CN115602582B - Automatic defective product removing device for chip detection - Google Patents
Automatic defective product removing device for chip detectionInfo
- Publication number
- CN115602582B CN115602582B CN202211382771.2A CN202211382771A CN115602582B CN 115602582 B CN115602582 B CN 115602582B CN 202211382771 A CN202211382771 A CN 202211382771A CN 115602582 B CN115602582 B CN 115602582B
- Authority
- CN
- China
- Prior art keywords
- chip
- air
- pipe
- suction
- movable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0611—Sorting devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/36—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
本发明公开了一种芯片检测用次品自动剔除装置，涉及芯片生产领域，包括驱动电机与转盘，转盘固定在驱动电机的输出端上，且转盘的外侧环绕四周有多组安装架，每组安装架的内部皆安装有芯片夹，且芯片夹的内部安装有芯片，所述驱动电机的一侧安装有支撑架。本发明在对芯片进行检测前，喷气管喷出的气流通过进气口喷入到安装架内，且沿着安装架内的导管进入到多租喷嘴内，通过喷嘴喷向芯片，对芯片外侧进行清理，且在清理过程中，气泵的负压也通过活动管、固定气管延伸至吸气机构内，吸气机构产生的负压对芯片上方的空气进行吸入，对吹起的杂质进行吸附收集，从而能够有效的减少杂质附着在芯片上，减少芯片受损。
This invention discloses an automatic defective chip rejection device for chip inspection, relating to the chip manufacturing field. It includes a drive motor and a turntable. The turntable is fixed to the output end of the drive motor, and multiple sets of mounting brackets surround the outer side of the turntable. Each mounting bracket houses a chip holder, and the chip holder contains a chip. A support frame is mounted on one side of the drive motor. Before chip inspection, airflow from a jet nozzle is injected into the mounting bracket through an air inlet and then enters multiple nozzles along a conduit within the mounting bracket. The airflow is sprayed onto the chip through the nozzles, cleaning the outer surface of the chip. During the cleaning process, the negative pressure of the air pump extends to the suction mechanism through a movable tube and a fixed air tube. The negative pressure generated by the suction mechanism draws in air above the chip, adsorbing and collecting any blown-up impurities, thereby effectively reducing impurities adhering to the chip and minimizing chip damage.
Description
Technical Field
The invention relates to the field of chip production, in particular to an automatic defective product removing device for chip detection.
Background
In electronics, a circuit (mainly including semiconductor devices and passive components) is miniaturized and is often manufactured on the surface of a semiconductor wafer, an integrated circuit chip is an electronic element including a silicon substrate, at least one circuit, a fixed seal ring, a ground ring and at least one protection ring, and after the integrated circuit chip is produced, a pipeline type detection device is generally used for detecting the electrical characteristics of the chip, and if the detection chip is found to be unqualified in the detection process, the unqualified chip needs to be removed by the device.
However, the existing removing devices generally remove chips by adopting a negative pressure adsorption mode, in the removing process, the negative pressure sucks the chips into a pipeline, and the chips penetrate through the pipeline to reach the collecting box under the action of the negative pressure, but the existing adsorption mode does not well protect the chips, the chips are easy to collide with the inner wall of the pipeline in the moving process of the pipeline, particularly the bent parts of the pipeline are easy to collide with the inner wall of the pipeline, secondary damage to the chips is easy to be caused, dust is easy to enter the device along with the chips in the adsorbing process of the chips, so that a large amount of impurities are attached to the outer sides of the chips, and the chips are damaged.
Disclosure of Invention
Based on the above, the invention aims to provide an automatic defective product removing device for chip detection, which is used for solving the technical problems that the chip is easy to collide with a pipeline in the chip discharging process and impurities enter the device along with the chip to damage the chip.
