CN115769370A - 端子部件、集合体、半导体装置以及它们的制造方法 - Google Patents

端子部件、集合体、半导体装置以及它们的制造方法 Download PDF

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Publication number
CN115769370A
CN115769370A CN202180044287.6A CN202180044287A CN115769370A CN 115769370 A CN115769370 A CN 115769370A CN 202180044287 A CN202180044287 A CN 202180044287A CN 115769370 A CN115769370 A CN 115769370A
Authority
CN
China
Prior art keywords
terminal member
main surface
annular protrusion
terminal
aggregate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180044287.6A
Other languages
English (en)
Chinese (zh)
Inventor
谢崇发
石井隆一
三井贵夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN115769370A publication Critical patent/CN115769370A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/631—Shapes of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/631—Shapes of strap connectors
    • H10W72/634—Cross-sectional shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
CN202180044287.6A 2020-06-30 2021-06-25 端子部件、集合体、半导体装置以及它们的制造方法 Pending CN115769370A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-112651 2020-06-30
JP2020112651 2020-06-30
PCT/JP2021/024120 WO2022004589A1 (ja) 2020-06-30 2021-06-25 端子部材、集合体、半導体装置およびこれらの製造方法

Publications (1)

Publication Number Publication Date
CN115769370A true CN115769370A (zh) 2023-03-07

Family

ID=79316067

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180044287.6A Pending CN115769370A (zh) 2020-06-30 2021-06-25 端子部件、集合体、半导体装置以及它们的制造方法

Country Status (4)

Country Link
US (1) US12555968B2 (https=)
JP (1) JP7341345B2 (https=)
CN (1) CN115769370A (https=)
WO (1) WO2022004589A1 (https=)

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0812891B2 (ja) 1992-03-17 1996-02-07 東洋産業株式会社 半田片付きダイオード用リードピンおよびその製造方法
US5508561A (en) 1993-11-15 1996-04-16 Nec Corporation Apparatus for forming a double-bump structure used for flip-chip mounting
JPH07142488A (ja) 1993-11-15 1995-06-02 Nec Corp バンプ構造及びその製造方法並びにフリップチップ実装 構造
JP2004507111A (ja) * 2000-08-18 2004-03-04 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 半導体デバイス及び支持基板の製造方法並びに前記方法によって得られる半導体デバイス
JP4281050B2 (ja) 2003-03-31 2009-06-17 株式会社デンソー 半導体装置
JP2006286977A (ja) * 2005-03-31 2006-10-19 Eudyna Devices Inc 半導体装置およびその製造方法並びに金属部材および金属部材の製造方法。
JP4968195B2 (ja) 2008-06-24 2012-07-04 株式会社デンソー 電子装置の製造方法
US8513784B2 (en) * 2010-03-18 2013-08-20 Alpha & Omega Semiconductor Incorporated Multi-layer lead frame package and method of fabrication
US8987879B2 (en) * 2011-07-06 2015-03-24 Infineon Technologies Ag Semiconductor device including a contact clip having protrusions and manufacturing thereof
CN103534796B (zh) * 2011-08-10 2016-06-01 富士电机株式会社 半导体装置和半导体装置的制造方法
JP5800778B2 (ja) 2011-11-25 2015-10-28 三菱電機株式会社 接合方法および半導体装置の製造方法
CN204144243U (zh) 2014-10-17 2015-02-04 常州银河世纪微电子有限公司 一种贴片式二极管的结构
JP2016099127A (ja) * 2014-11-18 2016-05-30 富士電機株式会社 パワー半導体モジュールの製造方法及びその中間組立ユニット
KR101631232B1 (ko) 2014-12-15 2016-06-27 제엠제코(주) 클립을 이용한 적층 패키지
JP6485398B2 (ja) 2016-04-13 2019-03-20 株式会社デンソー 電子装置及びその製造方法
DE112016006908B4 (de) 2016-05-26 2024-12-12 Mitsubishi Electric Corporation Leistungshalbleitervorrichtung
CN109478521B (zh) * 2016-07-26 2022-10-11 三菱电机株式会社 半导体装置
JPWO2018207856A1 (ja) 2017-05-10 2020-05-14 ローム株式会社 パワー半導体装置
WO2019167102A1 (ja) 2018-02-27 2019-09-06 新電元工業株式会社 半導体装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
WO2022004589A1 (ja) 2022-01-06
JP7341345B2 (ja) 2023-09-08
US12555968B2 (en) 2026-02-17
JPWO2022004589A1 (https=) 2022-01-06
US20230187339A1 (en) 2023-06-15

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