CN115637423B - Silicon wafer flipping device and silicon wafer coating system - Google Patents
Silicon wafer flipping device and silicon wafer coating systemInfo
- Publication number
- CN115637423B CN115637423B CN202211370731.6A CN202211370731A CN115637423B CN 115637423 B CN115637423 B CN 115637423B CN 202211370731 A CN202211370731 A CN 202211370731A CN 115637423 B CN115637423 B CN 115637423B
- Authority
- CN
- China
- Prior art keywords
- frame
- turnover
- silicon wafer
- turning
- overturning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the technical field of semiconductor manufacturing and solar photovoltaic cell manufacturing, and discloses a silicon wafer overturning device, which comprises a silicon wafer arranging mechanism, wherein the silicon wafer arranging mechanism comprises an arranging frame and an overturning frame, and the overturning frame is arranged in the arranging frame in a overturning manner and is used for fixing a silicon wafer; the device comprises a turnover mechanism, wherein the output end of the turnover mechanism is connected with the turnover frame to turn over the turnover frame, and the device comprises a limiting mechanism which is connected with the turnover frame and the placement frame to limit the turnover frame before and after turning over. The silicon wafer film coating processing system comprises the silicon wafer turnover device, so that the silicon wafer placed on the turnover frame can be turned through the turnover mechanism, the turnover mechanism provides turnover power, the limiting mechanism can limit the turnover frame before and after the turnover, the situation that the silicon wafer is deviated before and after the turnover is avoided, and the silicon wafer is turned in the conversion cavity after the placement frame is moved out of the processing process cavity through the combined action, so that the setting of the conversion cavity is reduced, the setting of the mechanism is reduced, and the cost is reduced.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing and solar photovoltaic cell manufacturing, in particular to a silicon wafer overturning device and a silicon wafer coating processing system.
Background
When a large silicon wafer is used for manufacturing heterojunction solar cells and semiconductors, a Chemical Vapor Deposition (CVD) process is utilized to deposit a very thin I-type intrinsic amorphous silicon film and a very thin P-type amorphous silicon film on one surface of N-type crystalline silicon after surface texturing, and a thin I-type intrinsic amorphous silicon film and a thin N-type amorphous silicon film are deposited on the other surface of the crystalline silicon, so that the silicon wafer is required to be turned over between coating P, N processes, and how to turn over the silicon wafer on a carrier plate has a great relation to improving coating efficiency. In the existing production line, a conversion cavity is added between two processing technologies, the conversion cavity is turned over, the conversion cavity is additionally added, a plurality of sets of equipment are added in the conversion cavity, the structure is complex, the steps are more, and the cost is high.
Disclosure of Invention
The invention aims to provide a silicon wafer overturning device and a silicon wafer coating processing system, which can realize overturning without moving a silicon wafer out of a processing process cavity, reduce the arrangement of a conversion cavity and a plurality of sets of equipment, simplify the structure and save the cost.
To achieve the purpose, the invention adopts the following technical scheme:
silicon chip turning device includes:
the silicon wafer placement mechanism comprises a placement frame and a roll-over stand, wherein the roll-over stand is arranged in the placement frame in a turnover manner and is used for fixing a silicon wafer;
The output end of the turnover mechanism is connected with the turnover frame, and the input end of the turnover mechanism can be connected with the output end of the external driving mechanism to turn over the turnover frame;
And the limiting mechanism is connected with the roll-over frame and the placement frame so as to limit the roll-over frame in one direction before and after the roll-over.
Preferably, the turnover mechanism comprises a transmission shaft, one end of the transmission shaft is connected to the outer end of the turnover frame, a transmission gear is arranged on the transmission shaft, and the transmission gear can be connected with the output end of the external driving mechanism.
Preferably, the limiting mechanism is provided with a first switching part and a second switching part, the first switching part is connected with the turnover frame, the second switching part is connected with the placement frame, a first limiting part is arranged on the first switching part, a second limiting part matched with the first limiting part is arranged on the second switching part, and the first switching part and the second switching part are limited by one-way clamping through the first limiting part and the second limiting part when relatively rotating.
