CN115605002A - An integrated unit and application unit with water channels, capacitors and power modules - Google Patents

Abstract

The invention provides an integrated unit and an application unit with a water channel, a capacitor and a power module, and relates to the technical field of power modules, including a water-cooled plate, DC bus capacitors connected to both sides of the water-cooled plate, and a power module; the water-cooled plate There is a heat dissipation water cavity with a cavity opening facing the power module, and the power module is tightly connected to one side of the water cooling plate through a sealing part and closes the heat dissipation water cavity; The water inlet part and the water outlet part connected to the opposite sides of the heat dissipation water cavity; the DC bus capacitor is connected to the water cooling plate away from the power module through the connectors respectively located on both sides of the water inlet part and the water outlet part. side, through the water inlet, water outlet and heat dissipation water cavity to form a heat dissipation channel for the DC bus capacitor and the power module, to solve the lack of a common integrated unit in the standard plastic package module design, the need for water channels and housings The problem of low efficiency due to repeated design of the body.

Description

An integrated unit and application unit with water channels, capacitors and power modules

technical field

The invention relates to the technical field of power modules, in particular to an integrated unit and an application unit with a water channel, a capacitor and a power module.

Background technique

The semiconductor device module will generate heat in the working state, so in actual use, a cooling water channel will be installed after the module is installed to dissipate heat through the cooling water channel to reduce the temperature of the device and ensure that the junction temperature of the power semiconductor device is within the allowable range. However, the standard plastic-sealed module lacks a common integrated unit when designing a three-in-one electric control common housing. The water channel and capacitor in the lower part of the power module need to be redesigned. Complicated and less efficient.

Contents of the invention

In order to overcome the above-mentioned technical defects, the purpose of the present invention is to provide an integrated unit and an application unit with a water channel, a capacitor and a power module, which is used to solve the lack of an integrated unit in the design of a standard plastic-encapsulated module. Duplicate design, low efficiency problem.

The invention discloses an integrated unit with a water channel, a capacitor and a power module,

It includes a water cooling plate, DC bus capacitors connected to both sides of the water cooling plate, and a power module;

The water-cooling plate is provided with a heat dissipation water cavity with a cavity opening facing the power module, and the power module is tightly connected to one side of the water-cooling plate through a sealing part and closes the heat dissipation water cavity;

The water cooling plate is provided with a water inlet and a water outlet respectively communicating with the opposite sides of the heat dissipation water cavity;

The DC bus capacitor and the water-cooled plate are connected through connecting pieces respectively located on both sides of the water inlet and water outlet, and the DC bus capacitor and the water cooling plate are formed through the water inlet, water outlet and heat dissipation water cavity The heat dissipation channel of the power module.

Preferably, the water inlet part is connected to the water inlet pipe through the water inlet, and the volume of the water inlet part gradually increases along the side where the water inlet is located to the side communicating with the heat dissipation water chamber;

The water outlet part communicates with the water outlet pipe through the water outlet, and the volume of the water outlet part gradually decreases from the side communicating with the heat dissipation water cavity to the side where the water outlet is located.

Preferably, the water inlet portion is set such that its width gradually increases along the side where the water inlet is located to the side communicating with the heat dissipation water cavity;

The water outlet part is configured such that its width gradually decreases from the side communicating with the heat dissipation water cavity to the side where the water outlet is located.

Preferably, the water inlet portion is set such that its height gradually increases along the side where the water inlet is located to the side communicating with the heat dissipation water cavity;

The water outlet part is arranged such that its height gradually decreases from the side communicating with the heat dissipation water cavity to the side where the water outlet is located.

Preferably, the volume of the water inlet portion and/or the water outlet portion changes linearly or exponentially along the side where the water inlet and/or the water outlet are located to the side communicating with the heat dissipation water chamber.

Preferably, the water cooling plate is provided with a first seal at the connection between the water inlet pipe and the water inlet;

The water cooling plate is provided with a second sealing member at the connection between the water outlet pipe and the water outlet.

Preferably, the housing of the DC bus capacitor extends along the length direction;

A portion of the connecting piece extending through the housing of the DC bus capacitor is fixed to the water cooling plate.

The present invention also provides an integrated unit with a water channel, a capacitor and a power module,

comprising an integrated unit as described in any of the above;

It also includes a control and drive board, which is used to control the working status of the DC bus capacitor, power module and cooling channel;

The control and drive board is connected to the side of the power module away from the cooling channel.

The present invention also provides an application unit, using at least one integrated unit described in any one of the above;

At least one DC bus capacitor is connected in parallel on the integrated unit along a direction perpendicular to the line connecting the water inlet and the water outlet.

After adopting the above technical solution, compared with the prior art, it has the following beneficial effects:

In the present invention, the DC bus capacitor and the power module are connected to the water-cooled plate, and the water-cooled plate is provided with a heat dissipation water chamber, and a water inlet and a water outlet respectively communicated with the opposite sides of the heat dissipation water chamber, through which the water inlet The heat dissipation water channel directly acts on the DC bus capacitor and the power module, and the shell of the power module and the DC bus capacitor is fixed with the water cooling plate to realize the integration of the DC bus capacitor, the power module and the heat dissipation water channel. The integrated module, which can be used as a standardized module, can be directly applied during use without modifying the structure of the waterway or the shell each time. It is used to solve the problem of lack of an integrated unit and low efficiency in the design of standard plastic-encapsulated modules. It can also be used At least other DC bus capacitors are connected in parallel on the integrated unit along a direction perpendicular to the connection line between the water inlet part and the water outlet part, so as to realize capacity expansion applications.

Description of drawings

Fig. 1 is a structural schematic diagram of Embodiment 1 of an integrated unit and an application unit with a water channel, a capacitor and a power module according to the present invention;

Fig. 2 is a structural schematic diagram of a housing embodying a DC bus capacitor in Embodiment 1 of an integrated unit and an application unit having a water channel, a capacitor and a power module according to the present invention;

Fig. 3 is a schematic diagram of the structure of an integrated unit with water channels, capacitors and power modules and an application unit in Embodiment 1 of the present invention embodying a cooling water cavity;

Fig. 4 is a schematic structural view of the water inlet and the water outlet in Embodiment 1 of an integrated unit and application unit with water channels, capacitors and power modules according to the present invention;

Fig. 5 is a structural schematic diagram showing the gradual increase in the height of the water inlet in Embodiment 1 of an integrated unit and an application unit with water channels, capacitors and power modules according to the present invention;

Fig. 6 is a schematic structural diagram of Embodiment 2 of an integrated unit and an application unit with water channels, capacitors and power modules according to the present invention;

FIG. 7 is a schematic structural diagram of Embodiment 1 or Embodiment 2 of an integrated unit and application unit having water channels, capacitors and power modules according to the present invention, which is used to embody a heat conduction pad of a board.

Reference signs:

1- DC bus capacitor; 2- water cooling plate; 3- power module; 4- sealing part; 5- cooling water chamber; 6- water inlet; 61- water inlet; Connector; 9-control and drive board; 10-capacitor thermal pad; 11-board thermal pad; 12-current sensor.

detailed description

The advantages of the present invention will be further elaborated below in conjunction with the accompanying drawings and specific embodiments.

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present disclosure as recited in the appended claims.

The terminology used in the present disclosure is for the purpose of describing particular embodiments only, and is not intended to limit the present disclosure. As used in this disclosure and the appended claims, the singular forms "a", "the", and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It should also be understood that the term "and/or" as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

It should be understood that although the terms first, second, third, etc. may be used in the present disclosure to describe various information, the information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of the present disclosure, first information may also be called second information, and similarly, second information may also be called first information. Depending on the context, the word "if" as used herein may be interpreted as "at" or "when" or "in response to a determination."

In describing the present invention, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than Nothing indicating or implying that a referenced device or element must have a particular orientation, be constructed, and operate in a particular orientation should therefore not be construed as limiting the invention.

