CN115424972B - 一种对晶圆背部进行温度补偿的蚀刻装置 - Google Patents
一种对晶圆背部进行温度补偿的蚀刻装置 Download PDFInfo
- Publication number
- CN115424972B CN115424972B CN202211370161.0A CN202211370161A CN115424972B CN 115424972 B CN115424972 B CN 115424972B CN 202211370161 A CN202211370161 A CN 202211370161A CN 115424972 B CN115424972 B CN 115424972B
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- wafer
- constant temperature
- etching
- main shaft
- temperature
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- 238000005530 etching Methods 0.000 title claims abstract description 78
- 239000007788 liquid Substances 0.000 claims abstract description 70
- 238000005507 spraying Methods 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 5
- 238000004891 communication Methods 0.000 claims description 32
- 238000002347 injection Methods 0.000 claims description 20
- 239000007924 injection Substances 0.000 claims description 20
- 238000007789 sealing Methods 0.000 claims description 14
- 239000007921 spray Substances 0.000 claims description 11
- 238000009423 ventilation Methods 0.000 claims description 9
- 230000008093 supporting effect Effects 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 3
- 230000002277 temperature effect Effects 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211370161.0A CN115424972B (zh) | 2022-11-03 | 2022-11-03 | 一种对晶圆背部进行温度补偿的蚀刻装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211370161.0A CN115424972B (zh) | 2022-11-03 | 2022-11-03 | 一种对晶圆背部进行温度补偿的蚀刻装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN115424972A CN115424972A (zh) | 2022-12-02 |
CN115424972B true CN115424972B (zh) | 2023-07-11 |
Family
ID=84207693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202211370161.0A Active CN115424972B (zh) | 2022-11-03 | 2022-11-03 | 一种对晶圆背部进行温度补偿的蚀刻装置 |
Country Status (1)
Country | Link |
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CN (1) | CN115424972B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116994998B (zh) * | 2023-09-26 | 2023-12-08 | 苏州智程半导体科技股份有限公司 | 一种半导体工艺冷盘及水冷增强方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5673929B2 (ja) * | 2010-10-14 | 2015-02-18 | 株式会社東京精密 | スピンナ洗浄装置及びスピンナ洗浄方法 |
TWI418418B (zh) * | 2011-02-18 | 2013-12-11 | Sparking Power Technology Co Ltd | 元件清洗機 |
US20230079804A1 (en) * | 2020-01-29 | 2023-03-16 | Lam Research Corporation | Wafer chuck with thermal tuning cavity features |
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2022
- 2022-11-03 CN CN202211370161.0A patent/CN115424972B/zh active Active
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Publication number | Publication date |
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CN115424972A (zh) | 2022-12-02 |
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CB02 | Change of applicant information |
Address after: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Applicant before: Zhicheng semiconductor equipment technology (Kunshan) Co.,Ltd. |
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CB02 | Change of applicant information | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: 215000, No. 889 Zhonghua Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region after: China Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region before: China |
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CP03 | Change of name, title or address |