Preferably, the first transfer part and the second transfer part are annular seats, the annular seats comprise two semi-annular seats connected end to end, the height of the first end of any one semi-annular seat is higher than that of the second end of any one semi-annular seat, and the first end of any one semi-annular seat is connected with the second end of any other semi-annular seat to form the annular seat.
Preferably, a first fixing plate is arranged in the placement frame, the second switching part is arranged on the first fixing plate, a protruding key is arranged on the turnover frame, and the protruding key sequentially penetrates through the first fixing plate and the first switching part to be connected with the second switching part.
Preferably, the second adapting part is connected with the frame on the placement frame parallel to the first fixing plate through an elastic piece.
Preferably, the roll-over stand comprises a driving roll-over stand and a plurality of driven roll-over stands, the roll-over mechanism is connected with the driving roll-over stand, and the driven roll-over stand is connected with the driving roll-over stand through a connecting rod mechanism.
Preferably, the limiting mechanism is provided on at least one of the driven roll-over frames.
Preferably, the link mechanism comprises a link, a rotating plate is arranged on the link, the rotating plate is connected with the driven turnover frame through a transfer shaft, a fixed shaft is arranged on the rotating plate, and the rotating plate is connected with the driven turnover frame through the fixed shaft.
The silicon wafer film coating processing system comprises a vacuum cavity, wherein the silicon wafer turnover device is arranged in the vacuum cavity, and the silicon wafer film coating processing system further comprises a distance adjusting mechanism, the distance adjusting mechanism is arranged in the vacuum cavity, a carrier frame is arranged on the distance adjusting mechanism and used for mounting a mounting frame on the silicon wafer turnover device, and a turnover output end of an external driving mechanism matched with the turnover mechanism is arranged on the inner wall of the vacuum cavity in a penetrating mode.
Preferably, the walking mechanism comprises a walking rack which is arranged along the conveying direction of the placement frame, a walking gear is matched on the walking rack, and the walking gear is connected with the output end of the external walking driving part.
The invention has the beneficial effects that:
through setting up roll-over stand, tilting mechanism and restriction mechanism on settling the frame, can make the silicon chip of settling on the roll-over stand pass through tilting mechanism and can realize the upset, tilting mechanism provides power when the upset, and restriction mechanism can carry out one-way spacing to the roll-over stand around the upset, avoid its off normal around the upset, the combined action need not to shift out the processing's of settling the frame process chamber promptly and overturn the silicon chip in to the conversion chamber, reduced the setting of conversion chamber, reduction mechanism's setting to the cost is reduced.
Drawings
FIG. 1 is a schematic view of a silicon wafer turning device in a vacuum chamber according to the present invention;
FIG. 2 is a schematic view of one of the angles of the wafer flipping mechanism of the present invention;
FIG. 3 is an enlarged view at A in FIG. 2;
FIG. 4 is a schematic view of another angle of the wafer flipping mechanism of the present invention;
FIG. 5 is an enlarged view at B in FIG. 4;
FIG. 6 is an enlarged view of FIG. 4 at C;
FIG. 7 is a schematic diagram of the silicon wafer turnover device according to the present invention when the first limit part and the second limit part are limited;
FIG. 8 is a schematic diagram showing the first limit part and the second limit part of the silicon wafer turnover device of the present invention separately;
FIG. 9 is a schematic view of a portion of a wafer flipping apparatus of the present invention disposed in a coating processing system.