In order to achieve the above purpose, the automatic defective product removing device for chip detection comprises a driving motor and a turntable, wherein the turntable is fixed at the output end of the driving motor, a plurality of groups of installation racks are arranged around the outer side of the turntable, chip clamps are arranged in the installation racks, chips are arranged in the chip clamps, a support frame is arranged on one side of the driving motor, the top end of the support frame extends to the upper side of one group of chip clamps and is connected with a detection mechanism, a fixed air pipe communicated with the detection mechanism is arranged in the interior of the support frame, a suction nozzle is arranged at the bottom end of the detection mechanism and aligned with the chips, an air injection mechanism is arranged below the air suction mechanism and simultaneously positioned below the installation racks, the top end of the air injection mechanism is connected with an air injection pipe, the air injection pipe is aligned with the bottom end of the installation racks, air inlets are arranged at the bottom ends of the installation racks, two sides of the air inlets are connected with guide pipes, the guide pipes extend to the two sides of the chip clamps and are provided with nozzles, the bottom end of the air injection mechanism is provided with an air pump, the output end of the air pump faces upwards and is aligned with the air injection pipe, the inner side of the air injection mechanism is positioned above the output end and is connected with the air guide pipe, and the air pump is connected with the air guide mechanism.
Through adopting above-mentioned technical scheme, can conveniently carry out the assembly line to multiunit chip and detect the back and clear up the chip through jet mechanism and inhalation mechanism, clear up the impurity in the chip outside to absorb the impurity through inhalation mechanism, after detecting out the chip and go out the problem, can last to separating chip and chip clamp, remove the back at the mounting bracket, make the chip fall into the jet stack in, retrieve the chip, and under the effect of air current, the damage that receives when the piece chip whereabouts.
The invention further provides that the detection mechanism comprises an air cylinder and an air suction mechanism, the air suction mechanism is communicated with the fixed air pipe through a hose, the air cylinder is fixed at the top end of the support frame, the output end of the support frame is fixedly connected with the top end of the air suction mechanism, and the air suction mechanism is movably connected with the support frame.
Through adopting above-mentioned technical scheme, can remove the position of inhaling mechanism through the cylinder, in the removal in-process, make inhaling mechanism can conveniently adsorb the chip.
The invention is further arranged that the suction mechanism comprises a suction groove and a suction pipe, the suction nozzle is fixed at the bottom end of the suction pipe, the two sides of the suction pipe are provided with detection rods, the detection rods are communicated with external detection equipment, a filter screen is arranged above the suction pipe in the detection mechanism, and the filter screen is detachably connected with the suction mechanism.
Through adopting above-mentioned technical scheme, conveniently inhale the impurity of chip outside spun to the mechanism of breathing in to adsorb impurity through the filter screen.
The invention is further arranged that one side of the air injection mechanism is connected with the collecting box, the inner wall of the air injection mechanism is positioned above the air bag and is provided with the blanking groove, the air bag is obliquely arranged, the blanking groove is aligned with the lowest end of the air bag, and the blanking groove extends to the upper part of the collecting box.
Through adopting above-mentioned technical scheme, make things convenient for the chip to slide down on the gasbag and enter into the collection box in, collect the chip through the collection box.
The invention is further arranged that the shape of the chip clamp is matched with the shape of the chip, the outer side of the chip clamp is provided with the half-leakage net, the half-leakage net is aligned with the nozzle, and the shape of the nozzle is also matched with the shape of the chip clamp.
Through adopting above-mentioned technical scheme, conveniently fix spacing to different chips.
The movable air guide mechanism is further arranged to comprise a movable pipe and a movable rod, wherein the input end of the movable pipe is communicated with the input end of the air pump through a hose, one end of the movable pipe extends to the inside of the support frame and is aligned with the bottom end of the fixed air pipe, an air vent is formed in the position where the top end of the movable pipe is aligned with the fixed air pipe, the end of the movable pipe extends to the outer side of the support frame, the outer side of the movable rod extends to the outer side of the air injection mechanism, the movable rod is connected with a limiting seat in the air injection mechanism, a spring is sleeved on the outer side of the movable rod, and two ends of the spring are respectively fixed on the outer sides of the movable pipe and the limiting seat.
By adopting the technical scheme, the air flow of the fixed air pipe can be cut off through the movement of the movable air guide mechanism, so that the chip is separated from the air suction mechanism.
The invention is further characterized in that a connecting rod is arranged on the connecting arm between the turntable and the mounting frame, the connecting rod extends towards the opposite direction of the rotating direction of the turntable, the bottom end of the connecting rod is connected with a top plate, and the top plate is contacted with the movable rod and extrudes the movable rod.
