CN115602759A - Film strip processing device and method and series welding machine - Google Patents
Film strip processing device and method and series welding machine Download PDFInfo
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- CN115602759A CN115602759A CN202211315358.4A CN202211315358A CN115602759A CN 115602759 A CN115602759 A CN 115602759A CN 202211315358 A CN202211315358 A CN 202211315358A CN 115602759 A CN115602759 A CN 115602759A
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- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
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- H—ELECTRICITY
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- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
- H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
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Abstract
本发明提供了一种膜带处理装置、处理方法及串焊机，其中的膜带处理装置包括焊带牵引机构、膜带送料机构、贴膜机构，其中：焊带牵引机构被配置为牵引出多根并行的焊带，使得焊带经过膜带处理工位；膜带送料机构被配置为将待贴附膜带沿焊带的牵引方向送至膜带处理工位；贴膜机构将位于膜带处理工位处的待贴附膜带分切成若干预定长度的膜带段，以及将若干膜带段贴附至位于膜带处理工位处的焊带的第一侧表面；或者，将若干膜带段间隔地贴附至位于膜带处理工位处焊带的第一侧表面及与第一侧表面相对的第二侧表面。通过牵引机构、膜带送料机构及贴膜机构的配合，本发明的膜带处理装置能够同时将若干膜带段贴附至焊带上，从而提升膜带处理效率。
The invention provides a film tape processing device, a processing method and a serial welding machine, wherein the film tape processing device includes a tape pulling mechanism, a film tape feeding mechanism, and a film sticking mechanism, wherein: the welding tape pulling mechanism is configured to pull out multiple root parallel welding ribbons, so that the ribbons pass through the tape processing station; the film tape feeding mechanism is configured to send the film tape to be attached to the tape processing station along the pulling direction of the welding tape; the film sticking mechanism will be located at the tape processing station The film tape to be attached at the station is cut into several film tape sections of predetermined length, and the several film tape sections are attached to the first side surface of the welding tape at the film tape processing station; The strip segments are attached to the first side surface and the second side surface opposite to the first side surface of the welding strip at the film strip processing station at intervals. Through the cooperation of the traction mechanism, the film tape feeding mechanism and the film sticking mechanism, the film tape processing device of the present invention can attach several film tape segments to the welding tape at the same time, thereby improving the film tape processing efficiency.
Description
Technical Field
The invention relates to the field of battery production, in particular to a membrane strip processing device, a membrane strip processing method and a stringer.
Background
The traditional method for stringing the battery pieces is as follows: and in the process of stacking the battery pieces and the welding strip groups, dispensing glue on the battery pieces, heating and pressing the stacked battery pieces and the welding strip groups to enable the welding strip groups to be bonded on the corresponding battery pieces through the melted glue, thereby obtaining the battery string. The traditional cell stringing mode has the main defects that: in the process of stacking the battery pieces and the welding strips, firm bonding between the battery pieces and the welding strip groups cannot be realized by glue adhesion, so that the quality of the battery string is reduced. In order to overcome the above problems of the conventional cell string method, a thermal compression bonding of the cell is performed using a solder strip with an adhesive film attached thereto, i.e. the solder strip is adhered to the corresponding cell by the melted adhesive film thereon.
The existing film strip processing device is arranged according to a traditional battery string laying method, when a battery string is produced, one section of film strip is attached to a welding strip section when one section of welding strip is provided, then the welding strip attached with the film strip is pulled and laid, the battery string is produced, the existing mode film strip attaching device can only process one section of film strip once, the attaching time of the film strip is long, the efficiency of pulling the welding strip and attaching the film strip at one time is low, and the productivity is seriously influenced.
Disclosure of Invention
In order to solve the technical problems, the invention firstly provides a film strip processing device, and the detailed technical scheme is as follows:
the utility model provides a film strip processing apparatus, takes drive mechanism, film tape feeding mechanism, pad pasting mechanism including welding, wherein:
the welding strip traction mechanism is configured to pull out a plurality of parallel welding strips so that the welding strips pass through the film strip processing station;
the film strip feeding mechanism is configured to send the film strip to be attached to the film strip processing station along the traction direction of the welding strip;
the film sticking mechanism cuts the film strip to be stuck at the film strip processing station into a plurality of film strip sections with preset lengths, and sticks the film strip sections to the first side surface of the welding strip at the film strip processing station; alternatively, the plurality of film tape sections are attached to a first side surface of the solder tape at the film tape processing station and a second side surface opposite to the first side surface at intervals.