In the figure:
1-silicon wafer setting mechanism, 11-setting frame, 111-first fixing plate, 112-second fixing plate, 12-turnover frame, 121-protruding key, 13-fixing piece, 2-turnover mechanism, 21-transmission shaft, 22-transmission gear, 3-limiting mechanism, 31-first transfer part, 31 a-first limiting part, 32-second transfer part, 32 a-second limiting part, 32 b-protruding cavity, 32 c-limiting surface, 33-elastic piece, 34-sliding sleeve, 4-connecting rod mechanism, 41-connecting rod, 42-transfer shaft, 43-rotating plate, 44-fixing shaft, 5-vacuum cavity, 6-adjustable distance mechanism, 61-carrier frame, 7-turnover output end, 8-walking mechanism, 81-walking gear and 82-walking rack.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
In the description of the present invention, unless explicitly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may, for example, be fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected through an intervening medium, or in communication between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
As shown in fig. 1 to 9, the present embodiment provides a silicon wafer turning device, which comprises a silicon wafer placement mechanism 1, the silicon wafer placement mechanism 1 comprising a placement frame 11 and a turning frame 12, the turning frame 12 being provided in the placement frame 11 in a turnable manner and being used for fixing silicon wafers, the device further comprising a turning mechanism 2, an output end of the turning mechanism 2 being connected with the turning frame 12, an input end of the turning mechanism 2 being connectable with an output end of an external driving mechanism for turning the turning frame 12, the device further comprising a restriction mechanism 3, the restriction mechanism 3 being connected with the turning frame 12 and the placement frame 11 for unidirectional restriction of the turning frame 12 before and after turning.
Through setting up roll-over stand 12, tilting mechanism 2 and restriction mechanism 3 on settling frame 11, can make the silicon chip of settling on roll-over stand 12 pass through tilting mechanism 2 and can realize the upset, tilting mechanism provides power when the upset, and restriction mechanism can carry out one-way spacing to roll-over stand 12 around the upset, avoid its off-normal around the upset, the combined action need not to shift out the settling frame 11 processing's technology chamber to the conversion chamber in the upset silicon chip promptly, the setting of conversion chamber has been reduced, the setting of reduction mechanism, thereby the cost is reduced.
The following describes the present embodiment in detail, as shown in fig. 1, a silicon wafer turning device for turning a silicon wafer during film plating, where the silicon wafer turning device includes a silicon wafer placement mechanism 1, the silicon wafer placement mechanism 1 has a placement frame 11, in this embodiment, the placement frame 11 is a rectangular frame for fixing a silicon wafer to be plated, specifically, a turning frame 12 for fixing the silicon wafer is disposed in the placement frame 11, and a plurality of fixing pieces 13 for fixing the silicon wafer are disposed on the turning frame 12 and are uniformly distributed, so that the silicon wafer can be turned along with the turning frame 12, and the fixing pieces 13 in this embodiment can take various forms, such as a clamping piece and an adhering piece, and the form of the fixing pieces 13 is not limited by the present application.
As shown in fig. 1,2 and 3, the silicon wafer turning device turns the turning frame 12 arranged in the placement frame 11 through the turning mechanism 2 to drive the silicon wafer to turn, the output end of the turning mechanism 2 is connected with the turning frame 12, the input end of the turning mechanism 2 can be connected with the output end of an external driving mechanism to turn the turning frame 12, specifically, a first fixing plate 111 is arranged in the placement frame 11, the first fixing plate 111 is arranged in parallel with the upper frame of the placement frame 11 to facilitate the installation of the turning frame 12, turning interference caused by different heights of the first fixing plate 111 is avoided when the turning frame 12 turns, the turning mechanism 2 comprises a transmission shaft 21, one end of the transmission shaft 21 passes through the first fixing plate 111 to be connected with the outer end of the turning frame 12, a transmission gear 22 is arranged on the transmission shaft 21, and the transmission gear 22 can be connected with the output end of the external driving mechanism to drive the turning frame 12 to rotate when the driving gear rotates.
