CN115562439A - Refrigerating device and blade server with same - Google Patents

Abstract

The invention belongs to the technical field of integrated circuit chip heat dissipation, and particularly relates to a refrigerating device and a blade server with the same. The blade server with the refrigerating device comprises the thermoelectric refrigerating device, a cooler, a thermoelectric radiator, a chip radiator and an axial flow fan. The method comprises the steps of firstly cooling air which just enters a blade server by using a thermoelectric refrigerating device, simultaneously refrigerating the air in a blade server case, carrying out heat exchange cooling on the cold air and a chip radiator in the blade server, and then rapidly discharging CPU heat absorbed by the chip radiator to the outside of the blade server case by using forced convection, so that the heat dissipation efficiency of the blade server can be greatly improved under the condition of reducing the rotating speed and noise of a fan, and the problem of aerodynamic noise and rotational noise generated by the existing heat dissipation device using a high-power and high-rotating-speed powerful axial flow fan can be solved.

Description

Cooling device and blade server with cooling device

technical field

The invention belongs to the technical field of integrated circuit chip heat dissipation, and in particular relates to a cooling device and a blade server with the cooling device.

Background technique

A blade server refers to a server unit that can be plugged with multiple card types in a rack-mounted chassis of a standard height. It is a low-cost server platform that achieves high availability and high density. It is currently widely used in large cloud computing data centers and high-end Construction of performance computing clusters. Due to the high-performance and high-integration design of the blade server, its advantage is that it minimizes the physical space occupied, but the disadvantage is that it greatly increases the power density and generates a lot of heat during operation. Therefore, the blade server The heat dissipation performance becomes the key factor to determine the stability of the system operation.

The blade server is limited by the physical space. The heat sink of the CPU chip cannot be too large, and the fan for forced air flow cannot be installed on the heat sink. The heat dissipation problem is extremely serious. The structure of the existing cooling device is shown in Fig. 1, which can only adopt the design of air inlet from the front panel and air outlet from the back panel, and the heat generated by the CPU chip can be taken away by air convection. Due to the large number of electronic components in the blade server, the internal air duct structure is complex, the fluid resistance is large, and there is a cascade heating effect, resulting in poor heat dissipation. In order to take away the heat generated by the internal electronic components in time, the air flow in and out of the blade server chassis must be very large, so a powerful axial flow fan with high power and high speed has to be used, because the motor in the axial flow fan occupies the center of the air duct. The large area creates a large turbulent flow area, making the aerodynamic noise and rotational noise of the high-speed axial flow fan the main source of blade server noise.

Contents of the invention

The object of the present invention is to provide a cooling device and a blade server with the cooling device, and to improve the structure of the heat dissipation device of the existing blade server so as to make the blade server more efficient in cooling.

In the first aspect of the present invention, a refrigeration device is proposed, including a thermoelectric radiator, a thermoelectric refrigeration device, and a cooler; the cold surface of the thermoelectric refrigeration device is connected to the cooler, and the cooler is placed in an environment to be refrigerated. The hot surface of the thermoelectric cooling device is connected with the thermoelectric radiator, and the thermoelectric radiator is placed in the air.

The second aspect of the present invention proposes a blade server with a cooling device, including a chip radiator, an axial fan, and a cooling device, and the cooling device is composed of a thermoelectric radiator, a thermoelectric cooling device and A cooler, the cooler is placed in the blade server to be cooled, the bottom of the cooler is relatively fixed to the bottom of the blade server chassis; the cold surface of the thermoelectric cooling device is connected to the cooler, and the thermoelectric cooling device wears Through the chassis side wall of the blade server chassis, the hot surface of the thermoelectric cooling device is connected to the thermoelectric radiator, and the thermoelectric radiator is placed in the air.

The cooling device proposed by the present invention and the blade server with cooling device thereof have the advantages of:

The blade server of the present invention is equipped with a refrigeration device, utilizes the thermoelectric refrigeration device and the cooler in the refrigeration device to cool the air that has just entered the blade server, and refrigerates the air in the blade server chassis. The inside of the blade server is cooled by heat exchange with the chip radiator, and forced air convection is generated under the action of the axial flow fan, which quickly transfers the CPU heat absorbed by the chip radiator to the outside of the blade server chassis, which can reduce fan speed and noise. , greatly improving the cooling efficiency of the blade server.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings that are required for the description of the embodiments or the prior art. Apparently, the drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other drawings according to these drawings without creative efforts.

Fig. 1 is a structural front view of an existing blade server.

Fig. 2 is a schematic structural diagram of a blade server with a cooling device proposed by an embodiment of the present invention.

Fig. 3 is a schematic diagram of the aluminum alloy heat dissipation profiles used in the chip radiator, thermoelectric radiator and cooler in the blade server according to an embodiment of the present invention.

In Fig. 1 and Fig. 2, 1 is a CPU chip, 2 is a chip radiator, 3 is an axial fan, 4 is a blade server chassis, 5 is a cooler, 6 is a thermoelectric cooling device, and 7 is a thermoelectric radiator.

