CN115534146A - An IC chip manufacturing process capable of reducing defective rate - Google Patents

An IC chip manufacturing process capable of reducing defective rate Download PDF

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CN115534146A
CN115534146A CN202211133474.4A CN202211133474A CN115534146A CN 115534146 A CN115534146 A CN 115534146A CN 202211133474 A CN202211133474 A CN 202211133474A CN 115534146 A CN115534146 A CN 115534146A
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transmission
gear
cavity
fixedly installed
absorption cavity
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CN115534146B (en
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赵德全
张涛涛
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Enpu Qianrui Electronic Technology Suzhou Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064Devices for the automatic drive or the program control of the machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

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Abstract

本发明涉及IC芯片制造领域,具体的说是一种可降低次品率的IC芯片制造工艺,包括支撑基座,所述支撑基座的顶端固定安装有调控移动装置,所述调控移动装置的内部底端固定安装有支撑传动机构,所述支撑传动机构的侧端固定安装有辅助收集装置,所述辅助收集装置包括接触尼龙软刷、第二齿轮、延伸支架、第一吸收腔体、转动尼龙刷、圆弧隔离板、接触橡胶条、螺旋叶片、第二吸收腔体、联通传输腔体、第三齿轮、第四齿轮和连接支撑轴,所述第一吸收腔体和第二吸收腔体分别固定安装在联通传输腔体的底部两端。通过支撑传动机构和辅助收集装置的设置,实现了可防止晶元盘在切割时碎屑飞溅的目的,降低了芯片在切割时的次品率。

Figure 202211133474

The invention relates to the field of IC chip manufacturing, in particular to an IC chip manufacturing process capable of reducing the rate of defective products, comprising a support base, the top of the support base is fixedly equipped with a regulating and moving device, and the regulating and moving device A support transmission mechanism is fixedly installed at the inner bottom, and an auxiliary collection device is fixedly installed at the side end of the support transmission mechanism, and the auxiliary collection device includes a soft nylon brush, a second gear, an extension bracket, a first absorption cavity, a rotating Nylon brushes, circular arc isolation plates, contact rubber strips, spiral blades, the second absorption cavity, the Unicom transmission cavity, the third gear, the fourth gear and connecting support shafts, the first absorption cavity and the second absorption cavity The bodies are respectively fixedly installed at both ends of the bottom of the Unicom transmission cavity. Through the setting of the supporting transmission mechanism and the auxiliary collecting device, the purpose of preventing debris from splashing when the wafer disk is cut is achieved, and the defective rate of chips during cutting is reduced.

Figure 202211133474

Description

一种可降低次品率的IC芯片制造工艺An IC chip manufacturing process capable of reducing defective rate

技术领域technical field

本发明涉及IC芯片制造领域,具体说是一种可降低次品率的IC芯片制造工艺。The invention relates to the field of IC chip manufacturing, in particular to an IC chip manufacturing process capable of reducing defective rate.

背景技术Background technique

IC芯片是一种微型电子器件或部件,采用一定的工艺,把一个电路中所需的晶体管、二极管、电阻、电容和电感等元件及布线互连一起,制作在一小块或几小块半导体晶片或介质基片上,然后封装在一个管壳内,成为具有所需电路功能的微型结构,现有的IC芯片在生产时,仍然存在一些问题,例如:IC chip is a kind of miniature electronic device or component. It adopts a certain process to interconnect the transistors, diodes, resistors, capacitors, inductors and other components and wiring required in a circuit, and make them in one or several small semiconductor chips. On a wafer or a dielectric substrate, and then packaged in a package, it becomes a microstructure with the required circuit functions. There are still some problems in the production of existing IC chips, such as:

现有的IC芯片切片装置在使用时,由于切割刀周围未设置有防溅装置,使得切割刀在对晶元切割时,碎屑会向四周飞溅,当碎屑从晶元上高速移动时,很可能会在晶元的其他待切割区域留下划痕,致使其他区域的晶元出现报废或磨损的现象,明显的提升了IC芯片的次品率,因此针对上述问题需要一种设备对其进行改进。When the existing IC chip slicing device is in use, since there is no anti-splash device around the dicing knife, when the dicing knife cuts the wafer, the debris will splash around. When the debris moves from the wafer at a high speed, It is likely to leave scratches on other areas of the wafer to be cut, causing the wafers in other areas to be scrapped or worn out, which significantly increases the defective rate of IC chips. Therefore, a device is needed to solve the above problems. Make improvements.

发明内容Contents of the invention

针对现有技术中的问题,本发明提供了一种可降低次品率的IC芯片制造工艺。Aiming at the problems in the prior art, the invention provides an IC chip manufacturing process which can reduce the defective rate.

本发明解决其技术问题所采用的技术方案是:一种可降低次品率的IC芯片制造工艺,包括支撑基座,所述支撑基座的顶端固定安装有调控移动装置,所述调控移动装置的内部底端固定安装有支撑传动机构,所述支撑传动机构的侧端固定安装有辅助收集装置,其特征在于:所述辅助收集装置包括接触尼龙软刷、第二齿轮、延伸支架、第一吸收腔体、转动尼龙刷、圆弧隔离板、接触橡胶条、螺旋叶片、第二吸收腔体、联通传输腔体、第三齿轮、第四齿轮和连接支撑轴,所述第一吸收腔体和第二吸收腔体分别固定安装在联通传输腔体的底部两端,所述圆弧隔离板固定安装在第一吸收腔体与第二吸收腔体之间,所述延伸支架分别固定安装在第一吸收腔体和第二吸收腔体的前侧顶端,所述第二齿轮转动安装在延伸支架相对的侧端上,所述接触尼龙软刷固定安装在第二齿轮相对的侧端上,所述接触橡胶条固定安装在第一吸收腔体和第二吸收腔体的底端,所述连接支撑轴转动安装在第一吸收腔体和第二吸收腔体的侧端中心,所述转动尼龙刷固定安装在连接支撑轴上,所述第四齿轮固定安装在连接支撑轴上,且所述第三齿轮啮合在第四齿轮的顶端,所述螺旋叶片转动贯穿第二吸收腔体固定安装在第三齿轮上。The technical solution adopted by the present invention to solve the technical problem is: an IC chip manufacturing process that can reduce the defective rate, including a support base, the top of the support base is fixedly equipped with a regulating and moving device, and the regulating and moving device The inner bottom end of the inner bottom is fixedly installed with a supporting transmission mechanism, and the side end of the supporting transmission mechanism is fixedly installed with an auxiliary collection device, which is characterized in that: the auxiliary collection device includes a contact nylon soft brush, a second gear, an extension bracket, a first Absorption cavity, rotating nylon brush, circular arc isolation plate, contact rubber strip, spiral blade, second absorption cavity, Unicom transmission cavity, third gear, fourth gear and connecting support shaft, the first absorption cavity and the second absorption cavity are respectively fixedly installed at both ends of the bottom of the Unicom transmission cavity, the arc isolation plate is fixedly installed between the first absorption cavity and the second absorption cavity, and the extension brackets are respectively fixed on The front top ends of the first absorption cavity and the second absorption cavity, the second gear is rotatably mounted on the opposite side end of the extension bracket, and the contact nylon soft brush is fixedly mounted on the opposite side end of the second gear, The contact rubber strip is fixedly installed on the bottom ends of the first absorption cavity and the second absorption cavity, and the connecting support shaft is rotatably installed at the center of the side ends of the first absorption cavity and the second absorption cavity. The nylon brush is fixedly installed on the connecting support shaft, the fourth gear is fixedly installed on the connecting support shaft, and the third gear is engaged with the top end of the fourth gear, and the spiral blade rotates through the second absorption cavity and is fixedly installed on third gear.