As shown in fig. 1,4, 5, 7 and 8, the silicon wafer flipping apparatus further has a restricting mechanism 3, and the restricting mechanism 3 is connected to the flipping frame 12 and the setting frame 11 to restrict the flipping frame 12 before and after flipping. Specifically, the limiting mechanism 3 has a first switching portion 31 and a second switching portion 32, in this embodiment, the second switching portion 32 is located above the first switching portion 31, the first switching portion 31 is connected with the roll-over stand 12, the second switching portion 32 is connected with the placement frame 11, a first limiting portion 31a is disposed on the first switching portion 31, a second limiting portion 32a matched with the first limiting portion 31a is disposed on the second switching portion 32, when the first switching portion 31 and the second switching portion 32 relatively rotate, limiting operation can be achieved by adopting the first switching portion 31 and the second switching portion 32 to rotate in the process of rotating the roll-over stand 12, and limiting devices and processes are simplified. More specifically, the first adapter part 31 and the second adapter part 32 are annular seats, the annular seats comprise two semi-annular seats connected end to end, the first end of any one semi-annular seat is higher than the second end of the other semi-annular seat, in this embodiment, the first end of any one semi-annular seat is smoothly and excessively connected to the second end so as to facilitate the adapter, the first end of any one semi-annular seat is connected with the second end of any other semi-annular seat to form an annular seat, two symmetrical stepped limiting positions are formed on the annular seat, in this embodiment, the first adapter part 31 and the second adapter part 32 are integrally formed by demolding, in other embodiments, the two semi-annular seats can be connected by welding, inserting and other modes, the first adapter part 31 and the second adapter part 32 can form stepped limiting positions on the annular seat through the height difference between the end and the head formed by the semi-annular seats so as to perform clamping and matching to form an adapter unidirectional limiting position.
The second adapting portion 32 is disposed on the first fixing plate 111, the second adapting portion 32 is provided with a protruding cavity 32b, the roll-over stand 12 is provided with a protruding key 121, the protruding key 121 sequentially penetrates through the first fixing plate 111 and the first adapting portion 31 to penetrate into the protruding cavity 32b on the second adapting portion 32 to form plug-in fit, and in this embodiment, the protruding key 121 and the inner wall of the protruding cavity 32b are provided with limiting surfaces 32c to drive the second adapting portion 32 to rotate when the protruding key 121 rotates. In this embodiment, the protruding cavity 32b is coaxial with the central hole of the second adapter portion 32 (i.e. the central hole of the annular seat) so as to facilitate the plugging and matching. When the turnover frame 12 is turned, the first switching part 31 and the second switching part 32 are subjected to unidirectional limiting (namely, a first limiting state) through stepped limiting, and when the turnover frame 12 is turned, the protruding key 121 on the turnover frame 12 drives the second switching part 32 to rotate, the stepped limiting structure of the second switching part 32 rotates, the relative position of the stepped limiting structure of the second switching part 32 and the first switching part 31 changes (namely, one step of the second switching part 32 rotates from the first step to the second step of the first switching part 31), after the turnover frame rotates 180 degrees, the second switching part 32 moves towards the first switching part 31 (due to the gravity factor), and the central symmetrical stepped limiting structures are recombined to form the unidirectional limiting position (namely, the second limiting state), and at the moment, the turnover frame 12 is rotated 180 degrees to finish turnover.
Further, the second adapting portion 32 is connected to the frame of the placement frame 11 parallel to the first fixing plate 111 through an elastic member 33, specifically, one end of the elastic member 33 is connected to the outer wall of the protruding cavity 32b, the other end of the elastic member 33 is connected to the placement frame 11, during the adapting process, the second adapting portion 32 is jacked up due to the height of the stepped surface limitation in the rotating process of the second adapting portion 32 relative to the first adapting portion 31, so that the elastic member 33 is compressed, and after the rotating process is completed, the height of the second adapting portion 32 falls back to the initial position elastically, so as to press against the second adapting portion 32 to avoid shaking during non-rotating, in this embodiment, the elastic member 33 adopts a compression spring, and in other embodiments, compressible elastic members such as elastic rubber can be adopted. The turnover frame further comprises a sliding sleeve 34, specifically, one end part of the sliding sleeve 34 is fixed on the placement frame 11, the elastic piece 33 is arranged in the sliding sleeve 34, on one hand, the elastic piece 33 is compressed along the vertical direction during compression, the position deviation during compression deformation is avoided, the turnover displacement of the turnover frame 12 during turnover is avoided, in addition, the sliding sleeve 34 can also protect the elastic piece 33, and the service life of the elastic piece is prolonged.