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

FIG. 2 shows a cooling device proposed by an embodiment of the present invention. As shown in FIG. 2 , the cooling device is composed of a thermoelectric radiator 7 , a thermoelectric cooling device 6 and a cooler 5 . The cold surface of the thermoelectric refrigeration device 6 is connected to the cooler 5 through thermal silica gel, and the cooler 5 is placed in an environment to be refrigerated. The hot surface of the thermoelectric refrigeration device 6 is connected to the thermoelectric radiator 7 through thermal silica gel, and the thermoelectric radiator 7 is placed in the air.

An embodiment of the present invention proposes a blade server with a cooling device, as shown in FIG. 2 .

FIG. 2 shows that after removing the top case cover of the blade server with cooling devices, the blade server is viewed from the top, so FIG. 2 is an internal top view of the blade server.

As shown in Figure 2, comprise chip radiator 2, axial flow fan 3, it is characterized in that also comprising a refrigeration device, described refrigeration device is made of thermoelectric radiator 7, thermoelectric cooling device 6 and cooler 5, described cooling The cooler 5 is placed in the blade server to be cooled, and the bottom of the cooler 5 is relatively fixed to the bottom of the blade server chassis 4 by screws; the cold surface of the thermoelectric cooling device 6 is connected to the cooler 5 through a heat-conducting silica gel. The thermoelectric cooling device 6 passes through the side wall of the blade server chassis 4, and the hot surface of the thermoelectric cooling device 6 is connected to the thermoelectric radiator 7 through thermal conductive silica gel, and the thermoelectric radiator 7 is placed in the air. The chip heat sink 2 is bonded on the CPU chip 1 through heat-conducting silica gel, and the axial flow fan 3 is fixed on the air outlet on the side wall of the chassis of the blade server 4 through screws.

As shown in FIG. 2 for a blade server with a cooling device, the chip radiator 2 is used to absorb the heat generated by the CPU chip 1, and the fins of the chip radiator 2 dissipate the heat to the surrounding air. The axial flow fan 3 is used to generate forced air convection in the blade server chassis 4, so that cold air enters from the air inlet on one side of the chassis wall, and the hot air after absorbing the heat of the CPU passes through the air outlet on the other side of the chassis wall. Passed to the outside of blade server chassis 4.

Among the cooling devices, the thermoelectric cooling device 6 is used for cooling the cooler 5, and the cooler 5 is used for cooling the air just entering the blade server and cooling the air in the blade server chassis. The thermoelectric radiator 7 is used to dissipate the heat generated by the hot surface of the thermoelectric cooling device 6 into the surrounding air.

In one embodiment of the blade server proposed by the present invention, the chip radiator 2, the thermoelectric radiator 7 and the cooler 5 all adopt aluminum alloy heat dissipation profiles as shown in Figure 3, and the axial flow fan 3 adopts a 12V small axial flow DC centrifugal fan , the thermoelectric cooling device 6 adopts the semiconductor cooling sheet of the model TEC1-12715 produced by Suzhou Bingxue Electronics Co., Ltd.

The blade server with refrigeration device of the present invention, its working principle is:

When the blade server starts to work, the thermoelectric cooling device 6 quickly absorbs heat from the cooler 5 connected to the cold side through thermal silica gel under the action of voltage, forming a phenomenon of heat absorption on the cold side and heat release on the hot side. Cooler 5 cools the air that has just entered the blade server, and cools the air in the blade server cabinet. The heat generated by thermoelectric cooling device 6 passes through the fins of thermoelectric radiator 7 that is connected with thermal silica gel. The heat is dissipated into the ambient air. When the temperature of the CPU chip 1 gradually rises, the CPU chip 1 transfers heat to the cooling fins of the chip radiator 2, and the fins on the chip radiator 2 quickly exchange heat with the surrounding cold air, dissipating the heat to the surrounding air Among them, the axial flow fan 3 forms forced air convection, and quickly discharges the air absorbing the heat of the chip radiator 2 to the outside of the blade server chassis.

In the blade server with cooling device of the present invention, the thermoelectric cooling device is used to cool the air that has just entered the blade server, and at the same time, the air in the blade server chassis is cooled, and the cold air is used to cool the chip radiator inside the blade server. Heat exchange and cooling, and then use forced convection to quickly discharge the CPU heat absorbed by the chip radiator to the outside of the blade server chassis, which can greatly improve the heat dissipation efficiency of the blade server while reducing the fan speed and noise, and can solve the problem of existing cooling devices. Aerodynamic noise and rotational noise generated by powerful axial flow fans with high power and high speed.

Claims (2)

1. A refrigeration device, characterized in that, comprises a thermoelectric radiator, a thermoelectric refrigeration device and a cooler; the cold surface of the thermoelectric refrigeration device is connected with the cooler, and the cooler is placed in an environment to be cooled, and the The hot face is connected to a thermoelectric heat sink, which is placed in air. 2. a kind of blade server with refrigeration device as claimed in claim 1, comprises chip radiator, axial flow fan, is characterized in that, also comprises a refrigeration device, and described refrigeration device is made of thermoelectric radiator, thermoelectric A cooling device and a cooler, the cooler is placed in the blade server to be cooled, the bottom of the cooler is relatively fixed to the bottom of the blade server chassis; the cold surface of the thermoelectric cooling device is connected to the cooler, and the thermoelectric The cooling device passes through the side wall of the chassis of the blade server, and the hot surface of the thermoelectric cooling device is connected with the thermoelectric radiator, and the thermoelectric radiator is placed in the air.

Images