CN115401019A - Chip cleaning device for semiconductor device processing - Google Patents
Chip cleaning device for semiconductor device processing Download PDFInfo
- Publication number
- CN115401019A CN115401019A CN202210884040.1A CN202210884040A CN115401019A CN 115401019 A CN115401019 A CN 115401019A CN 202210884040 A CN202210884040 A CN 202210884040A CN 115401019 A CN115401019 A CN 115401019A
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- Prior art keywords
- cleaning
- chip body
- filter screen
- semiconductor device
- gear
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- Pending
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- 238000004140 cleaning Methods 0.000 title claims abstract description 80
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 239000007788 liquid Substances 0.000 claims abstract description 27
- 238000005406 washing Methods 0.000 claims abstract description 12
- 230000010355 oscillation Effects 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 241000252254 Catostomidae Species 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 8
- 238000005457 optimization Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/041—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention discloses a chip cleaning device for processing a semiconductor device, which comprises a base, a vibrating structure, a limiting structure, a turning structure, a chip body and a cleaning box. The beneficial effects of the invention are: through limit structure, install the chip body on the connecting plate, avoid the chip body to remove, and then the washing liquid sees through the filter screen and carries out the submergence to the chip body, through starting first motor, first motor drives the cam and rotates, and then two slides of reciprocal conflict of cam rotation, make the slide constantly compress reset spring and reciprocating sliding, and then the slide drives and vibrates the board reciprocating sliding, vibrate the board and vibrate the washing liquid in the case to wasing, make the washing liquid motion, be convenient for carry out abundant washing to the chip body, drive the fixing base through flip structure and rotate, thereby be convenient for drive the chip body and rotate, be convenient for chip body and washing liquid fully contact, the cleaning performance is improved, the abluent stability of chip body has also been guaranteed simultaneously, avoid damaging the chip body.
Description
Technical Field
The invention relates to a cleaning device, in particular to a chip cleaning device for semiconductor device processing, and belongs to the technical field of chip processing.
Background
With the continuous development of science and technology, various chips have been widely applied to daily life, work and industry of people, and bring great convenience to the life of people. However, in the process of manufacturing the chip, foreign matters such as particles and photoresist residues are easily attached to the surface of the chip, and therefore, the chip needs to be cleaned before being assembled.
The method for cleaning the chip in the prior art is mainly divided into two methods, the first method is manual cleaning, the method is easy to cause chip breakage and consumes a large amount of manpower, in addition, the cleaning and throwing speed is uncontrollable in the cleaning process, and the second method is cleaning through a mechanical arm, the method has the defects of high price and difficult maintenance, so a chip cleaning device for processing the semiconductor device needs to be designed to solve the problems.
Disclosure of Invention
The present invention has been made to solve the above problems, and an object of the present invention is to provide a wafer cleaning apparatus for semiconductor device processing, which is easy to clean, has high stability, and is easy to operate.
The chip cleaning device comprises a base and a cleaning box, wherein the cleaning box filled with cleaning liquid is arranged at the top of the base, a vibration structure used for vibrating the cleaning liquid is arranged on the base, a limiting structure used for installing a chip body is arranged inside the cleaning box, and a turnover structure used for turning over the chip body is arranged on the side, located on the limiting structure, of the cleaning box.
Preferably, in order to facilitate the oscillation washing liquid, make things convenient for the washing liquid to wash chip body surface, it includes connecting plate, first motor, cam, slide, shakes board and reset spring to vibrate the structure, be fixed with on the base the connecting plate, the top of base is fixed with first motor, the one end of first motor is fixed with the cam, the inner wall sliding connection of connecting plate has two the slide, the cam can with the slide is contradicted, the slide with be connected with between the connecting plate reset spring, the bottom of slide is fixed with shake the board, shake the board can extend to wash the inside of case.
Preferably, in order to reduce the sliding friction resistance of the sliding plate, the oscillating structure further comprises a plurality of rollers, the sliding plate is rotatably connected with the rollers, and the rollers are connected with the connecting plate in a rolling manner.
