CN115741451A - Ceramic disc grinding machine, floating type grinding mechanism and working method of floating type grinding mechanism - Google Patents
Ceramic disc grinding machine, floating type grinding mechanism and working method of floating type grinding mechanism Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 49
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- 238000006073 displacement reaction Methods 0.000 claims description 13
- 239000003638 chemical reducing agent Substances 0.000 claims description 7
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
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Abstract
Description
技术领域technical field
本发明涉及半导体清洗设备技术领域,具体涉及一种陶瓷盘研磨机、浮动式研磨机构及其工作方法。The invention relates to the technical field of semiconductor cleaning equipment, in particular to a ceramic disc grinder, a floating grinding mechanism and a working method thereof.
背景技术Background technique
现有的客户现场是通过手动打磨陶瓷盘,存在以下技术缺陷:手工打磨时,陶瓷盘受力不均匀,产品表面光洁度不好;另外,人工打磨的工作效率低,耗时长。The existing customer site is to manually polish the ceramic disc, which has the following technical defects: when manual grinding, the force on the ceramic disc is uneven, and the surface finish of the product is not good; in addition, the work efficiency of manual grinding is low and takes a long time.
因此,如何设计一种可以代替手工打磨的、用于陶瓷盘研磨机的浮动式研磨机构,成为急需解决的问题。Therefore, how to design a floating grinding mechanism for ceramic disc grinding machines that can replace manual grinding has become an urgent problem to be solved.
发明内容Contents of the invention
针对现有技术存在的问题,本发明提供一种陶瓷盘研磨机、浮动式研磨机构及其工作方法,以解决上述至少一种技术问题。Aiming at the problems existing in the prior art, the present invention provides a ceramic disc grinder, a floating grinding mechanism and a working method thereof, so as to solve at least one of the above-mentioned technical problems.
本发明的技术方案是:一种陶瓷盘研磨机的浮动式研磨机构,包括沿着垂直方向布置的Z轴底板,所述Z轴底板上设置有支撑座,支撑座上设置有气缸,气缸的活塞向下布置,气缸的活塞端设置有压力传感器,压力传感器安装在Z轴滑块上,Z轴滑块上还设置有第一伺服电机,第一伺服电机的输出端向下布置,第一伺服电机的输出端通过磨头轴连接研磨头;气缸的缸体一侧设置有编码器拉板,Z轴滑块上设置有拉绳位移编码器,拉绳位移编码器的头部与编码器拉板连接;气源分两路分别接入气缸的上端接口和下端接口,一路依次通过减压阀、速度控制阀、二位二通电磁阀接入气缸的下端接口,另一路依次通过电气比例阀、二位三通电磁阀接入气缸的上端接口,二位三通电磁阀的一个端口接蓄能器;第一伺服电机、拉绳位移编码器、压力传感器、二位二通电磁阀、电气比例阀、二位三通电磁阀均连接PLC控制器。The technical solution of the present invention is: a floating grinding mechanism of a ceramic disc grinding machine, including a Z-axis bottom plate arranged along the vertical direction, a support seat is arranged on the Z-axis bottom plate, a cylinder is arranged on the support seat, and the cylinder The piston is arranged downwards, and the piston end of the cylinder is provided with a pressure sensor. The pressure sensor is installed on the Z-axis slider, and the Z-axis slider is also provided with a first servo motor. The output end of the first servo motor is arranged downwards. The output end of the servo motor is connected to the grinding head through the grinding head shaft; the side of the cylinder body of the cylinder is provided with an encoder pull plate, and the Z-axis slider is provided with a drawstring displacement encoder, and the head of the drawstring displacement encoder is connected to the encoder. Pull plate connection; the air source is connected to the upper port and the lower port of the cylinder in two ways, one way is connected to the lower port of the cylinder through the pressure reducing valve, the speed control valve, and the two-position two-way solenoid valve in turn, and the other way is through the electrical proportional The valve and the two-position three-way solenoid valve are connected to the upper interface of the cylinder, and one port of the two-position three-way solenoid valve is connected to the accumulator; the first servo motor, pull rope displacement encoder, pressure sensor, two-position two-way solenoid valve, The electric proportional valve and the two-position three-way solenoid valve are connected to the PLC controller.