Through adopting above-mentioned technical scheme, can leave the gas jet through the rotation of carousel at the mounting bracket, promote movable rod through the roof to the position of control activity air guide mechanism.
In summary, the invention has the following advantages:
1. According to the invention, after the chip is detected and found to be out of question, the chip is adsorbed through the suction nozzle, the chip falls off and falls into the air ejector after the mounting frame is far away from the air ejector, the chip is pushed under the action of the ejected air flow, the impact of the chip falling is reduced, the impact force of the chip falling can be effectively reduced by the air in the air bag after the chip falls on the air bag, the damage of the chip in the sucking process can be effectively reduced, and the problem that the chip is easy to collide with a pipeline in the discharging process is effectively solved.
2. According to the invention, before the chip is detected, the air flow sprayed by the air spraying pipe is sprayed into the mounting frame through the air inlet, enters the multi-lease nozzle along the guide pipe in the mounting frame, is sprayed to the chip through the nozzle to clean the outer side of the chip, and in the cleaning process, the negative pressure of the air pump is extended into the air suction mechanism through the movable pipe and the fixed air pipe, and the air above the chip is sucked by the negative pressure generated by the air suction mechanism, so that the blown-up impurities are adsorbed and collected, thereby effectively reducing the adhesion of the impurities to the chip, reducing the damage of the chip, and effectively solving the problem that the chip is damaged along with the entry of the impurities into the device.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic side sectional view of the present invention;
FIG. 3 is a schematic view of the partial structure of the portion A in FIG. 2 according to the present invention;
FIG. 4 is a schematic view of the internal structure of the suction mechanism of the present invention;
FIG. 5 is a schematic view of a suction nozzle structure according to the present invention;
FIG. 6 is a schematic view of the internal structure of the air injection mechanism according to the present invention;
FIG. 7 is a schematic view of a movable pipe installation structure according to the present invention;
FIG. 8 is a schematic view of the connection structure of the movable pipe and the fixed pipe according to the present invention;
FIG. 9 is a schematic view of a movable rod and a squeeze plate according to the present invention;
FIG. 10 is a schematic view of a connecting rod according to the present invention;
FIG. 11 is a schematic diagram of a chip clip according to the present invention;
FIG. 12 is a schematic view of a chip clip mounting structure of the present invention;
fig. 13 is a schematic sectional view of a partial structure of the mounting frame of the present invention.
The device comprises a driving motor, a feeding mechanism, a discharging mechanism, a rotary table, 401, a mounting frame, 402, an air inlet, 403, a guide pipe, 404, a nozzle, 5, a supporting frame, 6, a detection mechanism, 7, an air cylinder, 8, an air injection mechanism, 801, an air injection pipe, 802, a discharging groove, 9, a chip clamp, 901, a semi-leakage net, 10, a processing mechanism, 11, a connecting rod, 1101, a top plate, 12, a movable rod, 13, a collecting box, 14, an air suction mechanism, 1401, an air suction groove, 1402, an air suction pipe, 1403, a filter screen, 15, a suction nozzle, 1501, a slot, 16, a detection rod, 17, a fixed air pipe, 18, an air pump, 19, a movable pipe, 20, an air bag, 2001 and a leakage hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
Hereinafter, an embodiment of the present invention will be described in accordance with its entire structure.