In the description of the present invention, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be mechanical connection or electrical connection, or two The internal communication of each element may be directly connected or indirectly connected through an intermediary. Those skilled in the art can understand the specific meanings of the above terms according to specific situations.

In the following description, use of suffixes such as 'module', 'part' or 'unit' for denoting elements is only for facilitating description of the present invention and has no specific meaning by itself. Therefore, "module" and "component" may be mixedly used.

Embodiment 1: This embodiment discloses an integrated unit with a water channel, a capacitor and a power module, referring to Fig. 1-Fig. But not limited to IGBT modules, SiC modules); in this embodiment, the power module is tightly connected to one side of the water-cooled plate through the sealing part, and the housing of the DC bus capacitor is connected to the other side of the water-cooled plate through a connecting piece to realize Integration of DC bus capacitors, power modules and cooling channels. Specifically, the connecting parts can include bolts, positioning pins, etc., and can also be fixed and connected by means of adhesive parts or welding parts after the shell of the DC bus capacitor is aligned with the water-cooled plate (side-to-side), which is easy to operate and easy to disassemble , can also be connected by fixed point welding or other existing connection structures.

In this embodiment, referring to Fig. 1-4, the mouth of the water-cooled plate is facing the heat dissipation water cavity of the DC bus capacitor, and the power module is tightly connected to one side of the water-cooled plate through a sealing part and closes the As an illustration, the heat dissipation water cavity is used for sealing parts or parts that make the power module and the water cooling plate tightly connected. On the plate, the sealing ring in the sealing groove is squeezed to make the power module and the water cooling plate tightly connected to reduce the gap between the two; in addition, other existing connection structures (including but not limited to clamping, welding, Bolt connection, etc.) to make the power module and water cooling plate tightly connected can also be used for this.

The water-cooled plate is provided with a water inlet and a water outlet respectively communicating with the opposite sides of the heat dissipation water cavity, and the DC bus capacitor is connected through connecting pieces respectively located on both sides of the water inlet and water outlet. On the side of the water-cooled plate away from the power module, through the water inlet part, the water outlet part and the heat dissipation water cavity, a heat dissipation water channel directly acting on the DC bus capacitor and the power module is formed, so as to realize the integration of the heat dissipation water channel, The DC bus capacitor and the power module; that is, the cooling water enters the heat dissipation water cavity from the water inlet, and the formed heat dissipation channel passes between the DC bus capacitor and the power module, so as to realize the protection of the power module and the DC bus capacitor For heat dissipation, the heat dissipation water cavity can be set corresponding to the shape of the DC bus capacitor to achieve sufficient heat dissipation for the DC bus capacitor.

As mentioned above, the integrated module of the DC bus capacitor, the power module and the heat dissipation water channel can be used as a standardized module, which can be directly mass-produced during use, without the need to individually modify the structure of the water channel or the housing each time. The heat dissipation water cavity is set along the DC bus capacitor. As an example, multiple baffles can also be set in the heat dissipation water cavity to form different water flow paths (such as rings, S shapes, etc.), increase the length of the heat dissipation path, and improve the heat dissipation effect .

In this embodiment, if the water outlet part and the water inlet part are arranged on both sides of the cooling water chamber, the water outlet part and the water inlet part can be located on both sides of the DC bus capacitor correspondingly, and the shell of the DC bus capacitor and the water cooling plate It can be connected by a plurality of connectors respectively located on both sides of the water inlet and the water outlet, and the connectors can avoid the area where the DC bus capacitor extends in a direction perpendicular to the line connecting the water inlet and the water outlet , if the water inlet and outlet are arranged on both sides of the cooling water cavity in the length direction, the connecting piece can avoid the area where the DC bus capacitor extends along the width direction; On both sides, the connector can avoid the area where the DC bus capacitor extends along the length direction, thus forming a certain direction area that can be used to arrange multiple DC bus capacitors, so that the subsequent capacitor can be further expanded. In order to improve the heat dissipation effect, it can also be used in the The part where the water inlet and the water outlet are connected to the power module is provided with board-card thermal pads (see Figure 7), and auxiliary heat dissipation structures such as capacitor thermal pads (see Figure 7) can also be provided between the water cooling plate and the capacitor connection of the DC bus.