Through the matching of the traction mechanism, the film tape feeding mechanism and the film sticking mechanism, the film tape processing device can stick a plurality of film tape sections to the welding tape at the same time, so that the film tape processing efficiency is improved.
In some embodiments, the film attaching mechanism includes an adsorption part and a slitting part, wherein: the adsorption part is used for adsorbing the film belt to be attached; the cutting part is used for cutting the film strip into a plurality of film strip sections; the adsorption part is also used for attaching a plurality of film band sections to the welding band.
Through the cooperation of absorption portion with cut the portion, pad pasting mechanism has realized cutting the automation in membrane area to a plurality of membrane area sections that will cut are attached to welding the area simultaneously.
In some embodiments, the adsorption part comprises a plurality of adsorption components arranged along the traction direction of the welding strip; the part of cutting all adsorbs a membrane area section on every adsorption component after will treating that attached membrane area divides to be cut into a plurality of membrane area sections, and every adsorption component is attached to welding the area with adsorbed membrane area section respectively.
The cutting part is used for cutting the film strip to be attached into a plurality of film strip sections, each adsorption component is provided with an adsorption film strip section, and the position and the angle of the adsorption component are adjusted to attach the welding strip section to a preset position of the welding strip.
In some embodiments, all of the odd numbered suction assemblies attach the suctioned film tape segments to the first side surface of the solder tape, and all of the even numbered suction assemblies attach the suctioned film tape segments to the second side surface of the solder tape; or all the even-numbered adsorption assemblies attach the adsorbed film band sections to the first side surface of the welding strip, and all the odd-numbered adsorption assemblies attach the adsorbed film band sections to the second side surface of the welding strip.
The welding strip sections are attached to two opposite surfaces of the welding strip at intervals, and after the welding strip is cut, the welding strip assembly with the film strip sections attached to the first side surface of the front half section and the second side surface of the rear half section can be obtained.
In some embodiments, each even number of the adsorption assemblies is configured to be movable and turnable, and each even number of the adsorption assemblies is used for turning the adsorbed film tape section by 180 degrees and then attaching the film tape section to the second side surface of the solder tape; or each odd number of the adsorption assemblies are configured to be movable and turnable, and each odd number of the adsorption assemblies is used for turning the adsorbed film band section by 180 degrees and then attaching the film band section to the second side surface of the welding band.
By controlling the even adsorption assemblies or the odd adsorption groups in the adsorption assemblies to move and turn over, the welding strip sections are attached to two opposite surfaces of the welding strip at intervals.
In some embodiments, the film attachment mechanism further comprises a spacing mechanism for performing spacing of the plurality of film strip sections.
By arranging the distance dividing mechanism, the distance division of a plurality of film belt sections is realized, and the using amount of the film belts is saved.
In some embodiments, the film tape feeding mechanism and the film sticking mechanism are arranged in two sets, and the two sets of film tape feeding mechanisms correspond to the two sets of film sticking mechanisms one to one, wherein: the two groups of film sticking mechanisms are oppositely arranged, and one group of film sticking mechanisms is used for sticking the film strip to the first side of the welding strip; the other group of film sticking mechanisms are used for sticking the film strips to the second sides of the welding strips; the two groups of film strip feeding mechanisms are configured to respectively feed a group of film strips to be attached to corresponding film strip processing stations.
Two sets of film tape feeding mechanism and pad pasting mechanism implement the pad pasting to the both sides surface of welding the area in step, have further promoted film tape treatment effeciency.
The invention also provides a series welding machine which comprises any one of the film strip processing device, the welding strip splitting mechanism, the welding strip stacking device, the battery piece stacking device, the conveying device and the series connection device, wherein:
the film strip processing device is used for providing the welding strip attached with the film strip section for the welding strip splitting mechanism, and the welding strip splitting mechanism is used for splitting the welding strip into welding strip assemblies;
the battery plate stacking device and the welding strip stacking device are configured to stack the battery plate and the welding strip assembly onto the conveying device according to a preset stacking rule;
the conveying device is used for conveying the stacked welding strip assemblies to the serial connection device;
the series connection device is used for pressing the stacked battery plates and the welding strip assembly together to form a battery string.
Through the matching of the film strip processing device, the welding strip splitting mechanism, the welding strip stacking device, the battery piece stacking device, the conveying device and the serial connection device, the series welding machine provided by the invention realizes the compression connection and stringing of the battery pieces.