本发明采用压力传感器反馈气缸的压力给PLC控制器,通过PLC控制器控制气路系统中的各个电磁阀;拉绳位移编码器反馈记录研磨头的位置并发送给PLC控制器,通过PLC控制器控制研磨头的转速进行打磨,提高了工作效率,解决了人工打磨工作效率低、耗时长的技术缺陷。The present invention adopts the pressure sensor to feed back the pressure of the cylinder to the PLC controller, and controls each solenoid valve in the air circuit system through the PLC controller; the pull rope displacement encoder feeds back and records the position of the grinding head and sends it to the PLC controller, and through the PLC controller Grinding by controlling the speed of the grinding head improves work efficiency and solves the technical defects of low efficiency and time-consuming manual grinding.
本发明提供一种陶瓷盘研磨机的浮动式研磨机构工作方法,包括以下步骤:The invention provides a working method of a floating grinding mechanism of a ceramic disc grinder, comprising the following steps:
S1.研磨头向下运动至下限位的位置,S1. The grinding head moves down to the lower limit position,
浮动式研磨机构的研磨头升降部分在不通气的情况下,由于其自身的重量G1,向下运动至下限位的位置;The lifting part of the grinding head of the floating grinding mechanism moves downward to the lower limit position due to its own weight G1 without ventilation;
S2.首次调试,S2. First commissioning,
T1.气缸的下端压力调节,二位二通电磁阀通电,气源的气体依次通过减压阀、速度控制阀、二位二通电磁阀进入气缸的下端接口,调节减压阀的压力,使研磨头升降部分平衡不动时的压力为P1,此时P1=G1;T2.减压阀的实际使用压力调节,减压阀实际使用的压力记为P2,使P2-P1≥0MPa,差值范围为0.01-0.1MPa,根据需要在差值范围内任取一个值,这样研磨头升降部分能向上移动;T1. The pressure at the lower end of the cylinder is adjusted, the two-position two-way solenoid valve is energized, the gas from the gas source enters the lower end interface of the cylinder through the pressure reducing valve, the speed control valve, and the two-position two-way solenoid valve in sequence, and the pressure of the pressure relief valve is adjusted so that The pressure when the lifting part of the grinding head is balanced is P1, at this time P1=G1; T2. The actual pressure adjustment of the pressure reducing valve, the actual pressure of the pressure reducing valve is recorded as P2, so that P2-P1≥0MPa, the difference The range is 0.01-0.1MPa, any value can be selected within the difference range according to the needs, so that the lifting part of the grinding head can move upward;
T3.调节气缸的上升速度,T3. Adjust the rising speed of the cylinder,
调节速度控制阀的流量,使气缸上升时速度平缓,完成气缸的下端压力调节;Adjust the flow rate of the speed control valve so that the speed of the cylinder rises smoothly, and the pressure adjustment of the lower end of the cylinder is completed;
T4.气缸的上端压力调节,二位三通电磁阀通电,气源的气体依次通过电气比例阀、二位三通电磁阀进入气缸的上端接口,然后PLC控制器通过电信号调节电气比例阀的阀芯截面面积,从而调节压力的大小,此时的压力记为P3,使P3-(P2-P1)=P,P为压力传感器的设置压力,P设为0.1-0.5kg/cm2;T4. The upper end pressure of the cylinder is adjusted, the two-position three-way solenoid valve is energized, the gas of the gas source enters the upper end interface of the cylinder through the electric proportional valve and the two-position three-way solenoid valve in turn, and then the PLC controller adjusts the electric proportional valve through the electric signal. The cross-sectional area of the spool, thereby adjusting the size of the pressure, the pressure at this time is recorded as P3, so that P3-(P2-P1)=P, P is the set pressure of the pressure sensor, and P is set to 0.1-0.5kg/cm2;
S3.研磨头向上运动至上限位的位置,S3. The grinding head moves upward to the upper limit position,
在使用过程中,气缸的下端接口气路上的二位二通电磁阀一直通电,使研磨头升降部分上升至上限位的位置;During use, the two-position two-way solenoid valve on the air circuit at the lower end of the cylinder is always energized, so that the lifting part of the grinding head rises to the upper limit position;
S4.研磨,S4. Grinding,
U1.使研磨头移动至原点,原点为陶瓷盘的圆心;U1. Move the grinding head to the origin, which is the center of the ceramic disc;
U2.第一伺服电机控制研磨头旋转,转速范围0-600rpm,根据需要设定;U2. The first servo motor controls the rotation of the grinding head, and the speed range is 0-600rpm, which can be set according to needs;
U3.喷嘴开始喷水;U3. The nozzle starts to spray water;
U4.气缸的上端接口气路上的二位三通电磁阀通电,研磨头缓慢下压,当触碰到陶瓷盘时开始研磨;U4. The two-position three-way solenoid valve on the air circuit of the upper interface of the cylinder is energized, and the grinding head is slowly pressed down, and starts grinding when it touches the ceramic disc;
U5.研磨路径为沿着原点以螺旋线的方式向外扩散;U5. The grinding path is to spread out along the origin in a helical manner;
S5.研磨结束,S5. End of grinding,
V1.二位三通电磁阀断电,研磨头上升,并退回至停止点,可用于更换研磨头及陶瓷盘,V1. The two-position three-way solenoid valve is powered off, the grinding head rises and returns to the stop point, which can be used to replace the grinding head and ceramic disc.
