CN115631878A - Nano-imprinting electromagnetic shielding silver paste and preparation method thereof - Google Patents
Nano-imprinting electromagnetic shielding silver paste and preparation method thereof Download PDFInfo
- Publication number
- CN115631878A CN115631878A CN202211173099.6A CN202211173099A CN115631878A CN 115631878 A CN115631878 A CN 115631878A CN 202211173099 A CN202211173099 A CN 202211173099A CN 115631878 A CN115631878 A CN 115631878A
- Authority
- CN
- China
- Prior art keywords
- nano
- electromagnetic shielding
- imprinting
- silver
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 105
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 86
- 239000004332 silver Substances 0.000 title claims abstract description 86
- 238000002360 preparation method Methods 0.000 title abstract description 13
- 239000003822 epoxy resin Substances 0.000 claims abstract description 27
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 27
- 239000003960 organic solvent Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 21
- 239000002994 raw material Substances 0.000 claims abstract description 12
- 239000013538 functional additive Substances 0.000 claims abstract description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 26
- 238000002156 mixing Methods 0.000 claims description 24
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 claims description 16
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 claims description 16
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 14
- 239000003054 catalyst Substances 0.000 claims description 13
- 239000002270 dispersing agent Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- 239000012744 reinforcing agent Substances 0.000 claims description 13
- 239000002562 thickening agent Substances 0.000 claims description 13
- 239000013008 thixotropic agent Substances 0.000 claims description 13
- 239000012752 auxiliary agent Substances 0.000 claims description 12
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 12
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium ethoxide Chemical compound [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 claims description 12
- 239000004593 Epoxy Substances 0.000 claims description 11
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 10
- 238000000227 grinding Methods 0.000 claims description 10
- -1 mercaptothiol Chemical compound 0.000 claims description 10
- 239000004354 Hydroxyethyl cellulose Substances 0.000 claims description 9
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 claims description 9
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 claims description 9
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 8
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 claims description 8
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 claims description 8
- 239000004952 Polyamide Substances 0.000 claims description 8
- NWGKJDSIEKMTRX-AAZCQSIUSA-N Sorbitan monooleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O NWGKJDSIEKMTRX-AAZCQSIUSA-N 0.000 claims description 8
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 8
- 229920002647 polyamide Polymers 0.000 claims description 8
- 239000001993 wax Substances 0.000 claims description 8
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 7
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 7
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 7
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 7
- 229910015900 BF3 Inorganic materials 0.000 claims description 7
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 7
- 229910021485 fumed silica Inorganic materials 0.000 claims description 7
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 claims description 7
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 7
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 6
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 6
- 239000005711 Benzoic acid Substances 0.000 claims description 6
- 239000001856 Ethyl cellulose Substances 0.000 claims description 6
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- 235000021355 Stearic acid Nutrition 0.000 claims description 6
- 235000010233 benzoic acid Nutrition 0.000 claims description 6
- 229920001249 ethyl cellulose Polymers 0.000 claims description 6
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- 239000011737 fluorine Substances 0.000 claims description 6
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 6
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 6
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 6
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 6
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 6
- 239000008117 stearic acid Substances 0.000 claims description 6
- 239000004094 surface-active agent Substances 0.000 claims description 6
- QNYBOILAKBSWFG-UHFFFAOYSA-N 2-(phenylmethoxymethyl)oxirane Chemical compound C1OC1COCC1=CC=CC=C1 QNYBOILAKBSWFG-UHFFFAOYSA-N 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 5
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Natural products CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 claims description 5
- 239000012948 isocyanate Substances 0.000 claims description 5
- 150000002513 isocyanates Chemical class 0.000 claims description 5
- 229910052723 transition metal Inorganic materials 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000005303 weighing Methods 0.000 claims description 3
- 239000002002 slurry Substances 0.000 abstract description 21
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 239000011159 matrix material Substances 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 abstract description 3
- 230000001105 regulatory effect Effects 0.000 abstract description 3
- 230000001276 controlling effect Effects 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 8
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000010998 test method Methods 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000008139 complexing agent Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000009835 boiling Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical class [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000000609 electron-beam lithography Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000011858 nanopowder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Conductive Materials (AREA)
Abstract
The invention discloses a nano-imprinting electromagnetic shielding silver paste and a preparation method thereof, wherein the nano-imprinting electromagnetic shielding silver paste comprises the following raw materials in parts by mass: 2-8 parts of epoxy resin, 70-75 parts of conductive silver, 2-5 parts of functional additive and 16-20 parts of organic solvent; the conductive silver comprises micron silver sheets and nanometer silver powder. According to the invention, the sheet resistance is lower when the nano-imprinting electromagnetic shielding silver paste is applied to the metal grid flexible conductive film by regulating and controlling the composition of the nano-imprinting electromagnetic shielding silver paste; the obtained nano-imprinting electromagnetic shielding slurry has low viscosity and is convenient for imprinting and blade coating; the curing temperature of the nano-imprinting electromagnetic shielding slurry is below 135 ℃, and the adhesive force between the cured nano-imprinting electromagnetic shielding slurry and the matrix is above 4B level.
Description
Technical Field
The invention belongs to the technical field of conductive materials, and particularly relates to nano-imprinting electromagnetic shielding silver paste and a preparation method thereof.
