CN115663588A - Heat radiator for high power laser instrument - Google Patents

Abstract

The invention relates to the technical field of heat dissipation for high-power lasers, in particular to a heat dissipation device for high-power lasers. The device includes a board and a laser module. The laser module is used to install the laser and dissipate heat for the laser. The laser module is installed on the board. There is a fluid channel inside the board, which is projected along the thickness direction of the board. The projection of each laser module is uniform. It coincides with the projection part of the fluid channel, and the area of the overlapped part is the same. The plate body is provided with a liquid inlet and a liquid outlet. The fluid channel is connected with the liquid inlet and the liquid outlet respectively, and the cooling liquid passes through the liquid inlet and the liquid outlet. Continuously flow through the fluid channel to dissipate heat from the laser module; the laser module includes a heat sink and a heat pipe, the heat sink is fixed on the board, the first end of the heat pipe is passed through the heat sink, and the second end of the heat pipe passes through the board into the fluid path. The invention provides a heat dissipation device for a high-power laser, which can realize uniform heat dissipation of multiple laser modules.

Description

A cooling device for a high-power laser

technical field

The invention relates to the technical field of heat dissipation for high-power lasers, in particular to a heat dissipation device for high-power lasers.

Background technique

The working principle of high-power lasers is to convert electrical energy into light energy through semiconductors. For lasers made of semiconductors, the photoelectric conversion efficiency is 50-60%, and the remaining electrical energy will generate heat. If the heat generated by the semiconductor laser cannot be discharged in time, the temperature of the PN junction will increase significantly, which will lead to a higher threshold current of the semiconductor laser, a significant decrease in quantum efficiency, and a decrease in the electro-optical conversion efficiency of the device, thereby generating more heat.

In related technologies, a water-cooled plate is used to dissipate heat from a laser in a water-circulating manner. The interior of the water cooling plate is a cavity, and the cooling liquid is circulated in the cavity. However, limited by the shape of the cavity, this heat dissipation method will lead to uneven heat dissipation. When the heat dissipation of the semiconductor laser is uneven, thermal stress will be generated in the active area of the chip, and the "smile" effect will appear, which will affect the quality of the output beam of the laser.

Therefore, in view of the above deficiencies, there is an urgent need for a heat dissipation device for high-power lasers.

Contents of the invention

The invention provides a heat dissipation device for a high-power laser, which can realize uniform heat dissipation of multiple laser modules.

An embodiment of the present invention provides a heat dissipation device for a high-power laser, including a board body and a plurality of laser modules, the laser module is used to install the laser and dissipate heat for the laser, and the laser module is installed on the board ;

The inside of the board is provided with a fluid channel, which is projected along the thickness direction of the board. The projection of each of the laser modules overlaps with the projection of the fluid channel, and the overlapped parts have the same area. The board is set There are liquid inlets and liquid outlets, the fluid passages communicate with the liquid inlets and the liquid outlets respectively, and the cooling liquid continuously flows through the fluid passages through the liquid inlets and the liquid outlets, to dissipate heat from the laser module;

The laser module includes a heat sink and a heat pipe, the heat sink is fixed on the board, the first end of the heat pipe is passed through the heat sink, and the second end of the heat pipe passes through the board body into the fluid channel.

In a possible design, a turbulence buffer chamber is provided at the liquid inlet of the fluid channel, at the junction of the branches, and at the place where the curvature is greater than a preset value, and the width and depth of the turbulence buffer chamber are larger than that of the fluid channel. channel, the turbulence buffer chamber is used to reduce the hydraulic pressure of the coolant.

In a possible design, the heat pipe is installed close to the surface of the heat sink where the laser is installed, so as to increase the heat conduction rate.

In a possible design, the heat pipe is provided with a sealing module, the second end penetrates through the first surface of the sealing module, and passes through the second surface of the sealing module, and the first The surface is adjacent to the second surface, the plate body is provided with a through hole, the second end passing through the second surface enters the fluid channel through the through hole, and the second surface is installed on on the board to seal the through hole.

In a possible design, the second surface is provided with a first sealing ring, and the first sealing ring is used to increase the sealing performance between the second surface and the through hole.

In a possible design, there is a distance between the heat sink and the sealing module, and a heat pipe is connected between the heat sink and the sealing module. The heat pipe has plasticity, and the heat pipe is adjusted to eliminate the interaction between the heat sink and the sealing module.

In a possible design, a plurality of spoilers are arranged on the inner wall of the fluid passage, and the plurality of spoilers are arranged along the central axis of the fluid passage, and the spoilers are used to make the The cooling liquid performs a turbulence movement so that the cooling liquid can take away heat faster, and the turbulence element is also used to reduce the impact of the cooling liquid on the plate body.

In a possible design, the spoiler includes at least one of strip fins, diamond fins and column fins.

In a possible design, the plate body includes a detachable first layer body and a second layer body, and the first layer body and the second layer body are installed to form the plate body and the fluid channels, the first layer and the second layer are disassembled to clean the fluid channels.

In a possible design, a second sealing ring is arranged between the first layer and the second layer, the second sealing ring is arranged on the periphery of the fluid channel, and the second sealing ring is used for To increase the sealing between the first layer and the second layer.

Compared with the prior art, the present invention has at least the following beneficial effects:

In this embodiment, the fluid channel is a curved channel, the fluid channel flows below the center of each laser module, and the area of the fluid channel below each laser module is equal. In this way, the heat dissipation area of each semiconductor laser is equal. The first end of the heat pipe is passed through the heat sink, and the second end is inserted into the fluid channel. Such arrangement can further lead the heat of the heat sink into the cooling liquid in the fluid channel, and then the heat is carried out by the cooling liquid. To sum up, under the joint effect of water cooling cycle heat dissipation and heat pipe heat dissipation, uniform heat dissipation of multiple laser modules can be ensured.

Description of drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are For some embodiments of the present invention, those skilled in the art can also obtain other drawings based on these drawings without creative work.

FIG. 1 is a schematic structural view of a heat dissipation device for a high-power laser provided by an embodiment of the present invention;

Fig. 2 is a schematic diagram of the internal structure of a panel provided by an embodiment of the present invention;

Fig. 3 is a schematic structural diagram of a laser module provided by an embodiment of the present invention;

Fig. 4 is a schematic top view of a laser module provided by an embodiment of the present invention;

Fig. 5 is a schematic diagram of the internal structure of another board body provided by an embodiment of the present invention.

In the picture:

1 - laser module;

11 - heat sink;

12 - heat pipe;

13 - sealing module;

131-the first sealing ring;

2-board body;

21 - fluid channel;

211-turbulence buffer chamber;

212 - spoiler;

22-liquid inlet;

23-liquid outlet;

24 - the first layer of body;

25 - second body;

26 - Through hole.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the protection of the present invention. scope.

In the description of the embodiments of the present invention, unless otherwise specified and limited, the terms "first" and "second" are only used for the purpose of description, and cannot be understood as indicating or implying relative importance; unless otherwise specified Or to explain, the term "plurality" refers to two or more; the terms "connection", "fixation" and so on should be understood in a broad sense, for example, "connection" can be a fixed connection or a detachable connection, or Connected integrally, or electrically; either directly or indirectly through an intermediary. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the description of this specification, it should be understood that the orientation words such as "up" and "down" described in the embodiments of the present invention are described from the angles shown in the drawings, and should not be interpreted as a description of the embodiments of the present invention. limited. Furthermore, in this context, it also needs to be understood that when it is mentioned that an element is connected "on" or "under" another element, it can not only be directly connected "on" or "under" another element, but can also To be indirectly connected "on" or "under" another element through an intervening element.

As shown in Figures 1 to 5, the embodiment of the present invention provides a heat dissipation device for a high-power laser, including a board body 2 and a plurality of laser modules 1, the laser module 1 is used to install the laser and dissipate heat for the laser, and the laser module is installed on board body 2;

There is a fluid channel 21 inside the plate body 2, which is projected along the thickness direction of the plate body 2. The projection of each laser module 1 overlaps with the projection part of the fluid channel 21, and the overlapped parts have the same area. The plate body 2 is provided with a liquid inlet. 22 and the liquid outlet 23, the fluid channel 21 communicates with the liquid inlet 22 and the liquid outlet 23 respectively, and the cooling liquid continuously flows through the fluid channel 21 through the liquid inlet 22 and the liquid outlet 23 to dissipate heat from the laser module 1;

The laser module 1 includes a heat sink 11 and a heat pipe 12, the heat sink 11 is fixed on the board body 2, the first end of the heat pipe 12 is penetrated in the heat sink 11, and the second end of the heat pipe 12 passes through the board body 2 and enters the fluid channel 21 middle.