V2.喷嘴停止喷水;V2. The nozzle stops spraying water;
V3.更换陶瓷盘;V3. Replace the ceramic disc;
S6.重复以上步骤S3-S5。S6. Repeat the above steps S3-S5.
本发明的浮动式研磨机构在研磨过程中,研磨头的上升下降位置是通过气缸来控制的,在研磨时研磨头是浮动的,不是完全的硬接触,当实际过程中的研磨压力与屏幕上设计的压力不一致时,PLC控制器进行压力实时监控并通过电气比例阀进行补偿压力,电气比例阀自动的微动调节使研磨的压力稳定,研磨路径为沿着原点以螺旋线的方式向外扩散,可使陶瓷盘表面残留的膜被均匀研磨掉,使陶瓷盘的表面纹理光滑,解决了手工打磨时陶瓷盘受力不均匀、产品表面光洁度不好的技术缺陷。In the floating grinding mechanism of the present invention, during the grinding process, the rising and falling position of the grinding head is controlled by the air cylinder. During grinding, the grinding head is floating and not in complete hard contact. When the grinding pressure in the actual process and the screen When the designed pressure is inconsistent, the PLC controller monitors the pressure in real time and compensates the pressure through the electric proportional valve. The automatic micro-adjustment of the electric proportional valve makes the grinding pressure stable, and the grinding path spreads out along the origin in the form of a spiral , the remaining film on the surface of the ceramic disc can be evenly ground off, making the surface texture of the ceramic disc smooth, which solves the technical defects of uneven force on the ceramic disc and poor surface finish of the product during manual grinding.
附图说明Description of drawings
图1为本发明的浮动式研磨机构三维图。Fig. 1 is a three-dimensional view of the floating grinding mechanism of the present invention.
图2为本发明的浮动式研磨机构气路控制图。Fig. 2 is a gas circuit control diagram of the floating grinding mechanism of the present invention.
图3为本发明的陶瓷盘研磨机安装结构俯视图。Fig. 3 is a top view of the installation structure of the ceramic disc grinding machine of the present invention.
图中:1.研磨头;2.磨头卡座;3.Z轴滑块;4.第一支撑;5.拉绳位移编码器;6.传感器过渡板;7.导轨;8.压力传感器;9.第二支撑;10.Z轴底板;11.编码器拉板;12.气缸安装板;13.气缸;14.第一伺服电机;15.减速机;16.电机安装座;17.联轴器;18.圆螺母;19.圆锥滚子轴承;20.磨头轴承座;21.磨头轴;22.磨头轴过渡板;23.陶瓷盘;24.二位二通电磁阀;25.速度控制阀;26.减压阀;27.气源;28.电气比例阀;29.二位三通电磁阀;30.喷嘴;31.停止点;32.Y轴丝杠;33.X轴丝杠;34.原点。In the figure: 1. Grinding head; 2. Grinding head holder; 3. Z-axis slider; 4. First support; ;9. Second support; 10. Z-axis bottom plate; 11. Encoder pull plate; 12. Cylinder mounting plate; 13. Cylinder; 14. First servo motor; 15. Reducer; 16. Motor mounting seat; 17. Coupling; 18. Round nut; 19. Tapered roller bearing; 20. Grinding head bearing seat; 21. Grinding head shaft; 22. Grinding head shaft transition plate; 23. Ceramic disc; 24. Two-position two-way solenoid valve ;25. Speed control valve; 26. Pressure reducing valve; 27. Air source; 28. Electric proportional valve; 29. Two-position three-way solenoid valve; 30. Nozzle; 31. Stop point; 32. Y-axis screw; 33 .X-axis lead screw; 34. Origin.
具体实施方式Detailed ways
下面结合附图对本发明做进一步的说明。The present invention will be further described below in conjunction with the accompanying drawings.
参阅图1-3,本说明书所附图式所绘示的结构、比例、大小等,均仅用以配合说明书所揭示的内容,以供熟悉此技术的人士了解与阅读,并非用以限定本发明可实施的限定条件,故不具技术上的实质意义,任何结构的修饰、比例关系的改变或大小的调整,在不影响本发明所能产生的功效及所能达成的目的下,仍均应落在本发明所揭示的技术内容能涵盖的范围内。同时,本说明书中所引用的如“上”、“下”、“左”、“右”、“中间”及“一”等的用语,亦仅为便于叙述的明了,而非用以限定本发明可实施的范围,其相对关系的改变或调整,在无实质变更技术内容下,当亦视为本发明可实施的范畴。Referring to Figures 1-3, the structures, proportions, sizes, etc. shown in the drawings attached to this manual are only used to match the content disclosed in the manual, for those who are familiar with this technology to understand and read, and are not intended to limit the scope of this manual. The restrictive conditions for the implementation of the invention, so it has no technical significance. Any modification of the structure, change of the proportional relationship or adjustment of the size shall still be implemented without affecting the effect and the purpose of the present invention. fall within the scope covered by the technical content disclosed in the present invention. At the same time, terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description and are not used to limit this specification. The practicable scope of the invention and the change or adjustment of its relative relationship shall also be regarded as the practicable scope of the present invention without any substantial change in the technical content.
实施例一、一种陶瓷盘研磨机的浮动式研磨机构工作方法,参考图2,包括以下步骤:S1.研磨头向下运动至下限位的位置,浮动式研磨机构的研磨头升降部分在不通气的情况下,由于其自身的重量G1,向下运动至下限位的位置,气缸13采用低摩擦气缸;
S2.首次调试,S2. First commissioning,
T1.气缸的下端压力调节,二位二通电磁阀24通电,气源27的气体依次通过减压阀26、速度控制阀25、二位二通电磁阀24进入气缸13的下端接口,调节减压阀26的压力,使研磨头升降部分平衡不动时的压力为P1,此时P1=G1;T1. The lower end pressure of the cylinder is adjusted, the two-position two-
T2.减压阀的实际使用压力调节,减压阀26实际使用的压力记为P2,使P2-P1≥0MPa,差值取0.05MPa,这样研磨头升降部分能向上移动;T2. The actual pressure adjustment of the pressure reducing valve. The actual pressure of the
T3.调节气缸的上升速度,调节速度控制阀25的流量,使气缸13上升时速度平缓,完成气缸13的下端压力调节;T3. Adjust the rising speed of the cylinder, adjust the flow rate of the
T4.气缸的上端压力调节,二位三通电磁阀29通电,气源27的气体依次通过电气比例阀28、二位三通电磁阀29进入气缸13的上端接口,然后PLC控制器通过电信号调节电气比例阀28的阀芯截面面积,从而调节压力的大小,此时的压力记为P3,使P3-(P2-P1)=P,P为压力传感器8的设置压力,P取值0.2kg/cm2;T4. The upper end pressure of the cylinder is adjusted, the two-position three-
S3.研磨头向上运动至上限位的位置,S3. The grinding head moves upward to the upper limit position,
在使用过程中,气缸13的下端接口气路上的二位二通电磁阀24一直通电,使研磨头升降部分上升至上限位的位置;During use, the two-position two-
S4.研磨,S4. Grinding,
U1.使研磨头1移动至原点34,原点34为陶瓷盘23的圆心;U1. Make the grinding
U2.第一伺服电机14控制研磨头1旋转,转速范围0-600rpm,根据需要设定;U2. The
U3.喷嘴30开始喷水;U3. The
U4.气缸13的上端接口气路上的二位三通电磁阀29通电,研磨头1缓慢下压,当触碰到陶瓷盘23时开始研磨;U4. The two-position three-
U5.研磨路径为沿着原点以螺旋线的方式向外扩散;U5. The grinding path is to spread out along the origin in a helical manner;
S5.研磨结束,S5. End of grinding,
V1.二位三通电磁阀29断电,研磨头1上升,并退回至停止点32,可用于更换研磨头1及陶瓷盘23,V1. The two-position three-
V2.喷嘴30停止喷水;V2. The
V3.更换陶瓷盘23;V3. Replace the
S6.重复以上步骤S3-S5。本发明的浮动式研磨机构在研磨过程中,研磨头的上升下降位置是通过气缸来控制的,在研磨时研磨头是浮动的,不是完全的硬接触,当实际过程中的研磨压力与屏幕上设计的压力不一致时,PLC控制器进行压力实时监控并通过电气比例阀进行补偿压力,电气比例阀自动的微动调节使研磨的压力稳定,研磨路径为沿着原点以螺旋线的方式向外扩散,可使陶瓷盘表面残留的膜被均匀研磨掉,使陶瓷盘的表面纹理光滑,解决了手工打磨时陶瓷盘受力不均匀、产品表面光洁度不好的技术缺陷。S6. Repeat the above steps S3-S5. In the floating grinding mechanism of the present invention, during the grinding process, the rising and falling position of the grinding head is controlled by the air cylinder. During grinding, the grinding head is floating and not in complete hard contact. When the grinding pressure in the actual process and the screen When the designed pressure is inconsistent, the PLC controller monitors the pressure in real time and compensates the pressure through the electric proportional valve. The automatic micro-adjustment of the electric proportional valve makes the grinding pressure stable, and the grinding path spreads out along the origin in the form of a spiral , the remaining film on the surface of the ceramic disc can be evenly ground off, making the surface texture of the ceramic disc smooth, which solves the technical defects of uneven force on the ceramic disc and poor surface finish of the product during manual grinding.
实施例二、一种陶瓷盘研磨机的浮动式研磨机构,参考图1、图2、图3,包括沿着垂直方向布置的Z轴底板10,所述Z轴底板10上设置有支撑座,支撑座上设置有气缸13,气缸13的活塞向下布置,气缸13的活塞端设置有压力传感器8,压力传感器8安装在Z轴滑块3上,Z轴滑块3上还设置有第一伺服电机14,第一伺服电机14的输出端向下布置,第一伺服电机14的输出端通过磨头轴21连接研磨头1,研磨头1的下方工作台上设置有待加工的陶瓷盘23;研磨头1的材质是砂纸打磨片和菜花布;气缸13的缸体一侧设置有编码器拉板11,Z轴滑块3上设置有拉绳位移编码器5,拉绳位移编码器5的头部与编码器拉板11连接;气源27分两路分别接入气缸13的上端接口和下端接口,一路依次通过减压阀26、速度控制阀25、二位二通电磁阀24接入气缸13的下端接口,另一路依次通过电气比例阀28、二位三通电磁阀29接入气缸13的上端接口,二位三通电磁阀29的一个端口接蓄能器;第一伺服电机14、拉绳位移编码器5、压力传感器8、二位二通电磁阀24、电气比例阀28、二位三通电磁阀29均连接PLC控制器。本发明采用压力传感器反馈气缸的压力给PLC控制器,通过PLC控制器控制气路系统中的各个电磁阀;拉绳位移编码器反馈记录研磨头的位置并发送给PLC控制器,研磨头未碰到陶瓷盘就开始进行研磨动作,会进行报警;通过PLC控制器控制研磨头的转速进行打磨,提高了工作效率,解决了人工打磨工作效率低、耗时长的技术缺陷。
实施例三、在实施例二的基础上,所述Z轴底板10上设置有平行布置的直线导轨副,直线导轨副包括导轨7及沿着导轨7移动的滑块,Z轴滑块3安装在滑块上;支撑座包括第一支撑4、第一支撑4上方的第二支撑9,其中第一支撑4安装在Z轴滑块3上,第一支撑4上设置有电机安装座16,拉绳位移编码器5、第一伺服电机14均安装在电机安装座16上。本发明采用滑块带动Z轴滑块、第一伺服电机沿着导轨移动,通过安装在电机安装座上的第一伺服电机驱动研磨头。
实施例四、在实施例三的基础上,所述第二支撑9为固定支撑座,第二支撑9上设置有气缸安装板12,编码器拉板11、气缸13均安装在气缸安装板12上。本发明通过第二支撑固定安装气缸的缸体部分。
实施例五、在实施例三的基础上,所述压力传感器8通过传感器过渡板6安装在电机安装座16上。本发明采用压力传感器随着Z轴滑块沿着导轨移动。
实施例六、在实施例五的基础上,所述第一伺服电机14与电机安装座16之间还设置有减速机15,第一伺服电机14的输出端连接减速机15的输入端,减速机15的输出端通过联轴器17连接磨头轴21。本发明采用减速机,降低磨头轴的转速。
实施例七、在实施例六的基础上,所述Z轴滑块3上还设置有磨头轴承座20,磨头轴承座20内设置有2个成对使用的圆锥滚子轴承19,磨头轴21向上穿过圆锥滚子轴承19后与联轴器17连接。本发明采用2个成对使用的圆锥滚子轴承,可以承受径向和轴向的联合负荷。
实施例八、在实施例七的基础上,所述磨头轴21露出圆锥滚子轴承19的一端均设置有外螺纹段,外螺纹段分别与圆螺母18旋合。所述磨头轴21远离第一伺服电机14的一端设置有磨头轴过渡板22,研磨头1安装在磨头卡座2上,磨头卡座2安装在磨头轴过渡板22上。本发明采用磨头轴承座的沉孔轴肩和圆螺母分别对圆锥滚子轴承的两侧端面进行限位。