As shown in fig. 1,2, 4 and 5, further, the roll-over stand 12 includes a driving roll-over stand and a plurality of driven roll-over stands, the drive shaft 21 of the roll-over mechanism 2 is connected with the driving roll-over stand, the restriction mechanism 3 is provided on at least one driven roll-over stand, in this embodiment, the driven roll-over stands are provided at uniform intervals with the driving roll-over stand, and each driven roll-over stand is provided with the restriction mechanism 3. The driven turnover frame is connected with the driving turnover frame through the connecting rod mechanism 4 so as to drive other turnover plates to rotate when one turnover frame turns, simplify the turnover step and facilitate the turnover operation. Specifically, the second fixing plate 112 is disposed in the placement frame 11, the second fixing plate 112 is disposed opposite to the first fixing plate 111, the driving roll-over stand and the driven roll-over stand are both provided with a fixing shaft 44, in this embodiment, the second fixing plate 112 is provided with a bearing sleeve, the fixing shaft 44 passes through the bearing sleeve of the second fixing plate 112 to connect the first end of the rotating plate 43, the second end of the rotating plate 43 is connected with a switching shaft 42, the switching shaft 42 is connected to the connecting rod 41, when the driving roll-over stand rotates, the driving roll-over stand drives the rotating plate 43 disposed on the fixing shaft 44 to rotate, so that the connecting rod 41 connected with the switching shaft 42 is driven to move through the switching shaft 42, and the connecting rod 41 is fed back to the switching shaft 42 connected with the driven roll-over stand, so that the driven roll-over stand is driven to rotate through the rotating plate 43 and the fixing shaft 44 disposed on the driven roll-over stand to realize synchronous rotation.
As shown in fig. 1 and 9, the embodiment further includes a silicon wafer film coating processing system, including a vacuum chamber 5, in which the silicon wafer turning device is disposed in the vacuum chamber 5 to turn over the silicon wafer, the system further includes a distance adjusting mechanism 6, in which the distance adjusting mechanism 6 is disposed in the vacuum chamber 5, a carrier 61 is disposed on the distance adjusting mechanism 6 to mount a mounting frame 11 on the silicon wafer turning device, and a turning output end 7 of an external driving mechanism matched with a transmission gear 22 of the turning mechanism 2 is disposed on an inner wall of the vacuum chamber 5 in a penetrating manner, in which the turning output end is an output rack, specifically, the number of teeth of the output rack is exactly half of the number of teeth of the transmission gear 22, so that the transmission gear 22 can be exactly rotated by half axle (180 degrees), and then the turning frame 12 is exactly rotated by 180 degrees, without precisely calculating and controlling the number of revolutions of the transmission gear 22, thereby facilitating operation. Further, the automatic overturning device further comprises a travelling mechanism 8, wherein the travelling mechanism 8 comprises a travelling rack 82 which is arranged to extend along the conveying direction of the arranging frame 11, the travelling rack 82 is arranged to extend along the upper side frame of the arranging frame 11 in the embodiment, a travelling gear 81 is matched with the travelling rack 82, the travelling gear 81 is connected with the output end of an external travelling driving part, so that the overturning frame 12 arranged on the arranging frame 11 can conveniently convey, on one hand, the manpower is reduced, the manpower is saved, on the other hand, the transmission gear 22 can be separated from the output rack, and the overturning frame 12 is prevented from being in an engaged state after the overturning frame 12 is completed, and damage caused during moving is avoided.