Background
The nanoimprint technology is divided into three steps: the first step is the processing of the template. Generally, electron beam lithography is used to process a desired structure on a silicon or other substrate as a template. Since the diffraction limit of electrons is much smaller than that of photons, much higher resolution than lithography can be achieved. The second step is the transfer of the pattern. Coating photoresist on the surface of a material to be processed, pressing the template on the surface of the material, and transferring the pattern onto the photoresist in a pressurizing mode. The third step is the processing of the substrate. And curing the photoresist by using ultraviolet light, removing the template, etching the photoresist which is not completely removed in the previous step by using etching liquid to expose the surface of the material to be processed, then processing by using a chemical etching method, and removing all the photoresist after the processing is finished to finally obtain the material processed with high precision.
Electromagnetic Compatibility (EMC) means that an electronic device does not interfere with other devices and is not influenced by other devices. Electromagnetic compatibility, like security, is one of the most important indicators of product quality. Safety concerns the human and property, while electromagnetic compatibility concerns human and environmental protection. The Interference of electronic components to the outside, which is called EMI (Electromagnetic Interference); the Electromagnetic wave interacts with the electronic components to generate an interference phenomenon called EMS (Electromagnetic scattering).
Electromagnetic shielding in a region of space, measures to reduce the field strength caused by certain sources. In most cases, the shield can be made of metal such as copper, aluminum, steel, etc., but for constant and very low frequency magnetic fields, materials such as ferrite can also be used as the shield. The system performance deterioration caused by the electromagnetic noise or interference generated in one system or between different systems is required: (1) the electric power line or the magnetic force line is limited in a certain area; (2) so that a certain area is not influenced by external electric lines of force and magnetic lines of force.
Therefore, the nano-imprint electromagnetic shielding silver paste capable of meeting the requirement of a superfine circuit with the diameter less than or equal to 3 microns and the preparation method thereof are required to meet the increasing electromagnetic shielding performance requirement of electronic products.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide the nano-imprinting electromagnetic shielding silver paste and the preparation method thereof, the nano-imprinting electromagnetic shielding silver paste can meet the requirement of an ultrafine line with the thickness less than or equal to 3 microns (the ultrafine line can meet the requirement of miniaturization of electronic equipment, and the ultrafine line silver paste has excellent printing performance), has excellent high-temperature and high-humidity resistance, low-temperature resistance and salt spray resistance, and has low sheet resistance and excellent conductivity when being applied to a metal grid flexible conductive film.
In order to achieve the purpose, the invention provides the following technical scheme:
the nano-imprinting electromagnetic shielding silver paste comprises the following raw materials in parts by weight: 2-8 parts of epoxy resin, 70-75 parts of conductive silver, 2-5 parts of functional additive and 16-20 parts of organic solvent;
the conductive silver comprises micron silver sheets and nanometer silver powder.
Further, the epoxy resin is bisphenol A type epoxy resin, and the epoxy equivalent is 6000 to 9000 g/equivalent.
Further, the mass ratio of the micro silver sheet to the nano silver powder is 1 (1-3); the thickness of the micron silver sheet is 1-2 μm, and the equivalent diameter is 2-5 μm; the particle size of the nano silver powder is 50-500nm, and the median particle size D50 is 100-200nm. The micro-nano silver powder is compounded to improve the conductivity of the silver paste, and the silver paste prepared according to the parameters has good printability.
Further, the functional auxiliary agent comprises a thickening agent, a thixotropic agent, a reinforcing agent, a dispersing agent, a leveling agent, a curing agent and a low-temperature active catalyst, and the mass ratio of the thickening agent to the thixotropic agent to the reinforcing agent to the dispersing agent to the leveling agent to the curing agent to the low-temperature active catalyst is 1 (1-3) to (1-3).
Further, the thickener is at least one of ethyl cellulose, fumed silica, polyamide wax, polyvinyl alcohol and hydroxyethyl cellulose;
the thixotropic agent is at least one of BYK-410, BYK-420 and dibutyl phthalate;
the reinforcing agent is at least one of latent isocyanate, tetraethyl titanate, methylimidazole and benzyl glycidyl ether;
the dispersant is at least one of polyvinylpyrrolidone, sodium dodecyl sulfate and span 80;
the flatting agent is at least one of ethylene glycol butyl ether, organic silicon and acrylate;
the curing agent is at least one of EP-500, methyl tetrahydrophthalic anhydride, dicyandiamide, 2-ethyl-4-methylimidazole, mercaptothiol, 2-phenylimidazole and acetylacetone transition metal complex;
the low-temperature active catalyst is at least one of benzoic acid, n-capric acid, fluorine modified surfactant, boron trifluoride complex, dodecanoic acid, silane coupling agent, p-phenylenediamine and stearic acid.
Further, the organic solvent is at least one of diethylene glycol ethyl ether acetate, diethylene glycol butyl ether acetate and ethylene glycol ethyl ether acetate.
The invention also provides a preparation method of the nano-imprinting electromagnetic shielding silver paste, which comprises the following steps:
1) Weighing raw materials according to mass, and uniformly mixing epoxy resin and an organic solvent to obtain a primary carrier;
2) Uniformly mixing the functional auxiliary agent and the primary carrier to obtain a secondary carrier;
3) And uniformly mixing the conductive silver and the secondary carrier, and grinding and dispersing to obtain the nano-imprinting electromagnetic shielding silver paste.