具体的,所述支撑传动机构包括接触导向装置和辅助收放装置,所述辅助收放装置固定安装在接触导向装置的顶端上。Specifically, the supporting transmission mechanism includes a contact guide device and an auxiliary retractable device, and the auxiliary retractable device is fixedly installed on the top end of the contact guide device.

具体的,所述接触导向装置包括移动接触导杆、连接侧板、支撑套管、限位弹簧、移动插板、导向传输腔体、第一齿轮、切割刀片、第一传动齿轮、传动齿带、第二传动齿轮和输出电机,所述支撑套管对称固定安装在连接侧板的前端底部,所述限位弹簧固定安装在支撑套管的内部顶端,所述移动插板滑动插接在支撑套管的内部底端,且所述移动接触导杆滑动贯穿连接侧板和支撑套管固定安装在移动插板上,所述导向传输腔体对称固定安装在移动插板的后侧,所述第一齿轮固定安装在切割刀片的两侧中心,所述切割刀片固定安装在输出电机上,所述输出电机固定安装在连接侧板靠近支撑套管的侧端上,所述第一传动齿轮固定安装在切割刀片靠近输出电机的外圈上,所述传动齿带啮合在第一传动齿轮的外圈上,所述第二传动齿轮啮合在传动齿带远离第一传动齿轮的内部一端。Specifically, the contact guide device includes a moving contact guide rod, a connecting side plate, a support sleeve, a limit spring, a moving plate, a guide transmission cavity, a first gear, a cutting blade, a first transmission gear, and a transmission tooth belt. , the second transmission gear and the output motor, the support sleeve is symmetrically and fixedly installed on the bottom of the front end of the connecting side plate, the limit spring is fixedly installed on the inner top of the support sleeve, and the moving plate is slidably inserted into the support The inner bottom end of the casing, and the moving contact guide rod slides through the connecting side plate and the supporting sleeve and is fixedly installed on the moving board, and the guide transmission cavity is symmetrically and fixedly installed on the rear side of the moving board. The first gear is fixedly mounted on the center of both sides of the cutting blade, the cutting blade is fixedly mounted on the output motor, and the output motor is fixedly mounted on the side end of the connecting side plate close to the support sleeve, and the first transmission gear is fixed Installed on the outer ring of the cutting blade close to the output motor, the transmission toothed belt is engaged with the outer ring of the first transmission gear, and the second transmission gear is engaged with the inner end of the transmission toothed belt away from the first transmission gear.

具体的,所述辅助收放装置包括蓄水槽、U型移动插杆、复位弹簧、封堵头、支撑连接架、传输管道、第一喷淋头、第二喷淋头和分向传输管,所述蓄水槽固定安装在支撑连接架的顶端,所述U型移动插杆滑动插接在蓄水槽的顶端中心,所述封堵头固定安装在U型移动插杆靠近支撑连接架的底端,所述复位弹簧固定安装在封堵头与蓄水槽之间,所述传输管道固定安装在蓄水槽和支撑连接架之间,所述第一喷淋头固定安装在传输管道远离支撑连接架的底端,所述分向传输管固定安装在传输管道背离第一喷淋头的侧端上,所述第二喷淋头固定安装在分向传输管的底端。Specifically, the auxiliary retractable device includes a water storage tank, a U-shaped movable plunger, a return spring, a plugging head, a supporting connecting frame, a transmission pipeline, a first spray head, a second spray head, and a divergent transmission pipe, The water storage tank is fixedly installed on the top of the support connecting frame, the U-shaped movable insertion rod is slidably inserted into the center of the top of the water storage tank, and the plugging head is fixedly installed on the bottom end of the U-shaped mobile insertion rod close to the support connection frame , the return spring is fixedly installed between the plugging head and the water storage tank, the transmission pipeline is fixedly installed between the water storage tank and the supporting connection frame, and the first sprinkler head is fixedly installed at the end of the transmission pipeline away from the support connection frame At the bottom end, the branching transmission pipe is fixedly installed on the side end of the transmission pipeline away from the first shower head, and the second shower head is fixedly installed on the bottom end of the branching transmission pipe.

具体的,所述连接侧板固定安装在调控移动装置的顶端内部,所述支撑连接架固定安装在连接侧板靠近移动接触导杆的顶端上,所述联通传输腔体背离螺旋叶片的侧端固定安装在连接侧板远离支撑套管的侧端顶部,所述第二齿轮与第一齿轮啮合,所述连接支撑轴固定安装在第二传动齿轮靠近切割刀片的侧端中心。Specifically, the connecting side plate is fixedly installed inside the top end of the regulating and moving device, the support connecting frame is fixedly installed on the top end of the connecting side plate close to the moving contact guide rod, and the side end of the Unicom transmission cavity is away from the helical blade The second gear is fixedly installed on the top of the side end of the connecting side plate away from the support sleeve, the second gear meshes with the first gear, and the connecting support shaft is fixedly installed on the center of the side end of the second transmission gear close to the cutting blade.

具体的,所述接触橡胶条的转动半径低于螺旋叶片的底端,所述联通传输腔体、第一吸收腔体和第二吸收腔体的内部均呈中空状态设置,且所述联通传输腔体、第一吸收腔体和第二吸收腔体互通,所述接触尼龙软刷的转动半径高于切割刀片的中心轴。Specifically, the radius of rotation of the contact rubber strip is lower than the bottom end of the helical blade, and the insides of the communicating transmission cavity, the first absorbing cavity and the second absorbing cavity are all set in a hollow state, and the communicating transmitting cavity The cavity, the first absorption cavity and the second absorption cavity communicate with each other, and the rotation radius of the contact nylon soft brush is higher than the central axis of the cutting blade.

具体的,所述导向传输腔体的底端与接触橡胶条的底端平齐,所述第二喷淋头的内部两侧开设有出水口,所述第一喷淋头的底端开设有出水口,所述第一喷淋头和第二喷淋头均匀切割刀片垂直对齐。Specifically, the bottom end of the guide transmission cavity is flush with the bottom end of the contact rubber strip, water outlets are provided on both sides of the interior of the second shower head, and water outlets are provided at the bottom end of the first shower head. The water outlet, the first spray head and the second spray head are evenly aligned vertically with the cutting blades.

具体的,所述移动接触导杆与U型移动插杆远离复位弹簧的一端底部垂直对齐,所述切割刀片与导向传输腔体间隔1厘米,且所述导向传输腔体的顶端呈20°斜坡设置,所述导向传输腔体远离支撑套管的一端与第一吸收腔体和第二吸收腔体的前端垂直平齐,所述接触尼龙软刷相对的侧端与切割刀片表面贴合。Specifically, the moving contact guide rod is vertically aligned with the bottom of one end of the U-shaped moving insertion rod away from the return spring, the cutting blade is separated from the guiding transmission cavity by 1 cm, and the top of the guiding transmission cavity is inclined at 20° It is set that the end of the guide transmission cavity away from the support sleeve is vertically flush with the front ends of the first absorption cavity and the second absorption cavity, and the opposite side end of the contact nylon soft brush is attached to the surface of the cutting blade.