The automatic defective product removing device for chip detection comprises a driving motor 1 and a rotary table 4, wherein the rotary table 4 is fixed at the output end of the driving motor 1, a plurality of groups of mounting frames 401 are arranged around the outer side of the rotary table 4, chip clamps 9 are arranged in the mounting frames 401 of each group, chips are arranged in the chip clamps 9, a feeding mechanism 2, a discharging mechanism 3 and a processing mechanism 10 are sequentially arranged around the outer side of the rotary table 4, each group of chips are moved onto the mounting frames 401 of the rotary table 4 from a conveyor belt through the feeding mechanism 2, after the chips are aligned with the chip clamps 9, the chips are arranged in the chip clamps 9, then the driving motor 1 is started, the output end of the driving motor 1 drives the rotary table 4 to rotate, the rotary table 4 drives the outer groups of the mounting frames 401 to rotate, and the mounting frames 401 drive the chips to enter the processing mechanism 10 for processing;
A support frame 5 is arranged on one side of the driving motor 1, a detection mechanism 6 is connected above a group of chip clamps 9 extending from the top end of the support frame 5, the detection mechanism 6 comprises an air cylinder 7 and an air suction mechanism 14, the air suction mechanism 14 is communicated with a fixed air pipe 17 through a hose, the air cylinder 7 is fixed on the top end of the support frame 5, the output end of the support frame 5 is fixedly connected with the top end of the air suction mechanism 14, the air suction mechanism 14 is movably connected with the support frame 5, the air suction mechanism 14 comprises an air suction groove 1401 and a suction pipe 1402, a suction nozzle 15 is fixed on the bottom end of the suction pipe 1402, detection rods 16 are arranged on two sides of the suction pipe 1402, the detection rods 16 are communicated with external detection equipment, a filter screen 1403 is arranged in the air suction mechanism 14 above the suction pipe 1402, the filter screen 1403 is detachably connected with the air suction mechanism 14, a fixed air pipe 17 communicated with the detection mechanism 6 is arranged in the support frame 5, the bottom end of the detection mechanism 6 is provided with a suction nozzle 15, the suction nozzle 15 is aligned with the chip, the suction mechanism 8 is arranged below the suction mechanism 14 and is positioned below the mounting frame 401 at the same time, the top end of the air injection mechanism 8 is connected with an air injection pipe 801, the air injection pipe 801 is aligned with the bottom end of the mounting frame 401, the bottom end of the mounting frame 401 is provided with an air inlet 402, two sides of the air inlet 402 are connected with a conduit 403, the conduit 403 extends to two sides of the chip clamp 9 and is provided with a nozzle 404, the bottom end of the air injection mechanism 8 is provided with an air pump 18, the output end of the air pump 18 faces upwards and is aligned with the air injection pipe 801, the chip is driven to the lower part of the detection mechanism 6, at the moment, the suction mechanism 14 is positioned right above the chip, the bottom end of the mounting frame 401 is attached to the air injection pipe of the air injection mechanism 8, air flow sprayed by the air injection pipe 801 enters the mounting frame 401 to clean attached impurities outside the chip, the impurity is blown up, and at the same time, the input end of the air pump 18 is communicated with the movable pipe 19 through a hose, the negative pressure generated by the air pump 18 can extend into the fixed air pipe 17 through the movable pipe 19, the fixed air pipe 17 is communicated with the air suction mechanism 14 through the hose, the negative pressure enters the air suction mechanism 14 and then sucks the external air through the suction pipe 1402, at the moment, the impurity blown up by the chip can be adsorbed, the impurity enters the air suction mechanism 14 and the sucked impurity is adsorbed through the filter screen 1403, so that the impurity outside the chip can be effectively cleaned, the cleanliness of the chip is ensured, the damage to the chip is reduced, after the cleaning is finished, the air suction mechanism 14 is pushed to move downwards through the air cylinder 7, the suction nozzle 15 is attached to the chip, the chip is attached to the suction nozzle 15, the open slot 1501 continues to suck the external air into the air suction mechanism 14, then the chip is detected through the detection rod 16, after the detection is finished, the chip is sent into the chip holder 9 again, and if the detection is problematic, the chip is continuously adsorbed;
The input end of the air pump 18 is connected with a movable air guide mechanism, the movable air guide mechanism comprises a movable pipe 19 and a movable rod 12, the movable pipe 19 is communicated with the input end of the air pump 18 through a hose, one end of the movable pipe 19 extends to the inside of the support frame 5 and is aligned with the bottom end of the fixed air pipe 17, an air vent is arranged at the position where the top end of the movable pipe 19 is aligned with the fixed air pipe 17, the end of the movable pipe 19 extends to the outside of the support frame 5, the outside of the movable rod 12 extends to the outside of the air injection mechanism 8, the movable rod 12 is positioned in the air injection mechanism 8 and is connected with a limit seat, the outside of the movable rod 12 is sleeved with a spring, the two ends of the spring are respectively fixed on the outside of the movable pipe 19 and the limit seat, a connecting rod 11 is arranged on a connecting arm between the turntable 4 and the mounting frame 401, the connecting rod 11 extends towards the reverse direction of the turntable 4, and the bottom end of the connecting rod 11 is connected with a top plate 1101, the top plate 1101 contacts with the movable rod 12 and presses the movable rod 12, the driving motor 1 is started, the driving motor 1 drives the chip clamp 9 without chips and the mounting frame 401 to move out from the lower part of the detection mechanism 6, so that the chips are aligned with the air ejector tube 801, the connecting rod 11 arranged on the outer side of the turntable 4 moves to the outer side of the air ejector mechanism 8, the top plate 1101 is attached to the movable rod 12 and presses the movable rod 12 to be inserted into the air ejector mechanism 8, the movable rod 12 drives the movable tube 19 to move, the end part of the movable tube 19 is pushed out of the support frame 5, the fixed air tube 17 is disconnected with the movable tube 19, negative pressure is not provided in the box fixed air tube 17, the connection between the movable tube 19 and the fixed air tube 17 moves to the outer side of the support frame 5, the external air is sucked, the air pump 18 is prevented from being stopped, the negative pressure is not arranged in the air suction mechanism 14, the chips are not adsorbed on the suction nozzle 15, falls into the gas lance 801 under the force of gravity;
the inside of jet mechanism 8 is located air pump 18 output top and is connected with gasbag 20, multiunit leak hole 2001 has been seted up to the inner wall of gasbag 20, one side of jet mechanism 8 is connected with collection box 13, the unloading groove 802 has been seted up to the inner wall of jet mechanism 8 in the top of gasbag 20, gasbag 20 slope setting, unloading groove 802 aligns with the extreme of gasbag 20, and unloading groove 802 extends to the top of collection box 13, the air current of spun in the jet pipe 801 can support the chip, reduce the impact when the chip falls down, when chip and gasbag 20 contact, the impact of chip unloading also can effectually be reduced to the gas in the gasbag 20, effectually protect the chip, avoid causing chip secondary damage at chip unloading in-process, the chip that falls on gasbag 20 can slide along gasbag 20 and enter into collection box 13 through unloading groove 802.
Referring to fig. 1 and 3, the shape of the chip holder 9 is matched with the chip shape, a half-mesh 901 is arranged on the outer side of the chip holder 9, the half-mesh 901 is aligned with the nozzle 404, and the shape of the nozzle 404 is also matched with the chip holder 9, so that different chips can be clamped and fixed.
The working principle of the invention is as follows: when detecting chips, each group of chips is firstly moved onto the mounting frame 401 of the rotary table 4 from the conveyor belt through the feeding mechanism 2, after the chips are aligned with the chip clamps 9, the chips are installed into the chip clamps 9, then the driving motor 1 is started, the output end of the driving motor 1 drives the rotary table 4 to rotate, the rotary table 4 drives the plurality of groups of mounting frames 401 outside to rotate, the mounting frames 401 drive the chips to enter the processing mechanism 10 for processing until the chips are driven to the lower part of the detecting mechanism 6, the air suction mechanism 14 is positioned right above the chips, the bottom ends of the mounting frames 401 are attached to the air injection pipes of the air injection mechanism 8, the air inlets 402 are aligned with the air injection pipes 801, the air pumps 18 are started at the moment, the output ends of the air pumps 18 firstly send air flows into the air bags 20, the air flows expand the air bags 20 and then pass through the leak holes 2001 to enter the air injection pipes 801, the air flow enters the air inlet 402 along the air spraying pipe 