In this embodiment, in this embodiment, the fluid channel 21 is a curved channel, the fluid channel 21 flows through the center of each laser module 1 below, and the area of the fluid channel 21 below each laser module 1 is equal . In this way, the heat dissipation area of each semiconductor laser is equal. The first end of the heat pipe 12 is passed through the heat sink 11, and the second end is inserted into the fluid channel 21, so that the heat of the heat sink 11 can be further introduced into the cooling liquid in the fluid channel 21, and then the heat is carried by the cooling liquid. out. To sum up, under the joint action of the water-cooling cycle heat dissipation and the heat pipe heat dissipation, the uniform heat dissipation of the multiple laser modules 1 can be ensured.

It can be understood that the plate body 2 can be made of a material with good thermal conductivity, preferably aluminum alloy. The preparation material of the heat sink 11 may be brass with excellent thermal conductivity.

It should be noted that the heat pipe 12 runs through the entire heat sink 11 , and the first end of the heat pipe 12 may or may not pass through the heat sink 11 .

In some embodiments of the present invention, a turbulence buffer bin 211 is provided at the liquid inlet 22 of the fluid channel 21, at the junction of the branches, and where the curvature is greater than a preset value, and the width and depth of the turbulent buffer bin 211 are larger than the fluid channel. 21. The turbulence buffer tank 211 is used to reduce the hydraulic pressure of the coolant.

In order to flow through the bottom of each laser module 1, the fluid passage 21 is designed as one or more meandering passages, turbulent eddies will be formed at the positions where the passages are more curved, and the turbulent eddies will generate air bubbles. The heat conduction efficiency between the cooling liquid and the plate body 2 will be reduced, and bubble corrosion will also occur, reducing the sealing reliability between the first layer body 24 and the second layer body 25 . The turbulence buffer chamber 211 is set at the liquid inlet 22, the junction of the branches, and the position with a large curvature. The suddenly enlarged turbulence buffer chamber 211 stabilizes the water flow in the area where turbulence is easy to occur, and prevents turbulence and bubble formation.

In addition, the hydraulic pressure at the liquid inlet 22, the converging point of the branches and the position with a large curvature is relatively large, and the coolant under the large hydraulic pressure will impact the inner wall of the fluid channel 21, that is, the plate body 2, which will cause the plate body 2 to be partially deformed. It affects the working performance of optical devices and increases the difficulty of laser beam shaping, coupling, collimation and other technologies. The suddenly enlarged turbulence buffer chamber 211 weakens the hydraulic pressure, thereby reducing the impact of the cooling liquid on the inner wall of the fluid channel 21 , avoiding local deformation of the plate body 2 and other adverse effects caused by the local deformation of the plate body 2 .

In this embodiment, a turbulence buffer chamber 211 is provided at a position with a large curvature, and the coolant flows out of the turbulence buffer chamber 211 and then enters the fluid channel 21 , where the laser module 1 is installed on the upper part of the fluid channel 21 . The buffer liquid enters the fluid channel 21 with a small space from the turbulent buffer chamber 211 with a large space, and the cooling liquid will fill the fluid channel 21, so that the cooling liquid in the fluid channel 21 fully contacts the plate body 2 and the heat pipe 12 at the bottom of the laser module 1, Improve the efficiency of heat dissipation.

It should be noted that the preset value can be determined through experiments or computer simulations, and the specific preset value is related to the type of cooling liquid, the shape and size of the fluid channel 21 and the flow rate of the cooling liquid.

In some embodiments of the present invention, the heat pipe 12 is close to the surface of the heat sink 11 on which the laser is installed, so as to increase the heat conduction rate.

In this embodiment, the heat pipe 12 is arranged as close as possible to the surface of the heat sink 11 where the laser is installed, that is, the heat pipe 12 is as close as possible to the heat source. Such arrangement can conduct heat and dissipate heat faster. Preferably, the heat pipe 12 is tangent to the surface of the heat sink 11 on which the laser is installed.