一种可降低次品率的IC芯片制造装置,其制造工艺包括以下步骤:A kind of IC chip manufacturing device that can reduce defective rate, its manufacturing process comprises the following steps:

S1、先将晶元放在支撑基座的内部基座上,再将支撑传动机构整体与调控移动装置内部进行配对连接,再将调控移动装置启动,带动支撑传动机构移动,此时,可将输出电机启动,带动切割刀片转动,当调控移动装置内部进行进给工作时,即可带动切割刀片与晶元接触,可将需要的部分切除,当切割刀片下降时,导向传输腔体会提前与晶元接触,同时,通过限位弹簧的弹性,可允许导向传输腔体向上移动,使得可在切割刀片切割时进行碎屑防飞溅的工作,防止碎屑将其他区域的晶元磨损;S1. First place the wafer on the inner base of the support base, then pair and connect the entire support transmission mechanism with the inside of the control and movement device, and then start the control and movement device to drive the support and transmission mechanism to move. At this time, the The output motor starts to drive the cutting blade to rotate. When the internal feeding of the moving device is adjusted, the cutting blade can be driven to contact with the wafer, and the required part can be cut off. At the same time, through the elasticity of the limit spring, the guide transmission cavity can be allowed to move upwards, so that the debris can be prevented from splashing when the cutting blade is cutting, and the debris can be prevented from wearing down the wafers in other areas;

S2、之后,切割刀片在转动时,还可通过传动齿带、第一传动齿轮和第二传动齿轮传递动力至连接支撑轴上,致使连接支撑轴同时转动,当连接支撑轴在转动时可带动转动尼龙刷在第一吸收腔体和第二吸收腔体的内部底端转动,使得可将第一吸收腔体和第二吸收腔体内壁上的碎屑清除,防止碎屑在第一吸收腔体和第二吸收腔体的内部堆积,同时,连接支撑轴转动时,还可通过第四齿轮和第三齿轮带动螺旋叶片转动,使得螺旋叶片可在第二吸收腔体的内部转动,将碎屑向外界的引流设备传输碎屑,实现碎屑及时传导的工作。S2. After that, when the cutting blade is rotating, it can also transmit power to the connecting support shaft through the transmission toothed belt, the first transmission gear and the second transmission gear, so that the connection support shaft rotates at the same time, and when the connection support shaft rotates, it can drive The rotating nylon brush rotates at the inner bottom of the first absorption cavity and the second absorption cavity, so that the debris on the inner wall of the first absorption cavity and the second absorption cavity can be removed to prevent the debris from being trapped in the first absorption cavity. At the same time, when the connecting support shaft rotates, the fourth gear and the third gear can also drive the helical blade to rotate, so that the helical blade can rotate inside the second absorption chamber, and the crushed The debris is transmitted to the external drainage equipment to realize the timely transmission of debris.

本发明的有益效果:Beneficial effects of the present invention:

一,通过支撑传动机构的设置,可进行芯片的切割工作,通过支撑传动机构的内部固定安装有辅助对位装置,使得支撑传动机构在向下移动时,辅助对位装置会首先与晶元表面接触,通过辅助对位装置内部固定安装有隔离防护装置,使得可防止切割时出现碎屑飞溅的现象,降低碎屑将晶元磨损的概率,通过支撑传动机构的内部固定安装有触发装置,使得支撑传动机构与晶元接触时,可将支撑传动机构内部的传输引流装置启动,致使传输引流装置内部的冷却液会流动至与支撑传动机构内部的切割刀接触,防止切割刀出现温度过高的现象,提升切割刀的切割耐久性。1. Through the setting of the supporting transmission mechanism, the cutting work of the chip can be carried out. The auxiliary alignment device is fixedly installed inside the supporting transmission mechanism, so that when the supporting transmission mechanism moves downward, the auxiliary alignment device will first contact with the wafer surface Contact, the auxiliary alignment device is fixedly installed with an isolation protection device, so that it can prevent debris from splashing during cutting, and reduce the probability of debris wearing the wafer, and a trigger device is fixed inside the supporting transmission mechanism, so that When the support transmission mechanism is in contact with the wafer, the transmission and drainage device inside the support transmission mechanism can be activated, so that the coolant inside the transmission and drainage device will flow to contact with the cutting knife inside the support transmission mechanism, preventing the cutting knife from overheating Phenomenon, improve the cutting durability of the cutting knife.

二,通过辅助收集装置的设置,可进行碎屑的收集与传输工作,通过辅助收集装置的内部固定安装有自适应转动装置,使得支撑传动机构在切割时,可同时带动自适应转动装置转动,同时,通过自适应转动装置与支撑传动机构内部的切割刀贴合,使得可将切割刀上的碎屑扫除,通过辅助收集装置的内部固定安装有内部清洁装置,且内部清洁装置与支撑传动机构内部的传动装置匹配连接是,使得支撑传动机构在启动时,还可带动内部清洁装置在辅助收集装置的内部转动,使得可将辅助收集装置内部完成清洁的工作,同时,通过内部清洁装置与辅助收集装置内部的引流装置连接,使得内部清洁装置在启动时,可将引流装置同时启动,完成碎屑导流的工作。Second, through the setting of the auxiliary collection device, the collection and transmission of debris can be carried out. The self-adaptive rotating device is fixed and installed inside the auxiliary collecting device, so that the supporting transmission mechanism can drive the adaptive rotating device to rotate at the same time when cutting. At the same time, the self-adaptive rotating device fits the cutting knife inside the supporting transmission mechanism, so that the debris on the cutting knife can be swept away, and an internal cleaning device is fixedly installed inside the auxiliary collection device, and the internal cleaning device and the supporting transmission mechanism The matching connection of the internal transmission device is such that when the supporting transmission mechanism is started, it can also drive the internal cleaning device to rotate inside the auxiliary collection device, so that the cleaning work can be completed inside the auxiliary collection device. At the same time, through the internal cleaning device and the auxiliary collection device The drainage device inside the collection device is connected so that when the internal cleaning device is activated, the drainage device can be activated at the same time to complete the debris diversion work.

附图说明Description of drawings

下面结合附图和实施例对本发明进一步说明。The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

图1为本本发明的主体结构示意图;Fig. 1 is a schematic diagram of the main structure of the present invention;

图2为本发明的支撑传动机构结构示意图;Fig. 2 is a structural schematic diagram of a supporting transmission mechanism of the present invention;

图3为本发明的接触导向装置局部剖切结构示意图;Fig. 3 is a schematic diagram of a partially cut-away structure of the contact guide device of the present invention;

图4为本发明的接触导向装置侧端结构示意图;Fig. 4 is a schematic diagram of the structure of the side end of the contact guide device of the present invention;

图5为本发明的辅助收放装置剖切结构示意图;Fig. 5 is a schematic diagram of the cutaway structure of the auxiliary retractable device of the present invention;

图6为本发明的辅助收放装置结构示意图;Figure 6 is a schematic structural view of the auxiliary retractable device of the present invention;

图7为本发明的辅助收集装置结构示意图;Fig. 7 is a schematic structural view of the auxiliary collecting device of the present invention;

图8为本发明的辅助收集装置后端结构示意图。Fig. 8 is a schematic diagram of the structure of the rear end of the auxiliary collection device of the present invention.

图中:1-支撑传动机构、2-辅助收集装置、3-调控移动装置、4-支撑基座、11-接触导向装置、12-辅助收放装置、111-移动接触导杆、112-连接侧板、113-支撑套管、114-限位弹簧、115-移动插板、116-导向传输腔体、117-第一齿轮、118-切割刀片、119-第一传动齿轮、1110-传动齿带、1111-第二传动齿轮、1112-输出电机、121-蓄水槽、122-U型移动插杆、123-复位弹簧、124-封堵头、125-支撑连接架、126-传输管道、127-第一喷淋头、128-第二喷淋头、129-分向传输管、21-接触尼龙软刷、22-第二齿轮、23-延伸支架、24-第一吸收腔体、25-转动尼龙刷、26-圆弧隔离板、27-接触橡胶条、28-螺旋叶片、29-第二吸收腔体、210-联通传输腔体、211-第三齿轮、212-第四齿轮、213-连接支撑轴。In the figure: 1-support transmission mechanism, 2-auxiliary collection device, 3-regulation and movement device, 4-support base, 11-contact guide device, 12-auxiliary retractable device, 111-moving contact guide rod, 112-connection Side plate, 113-support sleeve, 114-limit spring, 115-moving plate, 116-guide transmission cavity, 117-first gear, 118-cutting blade, 119-first transmission gear, 1110-transmission gear Belt, 1111-second transmission gear, 1112-output motor, 121-reservoir, 122-U-shaped movable plunger, 123-return spring, 124-blocking head, 125-supporting connecting frame, 126-transmission pipe, 127 -First spray head, 128-Second spray head, 129-Different transmission pipe, 21-Contact nylon soft brush, 22-Second gear, 23-Extended bracket, 24-First absorption chamber, 25- Rotating nylon brush, 26-arc isolation plate, 27-contact rubber strip, 28-spiral blade, 29-second absorption cavity, 210-unicom transmission cavity, 211-third gear, 212-fourth gear, 213 -Connect the support shaft.