Further, in the step 1), the mixing temperature is 80-100 ℃, the time is 4-8h, and the rotating speed is 800-1200r/min; in the step 2) and the step 3), the mixing temperature is 18-25 ℃, the time is 0.5-2h, and the rotating speed is 800-1200r/min.
Further, in the step 3), the grinding and dispersing are carried out by using a three-roll grinding machine.
The invention also provides a metal grid flexible conductive film which is prepared by curing the nano-imprint electromagnetic shielding silver paste.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the composition of the nano-imprinting electromagnetic shielding slurry is regulated according to the tunnel principle of electronic conduction, and the compounding of the micro-nano silver powder can provide sufficient conductive paths for a slurry system, and has good printing performance, so that the sheet resistance is low when the nano-imprinting electromagnetic shielding slurry is applied to a metal grid flexible conductive film; the obtained nano-imprinting electromagnetic shielding slurry is low in viscosity and convenient for imprinting and blade coating; the curing temperature of the nano-imprinting electromagnetic shielding slurry is below 135 ℃, and the adhesive force between the cured nano-imprinting electromagnetic shielding slurry and the matrix is above 4B grade.
Detailed Description
Reference will now be made in detail to various exemplary embodiments of the invention, the detailed description should not be construed as limiting the invention but as a more detailed description of certain aspects, features and embodiments of the invention.
It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Further, for numerical ranges in this disclosure, it is understood that each intervening value, between the upper and lower limit of that range, is also specifically disclosed. Every smaller range between any stated value or intervening value in a stated range and any other stated or intervening value in that stated range is encompassed within the invention. The upper and lower limits of these smaller ranges may independently be included or excluded in the range.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Although only preferred methods and materials are described herein, any methods and materials similar or equivalent to those described herein can be used in the practice or testing of the present invention. All documents mentioned in this specification are incorporated herein by reference to disclose and describe the methods and/or materials in connection with which the documents are cited. In case of conflict with any incorporated document, the present specification will control.
It will be apparent to those skilled in the art that various modifications and variations can be made in the specific embodiments of the present disclosure without departing from the scope or spirit of the disclosure. Other embodiments will be apparent to those skilled in the art from consideration of the specification. The specification and examples are exemplary only.
As used herein, the terms "comprising," "including," "having," "containing," and the like are open-ended terms that mean including but not limited to.
The "parts" in the present invention are all parts by mass unless otherwise specified.
The raw materials related to the invention are all purchased from the market (the purity of the alatin is more than 99.9%).
The nano-imprinting electromagnetic shielding silver paste comprises the following raw materials in parts by weight: 2-8 parts of epoxy resin, 70-75 parts of conductive silver, 2-5 parts of functional additive and 16-20 parts of organic solvent; the specific epoxy resin can be 2 parts by weight, 3 parts by weight, 4 parts by weight, 5 parts by weight, 6 parts by weight, 7 parts by weight or 8 parts by weight; the conductive silver can be 70 parts, 71 parts, 72 parts, 73 parts, 74 parts or 75 parts; the functional assistant can be 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts or 5 parts; the organic solvent can be 16 parts, 17 parts, 18 parts, 19 parts or 20 parts, and other values in the value range which are not listed are also applicable (other values are the same, and are not described in detail below);
the conductive silver comprises micron silver sheets and nanometer silver powder.
Further, the epoxy resin is bisphenol A type epoxy resin, and the epoxy equivalent is 6000 to 9000 g/equivalent. Specifically, it may be 6000 g/eq, 6500 g/eq, 7000 g/eq, 7500 g/eq, 8000 g/eq, 8500 g/eq or 9000 g/eq.
When the epoxy equivalent of the bisphenol A epoxy resin is less than 6000 g/equivalent, the obtained nano-imprinting electromagnetic shielding slurry is easy to agglomerate; when the epoxy equivalent of the bisphenol A epoxy resin exceeds 9000 g/equivalent, the obtained nano-imprinting electromagnetic shielding slurry cannot be effectively cured, and the application of the nano-imprinting electromagnetic shielding slurry in a metal grid flexible conductive film is influenced.
In some preferred embodiments, the mass ratio of the micro silver flakes to the nano silver powder is 1 (1-3); specifically, the ratio of 1:1, 1.5, 1:2, 1.
The thickness of the micron silver sheet is 1-2 μm, and specifically can be 1 μm, 1.2 μm, 1.4 μm, 1.5 μm, 1.6 μm, 1.8 μm or 2 μm; the equivalent diameter is 2 to 5 μm, and specifically may be 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm or 5 μm.
The particle size of the nano silver powder is 50-500nm, specifically can be 50nm, 60nm, 70nm, 80nm, 90nm or 100nm, and also can be 400nm, 410nm, 420nm, 430nm, 440nm, 450nm, 460nm, 470nm, 480nm, 490nm or 500nm; the median particle diameter D50 is 100-200nm, and specifically may be 100nm, 110nm, 120nm, 130nm, 140nm, 150nm, 160nm, 170nm, 180nm, 190nm or 200nm.