Preferably, in order to facilitate the chip body to carry on spacingly, convenient washing, limit structure includes fixing base, filter screen board, filter screen, fixture block and spacing spring, the inner wall of wasing the case rotates and is connected with the fixing base, two are installed to the inner wall of fixing base the filter screen board, install between the filter screen board the filter screen, the chip body is located two between the filter screen board, the inner wall sliding connection of filter screen board has the fixture block, the fixture block with sliding connection between the inner wall of fixing base, the fixture block with be connected with between the filter screen board spacing spring.
Preferably, for the convenience of overturning the chip body, the chip body and the cleaning liquid of being convenient for fully contact, the cleaning work of being convenient for, flip structure includes second motor, first gear, second gear and pivot, wash and install on the case the second motor, the one end of second motor is fixed with first gear, the side of wasing the case is fixed with the pivot, the one end of pivot is fixed with the second gear, first gear with the second gear meshing.
Preferably, in order to avoid touching the fixed seat, the oscillating plate is located on the top of the fixed seat.
Preferably, in order to facilitate the stable sliding of the sliding plate, the cross section of the sliding plate is I-shaped.
Preferably, in order to facilitate the installation of the washing tank, a plurality of suction cups are installed at the bottom of the washing tank.
Preferably, in order to facilitate reduction of the work load of the second motor, the diameter of the first gear is smaller than that of the second gear.
The invention has the beneficial effects that: the cleaning box is provided with a cleaning liquid, an oscillating structure used for oscillating the cleaning liquid is arranged on the base, a limiting structure used for installing a chip body is arranged inside the cleaning box, an overturning structure used for overturning the chip body is arranged on the side surface, located on the limiting structure, of the cleaning box, proper cleaning liquid is added into the cleaning box at first, the cleaning liquid is enabled to pass through the top of the fixing base, the bottom of the oscillating plate extends into the cleaning liquid, through the limiting structure, the chip body is installed on the connecting plate, the chip body is limited, the chip body is prevented from moving, the cleaning liquid is immersed into the chip body through the filter screen, by starting the first motor, the first motor drives the cam to rotate, and then the cam rotates to repeatedly conflict with the two sliding plates, so that the sliding plates continuously compress the reset spring and slide back and back, the sliding plates drive the oscillating plate to slide back and back, the cleaning liquid in the cleaning box is oscillated by the oscillating plate, the cleaning liquid is convenient to fully clean the chip body, the fixing base is driven to rotate by the overturning structure, the chip body is convenient to rotate, the chip body is fully contacted with the cleaning effect, the stability of the cleaning chip is also ensured, and the chip cleaning box is simple in use.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic structural diagram of the oscillating structure shown in FIG. 1;
fig. 3 is a schematic view of a connection structure of the limiting structure and the turning structure shown in fig. 1.
In the figure: 1. the base, 2, vibrate the structure, 21, the connecting plate, 22, first motor, 23, the cam, 24, the slide, 25, vibrate the board, 26, reset spring, 27, the gyro wheel, 3, limit structure, 31, fixing base, 32, filter screen board, 33, the filter screen, 34, the fixture block, 35, limit spring, 4, flip structure, 41, the second motor, 42, first gear, 43, the second gear, 44, the pivot, 5, the sucking disc, 6, the chip body, 7, wash the case.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 3, a chip cleaning apparatus for semiconductor device processing includes a base 1 and a cleaning box 7, the cleaning box 7 filled with a cleaning liquid is disposed on the top of the base 1, a vibration structure 2 for vibrating the cleaning liquid is disposed on the base 1, a limiting structure 3 for mounting a chip body 6 is disposed inside the cleaning box 7, and an overturning structure 4 for overturning the chip body 6 is disposed on a side surface of the cleaning box 7 located on the limiting structure 3.