In some embodiments of the present invention, the heat pipe 12 is provided with a sealing module 13, the second end penetrates through the first surface of the sealing module 13, and passes through the second surface of the sealing module 13, the first surface and the second surface Adjacent, the plate body 2 is provided with a through hole 26 , the second end passing through the second surface enters the fluid channel 21 through the through hole 26 , and the second surface is installed on the plate body 2 to seal the through hole 26 .

In this embodiment, the plate body 2 is provided with a through hole 26 , the through hole 26 communicates with the fluid channel 21 , and the heat pipe 12 enters the fluid channel 21 through the through hole 26 . In order to prevent the coolant in the fluid channel 21 from overflowing through the through hole 26, a sealing module 13 is arranged on the heat pipe 12, the heat pipe 12 is sealed and penetrates into the first surface of the sealing module 13, and the sealing passes through the second surface of the sealing module 13, and the second surface of the sealing module 13 is sealed. The surface is sealingly connected with the through hole 26 , thereby achieving the effect of sealing the through hole 26 through the sealing module 13 .

In some embodiments of the present invention, the second surface is provided with a first sealing ring 131 , and the first sealing ring 131 is used to increase the sealing performance between the second surface and the through hole 26 .

In order to increase the sealing performance between the second surface and the through hole 26 , a first sealing ring 131 is provided on the second surface to increase the sealing performance between the second surface and the through hole 26 .

In some embodiments of the present invention, there is a distance between the heat sink 11 and the sealing module 13, and a heat pipe 12 is connected between the heat sink 11 and the sealing module 13. The heat pipe 12 has plasticity, and the heat sink 11 and the sealing are eliminated by adjusting the heat pipe 12. Interaction between modules 13.

In this embodiment, if the heat sink 11 and the sealing module 13 are too close, it cannot be guaranteed that the two are installed horizontally on the board body 2 without affecting each other, or even if they are installed on the board body 2, they cannot Accurately ensure the flatness of the installation. If the flatness cannot be guaranteed, the accuracy of the laser will be affected, and the sealing reliability of the sealing module 13 and the plate body 2 will also be affected. In order to prevent the heat sink 11 and the sealing module 13 from influencing each other and increase the distance between the two, the heat pipe 12 connecting the two has a certain degree of plasticity. Through the coordination of the heat pipe 12, the heat sink 11 and the sealing module 13 can be installed on the board evenly. on body 2.

In some embodiments of the present invention, a plurality of spoilers 212 are arranged on the inner wall of the fluid channel 21, and the plurality of spoilers 212 are arranged along the central axis of the fluid channel 21, and the spoilers 212 are used to disturb the cooling liquid. The flow movement makes the cooling liquid take away heat faster, and the spoiler 212 is also used to reduce the impact of the cooling liquid on the plate body 2 .

In this embodiment, a plurality of spoilers 212 are arranged on the inner wall of the fluid channel 21 to disturb the cooling liquid so that the cooling liquid can take away heat from the heat sink 11 faster. In addition, the spoiler 212 also locally slows down the flow velocity and hydraulic pressure of the cooling liquid, thereby reducing the impact of the cooling liquid on the inner wall of the fluid channel 21 .

In some embodiments of the present invention, the spoiler 212 includes at least one of strip fins, diamond fins and column fins.

In this embodiment, diamond-shaped fins are preferred.

In some embodiments of the present invention, the plate body 2 includes a detachable first layer body 24 and a second layer body 25, and the first layer body 24 and the second layer body 25 are installed to form the plate body 2 and the fluid channel 21, The first layer body 24 and the second layer body 25 are disassembled to clean the fluid channel 21 .

In this embodiment, the first layer body 24 and the second layer body 25 can be disassembled, which is convenient for cleaning the internal fluid channel 21 and installing the heat pipe 12 after disassembly. Specifically, split the first layer 24 and the second layer 25, pass the heat pipe 12 through the through hole 26, the heat pipe 12 has plasticity, adjust the heat pipe 12 to a suitable curvature after passing through the through hole 26, and then merge the first layer Body 24 and second layer body 25.

In some embodiments of the present invention, a second sealing ring is arranged between the first layer 24 and the second layer 25, and the second sealing ring is arranged on the periphery of the fluid channel 21, and the second sealing ring is used to increase the thickness of the first layer. 24 and the sealing between the second layer body 25.