The working process of the silicon wafer coating processing system and the silicon wafer overturning device comprises the following steps:
The silicon wafer is fixed in a roll-over stand 12 on a placement frame 11 through a fixing piece 13, the placement frame 11 is placed in a carrier plate 61 on a distance-adjusting mechanism 6 in a vacuum cavity 5, the placement frame 11 is conveyed to a processing position through a travelling mechanism 8 and an external travelling driving part on the placement frame 11, the position of the carrier plate is adjusted through the distance-adjusting mechanism 6 to process the first surface of the silicon wafer, after the processing is finished, the distance-adjusting mechanism 6 adjusts the position of the placement frame 11, the placement frame 11 is close to an output rack on the wall of the vacuum cavity 5, the output rack is meshed with a transmission gear 22, the output rack outputs to drive the transmission gear 22 on a driving silicon wafer roll-over device to rotate so as to drive the driving roll-over stand to rotate, the driven roll-over stand is driven through a connecting rod 41 to synchronously roll-over, the limiting mechanism 3 performs one-way limiting before and after the roll-over of the roll-over stand 12 is finished, after the rotation action is finished, the travelling mechanism 8 controls the placement frame 11 to retreat to a certain position so that the output rack is not meshed with the transmission gear 22, and the position of the placement frame 11 is adjusted back to the processing position by the distance-adjusting mechanism 6 to process the processing position to complete double-side transfer of the silicon wafer, and after the completion of the next step of the silicon wafer is carried by the travelling mechanism 8 to process step. And then, the operation is circulated, so that the silicon wafer can be directly turned over in a processing process cavity, one middle conversion cavity and multiple sets of driving equipment are reduced, the space size of the equipment is reduced, and the cost is saved.
It is to be understood that the above examples of the present invention are provided for clarity of illustration only and are not limiting of the embodiments of the present invention. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the invention. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are desired to be protected by the following claims.
Claims (9)
1. Silicon chip turning device, its characterized in that includes:
The silicon wafer placement mechanism (1), wherein the silicon wafer placement mechanism (1) comprises a placement frame (11) and a roll-over stand (12), and the roll-over stand (12) is arranged in the placement frame (11) in a turnover manner and is used for fixing silicon wafers;
The turnover mechanism (2), the output end of the turnover mechanism (2) is connected with the turnover frame (12), and the input end of the turnover mechanism (2) can be connected with the output end of an external driving mechanism to turn over the turnover frame (12);
the limiting mechanism (3) is connected with the turnover frame (12) and the placement frame (11) so as to limit the turnover frame (12) before and after turnover in one way;
The limiting mechanism (3) is provided with a first switching part (31) and a second switching part (32), the first switching part (31) is connected with the turnover frame (12), the second switching part (32) is connected with the placement frame (11), a first limiting part (31 a) is arranged on the first switching part (31), a second limiting part (32 a) matched with the first limiting part (31 a) is arranged on the second switching part (32), and the first switching part (31) and the second switching part (32) are limited by one-way clamping through the first limiting part (31 a) and the second limiting part (32 a) when relatively rotating;
The first transfer part (31) and the second transfer part (32) are annular seats, each annular seat comprises two semi-annular seats connected end to end, the height of the first end of any one semi-annular seat is higher than that of the second end of any one semi-annular seat, and the first end of any one semi-annular seat is connected with the second end of any other semi-annular seat to form the annular seat.
2. The silicon wafer overturning device according to claim 1, wherein the overturning mechanism (2) comprises a transmission shaft (21), one end of the transmission shaft (21) is connected to the outer end of the overturning frame (12), a transmission gear (22) is arranged on the transmission shaft (21), and the transmission gear (22) can be connected with the output end of an external driving mechanism.
3. The silicon wafer overturning device according to claim 1, wherein a first fixing plate (111) is arranged in the placement frame (11), the second switching part (32) is arranged on the first fixing plate (111), a protruding key (121) is arranged on the overturning frame (12), and the protruding key (121) sequentially penetrates through the first fixing plate (111) and the first switching part (31) to be connected with the second switching part (32).