The invention also provides a film strip processing method, which comprises the following steps:
drawing out a plurality of parallel welding strips;
conveying the film strip to be attached to the first side of the welding strip along the traction direction of the welding strip;
cutting the film strip to be attached into a plurality of film strip sections with preset lengths;
attaching a plurality of film tape sections to a first side surface of the solder tape; or,
and attaching a plurality of film strip sections to a first side surface of the welding strip and a second side surface opposite to the first side surface at intervals.
The film strip processing method disclosed by the invention can be used for simultaneously attaching a plurality of film strip sections to the welding strip, so that the film strip processing efficiency is improved.
In some embodiments, the membrane strip processing method further comprises: after the film strip to be attached is cut into a plurality of film strip sections with preset lengths, the film strip sections are subjected to distance division treatment.
By spacing the film belt sections, the film belt amount of the adhesion part between the battery pieces without using the film strips is saved.
In some embodiments, attaching a plurality of film segments to a first side surface of the solder strip and a second side surface opposite to the first side surface at intervals comprises: attaching all odd film strip sections in the plurality of film strip sections to the first side surface of the solder strip, and attaching all even film strip sections in the plurality of film strip sections to the second side surface of the solder strip; or all even film tape sections in the plurality of film tape sections are attached to the first side surface of the solder tape, and all odd film tape sections in the plurality of film tape sections are attached to the second side surface of the solder tape.
The welding strip sections are attached to two opposite surfaces of the welding strip at intervals, and after the welding strip is cut, the welding strip assembly with the film strip sections attached to the first side surface of the front half section and the second side surface of the rear half section can be obtained.
Drawings
Fig. 1 is a schematic view of a solder ribbon assembly for use in connecting battery slices having grid lines on both sides into a battery string;
FIG. 2 is a schematic view of a process of processing a solder strip by a film strip processing apparatus according to a first embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a film tape feeding mechanism in the embodiment of the present invention
FIG. 4 is a schematic view illustrating a process of processing a solder strip by a film strip processing apparatus according to a second embodiment of the present invention;
FIG. 5 is a schematic view of a solder ribbon assembly for use in connecting IBC battery plates into a battery string;
FIG. 6 is a schematic flow chart illustrating a film strip processing method according to a fourth embodiment of the present invention;
fig. 7 is a schematic flow chart illustrating an implementation of a film strip processing method according to a fifth embodiment of the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
The existing film strip processing device is arranged according to a traditional battery string laying method, when a battery string is produced, one section of film strip is attached to a welding strip section when one section of welding strip is provided, then the welding strip attached with the film strip is pulled and laid, the battery string is produced, the existing mode film strip attaching device can only process one section of film strip once, the attaching time of the film strip is long, the efficiency of pulling the welding strip and attaching the film strip at one time is low, and the productivity is seriously influenced.
In order to solve the problems of the existing film tape processing device, the invention provides a film tape processing device which can attach a plurality of film tape sections to a welding tape at the same time, so that the film tape processing efficiency is improved.
The film tape processing apparatus of the present invention will be described below exemplarily by three embodiments.
First embodiment
The film strip processing apparatus provided in this embodiment is used for attaching film strip segments to the first side surface and the second side surface of the solder strip at intervals, and finally, the automatic production of the solder strip assembly 100 shown in fig. 1 is realized, as shown in fig. 1, the solder strip assembly 100 includes a solder strip group 101, and two film strip segments 102 attached to the first side surface of the first half section and the second side surface of the second half section of the solder strip group 101. By adopting the solder strip assembly 100 produced by the embodiment, the battery pieces with the grid lines on both sides can be connected in series to form a battery string.
As shown in fig. 2, the film tape processing apparatus according to the present embodiment includes a solder ribbon drawing mechanism (not shown), a film tape feeding mechanism 1, and a film sticking mechanism 2. Wherein:
the strip pulling mechanism is configured to pull out a plurality of parallel strips of solder 300 such that the strips of solder 300 pass through the film strip processing station.
The film strip feeding mechanism 1 is configured to feed the film strip to be attached to the film strip processing station along the drawing direction of the welding strip 300.
As shown in fig. 3, the film tape feed mechanism 1 optionally includes a film tape roll 11, a film tape pressing section 12, a film tape cutting section 13, and a film tape drawing section 14. The specific process that the film strip feeding mechanism 1 sends the film strip to be attached to the film strip processing station is as follows: the film tape drawing section 14 draws the film tape from the film tape roll 11 and causes the film tape to pass through the film tape pressing section 12 and the film tape cutting section 13 in order, and when the film tape 400 to be attached of a predetermined length is drawn to the film tape processing station, the film tape pressing section 12 presses the film tape, and the film tape cutting section 13 cuts the film tape 400 to be attached. Optionally, the number of the film strips 400 to be attached and the number of the welding strips 300 pulled out by the welding strip pulling mechanism are in one-to-one correspondence, that is, each film strip is to be correspondingly attached to one corresponding welding strip.