Specifically, the housing of the DC bus capacitor is connected to the water cooling plate through a connecting piece, specifically, the housing of the DC bus capacitor extends along the length direction; the connecting piece extends through the housing of the DC bus capacitor The part is fixed with the water-cooled plate, that is, the connection between the shell of the DC bus capacitor and the water-cooled plate avoids the area where the DC bus capacitor extends along the width (Y) direction, and connects the connectors at both ends of the DC bus capacitor in the length (X) direction , when it is necessary to set up capacitance expansion, set up multiple integrated units or arrange other components during use, it can be arranged side by side in the area where the DC bus capacitor extends along the width (Y) direction or height (Z) direction to achieve capacitance expansion, and at the same time Improve space utilization inside the device.

As a supplement, in order to further increase the stability of the connection between the shell of the DC bus capacitor and the water-cooled plate, connectors can also be installed at other positions between the water-cooled plate and the shell of the DC bus capacitor, without affecting the above expansion or other component settings. At the same time, a plurality of lead wires for communicating with the DC bus capacitor can also be arranged on the shell of the DC bus capacitor, and are used for connecting with other components for easy application. It should also be noted that in the actual preparation process, in order to realize the setting of the water inlet and outlet, after the cooling water cavity is installed on the water cooling plate, the installation area for the water inlet and outlet is reserved on the water cooling plate , and then weld the water inlet and outlet parts with gradually changing inner width or height to the water cooling plate to form a structure similar to being sleeved on both ends of the heat dissipation water cavity and communicated with the heat dissipation water cavity, and fixed to form a heat dissipation water channel to facilitate production. Other operations that are conducive to improving the preparation efficiency are also available.

In a preferred embodiment, the water inlet part communicates with a water inlet pipe (not shown in the figure) through a water inlet, and the water inlet part communicates with the heat dissipation water cavity along the side direction where the water inlet is located. The side volume gradually increases; the water outlet part communicates with the water outlet pipe (not shown in the figure) through the water outlet, and the volume of the water outlet part gradually decreases from the side communicating with the heat dissipation water cavity to the side where the water outlet is located. Specifically, the water inlet pipe and the water outlet pipe can be arranged vertically or parallel to the water-cooled plate, and can be arranged outside the water-cooled plate. In order to have the same shape, the shapes may not be the same, but in this embodiment, the shapes are set to be the same. The volume is gradually increased along the side where the water inlet is located to the side communicating with the heat dissipation water cavity, so that the pressure of the cooling water entering the heat dissipation water cavity from the water inlet pipe gradually decreases, thereby accumulating and filling the entire heat dissipation water cavity, In order to achieve sufficient heat dissipation for the DC bus capacitor, reduce the excessive pressure of the incoming water flow directly through the heat dissipation water cavity, and cannot accumulate in the heat dissipation water cavity; The volume of the side where the water outlet is located gradually decreases, which can increase the pressure of the water flow out of the water outlet, thereby increasing the flow velocity of the water flow at the water outlet, so that the cooling water cannot be accumulated in the water outlet, and the circulation of the cooling water in the water channel can be maintained.

In the above embodiment, as an option, referring to FIG. 4 , the water inlet portion is set to gradually increase in width along the side where the water inlet is located to the side communicating with the heat dissipation water cavity; the water outlet portion is set to The width gradually decreases from the side communicating with the heat dissipation water cavity to the side where the water outlet is located. Specifically, the side where the water inlet and outlet communicate with the heat dissipation water cavity has the largest width. In this embodiment, it can Consistent with the width of the heat dissipation water chamber, the water inlet can be arranged on the center line of the water cooling plate, so that a fan-shaped or triangular area is formed along the water inlet to the side communicating with the heat dissipation water chamber, or the water inlet can be arranged At any position of the water cooling plate, a curved area with gradually increasing volume is formed along the water inlet to the side communicating with the cooling water chamber. The water outlet can also have a similar arrangement as the water inlet.