801, the nozzles 404 positioned at the two sides of the chip clamp 9 are electrically conductive through the guide pipe 403, the air flow blows air to the outer side of the chip through the semi-leakage net 901, the attached impurities on the outer side of the chip are cleaned, the impurities are blown up, and meanwhile, the input end of the air pump 18 is communicated with the movable pipe 19 through a hose, the negative pressure generated by the air pump 18 can extend into the fixed air pipe 17 through the movable pipe 19, the fixed air pipe 17 is communicated with the air suction mechanism 14 through the hose, the negative pressure is sucked into the air suction mechanism 14 through the suction pipe 1402, at the moment, the impurities blown up by the chip can be adsorbed, the impurities enter the air suction mechanism 14, the sucked impurities are adsorbed through the filter screen 1403, so that the impurities on the outer side of the chip can be effectively cleaned, the cleanliness of the chip is ensured, the damage to the chip is reduced;
Then, the air cylinder 7 is started to push the air suction mechanism 14 to move downwards so as to enable the suction nozzle 15 to be close to the chip, the chip is sucked by pushing air flows at two sides and negative pressure in the suction pipe 1402, so that the chip is adsorbed on the outer side of the suction nozzle 15, the air cylinder 7 is started to drive the air suction mechanism 14 to move upwards, so that the chip is extracted from the chip clamp 9, and the chip is electrically detected through the detection rods 16 at two sides of the suction nozzle 15, so that the chip can be conveniently taken out, blockage is avoided, and the use efficiency is improved;
After the chip detection is finished, if the chip has no problem, the starting cylinder 7 pushes the chip to return to the chip clamp 9, the air pump 18 is closed, the suction nozzle 15 does not adsorb the chip, and then the driving motor 1 is started to drive the next group of chips to reach the lower part of the detection mechanism 6; if a chip is detected to be in a problem, when the chip is adsorbed on the outer side of the suction nozzle 15, the driving motor 1 is directly started, the driving motor 1 drives the chip clamp 9 without the chip and the mounting frame 401 to move out from the lower side of the detection mechanism 6, so that the chip is aligned with the air injection tube 801, the connecting rod 11 arranged on the outer side of the turntable 4 moves to the outer side of the air injection mechanism 8, the top plate 1101 is attached to the movable rod 12 and extrudes the movable rod 12 to be inserted into the air injection mechanism 8, the movable rod 12 drives the movable tube 19 to move, the end part of the movable tube 19 is pushed out of the supporting frame 5, the fixed air tube 17 is disconnected with the movable tube 19, negative pressure is not provided in the box fixed air tube 17, the connection of the movable tube 19 and the fixed air tube 17 is moved to the outer side of the supporting frame 5, the outside air is sucked in, the air pump 18 is prevented from being stopped, the air pump 14 is not in the negative pressure at the moment, the chip is not adsorbed on the suction nozzle 15, the air injection tube 801 is supported by the action of gravity, the air injection tube 801, the impact when the chip falls down is reduced, the chip is effectively reduced, the air flow in the air injection tube 20 is contacted with the chip, the chip is also reduced, the end part of the chip is effectively blown down, the chip is pushed out of the air bag 20, the chip is effectively, the chip is prevented from falling down the supporting the air bag 20, the chip is effectively, the chip 802, the chip is effectively separated from the chip and the chip is recovered, the chip is separated by the air bag 20, and the chip is completely and the chip is recovered, and the chip is completely after the chip is separated by the chip, and the chip is separated by the air from the air through the top bag 20 and the air and the chip and is completely separated by the chip and is completely and after the chip and is recovered, the movable tube 19 returns to be communicated with the fixed air tube 17 again under the pulling of the spring, so that the subsequent chip can be conveniently detected.
Although embodiments of the invention have been shown and described, the detailed description is to be construed as exemplary only and is not limiting of the invention as the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples, and modifications, substitutions, variations, etc. may be made in the embodiments as desired by those skilled in the art without departing from the principles and spirit of the invention, provided that such modifications are within the scope of the appended claims.