4. A silicon wafer turning device according to claim 3, wherein the second adapting portion (32) is connected with the frame of the placement frame (11) parallel to the first fixing plate (111) through an elastic member (33).
5. The silicon wafer turning device according to any one of claims 1 to 4, characterized in that the turning frame (12) comprises a driving turning frame and a plurality of driven turning frames, the turning mechanism (2) is connected with the driving turning frame, and the driven turning frames are connected with the driving turning frame through a connecting rod mechanism (4).
6. The silicon wafer turning device according to claim 5, wherein the limiting mechanism (3) is provided on at least one of the driven roll-over frames.
7. The silicon wafer overturning device according to claim 5, wherein the link mechanism (4) comprises a link (41), a rotating plate (43) is arranged on the link (41), the rotating plate (43) is connected with the driven overturning frame through a switching shaft (42), a fixed shaft (44) is arranged on the rotating plate (43), and the rotating plate (43) is connected with the driven overturning frame through the fixed shaft (44).
8. The silicon wafer film coating treatment system is characterized by comprising a vacuum cavity (5), wherein the vacuum cavity (5) is internally provided with the silicon wafer turnover device as claimed in any one of claims 1-7, the silicon wafer film coating treatment system further comprises a distance adjusting mechanism (6), the distance adjusting mechanism (6) is arranged in the vacuum cavity (5), a carrier frame (61) is arranged on the distance adjusting mechanism (6) and used for mounting a mounting frame (11) on the silicon wafer turnover device, and a turnover output end (7) of an external driving mechanism matched with the turnover mechanism (2) is arranged on the inner wall of the vacuum cavity (5) in a penetrating mode.
9. The silicon wafer film plating system according to claim 8, further comprising a traveling mechanism (8), wherein the traveling mechanism (8) comprises a traveling rack (82) extending along the conveying direction of the placement frame (11), a traveling gear (81) is matched on the traveling rack (82), and the traveling gear (81) is connected with the output end of the external traveling driving part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211370731.6A CN115637423B (en) | 2022-11-03 | 2022-11-03 | Silicon wafer flipping device and silicon wafer coating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211370731.6A CN115637423B (en) | 2022-11-03 | 2022-11-03 | Silicon wafer flipping device and silicon wafer coating system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115637423A CN115637423A (en) | 2023-01-24 |
| CN115637423B true CN115637423B (en) | 2026-04-21 |
Family
ID=84947539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211370731.6A Active CN115637423B (en) | 2022-11-03 | 2022-11-03 | Silicon wafer flipping device and silicon wafer coating system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115637423B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102409315A (en) * | 2010-09-21 | 2012-04-11 | 鸿富锦精密工业（深圳）有限公司 | Transportation mechanism and coating equipment with same |
| CN205016501U (en) * | 2015-09-25 | 2016-02-03 | 西安立芯光电科技有限公司 | Semiconductor chip's surface treatment system |
| CN113351605A (en) * | 2021-07-16 | 2021-09-07 | 湖北韩泰智能设备有限公司 | Workpiece self-locking overturning fixture tool |
| CN215976022U (en) * | 2021-10-19 | 2022-03-08 | 镇江超威纳米科技有限公司 | Coating clamp of vacuum coating machine |
| CN218710833U (en) * | 2022-11-03 | 2023-03-24 | 拉普拉斯(无锡)半导体科技有限公司 | Silicon wafer turning device and silicon wafer coating processing system |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI343321B (en) * | 2008-11-17 | 2011-06-11 | Kinpo Elect Inc | Unidirectional rotation device and unidirectional paper-feeding apparatus using the same |