实施例九、一种陶瓷盘研磨机,参考图3,包括浮动式研磨机构,浮动式研磨机构的Z轴底板10安装在Y轴丝杠32的第一丝杠螺母上,Y轴丝杠32安装在X轴丝杠33的第二丝杠螺母上,Y轴丝杠32通过第二伺服电机驱动,X轴丝杠33通过第三伺服电机驱动,第二伺服电机、第三伺服电机均连接PLC控制器,通过PLC控制器控制研磨头1的工作路径;研磨头1的一侧设置有喷嘴30,待加工的陶瓷盘23圆心为原点34,陶瓷盘的外圈一侧设置有停止点31。本发明采用PLC控制器控制第一伺服电机、第二伺服电机、第三伺服电机控制研磨头的工作路径,实现研磨路径沿着原点以螺旋线的方式向外扩散。
以上仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。The above are only preferred embodiments of the present invention, and it should be pointed out that for those of ordinary skill in the art, some improvements and modifications can also be made without departing from the principle of the present invention, and these improvements and modifications should also be considered Be the protection scope of the present invention.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116551519A (en) * | 2023-04-06 | 2023-08-08 | 上海富乐德智能科技发展有限公司 | Polishing and cleaning equipment for ceramic component of semiconductor etching device and working method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102019572A (en) * | 2010-11-01 | 2011-04-20 | 中国人民解放军国防科学技术大学 | Polishing process adopting combined spiral polishing path |
| CN102873628A (en) * | 2012-09-26 | 2013-01-16 | 清华大学 | Helix machining path for numerical-control small tool polishing |
| CN109590853A (en) * | 2019-01-07 | 2019-04-09 | 河北工业大学 | A kind of large-scale curved Pneumatic flexible grinding device |
| CN213054298U (en) * | 2020-07-16 | 2021-04-27 | 东莞市钧杰陶瓷科技有限公司 | Rotary disc type ceramic plane grinder |
| CN113370071A (en) * | 2021-06-18 | 2021-09-10 | 深圳大学 | Grinding method and device for axisymmetric component |
| CN113910098A (en) * | 2021-10-19 | 2022-01-11 | 上海汉虹精密机械有限公司 | Accurate pressurization gas circuit control system for grinding and polishing machine |
-
2022
- 2022-12-05 CN CN202211547420.2A patent/CN115741451A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102019572A (en) * | 2010-11-01 | 2011-04-20 | 中国人民解放军国防科学技术大学 | Polishing process adopting combined spiral polishing path |
| CN102873628A (en) * | 2012-09-26 | 2013-01-16 | 清华大学 | Helix machining path for numerical-control small tool polishing |
| CN109590853A (en) * | 2019-01-07 | 2019-04-09 | 河北工业大学 | A kind of large-scale curved Pneumatic flexible grinding device |
| CN213054298U (en) * | 2020-07-16 | 2021-04-27 | 东莞市钧杰陶瓷科技有限公司 | Rotary disc type ceramic plane grinder |
| CN113370071A (en) * | 2021-06-18 | 2021-09-10 | 深圳大学 | Grinding method and device for axisymmetric component |
| CN113910098A (en) * | 2021-10-19 | 2022-01-11 | 上海汉虹精密机械有限公司 | Accurate pressurization gas circuit control system for grinding and polishing machine |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116551519A (en) * | 2023-04-06 | 2023-08-08 | 上海富乐德智能科技发展有限公司 | Polishing and cleaning equipment for ceramic component of semiconductor etching device and working method thereof |
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