In this embodiment, the sealing ring can be arranged on the first layer body 24, or on the second layer body 25. Specifically, the second sealing ring is processed on the first layer body 24 or the second layer body 25. The ring matches the groove, put the second sealing ring into the groove, and install the first layer body 24 and the second layer body 25 together through the sealing threaded hole. The second sealing ring surrounds the fluid channel 21 and keeps the first layer 24 and the second layer 25 sealed after installation.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still be Modifications are made to the technical solutions described in the foregoing embodiments, or equivalent replacements are made to some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims (10)

1. The heat dissipation device for the high-power laser is characterized by comprising a board body (2) and a plurality of laser modules (1), wherein the laser modules (1) are used for mounting the laser and dissipating heat of the laser, and are mounted on the board body (2);

the laser module heat dissipation plate is characterized in that a fluid channel (21) is arranged in the plate body (2), the plate body (2) is projected along the thickness direction, the projection of each laser module (1) is partially overlapped with the projection of the fluid channel (21), the overlapped partial areas are the same, the plate body (2) is provided with a liquid inlet (22) and a liquid outlet (23), the fluid channel (21) is respectively communicated with the liquid inlet (22) and the liquid outlet (23), and cooling liquid continuously flows through the fluid channel (21) through the liquid inlet (22) and the liquid outlet (23) so as to dissipate heat of the laser modules (1);

the laser module (1) comprises a heat sink (11) and a heat pipe (12), wherein the heat sink (11) is fixed on the plate body (2), the first end of the heat pipe (12) penetrates through the heat sink (11), and the second end of the heat pipe (12) penetrates through the plate body (2) to enter the fluid channel (21).

2. The heat sink according to claim 1, wherein turbulence buffers (211) are disposed at the liquid inlet (22), the branch convergence, and the bend of the fluid channel (21) greater than a predetermined value, the turbulence buffers (211) have a width and a depth greater than that of the fluid channel (21), and the turbulence buffers (211) are used for reducing the hydraulic pressure of the cooling fluid.

3. The heat dissipation device according to claim 1, wherein the heat pipe (12) is close to the laser-mounted face of the heat sink (11) to increase the rate of heat conduction.

4. The heat sink according to claim 1, wherein a sealing module (13) is disposed on the heat pipe (12), the second end of the heat pipe penetrates through a first surface of the sealing module (13) and penetrates out of a second surface of the sealing module (13), the first surface and the second surface are adjacent to each other, the plate body (2) is provided with a through hole (26), the second end of the heat pipe penetrating out of the second surface enters the fluid channel (21) through the through hole (26), and the second surface is mounted on the plate body (2) to seal the through hole (26).

5. The heat sink according to claim 4, wherein the second face is provided with a first sealing ring (131), the first sealing ring (131) being adapted to increase the sealing between the second face and the through-going hole (26).

6. The heat dissipation device according to claim 4, characterized in that there is a distance between the heat sink (11) and the sealing module (13), a heat pipe (12) is connected between the heat sink (11) and the sealing module (13), the heat pipe (12) has a compliance, and the interaction between the heat sink (11) and the sealing module (13) is eliminated by adjusting the heat pipe (12).

7. The heat dissipation device as claimed in claim 1, wherein a plurality of flow-disturbing members (212) are disposed on an inner wall of the fluid channel (21), the flow-disturbing members (212) are disposed along a central axis of the fluid channel (21), the flow-disturbing members (212) are configured to disturb the cooling fluid to allow the cooling fluid to take away heat faster, and the flow-disturbing members (212) are further configured to reduce an impact of the cooling fluid on the plate body (2).

8. The heat dissipating device of claim 7, wherein the turbulator (212) comprises at least one of a strip fin, a diamond fin, and a cylindrical fin.

9. The heat dissipating device according to claim 1, wherein the plate body (2) comprises a first layer (24) and a second layer (25) which are removable, the first layer (24) and the second layer (25) are mounted to form the plate body (2) and the fluid passage (21), and the first layer (24) and the second layer (25) are disassembled to clean the fluid passage (21).

10. The heat dissipating device according to claim 9, wherein a second sealing ring is disposed between the first layer (24) and the second layer (25), the second sealing ring is disposed at the periphery of the fluid passage (21), and the second sealing ring is used for increasing the sealing performance between the first layer (24) and the second layer (25).

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