| TWI480403B (en) * | 2010-10-26 | 2015-04-11 | Hon Hai Prec Ind Co Ltd | Deposition device |
| CN203700509U (en) * | 2013-12-16 | 2014-07-09 | 湘潭宏大真空技术股份有限公司 | Rotary platform mechanism |
| CN212335277U (en) * | 2020-04-15 | 2021-01-12 | 磐石创新(江苏)电子装备有限公司 | Vacuum coating substrate table capable of automatically turning over |
| CN212380430U (en) * | 2020-05-29 | 2021-01-19 | 武汉三工光电设备制造有限公司 | Automatic turnover string arranging machine and solar cell module production line |
| WO2021249216A1 (en) * | 2020-06-09 | 2021-12-16 | 江苏菲沃泰纳米科技股份有限公司 | Coating support, coating apparatus, and coating method therefor |
| CN215440671U (en) * | 2021-09-01 | 2022-01-07 | 浙江依缘纳米科技有限公司 | Workpiece overturning tool for vacuum coating equipment |
-
2022
- 2022-11-03 CN CN202211370731.6A patent/CN115637423B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102409315A (en) * | 2010-09-21 | 2012-04-11 | 鸿富锦精密工业（深圳）有限公司 | Transportation mechanism and coating equipment with same |
| CN205016501U (en) * | 2015-09-25 | 2016-02-03 | 西安立芯光电科技有限公司 | Semiconductor chip's surface treatment system |
| CN113351605A (en) * | 2021-07-16 | 2021-09-07 | 湖北韩泰智能设备有限公司 | Workpiece self-locking overturning fixture tool |
| CN215976022U (en) * | 2021-10-19 | 2022-03-08 | 镇江超威纳米科技有限公司 | Coating clamp of vacuum coating machine |
| CN218710833U (en) * | 2022-11-03 | 2023-03-24 | 拉普拉斯(无锡)半导体科技有限公司 | Silicon wafer turning device and silicon wafer coating processing system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115637423A (en) | 2023-01-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101138250B1 (en) | The walking beam device for solar cell wafer | |
| KR101329303B1 (en) | Substrates processing apparatus for loading/unloading of substrates | |
| US8215473B2 (en) | Next generation screen printing system | |
| KR101258860B1 (en) | The wafer picker device for using solar cell wafer transfer system | |
| KR20080103177A (en) | Tray alignment apparatus, solar cell manufacturing apparatus including the same and tray alignment method using the same | |
| KR101014746B1 (en) | Wafer loading and unloading device for solar cell | |
| US10453728B2 (en) | Exchange and flip chamber design for heterojunction solar cell formation | |
| KR101048297B1 (en) | In-Line Substrate Processing System and Process Chamber | |
| CN115637423B (en) | Silicon wafer flipping device and silicon wafer coating system | |
| CN108682715A (en) | A production equipment for multi-effect passivation film on the surface of ultra-high-efficiency solar cells | |
| US20090162170A1 (en) | Tandem type semiconductor-processing apparatus | |
| US20180040761A1 (en) | Cassette optimized for an inline annealing system | |
| CN107622965B (en) | wafer transmission method and device | |
| CN218710833U (en) | Silicon wafer turning device and silicon wafer coating processing system | |
| KR101106098B1 (en) | Rotate Picker Device in Cell Cell Wafer Transfer System | |
| KR20070114435A (en) | Substrate Processing System for Mass Production and Substrate Processing Method Using the Same | |
| KR101320330B1 (en) | In-line type substrate processing system and loadlock chamber | |
| CN212505060U (en) | Transmission mechanism and vacuum coating system using same | |
| CN119626932B (en) | Semiconductor process equipment | |
| KR101014747B1 (en) | Wafer loading and unloading device for solar cell | |
| CN223539565U (en) | Semiconductor process equipment | |
| CN222106745U (en) | Battery cell preparation equipment | |
| CN119626933B (en) | Process chamber, slide plate manipulator and slide plate temporary storage device | |
| CN119626949B (en) | Control method of transmission device | |
| KR101643233B1 (en) | Substrate transfer apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |