CN115427198A - 具有径向气帘和/或内部容积控制的晶片搬运机械手 - Google Patents

具有径向气帘和/或内部容积控制的晶片搬运机械手 Download PDF

Info

Publication number
CN115427198A
CN115427198A CN202180030454.1A CN202180030454A CN115427198A CN 115427198 A CN115427198 A CN 115427198A CN 202180030454 A CN202180030454 A CN 202180030454A CN 115427198 A CN115427198 A CN 115427198A
Authority
CN
China
Prior art keywords
turntable
radial
base
axis
cross
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180030454.1A
Other languages
English (en)
Chinese (zh)
Inventor
查尔斯·N·迪特莫尔
理查德·M·布兰克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of CN115427198A publication Critical patent/CN115427198A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/02—Arms extensible
    • B25J18/04—Arms extensible rotatable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0075—Means for protecting the manipulator from its environment or vice versa
    • B25J19/0079—Means for protecting the manipulator from its environment or vice versa using an internal pressure system
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0075—Means for protecting the manipulator from its environment or vice versa
    • B25J19/0083—Means for protecting the manipulator from its environment or vice versa using gaiters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
CN202180030454.1A 2020-02-27 2021-02-23 具有径向气帘和/或内部容积控制的晶片搬运机械手 Pending CN115427198A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202062982626P 2020-02-27 2020-02-27
US62/982,626 2020-02-27
PCT/US2021/019264 WO2021173568A1 (en) 2020-02-27 2021-02-23 Wafer handling robot with radial gas curtain and/or interior volume control

Publications (1)

Publication Number Publication Date
CN115427198A true CN115427198A (zh) 2022-12-02

Family

ID=77492125

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180030454.1A Pending CN115427198A (zh) 2020-02-27 2021-02-23 具有径向气帘和/或内部容积控制的晶片搬运机械手

Country Status (6)

Country Link
US (1) US11833662B2 (https=)
JP (2) JP7724227B2 (https=)
KR (1) KR20220146594A (https=)
CN (1) CN115427198A (https=)
TW (1) TW202146190A (https=)
WO (1) WO2021173568A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI854761B (zh) * 2023-08-02 2024-09-01 友達光電股份有限公司 半導體自動裝載系統

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7561568B2 (ja) * 2020-10-19 2024-10-04 ニデックインスツルメンツ株式会社 産業用ロボット
CN117832049A (zh) * 2022-09-28 2024-04-05 北京北方华创微电子装备有限公司 半导体工艺设备及其传输腔室
US12552619B2 (en) * 2023-02-16 2026-02-17 Samsung Electronics Co., Ltd. Wafer transfer apparatus, wafer transfer system, and method for removing particles in wafer transfer apparatus

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60189219A (ja) * 1984-03-08 1985-09-26 Matsushita Electric Ind Co Ltd 回転サセプタ支持装置
JPH06105082B2 (ja) * 1985-08-20 1994-12-21 株式会社東芝 発塵防止機構
JPH0469186A (ja) * 1990-07-09 1992-03-04 Mitsubishi Electric Corp 産業用特殊雰囲気内作業ロボット
JPH0929682A (ja) * 1995-07-11 1997-02-04 Canon Inc クリーン環境用機器のシール装置及びクリーンロボット
JP3638393B2 (ja) * 1997-03-04 2005-04-13 大日本スクリーン製造株式会社 基板処理装置
JPH1187461A (ja) * 1997-09-11 1999-03-30 Dainippon Screen Mfg Co Ltd 基板搬送装置およびそれを適用した基板処理装置
US6352265B1 (en) * 1999-05-26 2002-03-05 Brooks Automation, Inc. Seal ring using gas curtain
JP2001024045A (ja) * 1999-07-08 2001-01-26 Nikon Corp 搬送装置およびそれを用いた露光装置
JP2001300883A (ja) * 2000-04-20 2001-10-30 Kawasaki Heavy Ind Ltd ロボット
JP3983481B2 (ja) 2001-01-31 2007-09-26 東京エレクトロン株式会社 基板処理装置及び基板処理装置における基板搬送方法
JP2012056034A (ja) * 2010-09-09 2012-03-22 Sinfonia Technology Co Ltd ロボットアーム装置
JP5364769B2 (ja) * 2011-09-26 2013-12-11 株式会社安川電機 搬送ロボットおよび基板処理装置
TWI725303B (zh) * 2012-02-10 2021-04-21 美商布魯克斯自動機械公司 基材處理設備
JP5500206B2 (ja) * 2012-06-01 2014-05-21 株式会社安川電機 搬送ロボットおよび搬送ロボットを備えた局所クリーン装置
JP6120031B2 (ja) * 2016-01-20 2017-04-26 セイコーエプソン株式会社 部品検査装置、及び、ハンドラー
JP7137047B2 (ja) 2018-03-15 2022-09-14 シンフォニアテクノロジー株式会社 Ｅｆｅｍ、及び、ｅｆｅｍにおけるガス置換方法
JP7480635B2 (ja) * 2020-08-21 2024-05-10 東京エレクトロン株式会社 基板を搬送する装置、基板を処理するシステム、及び基板を処理する方法
JP7561568B2 (ja) * 2020-10-19 2024-10-04 ニデックインスツルメンツ株式会社 産業用ロボット

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI854761B (zh) * 2023-08-02 2024-09-01 友達光電股份有限公司 半導體自動裝載系統

Also Published As

Publication number Publication date
US11833662B2 (en) 2023-12-05
JP2025163166A (ja) 2025-10-28
US20230074285A1 (en) 2023-03-09
KR20220146594A (ko) 2022-11-01
WO2021173568A1 (en) 2021-09-02
TW202146190A (zh) 2021-12-16
JP7724227B2 (ja) 2025-08-15
JP2023516944A (ja) 2023-04-21

Similar Documents

Publication Publication Date Title
CN115427198A (zh) 具有径向气帘和/或内部容积控制的晶片搬运机械手
US7635244B2 (en) Sheet-like electronic component clean transfer device and sheet-like electronic component manufacturing system
CN114530394B (zh) 用于处理基板的设备
JP5029535B2 (ja) 熱処理装置、熱処理方法及び記憶媒体
US11472002B2 (en) Substrate polishing apparatus
US11728205B2 (en) Device for transferring substrate, system for processing substrate, and method of processing substrate
JP4498362B2 (ja) 基板処理装置および半導体デバイスの製造方法
JP2014197592A (ja) 基板処理装置
CN114527625A (zh) 用于处理基板的设备
TWI509724B (zh) 用於處理工具中之小微粒計數的氣流管理
KR100905262B1 (ko) 기판 처리 장치 및 반도체 장치의 제조 방법
CN115472529A (zh) 用于处理基板的装置
TW202214908A (zh) 批量晶圓脫氣室以及對工廠介面和基於真空的主機架的整合
CN111742400A (zh) 移动衬底传送室
US12460299B2 (en) Wet clean spray process chamber for substrates
JP6553388B2 (ja) 基板搬送装置、基板処理装置および基板搬送方法
KR102621848B1 (ko) 지지 유닛 및 기판 처리 장치
WO2019159468A1 (ja) 基板処理装置
CN108231625B (zh) 基板处理装置和基板处理方法
JP7512520B2 (ja) 真空処理装置
JP4023210B2 (ja) 処理システム
CN121237676A (zh) 碗状件及基板处理设备
KR20250117279A (ko) 이에프이엠
TW202549002A (zh) 半導體處理腔室中的容積減少
CN120060827A (zh) 排气装置和衬底处理设备

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination