting the chute; 36. an adjusting bolt; 37. a lower fastening bolt; 40. an upper support; 41. a driving motor; 42. a cross beam; 43. feeding a laser head; 44. an upper receiver; 45. and (5) fastening bolts.
Detailed Description
The following detailed description of the invention is provided in connection with the accompanying drawings to facilitate understanding and grasping of the technical scheme of the invention.
Referring to fig. 1 to 6, the present embodiment provides a silicon ring flaw detection apparatus and a silicon ring repair process, which can automatically detect the flaw degree on the surface of a silicon product to screen the silicon product meeting the repair conditions.
The utility model provides a silicon ring scar check out test set, includes the supporting seat 20 that is used for bearing the silicon ring and is used for setting up the base 10 of supporting seat 20, supporting seat 20 with base 10 rotates to be connected, the upside of supporting seat 20 is equipped with first detection subassembly, first detection subassembly with be equipped with the telescopic subassembly that is used for adjusting the horizontal interval of two between the base 10, first detection subassembly includes upper bracket 40, be equipped with driving motor 41 on upper bracket 40, be equipped with crossbeam 42 in driving motor 41's the drive shaft, crossbeam 42's rotation plane with the bearing plane of supporting seat 20 is parallel, be equipped with on the crossbeam 42 and go up laser head 43 and last receiver 44, go up laser head 43's rotation center with driving motor 41's drive shaft is concentric go up laser head 43 with supporting seat 20 interval sets up, go up laser head 43's transmission path with the bearing plane of supporting seat 20 is perpendicular.
When in use, the utility model is characterized in that: placing the silicon ring on the supporting seat 20, enabling the upper laser head 43 to emit light to irradiate the silicon ring, driving the beam 42 by the driving motor 41 to drive the upper laser head 43 and the upper receiver 44 to rotate, when the light emitted by the upper laser head 43 irradiates the pit on the plane of the silicon ring, and when the pit is shallow, the slope of the pit is smaller, the light emitted by the upper laser head 43 is reflected by the plane of the pit, the light reflection point irradiates the rotation plane of the upper receiver 44, and due to the rotation of the upper receiver 44, the light irradiates the upper receiver 44 at a moment in the rotation process of the upper receiver 44, and the upper receiver 44 receives a signal indicating that the pit is shallow and is a repairable pit;
When the pit is deeper, the slope of the pit is larger, the light emitted by the upper laser head 43 is reflected by the plane of the pit, the line reflection point irradiates outside the rotation plane of the upper receiver 44, and in the rotation process of the upper receiver 44, the light cannot irradiate on the upper receiver 44, and the upper receiver 44 cannot receive a signal, so that the pit is deeper and is an unrepairable pit.
The distance between the first detection component and the base 10 is controlled through the telescopic component, the angle of the silicon ring relative to the first detection component is controlled through the rotary supporting seat 20, and the flaw detection on the whole plane of the silicon ring is realized through the relative movement of the base 10 and the first detection component.
By arranging the upper laser head 43 and the upper receiver 44, light reflection and light receiving are utilized, and the position of the upper receiver 44 is regulated according to the principle that the slopes of pits are different due to different pit depths, so that pit flaws on the surface of a silicon product are effectively detected and distinguished.
Referring to fig. 1 to 5, in order to detect whether a flaw exists on the surface of the silicon ring, a support chute 21 is formed on the support base 20, a support slide block 22 for supporting the silicon ring is provided on the support base 20, the support slide block 22 is slidably connected with the support chute 21, a plurality of support slide blocks 22 are annularly arranged on the support base 20, one support slide block 22 is connected with a first driving component for driving the support slide block 22 to move, and a second detecting component is provided on the lower side of the support slide block 22, the second detecting component comprises a lower laser head 32 for irradiating the plane of the silicon ring and a lower receiver 33 for receiving light reflected by the plane of the silicon ring, and when the support slide block 22 is positioned on the exit path of the lower laser head 32, the first driving component drives the support slide block 22 to retract into the support chute 21.
When in use, the utility model is characterized in that: the lower laser head 32 emits light to irradiate the surface of the silicon ring, if the surface of the silicon ring is free from flaws, the light reflected by the surface of the silicon ring is received by the lower receiver 33, and if flaws exist on the surface of the silicon ring, the reflection path of the light changes, and the lower receiver 33 cannot receive the light, so that the flaws exist on the surface of the silicon ring.
In combination with fig. 1 to 5, in order to comprehensively detect whether a flaw exists on the lower surface of the silicon ring, the first driving assembly comprises a spring 23 for applying a driving force to the supporting slide block 22, the direction of which is directed to the circle center of the supporting seat 20, the spring 23 is arranged in the supporting slide groove 21, the supporting seat 20 is connected with a hollow shaft 13 for driving the hollow shaft 13 to rotate, the hollow shaft 13 is fixedly connected with the supporting seat 20, the hollow shaft 13 is rotationally connected with the base 10, a driven gear 12 is fixedly arranged on the hollow shaft 13, a driving gear 11 meshed with the driven gear 12 is arranged on the base 10, a concave wheel 25 is further arranged in the supporting seat 20, the supporting slide groove 21 penetrates through the supporting seat 20 and is communicated with the round groove 24, the concave wheel 25 is contained in the round groove 24, a limit groove 27 for sleeving the limit post 28 is arranged on the concave wheel 25, the hollow wheel 25 is fixedly connected with the base 10, the hollow shaft 28 is fixedly connected with the supporting seat 22, the sliding block 22 is in a state of the sliding block 22, and the sliding block is in a state of being switched from the side of being in the side of the sliding seat 22 to the side of the sliding seat 22, and the sliding block is in the state of being held in the sliding seat 22.
When in use, the utility model is characterized in that: the driven gear 12, the hollow shaft 13 and the supporting seat 20 are driven by the driving gear 11 to rotate, the supporting seat 20 drives the supporting slide block 22 to rotate, the concave wheel 25 cannot rotate due to the limit of the limit post 28 on the concave wheel 25, the outer side surface of the concave wheel 25 is always pressed against the supporting slide block 22, when the supporting slide block 22 rotates to the groove 26, the spring 23 drives the supporting slide block 22 to move so that the supporting slide block 22 is pressed against the inner wall of the groove 26, the supporting slide block 22 on the upper side of the lower laser head 32 is accommodated in the supporting chute 21, the lower laser head 32 can realize irradiation detection on the whole length of the radial line of the silicon ring plane, and the supporting seat 20 and the supporting slide block 22 are matched to drive the silicon ring to rotate, so that irradiation detection on the whole plane of the lower side of the silicon ring is realized.
As shown in fig. 2 and 3, in order to avoid the deviation of the light emergent path caused by equipment aging and change the depth tolerance degree of the pit on the surface of the silicon ring, a sliding rod 30 and a lower support 31 are arranged between the supporting seat 20 and the upper support 40, the telescopic assembly is a hydraulic cylinder 14, the sliding rod 30 is connected with the output end of the hydraulic cylinder 14, the mounting end of the hydraulic cylinder 14 is fixedly connected with the base 10, the sliding rod 30 is vertically and slidably connected with the lower support 31, a lower fastening bolt 37 for locking the relative position of the sliding rod 30 and the lower support 31 is arranged between the sliding rod 30 and the lower support 31, the lower fastening bolt 37 is in butt joint with the sliding rod 30, the lower fastening bolt 37 is in threaded connection with the lower support 31, the lower laser head 32 is arranged on the lower support 31, an adjusting plate 34 for adjusting the light angle of the lower laser head 32 is also arranged on the lower support 31, the adjusting plate 34 is fixedly connected with the lower laser head 32, the adjusting plate 34 is hinged with the lower support 31, the adjusting plate 34 is provided with an adjusting bolt 35, and the adjusting bolt 35 is arranged on the adjusting bolt.
When in use, the utility model is characterized in that: when the outgoing path of the light rays deviates, the distance between the adjusting plate 34 and the lower support 31 is adjusted by adjusting and rotating the adjusting bolt 36 so as to adjust the outgoing angle of the light rays of the lower laser head 32, thereby ensuring the stable operation of the equipment; under the condition that the requirements on the surface of the silicon ring are not very strict, the pits with extremely small surface of the silicon ring can still be qualified, due to the difference of tolerance degrees of the pits of the silicon ring, due to the fact that the surface of the silicon ring with different roughness and the emission path of the pits with extremely small surface of the silicon ring have certain deviation compared with the smooth surface, when the tolerance degrees of the pits of the silicon ring are required to be regulated, when the detection is carried out, the distance between the lower laser head 32 and the silicon ring is regulated by sliding the lower support 31, the relative position of the lower support 31 and the slide rod 30 is locked by rotating the lower fastening bolt 37, the light emergent angle of the lower laser head 32 is regulated by rotating the regulating bolt 36, so that the deviation at a certain reflection angle is changed, the deviation amount of the falling point of reflected light is changed, and the tolerance degree of the pits of the silicon ring is changed.
As shown in fig. 2 and 3, in order to change the detection range of pit slope meeting the condition, the upper receiver 44 is provided with a plurality of upper laser heads 43 and a plurality of upper receivers 44 which are sequentially and linearly arranged from left to right, a slide bar 30 is arranged between the base 10 and the upper support 40, the telescopic component is a hydraulic cylinder 14, the slide bar 30 is connected with the output end of the hydraulic cylinder 14, the mounting end of the hydraulic cylinder 14 is fixedly connected with the base 10, the upper support 40 is vertically and slidably connected with the slide bar 30, an upper fastening bolt 45 for locking the relative position of the upper support 40 and the slide bar 30 is arranged between the upper support 40 and the upper support 40, the upper fastening bolt 45 is used for being abutted with the slide bar 30, and the upper fastening bolt 45 is in threaded connection with the upper support 40.
When in use, the utility model is characterized in that: the distance between the lower receiver 33 and the silicon ring is adjusted by sliding the upper support 40, and the relative position between the upper support 40 and the slide bar 30 is locked by rotating the upper fastening bolt 45, so that the moving range of the falling point of the reflected light of the lower receiver 33 is changed on the premise that the change range of the slope of the emitting surface is fixed due to the change of the distance between the lower receiver 33 and the silicon ring, and the detection range of the pit slope meeting the condition is further realized.
A silicon ring repair process comprises the following steps:
flaw detection: selecting scratch and pit products through appearance inspection, detecting the thickness of the products and recording;
The appearance inspection adopts the silicon ring flaw detection equipment to detect flaws on the silicon ring, the flaw detection equipment is used for greatly improving the detection efficiency of flaws on the surface of the silicon ring, and meanwhile, compared with the manual visual inspection, the error rate is greatly reduced;
Repairing: removing scratch pits on the surface of a product by adopting a double-sided LAP machine, and repeating the step a after the product is taken off, and checking whether the scratch pits are removed;
Cleaning: firstly, boiling and cleaning a product, then taking out the product, wiping the product by using dust-free cloth, then flushing the product, and finally placing the product in ultrasonic cleaning equipment for ultrasonic cleaning, flushing, overflowing and blow-drying by nitrogen;
Rechecking: repeating the step a, detecting the product size data and checking whether the product size data is qualified or not, and repeating the step c;
MAE: proportioning an oxide layer of an acid corrosion product, flushing, overflowing and drying with nitrogen;
Full-size measurement: repeating the step a, detecting product size data and detecting product roughness;
Po l ish: polishing the product, pouring in a machine, cleaning, showering and drying;
and (3) final inspection: before packaging, visually inspecting whether scratch and pit exist on the surface of the product.
The process is used when: ensuring the uniformity of the surface of the product when repairing scratches and pits of the product; when the equipment is processed, the flatness is still in the range of a client after the equipment is reworked with high probability; mechanical operation is increased, personnel operation is reduced, and the automation degree of production is improved;
The repair can ensure that the important dimension (flatness is less than 0.005) is still qualified, and if the repair qualification rate of the original repair process is 0%, the repair product of the invention is used at present, and the qualification is improved to 50% -60%;
the current situation that the original important dimension (flatness is less than 0.005) cannot be repaired is finished.
Preferably, in the step b, the concentration of the gravel mixture is 20% -25%, the grinding pressure is gradually increased in four stages, the grinding pressure is increased from 800N to 1000N, 1200N and 1500N and then decreased to 1000N, the corresponding rotating speed is increased from 5 r/min to 10 r/min, 15 r/min and 20 r/min and then decreased to 10 r/min, and the total grinding time is 4-8 min, wherein the corresponding time proportion of each stage is 1:1:1:2.1:1.
The foregoing is only exemplary of the invention, and many other embodiments of the invention are possible, and all modifications and variations of the invention are intended to fall within the scope of the invention.
Claims (8)
1. Silicon ring flaw detection equipment, including being used for bearing silicon ring's supporting seat (20) and being used for setting up base (10) of supporting seat (20), its characterized in that: the support base (20) is rotationally connected with the base (10), a first detection component is arranged on the upper side of the support base (20), a telescopic component for adjusting the horizontal distance between the first detection component and the base (10) is arranged between the first detection component and the base, the first detection component comprises an upper support (40), a driving motor (41) is arranged on the upper support (40), a cross beam (42) is arranged on a driving shaft of the driving motor (41), a rotating plane of the cross beam (42) is parallel to a bearing plane of the support base (20), an upper laser head (43) and an upper receiver (44) are arranged on the cross beam (42), the rotating center of the upper laser head (43) is concentric with the driving shaft of the driving motor (41), the upper laser head (43) is arranged at intervals, and a transmitting path of the upper laser head (43) is perpendicular to the bearing plane of the support base (20);
The support base (20) is provided with a support sliding groove (21), the support base (20) is provided with a support sliding block (22) for supporting a silicon ring, the support sliding block (22) is in sliding connection with the support sliding groove (21), the support sliding block (22) is annularly arranged on the support base (20) in an array manner, the support sliding block (22) is connected with a first driving component for driving the support sliding block (22) to move, the lower side of the support sliding block (22) is provided with a second detection component, the second detection component comprises a lower laser head (32) for irradiating a silicon ring plane and a lower receiver (33) for receiving light reflected by the silicon ring plane, and when the support sliding block (22) is positioned on an emergent path of the lower laser head (32), the first driving component drives the support sliding block (22) to retract into the support sliding groove (21).
The first driving assembly comprises a spring (23), a power assembly and a concave wheel (25);
The spring (23) is used for applying a driving force with the direction pointing to the center of the supporting seat (20) to the supporting sliding block (22), the spring (23) is arranged in the supporting sliding groove (21), and the power assembly is used for driving the supporting seat (20) to rotate;
Concave wheel (25) with base (10) fixed connection, the lateral surface of concave wheel (25) with support slider (22) is supported and is pressed, offer on concave wheel (25) and be used for holding recess (26) of support slider (22), support slider (22) are including supporting state and storage state, during supporting state, support slider (22) support the silicon ring, along with the rotation of supporting seat (20), be located second detection component upside support slider (22) slide in the inside of recess (26), support slider (22) switch to storage state.
2. The flaw detection apparatus according to claim 1, wherein a slide bar (30) and a lower support (31) are arranged between the support base (20) and the upper support (40), the slide bar (30) is connected with the output end of the telescopic assembly, the mounting end of the telescopic assembly is fixedly connected with the base (10), the slide bar (30) is vertically and slidably connected with the lower support (31), a first locking assembly for locking the relative positions of the slide bar (30) and the lower support (31) is arranged between the slide bar (30) and the lower support (31), the lower laser head (32) and the lower receiver (33) are arranged on the lower support (31), and an adjusting assembly for adjusting the light emergent angle of the lower laser head (32) is further arranged on the lower support (31).