The film sticking mechanism 2 is configured to cut the film tape 400 to be stuck at the film tape processing station into a plurality of film tape sections 401 of a predetermined length, and to stick the plurality of film tape sections to a first side surface (e.g., upper side surface) and a second side surface (e.g., lower side surface) of the solder ribbon 300 at the film tape processing station at intervals.
It should be noted that the first side surface and the second side surface of the solder strip described in the present invention are only used to indicate the orientation of the film strip section with respect to the solder strip, and do not refer to the actual solder strip surface. In practical application, the solder strip can be a circular solder strip, a triangular solder strip and a special-shaped solder strip formed by alternately arranging circular solder strip sections and triangular solder strip sections.
Optionally, the film sticking mechanism 2 in this embodiment includes an adsorption portion and a slitting portion, wherein: the adsorption part is used for adsorbing the film belt 400 to be attached, and the cutting part is used for cutting the film belt 400 to be attached adsorbed by the adsorption part into a plurality of film belt sections 401. The suction part is also used for attaching the plurality of film strip sections 401 obtained by slitting to the first side surface and the second side surface of the solder strip 300 at intervals.
Optionally, the suction part in this embodiment includes a plurality of (e.g., 8 in fig. 2) suction assemblies 21 arranged along the drawing direction of the solder ribbon 300. The cutting part is configured to cut the film strip 400 to be attached into a plurality of film strip sections 401, and each of the adsorption members 21 adsorbs one of the film strip sections 401. Each suction assembly 21 attaches a respective sucked film strip section 401 to the solder strip 300.
As shown in fig. 2, in the present embodiment, all odd-numbered (e.g., 1 st, 3 rd, 5 th and 7 th) adsorption assemblies 21 attach the adsorbed film tape sections 401 to the first side surface of the solder ribbon 300, and all even-numbered (e.g., 2 nd, 4 th, 6 th and 8 th) adsorption assemblies 21 attach the adsorbed film tape sections 401 to the second side surface of the solder ribbon 300. Of course, all the even-numbered suction assemblies 21 may attach the sucked film tape section 401 to the first side surface of the solder ribbon 300, and all the odd-numbered suction assemblies 21 may attach the sucked film tape section 401 to the second side surface of the solder ribbon 300.
In this embodiment, all the suction assemblies 21 are located on the first side (e.g., upper side) of the solder ribbon in the initial state in order to be able to attach the film tape section 401 to the second side surface (e.g., lower side surface). Each even number (2 nd, 4 th, 6 th and 8 th in the figure) of the adsorption assemblies 21 is configured to be movable and turnable, and each even number of the adsorption assemblies 21 is used for turning the adsorbed film tape section 401 by 180 ° and then attaching the film tape section to the second side surface of the solder tape.
As shown in fig. 1, in order to save the amount of the film tape and make the middle portion of the solder ribbon assembly 100 between the two battery cells easier to bend or handle due to other process requirements, a predetermined distance is maintained between the two film tape sections 102 on the first side surface of the front half and the second side surface of the rear half of the solder ribbon assembly 101.
In order to realize the separation between the membrane tape sections 401, optionally, the film sticking mechanism 2 further includes a separation mechanism, and the separation mechanism is configured to perform the separation on the adsorption assembly 21, so as to drive the membrane tape sections adsorbed on the adsorption assembly 21 to be separated.
In order to make the technical solution of the film strip processing apparatus in this embodiment be more clearly understood by those skilled in the art, the following will exemplarily describe the operation of the film strip processing apparatus in this embodiment with reference to fig. 2, specifically as follows:
first, as shown in fig. 2 (a), the solder ribbon drawing mechanism draws out a plurality of parallel solder ribbons 300 so that the solder ribbons 300 pass through the film ribbon processing station.
Next, as shown in fig. 2 (b), the film tape feed mechanism 1 feeds the film tape 400 to be attached to the film tape processing station in the drawing direction of the solder tape 300.
Next, as shown in fig. 2 (c), each suction unit 21 of the film sticking mechanism 2 sucks the film tape 400 to be stuck. The slitting section of the laminating mechanism 2 then slits the film tape 400 to be laminated from the gaps between the respective adsorption assemblies 21. After the slitting is completed, each adsorption assembly 21 adsorbs a film tape segment 401.