As a technical optimization scheme of the invention, the oscillating structure 2 includes a connecting plate 21, a first motor 22, a cam 23, a sliding plate 24, an oscillating plate 25 and a return spring 26, the connecting plate 21 is fixed on the base 1, the first motor 22 is fixed on the top of the base 1, the cam 23 is fixed on one end of the first motor 22, two sliding plates 24 are slidably connected to the inner wall of the connecting plate 21, the cam 23 can abut against the sliding plates 24, the return spring 26 is connected between the sliding plates 24 and the connecting plate 21, the oscillating plate 25 is fixed on the bottom of the sliding plates 24, and the oscillating plate 25 can extend into the cleaning box 7, so that the cleaning liquid can be oscillated, and the cleaning liquid can clean the surface of the chip body 6 conveniently.
As a technical optimization scheme of the present invention, the oscillating structure 2 further includes a plurality of rollers 27, the sliding plate 24 is rotatably connected to the plurality of rollers 27, and the rollers 27 are connected to the connecting plate 21 in a rolling manner, so as to reduce sliding friction resistance of the sliding plate 24.
As a technical optimization scheme of the invention, the limiting structure 3 comprises a fixed seat 31, two filter screen plates 32, a fixture block 34 and a limiting spring 35, the inner wall of the cleaning tank 7 is rotatably connected with the fixed seat 31, the inner wall of the fixed seat 31 is provided with the two filter screen plates 32, the filter screen 33 is arranged between the filter screen plates 32, the chip body 6 is positioned between the two filter screen plates 32, the inner wall of the filter screen plate 32 is slidably connected with the fixture block 34, the fixture block 34 is slidably connected with the inner wall of the fixed seat 31, and the limiting spring 35 is connected between the fixture block 34 and the filter screen plates 32, so that the chip body 6 is limited and is convenient to clean.
As a technical optimization scheme of the present invention, the flipping mechanism 4 includes a second motor 41, a first gear 42, a second gear 43, and a rotating shaft 44, the second motor 41 is installed on the cleaning box 7, the first gear 42 is fixed at one end of the second motor 41, the rotating shaft 44 is fixed at a side surface of the cleaning box 7, the second gear 43 is fixed at one end of the rotating shaft 44, and the first gear 42 is engaged with the second gear 43, so as to flip the chip body 6, facilitate sufficient contact between the chip body 6 and the cleaning solution, and facilitate cleaning operation.
As a technical optimization scheme of the present invention, the oscillation plate 25 is located on the top of the fixing base 31, so as to avoid touching the fixing base 31.
As a technical optimization scheme of the invention, the cross section of the sliding plate 24 is I-shaped, so that the sliding plate 24 can stably slide.
As a technical optimization scheme of the invention, the bottom of the cleaning box 7 is provided with a plurality of suckers 5, so that the cleaning box 7 is convenient to install.
As a technical optimization scheme of the present invention, the diameter of the first gear 42 is smaller than that of the second gear 43, so as to facilitate reducing the working load of the second motor 41.