In the above embodiment, as an option, referring to FIG. 5 , the water inlet part is set to gradually increase in height along the side where the water inlet is located to the side communicating with the heat dissipation water chamber; the water outlet part is set to The height gradually decreases from the side communicating with the heat dissipation water cavity to the side where the water outlet is located. Based on the above needs, the water pressure is gradually reduced at the water inlet, and the water pressure is gradually increased at the water outlet. It can also be passed through the water inlet. Controlled by the height of the water outlet part, the height gradually increases along the side where the water inlet is located to the side communicating with the heat dissipation water cavity, thereby controlling the incoming water pressure to gradually decrease and allowing the cooling water to flow in the heat dissipation water cavity After accumulating for a certain period of time, the height gradually decreases from the side communicating with the cooling water chamber to the side where the water outlet is located, increasing the speed at which the cooling water moves to the water outlet, realizing the circulation of cooling water and improving the cooling effect.

In this embodiment, based on the above, referring to Fig. 1-Fig. 5, the width or height of the water inlet and/or water outlet can be adjusted to realize volume adjustment, and the width and height can also be set in a certain ratio so that The volume of the water inlet and/or the water outlet changes linearly or exponentially along the side where the water inlet and/or the water outlet are located to the side communicating with the heat dissipation water chamber, that is, the volume of the water inlet The pressure of the cooling water decreases linearly or exponentially, so as to reduce the damage caused by the rapid change of water pressure to the inside of the water cooling plate, or cause the water flow to be blocked. In this embodiment, the water inlet part and the water outlet part are arranged in a relatively consistent manner, forming a symmetrical distribution relative to the heat dissipation water chamber, so that the pressure changes on both sides are symmetrical, so that the cooling water passes through the heat dissipation water channel to form a uniform and stable cooling water channel, which increases the heat dissipation. In addition to the cooling effect of the DC bus capacitor, it also increases the safety of the practical process.

In a preferred embodiment, the water cooling plate is provided with a first sealing member (not shown in the figure) at the connection between the water inlet pipe and the water inlet; A second seal (not shown in the figure) is provided at the joint of the water outlet. The first seal and the second seal can be set to be consistent or inconsistent. The first seal and/or the second seal include a seal Rings, sealing strips, sealants, etc., or other structures for sealing can also be used to improve the safety in the practical process. At the same time, seals such as foam or sealing strips can be installed on the contact part of the DC bus capacitor and the water cooling plate (surrounding the heat dissipation water chamber) to reduce the gap between the power module and the water cooling plate. Other seals are provided at the connection with the water cooling plate to further increase the stability and safety of the integrated unit.

Embodiment 2: This embodiment also provides an integrated unit with water channels, capacitors and power modules, refer to Figure 6 and Figure 7, including the integrated unit in the above-mentioned embodiment 1; also includes control and drive boards, control and drive The board is used to control the working state of the DC bus capacitor, the power module and the heat dissipation water channel, and the control and driving board is connected to the side of the power module away from the heat dissipation water channel. Specifically, the control and drive boards are used to electrically connect DC bus capacitors, power modules or heat dissipation water channel control, the work of DC bus capacitors and power modules in integrated units or the on-off of water flow circuits in heat dissipation water channels (such as water inlet and water outlet) part of the work can form a water flow circuit for heat dissipation), in this embodiment, the control and drive board can be a drive and control integrated board, and can also be connected to a current sensor, through which the DC bus capacitor and power module can be connected And other precise circuit control. The integrated unit can also form a standard module, and can also adjust the water channel settings in the first embodiment, etc., so as to be suitable for various implementation scenarios, without separately modifying the water channel or shell structure each time.