Next, as shown in (d) and (e) of fig. 2, the pitch mechanism performs pitch of the respective adsorption assemblies 21 so that a pitch of a predetermined size is formed between each successive two film tape sections 401. As in fig. 2, a predetermined size of space is formed between the 1 st and 2 nd film segments 401, between the 3 rd and 4 th film segments 401, between the 5 th and 6 th film segments 401, and between the 7 th and 8 th film segments 401.
Next, as shown in (f) of fig. 2, all the even-numbered suction assemblies 21 are moved to the second side of the solder ribbon 300 and turned 180 ° or moved to the second side of the solder ribbon after being turned 180 °. Then, all the suction members 21 press the film tape section 401 sucked thereto to the solder tape 300.
Finally, as shown in fig. 2 (g), the corresponding film tape section 401 is heated by the heating plate assembly 3, so that each film tape section 401 is finally attached to the welding tape 300.
At this point, the film strip processing is completed, and the solder strip 300 with the film strip segments attached to the first side surface and the second side surface at intervals is obtained.
The welding strip slitting mechanism in the subsequent step slits the welding strip 300 with the film strip segment attached, so as to obtain a plurality of (e.g. 4) welding strip assemblies 100 shown in fig. 1. Slitting in such a way that every two consecutive film strip sections 401 are slit onto a length of solder ribbon, as in fig. 2, the 1 st and 2 nd film strip sections 401 are slit onto a length of solder ribbon, thereby forming a solder ribbon assembly; the 3 rd and 4 th film strip sections 401 are slit onto a length of solder strip to form a solder strip assembly; and so on, forming 4 solder strip assemblies.
Second embodiment
The film strip processing apparatus of the present embodiment, like the first embodiment, is also used to realize automatic production of the solder strip assembly 100 shown in fig. 1. Since the structure and the operation process of the film strip processing apparatus of the present embodiment are substantially the same as those of the first embodiment, for the sake of brevity, the present embodiment will focus on the specific description of the technical differences of the present embodiment with respect to the first embodiment. Identical or corresponding parts carry the reference numerals of the first embodiment without causing confusion.
In order to further improve the film strip processing efficiency, in this embodiment, as shown in fig. 3, the film strip feeding mechanism 1 and the film sticking mechanism 2 are provided in two sets.
One group of the film tape feeding mechanism 1 and the film sticking mechanism 2 is located on the first side of the solder strip 300 and used for sticking the film tape to the surface of the first side of the solder strip. And the other group of film strip feeding mechanism 1 and film sticking mechanism 2 are positioned on the second side of the welding strip 300 and are used for sticking the film strips to the surface of the second side of the welding strip.
In order to make the technical solution of the film strip processing apparatus in the present embodiment be more clearly understood by those skilled in the art, the following description will be made by referring to fig. 2, specifically, the working process of the film strip processing apparatus in the embodiment is as follows:
first, as shown in fig. 4 (a), the solder ribbon drawing mechanism draws out a plurality of parallel solder ribbons 300 so that the solder ribbons 300 pass through the film ribbon processing station.
Next, as shown in fig. 4 (b), the two film tape feeding mechanisms 1 located on both sides of the solder ribbon 300 respectively feed a section of the film tape 400 to be attached to the corresponding film tape processing station in the drawing direction of the solder ribbon 300. After the two film tapes are pulled, the two film tapes 400 to be attached are staggered, and the staggered distance is about the length of one film tape section to be divided.
Next, as shown in fig. 4 (c), the two film sticking mechanisms 2 respectively suck the corresponding film tapes 400 to be stuck. The cutting parts of the two film sticking mechanisms 2 respectively cut the corresponding film strips 400 to be stuck. After the slitting is completed, each adsorption assembly 21 adsorbs a film tape segment 401.
Next, as shown in fig. 4 (d), the pitch mechanisms of the two film application mechanisms 2 perform pitch separation on the respective adsorption modules 21. Finally, a predetermined size of space is formed between each two consecutive film strip sections 401. As in fig. 4, a predetermined size of space is formed between the 1 st and 2 nd film segments 401, between the 3 rd and 4 th film segments 401, between the 5 th and 6 th film segments 401, and between the 7 th and 8 th film segments 401.
Finally, as shown in fig. 4 (e), the corresponding film tape section 401 is heated by the heating plate assembly 3, so that the film tape section 401 is finally attached to the welding tape 300.