具体实施方式detailed description

为了使本发明实现的技术手段、创作特征、达成目的与功效易于明白了解,下面结合具体实施方式,进一步阐述本发明。In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

如图1-图8所示,本发明所述的一种可降低次品率的IC芯片制造工艺,包括支撑基座4,支撑基座4的顶端固定安装有调控移动装置3,调控移动装置3的内部底端固定安装有支撑传动机构1,支撑传动机构1的侧端固定安装有辅助收集装置2,其特征在于:辅助收集装置2包括接触尼龙软刷21、第二齿轮22、延伸支架23、第一吸收腔体24、转动尼龙刷25、圆弧隔离板26、接触橡胶条27、螺旋叶片28、第二吸收腔体29、联通传输腔体210、第三齿轮211、第四齿轮212和连接支撑轴213,第一吸收腔体24和第二吸收腔体29分别固定安装在联通传输腔体210的底部两端,圆弧隔离板26固定安装在第一吸收腔体24与第二吸收腔体29之间,延伸支架23分别固定安装在第一吸收腔体24和第二吸收腔体29的前侧顶端,第二齿轮22转动安装在延伸支架23相对的侧端上,接触尼龙软刷21固定安装在第二齿轮22相对的侧端上,接触橡胶条27固定安装在第一吸收腔体24和第二吸收腔体29的底端,连接支撑轴213转动安装在第一吸收腔体24和第二吸收腔体29的侧端中心,转动尼龙刷25固定安装在连接支撑轴213上,第四齿轮212固定安装在连接支撑轴213上,且第三齿轮211啮合在第四齿轮212的顶端,螺旋叶片28转动贯穿第二吸收腔体29固定安装在第三齿轮211上。As shown in Fig. 1-Fig. 8, a kind of IC chip manufacturing process that can reduce defective product rate described in the present invention, comprises support base 4, and the top of support base 4 is fixedly installed with control mobile device 3, and control mobile device The inner bottom end of 3 is fixedly installed with supporting transmission mechanism 1, and the side end of supporting transmission mechanism 1 is fixedly installed with auxiliary collection device 2, and it is characterized in that: auxiliary collection device 2 includes contact nylon soft brush 21, second gear 22, extension bracket 23. The first absorption cavity 24, the rotating nylon brush 25, the arc isolation plate 26, the contact rubber strip 27, the spiral blade 28, the second absorption cavity 29, the Unicom transmission cavity 210, the third gear 211, and the fourth gear 212 and connecting support shaft 213, the first absorption cavity 24 and the second absorption cavity 29 are respectively fixedly installed at both ends of the bottom of the Unicom transmission cavity 210, and the arc isolation plate 26 is fixedly installed between the first absorption cavity 24 and the second absorption cavity Between the two absorption chambers 29, the extension brackets 23 are respectively fixedly installed on the front top ends of the first absorption chamber 24 and the second absorption chamber 29, and the second gear 22 is rotatably installed on the opposite side ends of the extension brackets 23, contacting Nylon soft brush 21 is fixedly mounted on the opposite side end of the second gear 22, the contact rubber strip 27 is fixedly mounted on the bottom of the first absorption cavity 24 and the second absorption cavity 29, and the connecting support shaft 213 is rotatably mounted on the first At the center of the side ends of the absorption cavity 24 and the second absorption cavity 29, the rotating nylon brush 25 is fixedly mounted on the connection support shaft 213, the fourth gear 212 is fixedly mounted on the connection support shaft 213, and the third gear 211 meshes with the second At the top of the four gears 212 , the helical blade 28 rotates through the second absorption cavity 29 and is fixedly installed on the third gear 211 .

具体的,支撑传动机构1包括接触导向装置11和辅助收放装置12,辅助收放装置12固定安装在接触导向装置11的顶端上,通过外界的循环供给装置与辅助收放装置12内部互通,使得可将切割液循环添加至辅助收放装置12的内部。Specifically, the supporting transmission mechanism 1 includes a contact guide device 11 and an auxiliary retractable device 12, the auxiliary retractable device 12 is fixedly installed on the top of the contact guide device 11, and communicates with the auxiliary retractable device 12 through an external circulation supply device, This makes it possible to add cutting fluid to the interior of the auxiliary retracting device 12 in a circular manner.

具体的,接触导向装置11包括移动接触导杆111、连接侧板112、支撑套管113、限位弹簧114、移动插板115、导向传输腔体116、第一齿轮117、切割刀片118、第一传动齿轮119、传动齿带1110、第二传动齿轮1111和输出电机1112,支撑套管113对称固定安装在连接侧板112的前端底部,限位弹簧114固定安装在支撑套管113的内部顶端,移动插板115滑动插接在支撑套管113的内部底端,且移动接触导杆111滑动贯穿连接侧板112和支撑套管113固定安装在移动插板115上,导向传输腔体116对称固定安装在移动插板115的后侧,第一齿轮117固定安装在切割刀片118的两侧中心,切割刀片118固定安装在输出电机1112上,输出电机1112固定安装在连接侧板112靠近支撑套管113的侧端上,第一传动齿轮119固定安装在切割刀片118靠近输出电机1112的外圈上,传动齿带1110啮合在第一传动齿轮119的外圈上,第二传动齿轮1111啮合在传动齿带1110远离第一传动齿轮119的内部一端,通过移动插板115向下移动的极限距离不超过支撑套管113的内部,使得可防止导向传输腔体116出现移动脱落的现象。Specifically, the contact guide device 11 includes a moving contact guide rod 111, a connecting side plate 112, a support sleeve 113, a limit spring 114, a moving plate 115, a guide transmission cavity 116, a first gear 117, a cutting blade 118, a second A transmission gear 119, a transmission toothed belt 1110, a second transmission gear 1111 and an output motor 1112. The support sleeve 113 is symmetrically and fixedly installed on the bottom of the front end of the connecting side plate 112, and the limit spring 114 is fixedly installed on the inner top of the support sleeve 113. , the moving board 115 is slidably inserted into the inner bottom of the supporting sleeve 113, and the moving contact guide rod 111 slides through the connecting side plate 112 and the supporting sleeve 113 and is fixedly installed on the moving board 115, and the guiding transmission cavity 116 is symmetrical Fixedly installed on the rear side of the movable board 115, the first gear 117 is fixedly installed on the center of both sides of the cutting blade 118, the cutting blade 118 is fixedly installed on the output motor 1112, and the output motor 1112 is fixedly installed on the connecting side plate 112 close to the support sleeve On the side end of the pipe 113, the first transmission gear 119 is fixedly installed on the outer ring of the cutting blade 118 close to the output motor 1112, the transmission toothed belt 1110 is engaged on the outer ring of the first transmission gear 119, and the second transmission gear 1111 is engaged on the outer ring of the output motor 1112. The drive toothed belt 1110 is away from the inner end of the first drive gear 119, and the limit distance that the moving plate 115 can move downwards does not exceed the inside of the support sleeve 113, so that the guide transmission cavity 116 can be prevented from moving and falling off.

具体的,辅助收放装置12包括蓄水槽121、U型移动插杆122、复位弹簧123、封堵头124、支撑连接架125、传输管道126、第一喷淋头127、第二喷淋头128和分向传输管129,蓄水槽121固定安装在支撑连接架125的顶端,U型移动插杆122滑动插接在蓄水槽121的顶端中心,封堵头124固定安装在U型移动插杆122靠近支撑连接架125的底端,复位弹簧123固定安装在封堵头124与蓄水槽121之间,传输管道126固定安装在蓄水槽121和支撑连接架125之间,第一喷淋头127固定安装在传输管道126远离支撑连接架125的底端,分向传输管129固定安装在传输管道126背离第一喷淋头127的侧端上,第二喷淋头128固定安装在分向传输管129的底端,通过蓄水槽121远离封堵头124的侧端顶部固定安装有与U型移动插杆122相适配的限制套架,使得可防止U型移动插杆122在上升时出现卡顿的现象。Specifically, the auxiliary retractable device 12 includes a water storage tank 121, a U-shaped movable insertion rod 122, a return spring 123, a plugging head 124, a support connecting frame 125, a transmission pipe 126, a first spray head 127, a second spray head 128 and directional transfer pipe 129, the water storage tank 121 is fixedly installed on the top of the support connecting frame 125, the U-shaped mobile insertion rod 122 is slidably inserted in the top center of the water storage tank 121, and the plugging head 124 is fixedly installed on the U-shaped mobile insertion rod 122 is close to the bottom end of the support connecting frame 125, the return spring 123 is fixedly installed between the plugging head 124 and the water storage tank 121, the transmission pipe 126 is fixedly installed between the water storage tank 121 and the supporting connection frame 125, the first spray head 127 Fixedly installed on the bottom end of the transmission pipe 126 away from the support connecting frame 125, the branching transmission pipe 129 is fixedly installed on the side end of the transmission pipe 126 away from the first shower head 127, and the second shower head 128 is fixedly installed on the side end of the branching transmission pipe 126. The bottom end of the pipe 129 is fixedly installed on the top of the side end away from the plugging head 124 through the water storage tank 121 with a restricting sleeve frame suitable for the U-shaped movable insertion rod 122, so as to prevent the U-shaped movable insertion rod 122 from appearing when it rises. Caton phenomenon.

具体的,连接侧板112固定安装在调控移动装置3的顶端内部,支撑连接架125固定安装在连接侧板112靠近移动接触导杆111的顶端上,联通传输腔体210背离螺旋叶片28的侧端固定安装在连接侧板112远离支撑套管113的侧端顶部,第二齿轮22与第一齿轮117啮合,连接支撑轴213固定安装在第二传动齿轮1111靠近切割刀片118的侧端中心,当第二传动齿轮1111在转动时可带动连接支撑轴213同时转动,完成动力的传递。Specifically, the connecting side plate 112 is fixedly installed inside the top end of the regulating and moving device 3 , the support connecting frame 125 is fixedly installed on the top end of the connecting side plate 112 close to the moving contact guide rod 111 , and the side of the Unicom transmission cavity 210 away from the spiral blade 28 The end is fixedly installed on the top of the side end of the connecting side plate 112 away from the support sleeve 113, the second gear 22 meshes with the first gear 117, and the connecting support shaft 213 is fixedly installed on the center of the side end of the second transmission gear 1111 near the cutting blade 118, When the second transmission gear 1111 is rotating, it can drive the connecting support shaft 213 to rotate at the same time to complete the transmission of power.

具体的,接触橡胶条27的转动半径低于螺旋叶片28的底端,联通传输腔体210、第一吸收腔体24和第二吸收腔体29的内部均呈中空状态设置,且联通传输腔体210、第一吸收腔体24和第二吸收腔体29互通,接触尼龙软刷21的转动半径高于切割刀片118的中心轴,可防止接触尼龙软刷21在转动时与切割刀片118出现转动干涉的现象。Specifically, the radius of rotation of the contact rubber strip 27 is lower than the bottom end of the helical blade 28, and the insides of the Unicom transmission cavity 210, the first absorption cavity 24, and the second absorption cavity 29 are all set in a hollow state, and the communication transmission cavity Body 210, the first absorbing chamber 24 and the second absorbing chamber 29 communicate with each other, and the radius of rotation of the contact nylon soft brush 21 is higher than the central axis of the cutting blade 118, which can prevent the contact nylon soft brush 21 from appearing with the cutting blade 118 when rotating. The phenomenon of rotational interference.

具体的,导向传输腔体116的底端与接触橡胶条27的底端平齐,第二喷淋头128的内部两侧开设有出水口,第一喷淋头127的底端开设有出水口,第一喷淋头127和第二喷淋头128均匀切割刀片118垂直对齐,可将切削液准确的流动至切割刀片118上,提升切割刀片118的降温性能。Specifically, the bottom end of the guide transmission cavity 116 is flush with the bottom end of the contact rubber strip 27, the inner sides of the second spray head 128 are provided with water outlets, and the bottom end of the first shower head 127 is provided with water outlets. , the first shower head 127 and the second shower head 128 are evenly aligned vertically to the cutting blade 118 , so that the cutting fluid can flow accurately onto the cutting blade 118 and improve the cooling performance of the cutting blade 118 .

具体的,移动接触导杆111与U型移动插杆122远离复位弹簧123的一端底部垂直对齐,切割刀片118与导向传输腔体116间隔1厘米,且导向传输腔体116的顶端呈20°斜坡设置,导向传输腔体116远离支撑套管113的一端与第一吸收腔体24和第二吸收腔体29的前端垂直平齐,接触尼龙软刷21相对的侧端与切割刀片118表面贴合,当接触尼龙软刷21在转动时,可将切割刀片118表面上附着的碎屑向下扫除。Specifically, the moving contact guide rod 111 is vertically aligned with the bottom of one end of the U-shaped moving insertion rod 122 away from the return spring 123, the cutting blade 118 is spaced 1 cm from the guiding transmission cavity 116, and the top of the guiding transmission cavity 116 is inclined at 20° Setting, the end of the guide transmission cavity 116 away from the support sleeve 113 is vertically flush with the front ends of the first absorption cavity 24 and the second absorption cavity 29, and the opposite side end of the contact nylon soft brush 21 is attached to the surface of the cutting blade 118 , when the contact nylon soft brush 21 is rotating, the debris adhering to the cutting blade 118 surface can be swept downwards.

一种可降低次品率的IC芯片制造装置,其制造工艺包括以下步骤:A kind of IC chip manufacturing device that can reduce defective rate, its manufacturing process comprises the following steps:

S1、先将晶元放在支撑基座4的内部基座上,再将支撑传动机构1整体与调控移动装置3内部进行配对连接,再将调控移动装置3启动,带动支撑传动机构1移动,此时,可将输出电机1112启动,带动切割刀片118转动,当调控移动装置3内部进行进给工作时,即可带动切割刀片118与晶元接触,可将需要的部分切除,当切割刀片118下降时,导向传输腔体116会提前与晶元接触,同时,通过限位弹簧114的弹性,可允许导向传输腔体116向上移动,使得可在切割刀片118切割时进行碎屑防飞溅的工作,防止碎屑将其他区域的晶元磨损;S1. First place the wafer on the inner base of the support base 4, then pair and connect the entire support transmission mechanism 1 with the inside of the control and control mobile device 3, and then start the control and control mobile device 3 to drive the support and transmission mechanism 1 to move, At this time, the output motor 1112 can be started to drive the cutting blade 118 to rotate. When the feed operation is performed inside the moving device 3, the cutting blade 118 can be driven to contact with the wafer, and the required part can be cut off. When the cutting blade 118 When descending, the guide transmission cavity 116 will contact the wafer in advance, and at the same time, through the elasticity of the limit spring 114, the guide transmission cavity 116 can be allowed to move upward, so that debris can be prevented from splashing when the cutting blade 118 is cutting , to prevent debris from wearing out wafers in other areas;

S2、之后,切割刀片118在转动时,还可通过传动齿带1110、第一传动齿轮119和第二传动齿轮1111传递动力至连接支撑轴213上,致使连接支撑轴213同时转动,当连接支撑轴213在转动时可带动转动尼龙刷25在第一吸收腔体24和第二吸收腔体29的内部底端转动,使得可将第一吸收腔体24和第二吸收腔体29内壁上的碎屑清除,防止碎屑在第一吸收腔体24和第二吸收腔体29的内部堆积,同时,连接支撑轴213转动时,还可通过第四齿轮212和第三齿轮211带动螺旋叶片28转动,使得螺旋叶片28可在第二吸收腔体29的内部转动,将碎屑向外界的引流设备传输碎屑,实现碎屑及时传导的工作。S2. Afterwards, when the cutting blade 118 is rotating, it can also transmit power to the connection support shaft 213 through the transmission toothed belt 1110, the first transmission gear 119 and the second transmission gear 1111, so that the connection support shaft 213 rotates at the same time. When the connection support When the shaft 213 rotates, it can drive the rotating nylon brush 25 to rotate at the inner bottom of the first absorption chamber 24 and the second absorption chamber 29, so that the inner walls of the first absorption chamber 24 and the second absorption chamber 29 can Debris is removed to prevent debris from accumulating inside the first absorption cavity 24 and the second absorption cavity 29. At the same time, when the connecting support shaft 213 rotates, the fourth gear 212 and the third gear 211 can also drive the helical blade 28 Rotate, so that the helical blade 28 can rotate inside the second absorption cavity 29, and transfer the debris to the drainage equipment outside, so as to realize the work of timely conduction of the debris.

工作原理:在使用时,先将需要切割的晶元盘放置在支撑基座4内部的基座上,再将调控移动装置3启动,带动连接侧板112移动进给,此时,可将输出电机1112启动,带动切割刀片118转动,当连接侧板112向下移动时,可带动切割刀片118与晶元盘接触,进行晶元盘切割的工作,此时,通过导向传输腔体116保持常态时,限位弹簧114会带动导向传输腔体116向下超过切割刀片118的底端,使得切割刀片118在向下移动时,导向传输腔体116会提前与晶元盘接触,此时,当切割刀片118对晶元盘切割时,通过导向传输腔体116覆盖在晶元盘的切缝上,使得可防止切割产生的碎屑向四周飞溅,提升芯片在生产时的成品率,此时,通过导向传输腔体116远离支撑套管113的一端与第一吸收腔体24和第二吸收腔体29对齐,可将第二吸收腔体29靠近螺旋叶片28的一端与外界的吸收装置连接,再将吸收装置启动,使得可吸收第一吸收腔体24和第二吸收腔体29内部的气体,带动碎屑向吸收装置内部进给,此时,通过导向传输腔体116的格挡与导向,使得可限制碎屑的传输方向,提升第一吸收腔体24和第二吸收腔体29的吸收效率,与此同时,在导向传输腔体116向上移动时,还可带动移动接触导杆111上升,使得可挤压U型移动插杆122向上移动,通过封堵头124固定安装在U型移动插杆122的底端,使得U型移动插杆122在上升时,可带动封堵头124与蓄水槽121的底端中心分离,使得可释放蓄水槽121内部的切割液,致使切割液经过传输管道126和分向传输管129的内部流动至第一喷淋头127和第二喷淋头128的内部,此时,通过第一喷淋头127的底端和第二喷淋头128的内部两侧均开设有出水孔,且第一喷淋头127与第二喷淋头128与切割刀片118垂直对齐,使得第一喷淋头127内部的切割液会流动至切割刀片118的顶端上,使得可对切割刀片118进行降温,通过第二喷淋头128的内部两侧与切割刀片118的两侧贴合靠近,使得第二喷淋头128内部流出的切割液体会顺着切割刀片118的表面向下流动,使得可冷却切割刀片118的同时,将切割刀片118侧端上附着的碎屑流动带走,与此同时,当碎屑进入第一吸收腔体24和第二吸收腔体29的内部时,通过联通传输腔体210固定安装在第一吸收腔体24和第二吸收腔体29的顶端上,使得可将第一吸收腔体24和第二吸收腔体29的内部互通,从而可便于第一吸收腔体24内部的碎屑向第二吸收腔体29的内部传导,此时,通过切割刀片118转动时还可带动第一传动齿轮119转动,且传动齿带1110啮合在第一传动齿轮119和第二传动齿轮1111的外圈上,使得第一传动齿轮119在转动时可带动第二传动齿轮1111同时转动,通过连接支撑轴213转动贯穿第一吸收腔体24和第二吸收腔体29固定安装在第二传动齿轮1111上,使得第二传动齿轮1111在转动时,可带动连接支撑轴213转动,当连接支撑轴213在转动时,可带动转动尼龙刷25在第一吸收腔体24和第二吸收腔体29的内部底端转动,使得可将第一吸收腔体24和第二吸收腔体29内壁上的碎屑扫动,防止碎屑积存在第一吸收腔体24和第二吸收腔体29的内壁上,此时,通过连接支撑轴213在转动时还可带动第四齿轮212和第三齿轮211转动,且第三齿轮211转动贯穿第二吸收腔体29与螺旋叶片28适配连接,使得第三齿轮211在转动时可带动螺旋叶片28在第二吸收腔体29的顶端内部转动,使得可将第二吸收腔体29内部顶端的碎屑向第二吸收腔体29远离第一吸收腔体24的一端传输导流,通过转动尼龙刷25的转动半径低于螺旋叶片28的底端,使得可防止转动尼龙刷25转动时与螺旋叶片28发生干涉,同时,通过切割刀片118在转动时,可带动第一齿轮117和第二齿轮22同时转动,且第二齿轮22在转动时,可带动接触尼龙软刷21的内侧在切割刀片118的外侧表面转动,使得可将切割刀片118上附着的碎屑扫动清除,此时,通过接触尼龙软刷21的转动半径高于切割刀片118内部的支撑轴,使得可防止接触尼龙软刷21转动时与切割刀片118发生干涉,与此同时,通过导向传输腔体116相对的侧端与切割刀片118之间间隔1厘米,且导向传输腔体116的顶端呈20°斜坡设置,使得接触尼龙软刷21在清扫切割刀片118上的碎屑时,碎屑从导向传输腔体116和切割刀片118之间的缝隙中向下掉落,便于碎屑进入导向传输腔体116内部进行导流工作,完成工作。Working principle: When in use, first place the wafer tray to be cut on the base inside the support base 4, and then start the regulating and moving device 3 to drive the connecting side plate 112 to move and feed. At this time, the output The motor 1112 starts to drive the cutting blade 118 to rotate. When the connecting side plate 112 moves downward, it can drive the cutting blade 118 to contact the wafer disk to perform the work of cutting the wafer disk. At this time, the guide transmission cavity 116 maintains the normal state , the limit spring 114 will drive the guide transmission cavity 116 downward to exceed the bottom end of the cutting blade 118, so that when the cutting blade 118 moves downward, the guide transmission cavity 116 will contact the wafer disk in advance. At this time, when When the cutting blade 118 cuts the wafer disk, it covers the slit of the wafer disk by guiding the transmission cavity 116, so that the debris generated by cutting can be prevented from splashing around, and the yield rate of the chip during production can be improved. At this time, By guiding the end of the transmission cavity 116 away from the support sleeve 113 to align with the first absorption cavity 24 and the second absorption cavity 29, the end of the second absorption cavity 29 close to the spiral blade 28 can be connected to the external absorption device, Then start the absorption device, so that the gas inside the first absorption cavity 24 and the second absorption cavity 29 can be absorbed, and the debris is fed to the inside of the absorption device. , so that the transmission direction of debris can be limited, and the absorption efficiency of the first absorption cavity 24 and the second absorption cavity 29 can be improved. At the same time, when the guide transmission cavity 116 moves upward, it can also drive the moving contact guide rod 111 Rising, so that the extruded U-shaped movable plunger 122 moves upwards, and the plugging head 124 is fixedly installed on the bottom of the U-shaped movable plunger 122, so that the U-shaped movable plunger 122 can drive the plugging head 124 when rising. It is separated from the center of the bottom end of the water storage tank 121, so that the cutting fluid inside the water storage tank 121 can be released, causing the cutting fluid to flow to the first shower head 127 and the second shower head through the inside of the transmission pipe 126 and the diverting transmission pipe 129 128, at this time, through the bottom of the first shower head 127 and the inner sides of the second shower head 128, there are water outlet holes, and the first shower head 127 and the second shower head 128 are connected with the cutting The blades 118 are vertically aligned, so that the cutting fluid inside the first shower head 127 will flow to the top of the cutting blade 118, so that the temperature of the cutting blade 118 can be cooled, and the cutting fluid can pass through the inner sides of the second shower head 128 and the cutting blade 118. The two sides of the two sides are close together, so that the cutting liquid flowing out of the second shower head 128 will flow down along the surface of the cutting blade 118, so that the cutting blade 118 can be cooled, and the debris attached to the side end of the cutting blade 118 will be removed. At the same time, when the debris enters the interior of the first absorption cavity 24 and the second absorption cavity 29, it is fixedly installed in the first absorption cavity 24 and the second absorption cavity through the communication transmission cavity 210 body 29, so that the interior of the first absorption cavity 24 and the second absorption cavity 29 can communicate, thereby facilitating the first absorption cavity The debris inside the body 24 is conducted to the inside of the second absorption cavity 29. At this time, when the cutting blade 118 rotates, the first transmission gear 119 can also be driven to rotate, and the transmission toothed belt 1110 is engaged between the first transmission gear 119 and the second transmission gear 119. On the outer ring of the second transmission gear 1111, the first transmission gear 119 can drive the second transmission gear 1111 to rotate at the same time when rotating, and the first absorption cavity 24 and the second absorption cavity 29 are fixedly installed by connecting the support shaft 213 to rotate through the first absorption cavity 24 and the second absorption cavity 29 On the second transmission gear 1111, when the second transmission gear 1111 is rotating, it can drive the connecting support shaft 213 to rotate, and when the connecting support shaft 213 is rotating, it can drive the rotating nylon brush 25 between the first absorption cavity 24 and the second absorption cavity. The inner bottom of the two absorption chambers 29 rotates so that the debris on the inner walls of the first absorption chamber 24 and the second absorption chamber 29 can be swept away to prevent debris from accumulating in the first absorption chamber 24 and the second absorption chamber. On the inner wall of the cavity 29, at this time, the fourth gear 212 and the third gear 211 can also be driven to rotate by connecting the support shaft 213 when rotating, and the third gear 211 rotates through the second absorption cavity 29 and is suitable for the spiral blade 28. Matching connection, so that the third gear 211 can drive the spiral blade 28 to rotate inside the top of the second absorption cavity 29 when rotating, so that the debris at the top of the second absorption cavity 29 can be moved away from the second absorption cavity 29 One end of the first absorbing cavity 24 transmits and diverts water, and the radius of rotation of the rotating nylon brush 25 is lower than the bottom end of the helical blade 28, so that the rotating nylon brush 25 can be prevented from interfering with the helical blade 28 while rotating, and at the same time, the cutting blade 118 when rotating, can drive the first gear 117 and the second gear 22 to rotate simultaneously, and the second gear 22 can drive the inner side that contacts nylon soft brush 21 to rotate on the outer surface of cutting blade 118 when rotating, so that the cutting blade 118 can be cut The debris attached on the blade 118 sweeps and removes. At this time, the radius of rotation of the soft nylon brush 21 is higher than the support shaft of the cutting blade 118, so that the soft nylon brush 21 can be prevented from interfering with the cutting blade 118 when rotating. At the same time, space 1 centimeter between the opposite side ends of the guide transmission cavity 116 and the cutting blade 118, and the top of the guide transmission cavity 116 is provided with a 20° slope, so that the contact nylon soft brush 21 is cleaned on the cutting blade 118. When there is debris, the debris will fall down from the gap between the guide transmission cavity 116 and the cutting blade 118, so that the debris can enter the guide transmission cavity 116 for diversion work and complete the work.