Claims (7)
1. The utility model provides an automatic removing devices of defective products for chip detection, includes driving motor (1) and carousel (4), carousel (4) are fixed on the output of driving motor (1), and the outside of carousel (4) is encircleed all around has multiunit mounting bracket (401), chip clamp (9) are all installed to the inside of every group mounting bracket (401), and the internally mounted of chip clamp (9) has the chip, characterized in that supporting frame (5) are installed to one side of driving motor (1), and the top of supporting frame (5) extends to the top of a set of chip clamp (9) and is connected with detection mechanism (6), the internally mounted of supporting frame (5) has fixed trachea (17) with detection mechanism (6) switch-on, suction nozzle (15) have been seted up to the bottom of detection mechanism (6), suction nozzle (15) align with the chip, be located the below of detection mechanism (6) and be located the below of mounting bracket (401) simultaneously and be provided with jet-propelled mechanism (8), and the top of jet-propelled mechanism (8) is connected with jet-propelled pipe (801), jet-propelled pipe (801) are aligned with the bottom of 401) to the top of a set of chip clamp (9), the bottom of supporting frame (5) is installed to the fixed air pipe (17) that is connected with the air inlet (403) on both sides (403), the air pump (18) is installed to the bottom of air injection mechanism (8), the output of air pump (18) up and with jet stack (801) align, the inside of air injection mechanism (8) is located air pump (18) output top and is connected with gasbag (20), multiunit leak (2001) have been seted up to the inner wall of gasbag (20), the input of air pump (18) is connected with movable air guide mechanism, and the inside that movable air guide mechanism extends to support frame (5) is put through with fixed trachea (17) bottom.
2. The automatic defective product removing device for chip detection according to claim 1, wherein the detecting mechanism (6) comprises an air cylinder (7) and an air suction mechanism (14), the air suction mechanism (14) is communicated with a fixed air pipe (17) through a hose, the air cylinder (7) is fixed at the top end of the supporting frame (5), the output end of the supporting frame (5) is fixedly connected with the top end of the air suction mechanism (14), and the air suction mechanism (14) is movably connected with the supporting frame (5).
3. The automatic defective product removing device for chip detection according to claim 2, wherein the suction mechanism (14) comprises a suction groove (1401) and a suction pipe (1402), the suction nozzle (15) is fixed at the bottom end of the suction pipe (1402), the two sides of the suction pipe (1402) are provided with detection rods (16), the detection rods (16) are communicated with external detection equipment, a filter screen (1403) is arranged above the suction pipe (1402) in the suction mechanism (14), and the filter screen (1403) is detachably connected with the suction mechanism (14).
4. The automatic defective product removing device for chip detection according to claim 1, wherein a collecting box (13) is connected to one side of the air injection mechanism (8), a blanking groove (802) is formed in the inner wall of the air injection mechanism (8) above the air bag (20), the air bag (20) is obliquely arranged, the blanking groove (802) is aligned with the lowest end of the air bag (20), and the blanking groove (802) extends to the upper portion of the collecting box (13).
5. The automatic defective product removing device for chip inspection according to claim 1, wherein the shape of the chip holder (9) is matched with the shape of the chip, a half-mesh (901) is arranged on the outer side of the chip holder (9), the half-mesh (901) is aligned with the nozzle (404), and the shape of the nozzle (404) is matched with the shape of the chip holder (9).
6. The automatic defective product removing device for chip detection according to claim 1, wherein the movable air guide mechanism comprises a movable pipe (19) and a movable rod (12), the movable pipe (19) is communicated with the input end of the air pump (18) through a hose, one end of the movable pipe (19) extends to the inside of the supporting frame (5) and is aligned with the bottom end of the fixed air pipe (17), an air vent is formed in the position where the top end of the movable pipe (19) is aligned with the fixed air pipe (17), the end of the movable pipe (19) extends to the outside of the supporting frame (5), the outside of the movable rod (12) extends to the outside of the air injection mechanism (8), the movable rod (12) is connected with a limit seat, the outside of the movable rod (12) is sleeved with a spring, and two ends of the spring are respectively fixed on the outside of the movable pipe (19) and the limit seat.