When the cleaning device is used, firstly, a cleaning box 7 is installed on a base 1 through a sucking disc 5, a proper amount of cleaning liquid is added into the cleaning box 7, so that the cleaning liquid submerges the top of a fixed seat 31, meanwhile, the bottom of an oscillating plate 25 extends into the cleaning liquid, a filter screen plate 32 is installed in the fixed seat 31, a limiting spring 35 is compressed by sliding two fixture blocks 34, then the fixture blocks 34 are matched with the fixed seat 31, then the fixture blocks 34 are released, the fixture blocks 34 are clamped with the fixed seat 31, the filter screen plate 32 is convenient to install, a chip body 6 is placed on the filter screen plate 32, then another filter screen plate 32 is installed, the chip body 6 is limited, the chip body 6 is prevented from moving, the cleaning liquid penetrates through the filter screen 33 to immerse the chip body 6, and the first motor 22 drives a cam 23 to rotate by starting the first motor 22, and then the cam 23 rotates and will touch against two sliding plates 24 reciprocally, so that the sliding plates 24 compress the return spring 26 continuously and slide reciprocally, the roller 27 on the sliding plates 24 is convenient for reducing the sliding friction resistance of the sliding plates 24, the cross section of the sliding plates 24 is i-shaped, which is convenient for the sliding plates 24 to slide stably, and further the sliding plates 24 drive the vibrating plates 25 to slide reciprocally, so that the vibrating plates 25 vibrate the cleaning solution in the cleaning tank 7, so that the cleaning solution moves, which is convenient for fully cleaning the chip body 6, and by starting the second motor 41, the second motor 41 drives the first gear 42, the second gear 43 and the rotating shaft 44 to rotate, which further drives the fixing seat 31 to rotate, thereby conveniently driving the chip body 6 to rotate, which is convenient for the chip body 6 to fully contact with the cleaning solution, improving the cleaning effect, and simultaneously ensuring the cleaning stability of the chip body 6, avoiding damaging the chip body 6, the invention has a simple structure, is convenient to use.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and it is to be understood that all embodiments may be combined as appropriate by one of ordinary skill in the art to form other embodiments as will be apparent to those of skill in the art from the description herein.
Claims (9)
1. The utility model provides a chip belt cleaning device is used in semiconductor device processing, includes base (1) and washs case (7), its characterized in that: the top of base (1) is equipped with the washing liquid wash case (7), be equipped with on base (1) and be used for carrying out the oscillation structure (2) that vibrate to the washing liquid, the inside of wasing case (7) is equipped with limit structure (3) that are used for installing chip body (6), just it is located to wash case (7) the side of limit structure (3) is equipped with and is used for right flip structure (4) of chip body (6) upset.
2. The apparatus for cleaning a semiconductor device processing chip according to claim 1, wherein: vibrate structure (2) including connecting plate (21), first motor (22), cam (23), slide (24), vibrate board (25) and reset spring (26), be fixed with on base (1) connecting plate (21), the top of base (1) is fixed with first motor (22), the one end of first motor (22) is fixed with cam (23), the inner wall sliding connection of connecting plate (21) has two slide (24), cam (23) can with slide (24) are contradicted, slide (24) with be connected with between connecting plate (21) reset spring (26), the bottom of slide (24) is fixed with shake board (25), shake board (25) can extend to wash the inside of case (7).
3. The apparatus for cleaning a semiconductor device processing chip according to claim 2, wherein: the oscillating structure (2) further comprises a plurality of rollers (27), the sliding plate (24) is connected with the rollers (27) in a rotating mode, and the rollers (27) are connected with the connecting plate (21) in a rolling mode.
4. The apparatus for cleaning a semiconductor device processing chip according to claim 2, wherein: limiting structure (3) include fixing base (31), filter screen board (32), filter screen (33), fixture block (34) and spacing spring (35), the inner wall of wasing case (7) rotates and is connected with fixing base (31), two are installed to the inner wall of fixing base (31) filter screen board (32), install between filter screen board (32) filter screen (33), chip body (6) are located two between filter screen board (32), the inner wall sliding connection of filter screen board (32) has fixture block (34), fixture block (34) with sliding connection between the inner wall of fixing base (31), fixture block (34) with be connected between filter screen board (32) spacing spring (35).
5. The apparatus for cleaning a semiconductor device processing chip according to claim 4, wherein: flip structure (4) include second motor (41), first gear (42), second gear (43) and pivot (44), install on wasing case (7) second motor (41), the one end of second motor (41) is fixed with first gear (42), the side of wasing case (7) is fixed with pivot (44), the one end of pivot (44) is fixed with second gear (43), first gear (42) with second gear (43) meshing.
6. The apparatus for cleaning a semiconductor device processing chip according to claim 4, wherein: the vibration plate (25) is positioned at the top of the fixed seat (31).
7. The apparatus for cleaning a semiconductor device processing chip as set forth in claim 2, wherein: the cross section of the sliding plate (24) is I-shaped.