3. A silicon ring flaw detection apparatus according to claim 2, characterized in that: the adjusting assembly comprises an adjusting plate (34), the adjusting plate (34) is fixedly connected with the lower laser head (32), the adjusting plate (34) is hinged to the lower support (31), an adjusting sliding groove (35) is formed in the adjusting plate (34), an adjusting bolt (36) is arranged on the adjusting plate (34), the adjusting bolt (36) is in sliding connection with the adjusting sliding groove (35), and the adjusting bolt (36) is in threaded connection with the lower support (31).
4. A silicon ring flaw detection apparatus according to claim 1, characterized in that: the upper receiver (44) is provided with a plurality of upper laser heads (43) and a plurality of upper receivers (44) which are sequentially and linearly arranged from left to right.
5. The silicon ring flaw detection device according to claim 4, wherein a sliding rod (30) is arranged between the base (10) and the upper support (40), the sliding rod (30) is connected with the output end of the telescopic assembly, the mounting end of the telescopic assembly is fixedly connected with the base (10), the upper support (40) is vertically and slidably connected with the sliding rod (30), and a second locking assembly for locking the relative position of the upper support (40) and the sliding rod (30) is arranged between the upper support and the sliding rod (30).
6. A silicon ring flaw detection apparatus according to claim 1, characterized in that: the telescopic assembly comprises a hydraulic cylinder (14), the output end of the hydraulic cylinder (14) is fixedly connected with the first detection assembly, and the mounting end of the hydraulic cylinder (14) is fixedly connected with the base (10).
7. The silicon ring repairing process is characterized by comprising the following steps of:
a. Flaw detection: selecting scratch and pit products through appearance inspection, detecting the thickness of the products and recording; wherein the appearance inspection is performed on the silicon ring using the silicon ring flaw detection apparatus as defined in any one of claims 1 to 6;
b. Repairing: removing scratch pits on the surface of a product by adopting a double-sided LAP machine, and repeating the step a after the product is taken off, and checking whether the scratch pits are removed;
c. Cleaning: firstly, boiling and cleaning a product, then taking out the product, wiping the product by using dust-free cloth, then flushing the product, and finally placing the product in ultrasonic cleaning equipment for ultrasonic cleaning, flushing, overflowing and blow-drying by nitrogen;
d. rechecking: repeating the step a, detecting the product size data and checking whether the product size data is qualified or not, and repeating the step c;
e. proportioning an oxide layer of an acid corrosion product, flushing, overflowing and drying with nitrogen;
f. full-size measurement: repeating the step a, detecting product size data and detecting product roughness;
g. polishing: polishing the product, pouring in a machine, cleaning, showering and drying;
h. And (3) final inspection: before packaging, visually inspecting whether scratch and pit exist on the surface of the product.
8. The silicon ring repair process according to claim 7, wherein: in the step b, the concentration of the gravel mixture is 20% -25%, the grinding pressure is gradually increased in four stages, the grinding pressure is increased from 800N to 1000N, 1200N and 1500N and then decreased to 1000N, the corresponding rotating speed is increased from 5r/min to 10r/min, 15r/min and 20r/min and then decreased to 10r/min, and the total grinding time is 4-8min, wherein the corresponding time proportion of each stage is 1:1:1:2.1:1.
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| CN116899117B (en) * | 2023-05-26 | 2024-04-26 | 山西锶为智能科技有限公司 | Laser scar repairing device |
| CN116772757B (en) * | 2023-08-21 | 2023-10-24 | 国镓芯科(成都)半导体科技有限公司 | Be used for semiconductor processing finished product measurement system |
| CN118258131B (en) * | 2024-05-29 | 2024-08-13 | 山东省计量科学研究院 | A scale self-detection device for electric water heater |
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