In some preferred embodiments, the functional auxiliary agent comprises a thickening agent, a thixotropic agent, a reinforcing agent, a dispersing agent, a leveling agent, a curing agent and a low-temperature active catalyst in a mass ratio of 1 (1-3) to (1-3).
In some preferred embodiments, the thickener is at least one of ethyl cellulose, fumed silica, polyamide wax, polyvinyl alcohol, and hydroxyethyl cellulose; typical but non-limiting combinations include: combinations of ethylcellulose and fumed silica, polyamide wax and polyvinyl alcohol, polyamide wax, polyvinyl alcohol and hydroxyethylcellulose, ethyl cellulose, fumed silica and polyamide wax, fumed silica, polyamide wax, polyvinyl alcohol and hydroxyethylcellulose, ethyl cellulose, fumed silica, polyamide wax, polyvinyl alcohol and hydroxyethylcellulose.
The thixotropic agent is at least one of BYK-410, BYK-420 and dibutyl phthalate; typical but non-limiting combinations include: a combination of BYK-410 and BYK-420, a combination of BYK-420 and dibutyl phthalate, and a combination of BYK-410, BYK-420 and dibutyl phthalate.
The reinforcing agent is at least one of latent isocyanate, tetraethyl titanate, methylimidazole and benzyl glycidyl ether; typical but non-limiting combinations include: combinations of latent isocyanate and tetraethyl titanate, combinations of methylimidazole and benzyl glycidyl ether, combinations of latent isocyanate, tetraethyl titanate, methylimidazole and benzyl glycidyl ether.
The dispersant is at least one of polyvinylpyrrolidone, sodium dodecyl sulfate and span 80; typical but non-limiting combinations include: the combination of polyvinylpyrrolidone and sodium dodecyl sulfate, the combination of sodium dodecyl sulfate and span 80, the combination of polyvinylpyrrolidone and span 80, and the combination of polyvinylpyrrolidone, sodium dodecyl sulfate and span 80.
The flatting agent is at least one of ethylene glycol butyl ether, organic silicon and acrylate; typical but non-limiting combinations include: combinations of ethylene glycol butyl ether and silicone, silicone and acrylate, ethylene glycol butyl ether, silicone and acrylate.
The curing agent is at least one of EP-500, methyl tetrahydrophthalic anhydride, dicyandiamide, 2-ethyl-4-methylimidazole, mercaptothiol, 2-phenylimidazole and acetylacetone transition metal complex; typical but non-limiting combinations include: EP-500 in combination with methyltetrahydrophthalic anhydride, dicyandiamide in combination with 2-ethyl-4-methylimidazole, mercaptothiol in combination with 2-phenylimidazole, dicyandiamide, 2-phenylimidazole in combination with acetylacetone transition metal complexes, EP-500 in combination with methyltetrahydrophthalic anhydride, dicyandiamide, 2-ethyl-4-methylimidazole and mercaptothiol, EP-500 in combination with methyltetrahydrophthalic anhydride, dicyandiamide, 2-ethyl-4-methylimidazole, mercaptothiol, 2-phenylimidazole in combination with acetylacetone transition metal complexes.
The low-temperature active catalyst is at least one of benzoic acid, n-capric acid, fluorine modified surfactant, boron trifluoride complex, dodecanoic acid, silane coupling agent, p-phenylenediamine and stearic acid. Typical but non-limiting combinations include: the combination of benzoic acid and n-capric acid, the combination of n-capric acid and fluorine modified surfactant, the combination of boron trifluoride complexing agent and dodecanoic acid, the combination of dodecanoic acid, silane coupling agent, p-phenylenediamine and stearic acid, the combination of benzoic acid, n-capric acid, fluorine modified surfactant and boron trifluoride complexing agent, the combination of boron trifluoride complexing agent, dodecanoic acid, silane coupling agent, p-phenylenediamine and stearic acid, and the combination of benzoic acid, n-capric acid, fluorine modified surfactant, boron trifluoride complexing agent, dodecanoic acid, silane coupling agent, p-phenylenediamine and stearic acid.
In some preferred embodiments, the organic solvent is at least one of diethylene glycol ethyl ether acetate, diethylene glycol butyl ether acetate, and ethylene glycol ethyl ether acetate. Typical but non-limiting combinations include: diethylene glycol ethyl ether acetate in combination with diethylene glycol butyl ether acetate, diethylene glycol ethyl ether acetate in combination with ethylene glycol ethyl ether acetate, diethylene glycol butyl ether acetate in combination with ethylene glycol ethyl ether acetate.
The invention also provides a preparation method of the nano-imprinting electromagnetic shielding silver paste, which comprises the following steps:
1) Weighing raw materials according to mass, and uniformly mixing epoxy resin and an organic solvent to obtain a primary carrier;
2) Uniformly mixing the functional auxiliary agent and the primary carrier to obtain a secondary carrier;
3) And (3) uniformly mixing the conductive silver and the secondary carrier, and grinding and dispersing (passing through a 2000-mesh sieve) to obtain the nano-imprinting electromagnetic shielding silver paste.
In some preferred embodiments, in step 1), the mixing temperature is 80 to 100 ℃, and specifically may be 80 ℃, 85 ℃, 90 ℃, 95 ℃ or 100 ℃; the time is 4-8h, and specifically can be 4h, 5h, 6h, 7h or 8h; the rotation speed is 800-1200r/min, specifically 800r/min, 900r/min, 1000r/min, 1100r/min or 1200r/min.
In the step 2) and the step 3), the mixing temperature is 18-25 ℃, and specifically can be 18 ℃, 19 ℃, 20 ℃, 21 ℃, 22 ℃, 23 ℃, 24 ℃ or 25 ℃; the time is 2h, and the rotating speed is 800-1200r/min, specifically 800r/min, 900r/min, 1000r/min, 1100r/min or 1200r/min.
In some preferred embodiments, in step 3), the grinding dispersion is performed using a three-roll mill.
The invention also provides a metal grid flexible conductive film which is prepared by curing the nano-imprint electromagnetic shielding silver paste. The width of the wire groove of the metal grid flexible conductive film is less than or equal to 3 μm, and can be 1 μm, 1.5 μm, 2 μm, 2.5 μm or 3 μm, for example.
The width of a wire slot in a conventional metal grid flexible conductive film is 5-10 mu m, the nano silver powder can be well filled in the wire slot to form an effective interlayer overlapping effect of at least 5 layers, when the width of the wire slot is reduced to be below 3 mu m, the nano silver powder can only form 2-3 layers of overlapping in the wire slot, the filling effect is reduced, and the increase of local resistance and even the disconnection are easily caused. According to the invention, through the compounding of the micron silver sheets and the nano silver powder, at least 5 layers of interlayer lap joints can be formed on the conductive silver in the wire groove with the width less than or equal to 3 microns, so that abnormal phenomena such as uneven resistance, open circuit and the like are eliminated, and the conductive performance is greatly improved.
The nano-imprinting electromagnetic shielding slurry provided by the invention can be used for a metal grid flexible conductive film with the slot width less than or equal to 3 mu m, and when the nano-imprinting electromagnetic shielding slurry is used for the metal grid flexible conductive film with the slot width less than or equal to 3 mu m, the metal grid flexible conductive film can have lower surface resistance, and the adhesion force between the cured nano-imprinting electromagnetic shielding slurry and a substrate is more than or equal to 4B.
Example 1
The nano-imprinting electromagnetic shielding silver paste comprises the following raw materials in parts by mass: 5 parts of epoxy resin, 72 parts of conductive silver, 3 parts of functional additive and 18 parts of organic solvent.
The epoxy resin was bisphenol A epoxy resin (epoxy resin 1256) and had an epoxy equivalent of 7500 g/eq.
The conductive silver is composed of micron silver sheets and nanometer silver powder in a mass ratio of 1:2, the thickness of the micron silver sheets is 1.5 mu m, and the equivalent diameter is 3 mu m; the particle size range of the nano silver powder is 50-500nm, and the median particle size D50 is 150nm.
The functional auxiliary agent comprises a thickening agent, a thixotropic agent, a reinforcing agent, a dispersing agent, a leveling agent, a curing agent and a low-temperature active catalyst in a mass ratio of 1; the thickening agent is hydroxyethyl cellulose; the thixotropic agent is BYK-410; the reinforcing agent is tetraethyl titanate; the dispersant is sodium dodecyl sulfate; the leveling agent is acrylic ester; the curing agent is EP-500; the low-temperature activation catalyst is n-decanoic acid.
The organic solvent is diethylene glycol ethyl ether acetate.
The preparation method comprises the following steps:
1) Mixing epoxy resin and an organic solvent for 6 hours at the temperature of 90 ℃ and the rotating speed of 1000r/min to obtain a primary carrier;
2) Adding the functional auxiliary agent into the primary carrier obtained in the step 1) and mixing for 2 hours at the temperature of 22 ℃ and the rotating speed of 1000r/min to obtain a secondary carrier;
3) And (3) adding conductive silver into the secondary carrier obtained in the step 2) to mix for 2 hours at the temperature of 22 ℃ and the rotating speed of 1000r/min, and grinding and dispersing by adopting a three-roll grinder to obtain the nano-imprinting electromagnetic shielding silver paste.
Example 2
The nano-imprinting electromagnetic shielding silver paste comprises the following raw materials in parts by weight: 2 parts of epoxy resin, 70 parts of conductive silver, 2 parts of functional additive and 16 parts of organic solvent.
The epoxy resin was bisphenol A epoxy resin (epoxy 1256) and the epoxy equivalent was 6000 g/eq.
The conductive silver is composed of micron silver sheets and nanometer silver powder in a mass ratio of 1:1, the thickness of the micron silver sheets is 1 micrometer, and the equivalent diameter is 2 micrometers; the particle size range of the nano silver powder is 50-500nm, and the median particle size D50 is 100nm.
The functional auxiliary agent comprises a thickening agent, a thixotropic agent, a reinforcing agent, a dispersing agent, a leveling agent, a curing agent and a low-temperature active catalyst in a mass ratio of 1; the thickening agent is hydroxyethyl cellulose; the thixotropic agent is BYK-420; the reinforcing agent is methylimidazole; the dispersant is span 80; the flatting agent is ethylene glycol butyl ether; the curing agent is 2-ethyl-4-methylimidazole; the low temperature activating catalyst is dodecanoic acid.
The organic solvent is diethylene glycol butyl ether acetate.
The preparation method comprises the following steps:
1) Mixing epoxy resin and an organic solvent for 8 hours at the temperature of 80 ℃ and the rotating speed of 800r/min to obtain a primary carrier;
2) Adding the functional auxiliary agent into the primary carrier obtained in the step 1) and mixing for 2 hours at 18 ℃ and at the rotating speed of 1200r/min to obtain a secondary carrier;
3) And (3) adding conductive silver into the secondary carrier obtained in the step 2) to mix for 2 hours at the temperature of 18 ℃ and the rotating speed of 1200r/min, and grinding and dispersing by adopting a three-roll grinder to obtain the nano-imprinting electromagnetic shielding silver paste.
Example 3
The nano-imprinting electromagnetic shielding silver paste comprises the following raw materials in parts by weight: 8 parts of epoxy resin, 75 parts of conductive silver, 5 parts of functional additive and 20 parts of organic solvent.
The epoxy resin was bisphenol A epoxy resin (epoxy resin 4275) and had an epoxy equivalent of 9000 g/equivalent.
The conductive silver is composed of micron silver sheets and nanometer silver powder in a mass ratio of 1:3, the thickness of the micron silver sheets is 2 micrometers, and the equivalent diameter is 5 micrometers; the particle size range of the nano silver powder is 50-500nm, and the median particle size D50 is 200nm.
The functional auxiliary agent comprises a thickening agent, a thixotropic agent, a reinforcing agent, a dispersing agent, a leveling agent, a curing agent and a low-temperature active catalyst in a mass ratio of 1; the thickening agent is hydroxyethyl cellulose; the thixotropic agent is dicyanodiphthalate; the reinforcing agent is methylimidazole; the dispersant is span 80; the flatting agent is ethylene glycol butyl ether; the curing agent is dicyandiamide; the low-temperature activation catalyst is p-phenylenediamine.
The organic solvent is ethylene glycol monoethyl ether acetate.
The preparation method comprises the following steps:
1) Mixing epoxy resin and an organic solvent for 8 hours at the temperature of 100 ℃ and the rotating speed of 800r/min to obtain a primary carrier;
2) Adding the functional auxiliary agent into the primary carrier obtained in the step 1) and mixing for 2 hours at the temperature of 25 ℃ and the rotating speed of 800r/min to obtain a secondary carrier;
3) And (3) adding conductive silver into the secondary carrier obtained in the step 2) to mix for 2 hours at the temperature of 25 ℃ and the rotating speed of 800r/min, and grinding and dispersing by adopting a three-roll grinder to obtain the nano-imprinting electromagnetic shielding silver paste.
Example 4
The same as in example 1 except that the epoxy equivalent of the bisphenol A epoxy resin was 5500 g/equivalent.
Example 5
The same as in example 1 except that the epoxy equivalent of the bisphenol A epoxy resin was 9500 g/eq.
Example 6
The difference from example 1 is that the organic solvent was replaced with a combination of diethylene glycol ethyl ether acetate and diethylene glycol butyl ether acetate in a mass ratio of 1:1.
Example 7
The difference from example 1 is that the organic solvent was replaced with a combination of butyl diglycol acetate and ethylene glycol monoethyl ether acetate in a mass ratio of 1:1.
Example 8
The same as example 1, except that the organic solvent was replaced by a combination of diethylene glycol ethyl ether acetate, diethylene glycol butyl ether acetate and ethylene glycol ethyl ether acetate, and the mass ratio between the three raw materials was 1.
Comparative example 1
The difference from example 1 is that silver flakes of equal mass are replaced by silver nanopowders.
Comparative example 2
The difference from example 1 is that silver flakes of equal mass are replaced by silver flakes of equal mass.
Comparative example 3
The difference from example 1 is that the preparation method comprises: and (3) completely mixing the epoxy resin, the organic solvent, the functional assistant and the conductive silver for 6 hours at the temperature of 90 ℃ and the rotating speed of 1000r/min to obtain the nano-imprinting electromagnetic shielding silver paste.
Comparative example 4
The difference from example 1 is that the preparation method comprises:
1) Mixing epoxy resin and an organic solvent for 6 hours at the temperature of 90 ℃ and the rotating speed of 1000r/min to obtain a primary carrier;
2) Adding the functional auxiliary agent into the primary carrier obtained in the step 1) and mixing for 2 hours at the temperature of 90 ℃ and the rotating speed of 1000r/min to obtain a secondary carrier;
3) And (3) adding conductive silver into the secondary carrier obtained in the step 2) to mix for 2 hours at the temperature of 90 ℃ and the rotating speed of 1000r/min, and grinding and dispersing by adopting a three-roll grinder to obtain the nano-imprinting electromagnetic shielding silver paste.
Test example 1
The nano-imprinting electromagnetic shielding silver paste obtained in the above examples and comparative examples was tested for viscosity using a Bohler-Fei DV-II viscometer using a No. 51 rotor at 100r/min, and the results are shown in Table 1.
TABLE 1
Test example 2
And providing a substrate with the width of a wire groove being 1.5 mu m, filling the nano-imprinting electromagnetic shielding silver paste obtained in the embodiment and the comparative example into the wire groove respectively, and curing at the temperature of 130 ℃ for 30min to obtain the metal grid flexible conductive film.
1. Testing the adhesive force between the cured nano-imprinting electromagnetic shielding slurry and the matrix by using a lattice method;
2. testing the sheet resistance, boiling resistance, high temperature and high humidity resistance, cold and hot shock resistance, salt spray resistance and bending resistance of the obtained metal grid flexible conductive film; testing the sheet resistance by using a universal meter;
1) The test method of the boiling resistance comprises the following steps: boiling in water at 100 deg.C for 30min, and testing adhesion by Baige method;
2) The test method of the high temperature and high humidity resistance comprises the following steps: placing the obtained metal grid flexible conductive film in an environment with the temperature of 85 ℃ and the relative humidity of 85% for 1200h, and then testing the adhesion force according to a one-hundred-grid method;
3) The test method of the cold and heat shock resistance comprises the following steps: placing the obtained metal grid flexible conductive film in a cold and hot shock box for 1200h, wherein the temperature in the cold and hot shock box is cyclically changed within the range of-48 ℃ to 80 ℃ for 4h, and then testing the adhesive force according to a one-hundred-grid method;
4) The test method of the salt spray resistance comprises the following steps: placing the obtained metal grid flexible conductive film in a cold and hot impact box, carrying out 5% NaCl salt spray test for 42h at 35 ℃, and then testing the adhesive force according to a Baige method;
5) The test method of the bending resistance comprises the following steps: and continuously folding the obtained metal grid flexible conductive film for 1min, and then testing the adhesive force according to a check method.
The results are shown in tables 2 and 3.
TABLE 2
TABLE 3
As can be seen from tables 1-3, the sheet resistance of the nano-imprinting electromagnetic shielding slurry is low when the nano-imprinting electromagnetic shielding slurry is applied to a metal grid flexible conductive film by regulating and controlling the composition of the nano-imprinting electromagnetic shielding slurry; the obtained nano-imprinting electromagnetic shielding slurry has low viscosity and is convenient for imprinting and blade coating; the adhesive force between the nano-imprinting electromagnetic shielding slurry and the matrix after solidification is above 4B level.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included therein.
Claims (9)
1. The nano-imprinting electromagnetic shielding silver paste is characterized by comprising the following raw materials in parts by mass: 2-8 parts of epoxy resin, 70-75 parts of conductive silver, 2-5 parts of functional additive and 16-20 parts of organic solvent;
the conductive silver comprises micron silver sheets and nanometer silver powder.
2. The nanoimprint electromagnetic shielding silver paste of claim 1, wherein the epoxy resin is bisphenol a type epoxy resin and the epoxy equivalent is 6000-9000 g/eq.
3. The nanoimprint electromagnetic shielding silver paste of claim 1, wherein the mass ratio of the micro silver flakes to the nano silver powder is 1 (1-3); the thickness of the micron silver sheet is 1-2 μm, and the equivalent diameter is 2-5 μm; the particle size of the nano silver powder is 50-500nm, and the median particle size D50 is 100-200nm.
4. The nano-imprinting electromagnetic shielding silver paste of claim 1, wherein the functional additives comprise a thickening agent, a thixotropic agent, a reinforcing agent, a dispersing agent, a leveling agent, a curing agent and a low-temperature active catalyst in a mass ratio of 1 (1-3) to (1-3).
5. The nanoimprint electromagnetic shielding silver paste of claim 4,
the thickener is at least one of ethyl cellulose, fumed silica, polyamide wax, polyvinyl alcohol and hydroxyethyl cellulose;
the thixotropic agent is at least one of BYK-410, BYK-420 and dibutyl phthalate;
the reinforcing agent is at least one of latent isocyanate, tetraethyl titanate, methylimidazole and benzyl glycidyl ether;
the dispersant is at least one of polyvinylpyrrolidone, sodium dodecyl sulfate and span 80;
the flatting agent is at least one of ethylene glycol butyl ether, organic silicon and acrylate;
the curing agent is at least one of EP-500, methyl tetrahydrophthalic anhydride, dicyandiamide, 2-ethyl-4-methylimidazole, mercaptothiol, 2-phenylimidazole and acetylacetone transition metal complex;
the low-temperature active catalyst is at least one of benzoic acid, n-capric acid, fluorine modified surfactant, boron trifluoride complex, dodecanoic acid, silane coupling agent, p-phenylenediamine and stearic acid.
6. The nanoimprint electromagnetic shielding silver paste of claim 1, wherein the organic solvent is at least one of diethylene glycol ethyl ether acetate, diethylene glycol butyl ether acetate, and ethylene glycol ethyl ether acetate.
7. The method for preparing nano-imprinting electromagnetic shielding silver paste according to any one of claims 1 to 6, comprising the following steps:
1) Weighing raw materials by mass, and uniformly mixing epoxy resin and an organic solvent to obtain a primary carrier;
2) Uniformly mixing the functional auxiliary agent and the primary carrier to obtain a secondary carrier;
3) And uniformly mixing the conductive silver and the secondary carrier, and grinding and dispersing to obtain the nano-imprinting electromagnetic shielding silver paste.