7. The automatic defective product removing device for chip inspection according to claim 6, wherein a connecting rod (11) is mounted on a connecting arm between the turntable (4) and the mounting frame (401), the connecting rod (11) extends reversely to the rotating direction of the turntable (4), a top plate (1101) is connected to the bottom end of the connecting rod (11), and the top plate (1101) contacts with the movable rod (12) and presses the movable rod (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211382771.2A CN115602582B (en) | 2022-11-07 | 2022-11-07 | Automatic defective product removing device for chip detection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211382771.2A CN115602582B (en) | 2022-11-07 | 2022-11-07 | Automatic defective product removing device for chip detection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115602582A CN115602582A (en) | 2023-01-13 |
| CN115602582B true CN115602582B (en) | 2026-03-03 |
Family
ID=84852169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211382771.2A Active CN115602582B (en) | 2022-11-07 | 2022-11-07 | Automatic defective product removing device for chip detection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115602582B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116148640A (en) * | 2023-04-19 | 2023-05-23 | 深圳市华芯邦科技有限公司 | Integrated circuit test equipment |
| CN116544132B (en) * | 2023-07-07 | 2023-12-15 | 广东芯乐光光电科技有限公司 | Mini-LED patch detection equipment and detection method |
| WO2025222598A1 (en) * | 2024-04-26 | 2025-10-30 | 苏州联讯仪器股份有限公司 | Chip feeding apparatus and chip testing system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110575996A (en) * | 2019-08-08 | 2019-12-17 | 武汉华星光电半导体显示技术有限公司 | A substrate cleaning device |
| CN112285104A (en) * | 2020-09-21 | 2021-01-29 | 深圳市环测威检测技术有限公司 | Electronic product chip detection device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003158048A (en) * | 2001-11-20 | 2003-05-30 | Sony Corp | Dust cleaning equipment for semiconductor devices |
| JP4093910B2 (en) * | 2003-05-15 | 2008-06-04 | Ｊｕｋｉ株式会社 | Electronic component holding device |
| KR102488826B1 (en) * | 2021-04-09 | 2023-01-17 | 양해춘 | Pick and place systems with hybrid ejector |
| CN113522764B (en) * | 2021-09-16 | 2021-12-17 | 深圳市汇图技术有限公司 | Lithium battery pole piece coating distribution detection equipment |
| CN113964058B (en) * | 2021-09-28 | 2024-10-15 | 蓝芯存储技术(赣州)有限公司 | A defective automatic rejection device for chip detection |
-
2022
- 2022-11-07 CN CN202211382771.2A patent/CN115602582B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110575996A (en) * | 2019-08-08 | 2019-12-17 | 武汉华星光电半导体显示技术有限公司 | A substrate cleaning device |
| CN112285104A (en) * | 2020-09-21 | 2021-01-29 | 深圳市环测威检测技术有限公司 | Electronic product chip detection device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115602582A (en) | 2023-01-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN115602582B (en) | Automatic defective product removing device for chip detection | |
| WO2011091650A1 (en) | Laser marking dust-removal device and dust-removal method | |
| CN109226080B (en) | Cleaning machine | |
| CN116884880B (en) | A large-scale chip packaging equipment and method for improving yield | |
| CN115921419A (en) | Production of corrugated metal pipe is with wasing dry integration equipment | |
| CN102548673A (en) | Cleaning nozzle and dust removal device equipped with same | |
| CN110197813A (en) | A kind of dedusting cake core pick device with suction nozzle replacing function | |
| KR101489373B1 (en) | Cleaning apparatus for test handler | |
| CN215696397U (en) | Integrated circuit detection equipment with hierarchical clearance mechanism | |
| CN222249138U (en) | A vacuum feeder for erbium oxide processing | |
| CN111785661A (en) | Air blowing device for semiconductor packaging equipment | |
| CN108435704A (en) | A kind of dedusting mechanism removed and collect motor surface attachment paint bits | |
| CN219800783U (en) | Film uncovering device for reducing wafer damage | |
| CN119819641A (en) | Fpc cleaning equipment and operation method thereof | |
| CN111717638B (en) | Automatic feeding device with cleaning function | |
| CN222470030U (en) | Circuit board surface cleaning equipment | |
| CN218200641U (en) | Lead frame handling device that can remove dust | |
| CN115026046A (en) | Spray-washing type cleaning machine for monocrystalline silicon wafer production based on Bernoulli principle technology | |
| CN223916147U (en) | A dust removal device suitable for the packaging industry | |
| CN222402601U (en) | Blowing dust removing device for semiconductor packaging process | |
| CN220641483U (en) | Article sorting and conveying device | |
| CN118893049B (en) | Purging, adsorbing and cleaning mechanism | |
| CN217700452U (en) | A release film dust removal device | |
| CN223236342U (en) | Stamping workpiece manipulator grabbing device | |
| CN111330914A (en) | Inverted air washing cleaner |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |