CN115380074B - 固化性树脂组合物、固化物、及印刷电路板 - Google Patents

固化性树脂组合物、固化物、及印刷电路板 Download PDF

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Publication number
CN115380074B
CN115380074B CN202180026501.5A CN202180026501A CN115380074B CN 115380074 B CN115380074 B CN 115380074B CN 202180026501 A CN202180026501 A CN 202180026501A CN 115380074 B CN115380074 B CN 115380074B
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China
Prior art keywords
resin composition
curable resin
cured product
bisphenol
epoxy resin
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CN202180026501.5A
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Chinese (zh)
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CN115380074A (zh
Inventor
金泽康代
槙田升平
野口智崇
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Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/08—Epoxidised polymerised polyenes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
CN202180026501.5A 2020-03-31 2021-03-12 固化性树脂组合物、固化物、及印刷电路板 Active CN115380074B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020062179 2020-03-31
JP2020-062179 2020-03-31
PCT/JP2021/010035 WO2021200032A1 (ja) 2020-03-31 2021-03-12 硬化性樹脂組成物、硬化物、およびプリント配線板

Publications (2)

Publication Number Publication Date
CN115380074A CN115380074A (zh) 2022-11-22
CN115380074B true CN115380074B (zh) 2024-03-08

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Country Link
JP (1) JP7371321B2 (https=)
KR (1) KR102832902B1 (https=)
CN (1) CN115380074B (https=)
TW (1) TWI872226B (https=)
WO (1) WO2021200032A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118139929A (zh) * 2021-10-22 2024-06-04 东洋纺株式会社 导电性组合物
JP2023174097A (ja) * 2022-05-27 2023-12-07 住友ベークライト株式会社 基板材料用樹脂組成物、および半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002293882A (ja) * 2001-03-30 2002-10-09 Taiyo Ink Mfg Ltd 光硬化性・熱硬化性樹脂組成物及びプリント配線板
JP2008214413A (ja) * 2007-03-01 2008-09-18 Toray Ind Inc 熱硬化性樹脂組成物
CN105745213A (zh) * 2013-11-25 2016-07-06 四国化成工业株式会社 具有官能团的甘脲类及其利用
CN107207837A (zh) * 2015-01-21 2017-09-26 太阳油墨制造株式会社 热固化性树脂组合物、干膜、固化物和印刷电路板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3189988B2 (ja) * 1992-07-07 2001-07-16 住友ベークライト株式会社 絶縁樹脂ペースト
BR9910933A (pt) * 1998-06-02 2001-02-28 Bayer Ag Poliuretano-uréias, fibras de poliuretano-uréia e processo para a sua preparação
JP4343367B2 (ja) * 1999-12-17 2009-10-14 旭化成せんい株式会社 耐熱性に優れたポリウレタンウレア弾性繊維
ES2279017T3 (es) * 2002-02-23 2007-08-16 Bayer Materialscience Ag Procedimiento para la preparacion de elastomeros de poliuretano termoplasticos blandos bien desmoldeables con escasa contraccion.
JP5209888B2 (ja) * 2006-03-09 2013-06-12 昭和電工株式会社 熱硬化性樹脂組成物及びその用途
TW200908839A (en) 2007-08-09 2009-02-16 Nichigo Morton Co Ltd Solder mask, photoresist pattern forming method and the light-emitting device thereof
TWI466882B (zh) * 2009-09-29 2015-01-01 Fujifilm Corp 著色劑多聚體、著色硬化組成物、彩色濾光片及其製備方法
EP2829642A4 (en) * 2011-12-16 2015-12-16 Toray Opelontex Co Ltd ELASTIC POLYURETHANE FIBER AND METHOD FOR THE PRODUCTION THEREOF
JP2015121775A (ja) * 2013-11-20 2015-07-02 四国化成工業株式会社 光硬化性・熱硬化性樹脂組成物およびプリント配線板
JP7454906B2 (ja) * 2016-10-14 2024-03-25 株式会社レゾナック アンダーフィル材、電子部品装置及び電子部品装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002293882A (ja) * 2001-03-30 2002-10-09 Taiyo Ink Mfg Ltd 光硬化性・熱硬化性樹脂組成物及びプリント配線板
JP2008214413A (ja) * 2007-03-01 2008-09-18 Toray Ind Inc 熱硬化性樹脂組成物
CN105745213A (zh) * 2013-11-25 2016-07-06 四国化成工业株式会社 具有官能团的甘脲类及其利用
CN108164534A (zh) * 2013-11-25 2018-06-15 四国化成工业株式会社 具有官能团的甘脲类及其利用
CN107207837A (zh) * 2015-01-21 2017-09-26 太阳油墨制造株式会社 热固化性树脂组合物、干膜、固化物和印刷电路板

Also Published As

Publication number Publication date
WO2021200032A1 (ja) 2021-10-07
JP7371321B2 (ja) 2023-10-31
CN115380074A (zh) 2022-11-22
TW202202940A (zh) 2022-01-16
JPWO2021200032A1 (https=) 2021-10-07
KR20220140810A (ko) 2022-10-18
KR102832902B1 (ko) 2025-07-11
TWI872226B (zh) 2025-02-11

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