以上显示和描述了本发明的基本原理、主要特征和优点。本行业的技术人员应该了解,本发明不受上述实施例的限制,上述实施方式和说明书中的描述的只是说明本发明的原理,在不脱离本发明精神和范围的前提下,本发明还会有各种变化和改进,这些变化和改进都落入本发明要求保护的范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。The basic principles, main features and advantages of the present invention have been shown and described above. Those skilled in the industry should understand that the present invention is not limited by the above-mentioned embodiments, and the descriptions in the above-mentioned embodiments and specification only illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will also There are various changes and improvements, and these changes and improvements all fall within the scope of protection of the present invention. The protection scope of the present invention is defined by the appended claims and their equivalents.

Claims (9)

1. An IC chip manufacturing device capable of reducing defective rate comprises a supporting base (4), wherein a regulating and controlling moving device (3) is fixedly mounted at the top end of the supporting base (4), a supporting transmission mechanism (1) is fixedly mounted at the bottom end inside the regulating and controlling moving device (3), an auxiliary collecting device (2) is fixedly mounted at the side end of the supporting transmission mechanism (1), and the IC chip manufacturing device is characterized in that: the auxiliary collecting device (2) comprises a contact nylon soft brush (21), a second gear (22), an extension bracket (23), a first absorption cavity (24), a rotary nylon brush (25), an arc isolation plate (26), a contact rubber strip (27), a spiral blade (28), a second absorption cavity (29), a communication transmission cavity (210), a third gear (211), a fourth gear (212) and a connecting support shaft (213), wherein the first absorption cavity (24) and the second absorption cavity (29) are respectively and fixedly arranged at two ends of the bottom of the communication transmission cavity (210), the arc isolation plate (26) is fixedly arranged between the first absorption cavity (24) and the second absorption cavity (29), the extension bracket (23) is respectively and fixedly arranged at the top ends of the front sides of the first absorption cavity (24) and the second absorption cavity (29), the second gear (22) is rotatably arranged at the opposite side ends of the extension bracket (23), the contact nylon soft brush (21) is fixedly arranged at the opposite side ends of the second gear (22), the contact rubber strip (27) is fixedly arranged at the bottom end of the first absorption cavity (24) and the center of the second absorption cavity (29), rotate nylon brush (25) fixed mounting on connecting support shaft (213), fourth gear (212) fixed mounting is on connecting support shaft (213), just third gear (211) meshing is at the top of fourth gear (212), helical blade (28) rotate and run through second absorption cavity (29) fixed mounting on third gear (211).
2. The apparatus for manufacturing IC chips according to claim 1, wherein: the supporting transmission mechanism (1) comprises a contact guide device (11) and an auxiliary winding and unwinding device (12), and the auxiliary winding and unwinding device (12) is fixedly installed on the top end of the contact guide device (11).
3. The apparatus of claim 2, wherein: the contact guiding device (11) comprises a movable contact guide rod (111), a connecting side plate (112), a supporting sleeve (113), a limiting spring (114), a movable inserting plate (115), a guide transmission cavity (116), a first gear (117), a cutting blade (118), a first transmission gear (119), a transmission toothed belt (1110), a second transmission gear (1111) and an output motor (1112), wherein the supporting sleeve (113) is symmetrically and fixedly installed at the bottom of the front end of the connecting side plate (112), the limiting spring (114) is fixedly installed at the top end of the supporting sleeve (113), the movable inserting plate (115) is slidably inserted at the bottom end of the supporting sleeve (113), the movable contact guide rod (111) is slidably and penetratingly connected with the side plate (112) and the supporting sleeve (113) and is fixedly installed on the movable inserting plate (115), the guide transmission cavity (116) is symmetrically and fixedly installed at the rear side of the movable inserting plate (115), the first gear (117) is fixedly installed at the centers of the two sides of the cutting blade (118), the cutting blade (118) is fixedly installed on the output motor (1112), the output motor (1112) is fixedly installed at the side end of the connecting side plate (119), and the outer ring (113) is close to the output motor (1112), the transmission toothed belt (1110) is meshed with the outer ring of the first transmission gear (119), and the second transmission gear (1111) is meshed with one end, far away from the first transmission gear (119), of the transmission toothed belt (1110).
4. The apparatus of claim 3, wherein: the auxiliary retraction device (12) comprises a water storage tank (121), a U-shaped movable insertion rod (122), a return spring (123), a sealing head (124), a support connecting frame (125), a transmission pipeline (126), a first spray head (127), a second spray head (128) and a branch transmission pipeline (129), the water storage tank (121) is fixedly installed at the top end of the support connecting frame (125), the U-shaped movable insertion rod (122) is inserted in the center of the top end of the water storage tank (121) in a sliding mode, the sealing head (124) is fixedly installed at the bottom end, close to the support connecting frame (125), of the U-shaped movable insertion rod (122), the return spring (123) is fixedly installed between the sealing head (124) and the water storage tank (121), the transmission pipeline (126) is fixedly installed between the water storage tank (121) and the support connecting frame (125), the first spray head (127) is fixedly installed at the bottom end, far away from the support connecting frame (125), of the transmission pipeline (126), the branch transmission pipeline (129) is fixedly installed at the bottom end, far away from the first spray head (128), and the second spray head (129) are fixedly installed at the bottom end of the transmission pipeline (126).
5. The apparatus of claim 4, wherein: the connecting side plate (112) is fixedly installed inside the top end of the regulating and controlling moving device (3), the supporting connecting frame (125) is fixedly installed on the top end, close to the movable contact guide rod (111), of the connecting side plate (112), the lateral end, deviating from the spiral blade (28), of the communicating transmission cavity (210) is fixedly installed at the top of the lateral end, far away from the supporting sleeve (113), of the connecting side plate (112), the second gear (22) is meshed with the first gear (117), and the connecting supporting shaft (213) is fixedly installed at the center of the lateral end, close to the cutting blade (118), of the second transmission gear (1111).
6. The apparatus for manufacturing IC chips according to claim 5, wherein: the rotating radius of the contact rubber strip (27) is lower than the bottom end of the spiral blade (28), the interiors of the communicating and transmitting cavity (210), the first absorption cavity (24) and the second absorption cavity (29) are all arranged in a hollow state, the communicating and transmitting cavity (210), the first absorption cavity (24) and the second absorption cavity (29) are communicated, and the rotating radius of the contact nylon soft brush (21) is higher than the central shaft of the cutting blade (118).
7. The apparatus of claim 6, wherein: the bottom of direction transmission cavity (116) and the bottom parallel and level of contact rubber strip (27), the delivery port has been seted up to the inside both sides of second shower head (128), the delivery port has been seted up to the bottom of first shower head (127), first shower head (127) and the even cutting blade (118) of second shower head (128) are aimed at perpendicularly.
8. The apparatus of claim 7, wherein: the bottom of one end of a U-shaped movable insertion rod (122) away from a return spring (123) is vertically aligned with the movable contact guide rod (111), the interval between a cutting blade (118) and a guide transmission cavity (116) is 1 cm, the top end of the guide transmission cavity (116) is in 20-degree slope arrangement, one end of the guide transmission cavity (116) away from a support sleeve (113) is vertically flush with the front ends of a first absorption cavity (24) and a second absorption cavity (29), and the opposite side end of a contact nylon soft brush (21) is attached to the surface of the cutting blade (118).
9. The apparatus as claimed in claim 7, wherein the manufacturing process comprises the steps of:
s1, a wafer is placed on an inner base of a supporting base (4), the supporting transmission mechanism (1) is integrally connected with the inside of a regulating and controlling moving device (3) in a matching mode, the regulating and controlling moving device (3) is started to drive the supporting transmission mechanism (1) to move, at the moment, an output motor (1112) can be started to drive a cutting blade (118) to rotate, when the inside of the regulating and controlling moving device (3) is fed, the cutting blade (118) can be driven to be in contact with the wafer, a needed part can be cut off, when the cutting blade (118) descends, a guide transmission cavity (116) can be in contact with the wafer in advance, meanwhile, the guide transmission cavity (116) can be allowed to move upwards through the elasticity of a limiting spring (114), so that the scrap anti-splashing work can be carried out when the cutting blade (118) cuts, and the scraps are prevented from abrading the wafers in other areas;
s2, then, when the cutting blade (118) rotates, power can be transmitted to the connecting supporting shaft (213) through the transmission toothed belt (1110), the first transmission gear (119) and the second transmission gear (1111) to enable the connecting supporting shaft (213) to rotate simultaneously, when the connecting supporting shaft (213) rotates, the rotating nylon brush (25) can be driven to rotate at the bottom ends of the inner portions of the first absorption cavity (24) and the second absorption cavity (29), debris on the inner walls of the first absorption cavity (24) and the second absorption cavity (29) can be removed, the debris can be prevented from being accumulated inside the first absorption cavity (24) and the second absorption cavity (29), and meanwhile, when the connecting supporting shaft (213) rotates, the spiral blade (28) can be driven to rotate through the fourth gear (212) and the third gear (211), so that the spiral blade (28) can rotate inside the second absorption cavity (29), the debris can be transmitted to external drainage equipment, and timely conduction of the debris can be achieved.
CN202211133474.4A 2022-09-18 2022-09-18 IC chip manufacturing process capable of reducing defective rate Active CN115534146B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201616363D0 (en) * 2016-09-27 2016-11-09 Black & Decker Inc Dust extractor with flat back
DE102016125032A1 (en) * 2016-12-20 2018-06-21 Dreps Gmbh Suction drilling tool and method for producing a suction drilling
CN212666422U (en) * 2020-02-14 2021-03-09 四川华清新创新材料科技有限公司 Building material cutting device
CN213703764U (en) * 2020-11-13 2021-07-16 天津市天鹏建筑器材有限公司 Building board cutting and cleaning device
CN114393725A (en) * 2022-01-17 2022-04-26 山东澳远铝基新材料有限公司 Waste recovery processing device for preparation and production of aluminum oxide material

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201616363D0 (en) * 2016-09-27 2016-11-09 Black & Decker Inc Dust extractor with flat back
DE102016125032A1 (en) * 2016-12-20 2018-06-21 Dreps Gmbh Suction drilling tool and method for producing a suction drilling
CN212666422U (en) * 2020-02-14 2021-03-09 四川华清新创新材料科技有限公司 Building material cutting device
CN213703764U (en) * 2020-11-13 2021-07-16 天津市天鹏建筑器材有限公司 Building board cutting and cleaning device
CN114393725A (en) * 2022-01-17 2022-04-26 山东澳远铝基新材料有限公司 Waste recovery processing device for preparation and production of aluminum oxide material

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