At this point, the film strip processing is completed, and the solder strip 300 with the film strip segments attached to the first side surface and the second side surface at intervals is obtained.
The welding strip cutting mechanism in the subsequent step cuts the welding strip 300 with the film strip section attached, so as to obtain a plurality of (e.g. 4) welding strip assemblies 100 shown in fig. 1. Slitting in such a way that every two consecutive film strip sections 401 are slit onto a length of solder ribbon, as in fig. 4, the 1 st and 2 nd film strip sections 401 are slit onto a length of solder ribbon, thereby forming a solder ribbon assembly; the 3 rd and 4 th film strip segments 401 are slit onto a length of solder strip to form a solder strip assembly; and so on, form 4 solder strip assemblies.
Third embodiment
The film strip processing device provided in this embodiment is only used for attaching the film strip section to the first side surface of the solder strip, and finally, the automatic production of the solder strip assembly 200 as shown in fig. 5 is realized, where the solder strip assembly 200 includes a solder strip group 201, and the film strip section 202 is attached to the first side surface of the solder strip group 201. By adopting the solder strip assembly 200 produced by the embodiment, the battery pieces (IBC battery pieces) with grid lines on only one side (back side) can be connected in series to form a battery string.
Compared with the second embodiment, the film strip processing device provided by the embodiment only comprises the film strip feeding mechanism 1 and the film pasting mechanism 2 which are arranged on the first side of the welding strip 300, and the film strip feeding mechanism 1 and the film pasting mechanism 2 are matched to carry out film pasting on the first side surface of the welding strip, so that the welding strip 300 with the film strip sections pasted on the first side surface at intervals is obtained.
The welding strip 300 with the film strip section attached is cut by a subsequent welding strip cutting mechanism, so that a plurality of welding strip assemblies 200 shown in fig. 5 can be obtained.
The specific film laminating process of the film tape feeding mechanism 1 and the film laminating mechanism 2 in this embodiment is substantially the same as that in the second embodiment, and details are not repeated in this specification.
The invention also provides a film strip processing method which can attach a plurality of film strip sections to the welding strip at the same time, so that the film strip processing efficiency is improved. The film strip treatment process of the present invention will be described below by way of two examples.
Fourth embodiment
The solder strip processing method of this embodiment is used for attaching film strip segments to a first side surface and a second side surface of a solder strip at intervals, and finally realizing automatic production of the solder strip assembly 100 as shown in fig. 1, where the solder strip assembly 100 includes a solder strip group 101, and two film strip segments 102 attached to the first side surface of a front half section and the second side surface of a rear half section of the solder strip group 101. By adopting the solder strip assembly 100 produced by the embodiment, the battery pieces with the grid lines on both sides can be connected in series to form a battery string.
The film tape processing method in this embodiment can be implemented by the film tape processing apparatus in the first embodiment described above. As shown in fig. 6, the solder strip processing method of the present embodiment includes the following steps:
and S101, drawing out a plurality of parallel welding strips.
S102, the film strip to be attached is sent to the first side of the welding strip along the traction direction of the welding strip.
S103, cutting the film strip to be attached into a plurality of film strip sections with preset lengths.
And S105, attaching a plurality of film tape sections to the first side surface of the welding tape and the second side surface opposite to the first side surface at intervals.
Optionally, step S105 specifically includes:
and attaching all odd film strip sections in the plurality of film strip sections to the first side surface of the solder strip, and attaching all even film strip sections in the plurality of film strip sections to the second side surface of the solder strip. Or,
and attaching all even film tape sections of the plurality of film tape sections to the first side surface of the solder tape, and attaching all odd film tape sections of the plurality of film tape sections to the second side surface of the solder tape.
As shown in fig. 1, in order to save the amount of the film tape, and to make the middle portion of the solder ribbon assembly 100 between the two battery cells easier to bend or to facilitate the handling of the solder ribbon in the following process, a predetermined distance is maintained between two film tape segments 102 on the first side surface of the front half section and the second side surface of the rear half section of the solder ribbon group 101. In view of this, optionally, the film tape processing method of the present embodiment further includes the following steps between step S103 and step S105:
and S104, carrying out separation treatment on the plurality of film belt sections.
For more specific processing details of the film strip processing method of this embodiment, reference may be made to the related contents of the film strip processing apparatus in the first embodiment, and details thereof are not repeated here.
Fifth embodiment
The film strip processing device provided in this embodiment is only used for attaching the film strip section to the first side surface of the solder strip, and finally, the automatic production of the solder strip assembly 200 as shown in fig. 5 is achieved, where the solder strip assembly 200 includes a solder strip group 201 and a film strip section 202 attached to the first side surface of the solder strip group 201. By adopting the solder strip assembly 200 produced by the embodiment, the battery pieces (IBC battery pieces) with grid lines on only one side (back side) can be connected in series to form a battery string.
The solder ribbon processing method in this embodiment can be implemented by the film ribbon processing apparatus in the third embodiment described above. As shown in fig. 7, the solder strip processing method of the present embodiment includes the following steps:
s201, drawing out a plurality of parallel welding strips.
S202, the film strip to be attached is sent to the first side of the welding strip along the traction direction of the welding strip.
And S203, cutting the film strip to be attached into a plurality of film strip sections with preset lengths.
And S205, attaching a plurality of film strip sections to the first side surface of the welding strip.
Similarly, the following steps are also included between step S203 and step S205:
and S204, carrying out separation treatment on the plurality of film belt sections.
The invention finally provides a series welding machine, which comprises the film strip processing device, the welding strip splitting mechanism, the welding strip stacking device, the battery piece stacking device, the conveying device and the series connection device in any embodiment, wherein: the film strip processing device is used for providing the welding strip attached with the film strip section for the welding strip splitting mechanism, and the welding strip splitting mechanism is used for splitting the welding strip into welding strip assemblies; the battery plate stacking device and the welding strip stacking device are configured to stack the battery plate and the welding strip assembly onto the conveying device according to a preset stacking rule; the conveying device is used for conveying the stacked welding strip assemblies to the serial connection device; the series connection device is used for pressing the stacked battery plates and the welding strip assembly together to form a battery string. Through the matching of the film strip processing device, the welding strip splitting mechanism, the welding strip stacking device, the battery piece stacking device, the conveying device and the serial connection device, the series welding machine provided by the invention realizes the compression connection and stringing of the battery pieces.
The invention has been described above with a certain degree of particularity. It will be understood by those of ordinary skill in the art that the description of the embodiments is merely exemplary and that all changes that come within the true spirit and scope of the invention are desired to be protected. The scope of the invention is defined by the claims set forth below, rather than the foregoing description of the embodiments.
Claims (11)
1. The utility model provides a membrane area processing apparatus, its characterized in that, membrane area processing apparatus is including welding area drive mechanism, membrane area feeding mechanism, pad pasting mechanism, wherein:
the welding strip traction mechanism is configured to pull out a plurality of parallel welding strips so that the welding strips pass through the film strip processing station;
the film strip feeding mechanism is configured to feed a film strip to be attached to the film strip processing station along the traction direction of the welding strip;
the film sticking mechanism is used for cutting the film strip to be stuck at the film strip processing station into a plurality of film strip sections with preset lengths and sticking the film strip sections to the first side surface of the welding strip at the film strip processing station; or attaching a plurality of film strip sections to a first side surface of a welding strip at the film strip processing station and a second side surface opposite to the first side surface at intervals.
2. The film strip processing apparatus of claim 1, wherein the film sticking mechanism comprises an adsorption part and a slitting part, wherein:
the adsorption part is used for adsorbing the film belt to be attached;
the cutting part is used for cutting the film strip into a plurality of film strip sections;
the adsorption part is also used for attaching the film strip sections to the welding strips.
3. The film strip processing apparatus according to claim 2, wherein the suction portion includes a plurality of suction modules arranged in a drawing direction of the solder strip;
the cutting part is used for cutting the film strip to be attached into a plurality of film strip sections, each film strip section is adsorbed on the adsorption component, and each adsorption component is used for respectively attaching the film strip section to the welding strip.
4. The membrane tape processing apparatus of claim 3 wherein, in a plurality of the adsorption modules:
all the odd-numbered adsorption assemblies attach the adsorbed film strip sections to the first side surface of the welding strip, and all the even-numbered adsorption assemblies attach the adsorbed film strip sections to the second side surface of the welding strip;
or,
all the even-numbered adsorption assemblies attach the adsorbed film strip sections to the first side surface of the welding strip, and all the odd-numbered adsorption assemblies attach the adsorbed film strip sections to the second side surface of the welding strip.
5. The film strip processing apparatus of claim 4, wherein:
each even number of the adsorption assemblies is configured to be movable and turnable, and each even number of the adsorption assemblies is used for attaching the film strip section to the second side surface of the welding strip after turning the adsorbed film strip section by 180 degrees; or,
each odd number of the adsorption assemblies is configured to be movable and turnable, and each odd number of the adsorption assemblies is used for turning the adsorbed film tape section by 180 degrees and then attaching the film tape section to the second side surface of the solder tape.
6. The film strip handling device of claim 2, wherein the film application mechanism further comprises a spacing mechanism for performing spacing of a plurality of the film strip segments.
7. The film strip processing apparatus according to claim 1, wherein the film strip feeding mechanism and the film sticking mechanism are provided in two sets, and the two sets of the film strip feeding mechanisms correspond one-to-one to the two sets of the film sticking mechanisms, wherein:
the two groups of film sticking mechanisms are oppositely arranged, and one group of film sticking mechanisms is used for sticking a film strip to the first side of the welding strip; the other group of film sticking mechanisms are used for sticking the film strip to the second side of the welding strip;
the two groups of film strip feeding mechanisms are configured to respectively feed a group of film strips to be attached to the corresponding film strip processing stations.
8. A stringer comprising the film tape processing apparatus, the tape slitting mechanism, the tape stacking apparatus, the cell sheet stacking apparatus, the conveying apparatus, and the tandem apparatus according to any one of claims 1 to 7, wherein:
the film strip processing device is used for providing the welding strip attached with the film strip section to the welding strip splitting mechanism, and the welding strip splitting mechanism is used for splitting the welding strip into welding strip assemblies;
the battery plate stacking device and the welding strip stacking device are configured to stack the battery plate and the welding strip assembly onto the conveying device according to a preset stacking rule;
the conveying device is used for conveying the stacked welding strip assemblies to the serial connection device;
the series connection device is used for pressing the stacked battery plates and the welding strip assembly together to form a battery string.
9. A film tape processing method, characterized by comprising:
drawing out a plurality of parallel welding strips;
conveying a film strip to be attached to a first side of the welding strip along the traction direction of the welding strip;
cutting the film strip to be attached into a plurality of film strip sections with preset lengths;
attaching a plurality of the film strip sections to a first side surface of a solder strip; or,
and attaching a plurality of film strip sections to a first side surface of the welding strip and a second side surface opposite to the first side surface at intervals.
10. The film strip processing method of claim 9, further comprising: after the film strip to be attached is cut into a plurality of film strip sections with preset lengths,
and carrying out separation treatment on a plurality of membrane band sections.
11. The film strip processing method of claim 10, wherein said attaching a plurality of said film strip segments at intervals to a first side surface of a solder strip and a second side surface opposite said first side surface comprises:
attaching all odd film strip sections of the film strip sections to the first side surface of the welding strip, and attaching all even film strip sections of the film strip sections to the second side surface of the welding strip; or,
and attaching all even film strip sections in the film strip sections to the first side surface of the welding strip, and attaching all odd film strip sections in the film strip sections to the second side surface of the welding strip.
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| CN202211315358.4A CN115602759B (en) | 2022-10-26 | 2022-10-26 | A membrane tape processing device, processing method and string welding machine |
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| CN202211315358.4A CN115602759B (en) | 2022-10-26 | 2022-10-26 | A membrane tape processing device, processing method and string welding machine |
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| CN115602759B CN115602759B (en) | 2025-11-18 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114784145A (en) * | 2022-05-11 | 2022-07-22 | 无锡奥特维科技股份有限公司 | Weld and take processing apparatus |
| CN114843372A (en) * | 2022-06-02 | 2022-08-02 | 无锡奥特维科技股份有限公司 | Bus bar pad pasting mechanism and stitch welding machine |
| CN115036392A (en) * | 2022-06-28 | 2022-09-09 | 无锡奥特维科技股份有限公司 | Welding strip film pasting device, film pasting method and battery string production equipment |
| CN115224158A (en) * | 2022-06-30 | 2022-10-21 | 无锡奥特维科技股份有限公司 | A battery string sticking film device and film sticking method |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114784145A (en) * | 2022-05-11 | 2022-07-22 | 无锡奥特维科技股份有限公司 | Weld and take processing apparatus |
| CN114843372A (en) * | 2022-06-02 | 2022-08-02 | 无锡奥特维科技股份有限公司 | Bus bar pad pasting mechanism and stitch welding machine |
| CN115036392A (en) * | 2022-06-28 | 2022-09-09 | 无锡奥特维科技股份有限公司 | Welding strip film pasting device, film pasting method and battery string production equipment |
| CN115224158A (en) * | 2022-06-30 | 2022-10-21 | 无锡奥特维科技股份有限公司 | A battery string sticking film device and film sticking method |
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