Embodiment 3: This embodiment provides an application unit, using at least one integrated unit described in Embodiment 1 above; on the integrated unit along a direction perpendicular to the line connecting the water inlet and the water outlet Connect at least one DC bus capacitor in parallel. The DC bus capacitor can be paralleled with the DC bus capacitor on the integrated unit to achieve capacitance expansion, and the DC bus capacitor on the integrated unit passes through the lead wire of the DC bus capacitor to realize adjacent DC. The connection of the busbar capacitor, thereby realizing the batch use of the integrated unit, and at the same time, the expansion can be independently selected according to the application scenario. As an example, the three-dimensional coordinates are established with the center point of the integrated unit as the origin, and the water inlet and the water outlet If the external connection direction is the X-axis direction of the integrated unit, you can choose to set the expansion in the Y-axis direction or the Z-axis direction of the integrated unit.

It should be noted that the embodiments of the present invention have better implementability and are not intended to limit the present invention in any form. Any person skilled in the art may use the technical content disclosed above to change or modify equivalent effective embodiments. However, any modification or equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still belong to the scope of the technical solution of the present invention.

Claims (9)

1. An integrated unit having a water channel, a capacitor and a power module, characterized in that:

the direct current bus capacitor comprises a water cooling plate, direct current bus capacitors connected to two sides of the water cooling plate and a power module;

the water cooling plate is provided with a heat dissipation water cavity with a cavity opening facing the power module, and the power module is tightly connected to one side of the water cooling plate through a sealing part and seals the heat dissipation water cavity;

a water inlet part and a water outlet part which are respectively communicated with two opposite sides of the heat dissipation water cavity are arranged on the water cooling plate;

the direct current bus capacitor is connected to one side, away from the power module, of the water cooling plate through connecting pieces respectively located on two sides of the water inlet portion and the water outlet portion, so that a heat dissipation water channel acting on the direct current bus capacitor and the power module is formed through the water inlet portion, the water outlet portion and the heat dissipation water cavity.

2. The integrated unit of claim 1, wherein:

the water inlet part is communicated with a water inlet pipeline through a water inlet, and the volume of one side of the water inlet part, which is communicated with the heat dissipation water cavity, is gradually increased along one side where the water inlet is located;

the water outlet part is communicated with a water outlet pipeline through a water outlet, and the volume of the water outlet part is gradually reduced from one side where the water outlet part is communicated with the heat dissipation water cavity to the side where the water outlet is located.

3. The integrated unit of claim 2, wherein:

the width of the water inlet part is gradually increased along one side where the water inlet is located and the side, communicated with the heat dissipation water cavity, of the water inlet part; the water outlet part is arranged to gradually reduce in width along one side communicated with the heat dissipation water cavity and towards the side where the water outlet is located.

4. An integrated unit as claimed in claim 2 or 3, characterized in that:

the water inlet part is arranged to be gradually increased in height along one side where the water inlet is located and communicated with the heat dissipation water cavity; the water outlet part is set to be gradually reduced in height from one side communicated with the heat dissipation water cavity to the side where the water outlet is located.

5. The integrated unit of claim 2, wherein:

the volume of the water inlet part and/or the water outlet part is/are linearly or exponentially changed along the side where the water inlet and/or the water outlet are/is communicated with the heat dissipation water cavity.

6. The integrated unit of claim 2, wherein:

the water cooling plate is provided with a first sealing element at the joint of the water inlet pipeline and the water inlet;

and a second sealing element is arranged at the joint of the water outlet pipeline and the water outlet of the water cooling plate.

7. The integrated unit of claim 1, wherein:

the shell of the direct current bus capacitor extends along the length direction;

and the part of the connecting piece, which penetrates through the shell of the direct current bus capacitor and extends out, is fixed with the water cooling plate.

8. An integrated unit having a water channel, a capacitor and a power module, characterized in that:

comprising an integrated unit according to any of the preceding claims 1-7;

the control and drive board card is used for controlling the working states of the direct current bus capacitor, the power module and the heat dissipation water channel;

the control and drive board card is connected on one side of the power module, which deviates from the heat dissipation water channel.

9. An application unit, characterized by:

applying at least one integrated unit according to any of the preceding claims 1-8;

and at least one direct current bus capacitor is connected in parallel on the integrated unit along the direction vertical to the connecting line of the water inlet part and the water outlet part.

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