8. The apparatus for cleaning a semiconductor device processing chip according to claim 1, wherein: the bottom of the cleaning box (7) is provided with a plurality of suckers (5).
9. The apparatus for cleaning a semiconductor device processing chip as set forth in claim 5, wherein: the diameter of the first gear (42) is smaller than the diameter of the second gear (43).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210884040.1A CN115401019A (en) | 2022-07-26 | 2022-07-26 | Chip cleaning device for semiconductor device processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210884040.1A CN115401019A (en) | 2022-07-26 | 2022-07-26 | Chip cleaning device for semiconductor device processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115401019A true CN115401019A (en) | 2022-11-29 |
Family
ID=84157804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210884040.1A Pending CN115401019A (en) | 2022-07-26 | 2022-07-26 | Chip cleaning device for semiconductor device processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115401019A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08141532A (en) * | 1994-11-25 | 1996-06-04 | Sharp Corp | Batchwise brush washing apparatus and method |
| JP2000232955A (en) * | 1999-02-15 | 2000-08-29 | Katsuya Iwamoto | Washing device for toasting net plate |
| CN109290266A (en) * | 2018-08-28 | 2019-02-01 | 老肯医疗科技股份有限公司 | A kind of medical instrument cleaning sterilizing device |
| CN211153722U (en) * | 2019-12-02 | 2020-08-04 | 井冈山市瓯峰农业科技有限公司 | Asparagus belt cleaning device |
| CN211275692U (en) * | 2019-09-30 | 2020-08-18 | 安徽省北斗中星机电科技有限公司 | Vibrating cleaning tool |
| CN112317444A (en) * | 2020-11-24 | 2021-02-05 | 湖南豪镨博德新材料科技有限公司 | Belt cleaning device is used in ceramic material production |
| CN213001536U (en) * | 2020-08-14 | 2021-04-20 | 湖南得琪电子科技有限公司 | Glass cleaning device is used in liquid crystal display production |
| CN112718686A (en) * | 2020-12-13 | 2021-04-30 | 宜昌高求光电有限公司 | High-efficient belt cleaning device of magnetic force vibrating optical lens piece |
| CN215430584U (en) * | 2021-07-26 | 2022-01-07 | 晋宁腾锐光学仪器工贸有限公司 | Ultrasonic nondestructive cleaning system for small-size optical lens |
-
2022
- 2022-07-26 CN CN202210884040.1A patent/CN115401019A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08141532A (en) * | 1994-11-25 | 1996-06-04 | Sharp Corp | Batchwise brush washing apparatus and method |
| JP2000232955A (en) * | 1999-02-15 | 2000-08-29 | Katsuya Iwamoto | Washing device for toasting net plate |
| CN109290266A (en) * | 2018-08-28 | 2019-02-01 | 老肯医疗科技股份有限公司 | A kind of medical instrument cleaning sterilizing device |
| CN211275692U (en) * | 2019-09-30 | 2020-08-18 | 安徽省北斗中星机电科技有限公司 | Vibrating cleaning tool |
| CN211153722U (en) * | 2019-12-02 | 2020-08-04 | 井冈山市瓯峰农业科技有限公司 | Asparagus belt cleaning device |
| CN213001536U (en) * | 2020-08-14 | 2021-04-20 | 湖南得琪电子科技有限公司 | Glass cleaning device is used in liquid crystal display production |
| CN112317444A (en) * | 2020-11-24 | 2021-02-05 | 湖南豪镨博德新材料科技有限公司 | Belt cleaning device is used in ceramic material production |
| CN112718686A (en) * | 2020-12-13 | 2021-04-30 | 宜昌高求光电有限公司 | High-efficient belt cleaning device of magnetic force vibrating optical lens piece |
| CN215430584U (en) * | 2021-07-26 | 2022-01-07 | 晋宁腾锐光学仪器工贸有限公司 | Ultrasonic nondestructive cleaning system for small-size optical lens |
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Application publication date: 20221129 |
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