8. The method for preparing nano-imprinting electromagnetic shielding silver paste according to claim 7, wherein in step 1), the mixing temperature is 80-100 ℃, the time is 4-8h, and the rotation speed is 800-1200r/min; in the step 2) and the step 3), the mixing temperature is 18-25 ℃, the time is 0.5-2h, and the rotating speed is 800-1200r/min.
9. A metal grid flexible conductive film is characterized in that the metal grid flexible conductive film is prepared by curing the nano-imprinting electromagnetic shielding silver paste according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211173099.6A CN115631878A (en) | 2022-09-26 | 2022-09-26 | Nano-imprinting electromagnetic shielding silver paste and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211173099.6A CN115631878A (en) | 2022-09-26 | 2022-09-26 | Nano-imprinting electromagnetic shielding silver paste and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115631878A true CN115631878A (en) | 2023-01-20 |
Family
ID=84902607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211173099.6A Withdrawn CN115631878A (en) | 2022-09-26 | 2022-09-26 | Nano-imprinting electromagnetic shielding silver paste and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115631878A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116313218A (en) * | 2023-02-20 | 2023-06-23 | 北京梦之墨科技有限公司 | Ultralow-temperature-cured wear-resistant conductive paste and preparation method and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200056010A1 (en) * | 2016-11-02 | 2020-02-20 | Bioneer Corporation | Epoxy paste composition including a silver-coated copper nanowire having core-shell structure, and conductive film including same |
| US20210147732A1 (en) * | 2019-05-22 | 2021-05-20 | Blue Ocean & Black Stone Technology Co., Ltd. (Beijing) | Composition, Low Halogen and Fast Curing Conductive Adhesive and Its Preparation Method |
| CN114999706A (en) * | 2022-06-28 | 2022-09-02 | 北京中科纳通电子技术有限公司 | Nano-imprinting conductive slurry and preparation method and application thereof |
-
2022
- 2022-09-26 CN CN202211173099.6A patent/CN115631878A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200056010A1 (en) * | 2016-11-02 | 2020-02-20 | Bioneer Corporation | Epoxy paste composition including a silver-coated copper nanowire having core-shell structure, and conductive film including same |
| US20210147732A1 (en) * | 2019-05-22 | 2021-05-20 | Blue Ocean & Black Stone Technology Co., Ltd. (Beijing) | Composition, Low Halogen and Fast Curing Conductive Adhesive and Its Preparation Method |
| CN114999706A (en) * | 2022-06-28 | 2022-09-02 | 北京中科纳通电子技术有限公司 | Nano-imprinting conductive slurry and preparation method and application thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116313218A (en) * | 2023-02-20 | 2023-06-23 | 北京梦之墨科技有限公司 | Ultralow-temperature-cured wear-resistant conductive paste and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114999706A (en) | Nano-imprinting conductive slurry and preparation method and application thereof | |
| CN113012844A (en) | HJT low-temperature silver paste capable of being rapidly cured and sintered and preparation method thereof | |
| CN115631878A (en) | Nano-imprinting electromagnetic shielding silver paste and preparation method thereof | |
| CN104308183A (en) | Preparation method for flake silver powder for electronic paste | |
| CN102329550B (en) | Nano-zinc oxide waterborne epoxy resin special protective paint and preparation method thereof | |
| CN106205776A (en) | Low temperature curing type Graphene/conductive silver slurry and its preparation method and application | |
| CN106158068A (en) | conductive silver paste and preparation method thereof | |
| CN110097998B (en) | Conductive silver paste for transfer printing process touch screen and preparation method thereof | |
| WO2021213190A1 (en) | Conductive printing ink for pad printing process and preparation method therefor | |
| CN106887271B (en) | Modified lead-free silver slurry of a kind of graphene and preparation method thereof | |
| CN105295651B (en) | A kind of high corrosion-resistant anticorrosive paint and preparation method thereof | |
| CN104021838A (en) | Polythiophene/ mixed valence metal oxide collaborative conductive slurry and preparation method thereof | |
| CN105802346A (en) | Composite electrically-conductive printing ink film and preparation method thereof | |
| CN113808779A (en) | Low-temperature curing insulating medium slurry for chip resistor | |
| CN116875103A (en) | Nano heat conduction wave absorbing auxiliary agent, low-temperature curing thermosetting powder coating and preparation method and application thereof | |
| CN112521806A (en) | Color paste for environment-friendly electrolyte-resistant termination adhesive tape for lithium battery and preparation method of color paste | |
| CN115579189A (en) | High-welding-tension solar cell low-temperature silver paste and preparation method thereof | |
| CN114464343B (en) | High-wear-resistance high-conductivity low-temperature cured silver paste and preparation method thereof | |
| CN112210262B (en) | Heat-conducting coating and preparation method thereof | |
| CN101950597A (en) | Silver aluminum slurry for electromagnetic shielding and preparation method thereof | |
| KR101321414B1 (en) | Resin composition for hard coating hanving antiblocking and antistatic property and hard coating film using the same | |
| CN107286802A (en) | Refitted car ultrafast dry one-component priming paint and preparation method | |
| CN107424660A (en) | A kind of back silver paste used for solar batteries and preparation method thereof | |
| CN109504260A (en) | A kind of watersoluble plumbago alkene is from dry polyurethane electric conduction paint | |
| CN116941048A (en) | Conductive paste, electrode for solar cell, and solar cell |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20230120 |