CN115339905B - Pick-up device and wafer picking mechanism - Google Patents
Pick-up device and wafer picking mechanism Download PDFInfo
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- CN115339905B CN115339905B CN202210975750.5A CN202210975750A CN115339905B CN 115339905 B CN115339905 B CN 115339905B CN 202210975750 A CN202210975750 A CN 202210975750A CN 115339905 B CN115339905 B CN 115339905B
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- magnetic component
- magnetic
- pickup device
- shaft hole
- suction nozzle
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H10P72/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G45/00—Lubricating, cleaning, or clearing devices
- B65G45/02—Lubricating devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
本发明提供一种拾取装置和晶片拾取机构，拾取装置包括：支架，驱动部件，第一磁性部件以及吸附旋柱，支架包括第一安装部和第二安装部；驱动部件设置于第一安装部；驱动部件与第一磁性部件传动连接；吸附旋柱设置于第二安装部；吸附旋柱包括吸嘴杆和固定于吸嘴杆上的第二磁性部件，第二磁性部件位于第一磁性部件一侧，并与第一磁性部件间隔设置，第一磁性部件通过非接触力磁耦合效应带动第二磁性部件绕自身中心轴旋转。本发明实施例的拾取装置通过第一磁性部件和第二磁性部件的磁力耦合作用实现非接触式传动，从而使磁吸旋柱旋转并实现非接触式角度控制，消除了摩擦力带来的力控精度误差。
The present invention provides a pickup device and a wafer pickup mechanism, the pickup device includes: a bracket, a driving component, a first magnetic component and an adsorption rotary column, the bracket includes a first mounting portion and a second mounting portion; the driving component is arranged on the first mounting portion; the driving component is in transmission connection with the first magnetic component; the adsorption rotary column is arranged on the second mounting portion; the adsorption rotary column includes a suction nozzle rod and a second magnetic component fixed on the suction nozzle rod, the second magnetic component is located on one side of the first magnetic component and is spaced apart from the first magnetic component, and the first magnetic component drives the second magnetic component to rotate around its own central axis through a non-contact force magnetic coupling effect. The pickup device of the embodiment of the present invention realizes non-contact transmission through the magnetic coupling effect of the first magnetic component and the second magnetic component, so that the magnetic attraction rotary column rotates and realizes non-contact angle control, eliminating the force control precision error caused by friction.
Description
Technical Field
The present invention relates to the field of semiconductor chip mounting apparatuses, and more particularly, to a pick-up device and a wafer pick-up mechanism.
Background
The assembly of semiconductor chips in production generally uses mounting equipment, and most of the current production schemes in industry use fixed continuous rails to implement the mounting process, wherein the practical pick-and-place equipment picks up chips from the supply end and sends the chips to the rails for mounting. The chip is required to be adjusted after being picked up, the chip is currently adjusted through structures such as belt transmission and connecting rods, the elastic mechanism is used for controlling the pressure of the suction nozzle patch, the friction force between the mechanisms is large, and large errors can be generated on the force control precision.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems in the related art to some extent. To this end, an embodiment of the present invention proposes a pickup apparatus including:
the bracket comprises a first mounting part and a second mounting part;
a driving member provided to the first mounting portion;
A first magnetic part, the driving part is in transmission connection with the first magnetic part to drive the first magnetic part to rotate, and
The adsorption spin column is arranged on the second installation part and can rotate around the central shaft of the support relative to the support, the adsorption spin column comprises a suction nozzle rod and a second magnetic component fixed on the suction nozzle rod, the suction nozzle rod is used for picking up a workpiece, the second magnetic component is positioned on one side of the first magnetic component and is arranged at intervals with the first magnetic component, and the first magnetic component drives the second magnetic component to rotate around the central shaft of the support through a non-contact force magnetic coupling effect.
According to the pickup device provided by the embodiment of the invention, the non-contact transmission is realized through the magnetic coupling action of the first magnetic component and the second magnetic component, so that the magnetic attraction rotating column rotates and the non-contact angle control is realized, and the force control precision error caused by friction force is eliminated.
Optionally, the first installation department is the installation flat board, just set up the drive shaft hole on the installation flat board, drive component is located the installation flat board upside, first magnetic component is located the installation flat board downside, drive component's transmission shaft passes the drive shaft hole with first magnetic component transmission is connected.
Optionally, the second installation part is a rotation shaft hole, and the suction nozzle rod is arranged in the rotation shaft hole in a penetrating way and is in clearance fit with the rotation shaft hole.
Optionally, the first magnetic component and the second magnetic component are both cylindrical, and the diameter of the first magnetic component is 2-4 times that of the second magnetic component.
Optionally, the second magnetic component has a central mating hole, and the suction nozzle rod is inserted through the central mating hole and is in interference fit with the central mating hole.
Optionally, the suction nozzle rod comprises a rod body and a limiting ring fixed on the rod body, the limiting ring and the rod body are coaxially arranged, and the second magnetic component is located on the upper side of the limiting ring.
Optionally, the second installation part is a rotation shaft hole, and the suction nozzle rod is arranged in the rotation shaft hole in a penetrating way;
the vacuum adsorption groove is formed in the upper side of the rotary shaft hole, the limiting ring covers the notch of the vacuum adsorption groove, and the bottom wall and/or the side wall of the vacuum adsorption groove are/is provided with a suction hole for communicating with a vacuum pumping device.
Optionally, a sealing gasket used for being in sealing fit with the limiting ring is arranged around the vacuum adsorption groove, and the sealing gasket supports the limiting ring.
The invention further provides a wafer pickup mechanism, which comprises a mounting table, a horizontal moving assembly arranged on the mounting table, a vertical moving assembly arranged on the horizontal moving assembly and a pickup device arranged on the vertical moving assembly, wherein the pickup device is the pickup device of the embodiment of the invention;
The horizontal moving assembly can drive the vertical moving assembly to reciprocate in the horizontal direction, and the vertical moving assembly can drive the pickup device to reciprocate in the vertical direction.
The wafer pickup mechanism of the present invention includes the pickup device of the present invention, so that a workpiece can be picked up flexibly and accurately, and posture adjustment of the workpiece is to be performed.
Optionally, the vertical moving component is provided with a crystal leakage detection device, and the crystal leakage detection device is used for detecting whether the pick-up device picks up the workpiece.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a schematic perspective view of a pick-up device according to an embodiment of the present invention;
FIG. 2 is an exploded view of a pickup device according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a pick-up device according to an embodiment of the present invention;
FIG. 4 is a schematic perspective view of a bracket according to an embodiment of the present invention;
figure 5 is a schematic perspective view of a wafer pick-up mechanism in accordance with one embodiment of the present invention.
Reference numerals:
10-bracket, 11-first mounting part, 111-transmission shaft hole, 12-second mounting part and 121-vacuum adsorption groove;
20-a driving part;
30-a first magnetic component;
40-adsorption rotary column, 41-suction nozzle rod, 411-body, 412-limit ring, 42-second magnetic component, 421-central matching hole and 43-suction nozzle.
50-Mounting;
60-a horizontal movement assembly;
70-a vertical movement assembly;
80-a crystal leakage detection device.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.
The invention provides a pickup device which can be used for picking up a workpiece and adjusting the posture of the workpiece, wherein the workpiece can be a wafer, and the pickup device is used for picking up the wafer and adjusting the posture of the wafer to a preset state.
Referring to fig. 1-3, in some embodiments, the pickup device mainly includes a holder 10, a driving part 20, a first magnetic part 30, and a suction spin column 40. The bracket 10 comprises a first mounting part 11 and a second mounting part 12, wherein a driving part 20 is arranged on the first mounting part 11, the driving part 20 can be a motor, and the driving part 20 is in transmission connection with the first magnetic part 30 so as to drive the first magnetic part 30 to rotate.
The suction spin column 40 is disposed on the second mounting portion 12 and can rotate around its central axis relative to the bracket 10, the suction spin column 40 includes a suction nozzle lever 41 and a second magnetic component 42 fixed on the suction nozzle lever 41, the suction nozzle lever 41 is used for picking up a workpiece, the second magnetic component 42 is disposed on one side of the first magnetic component 30 and is spaced from the first magnetic component 30, and the first magnetic component 30 drives the second magnetic component 42 to rotate around its central axis through a non-contact force magnetic coupling effect.
In the pickup device of the above embodiment, the first magnetic component 30 and the second magnetic component 42 are not in contact, the second magnetic component 42 drives the suction nozzle lever 41 to rotate synchronously, and in the rotating process, the main friction force is between the suction spin column 40 and the second mounting portion 12, no friction force exists between the first magnetic component 30 and the second magnetic component 42, transmission is realized between the two magnetic components through a non-contact force magnetic coupling effect, and the rotation angle is controlled accurately.
In some embodiments, referring to fig. 2 and 4, the first mounting portion 11 is a mounting plate, and the mounting plate is provided with a transmission shaft hole 111, the driving component 20 is located on the upper side of the mounting plate, the first magnetic component 30 is located on the lower side of the mounting plate, and a transmission shaft of the driving component 20 passes through the transmission shaft hole 111 and is in transmission connection with the first magnetic component 30.
The mounting plate may also be provided with bolt holes for fixing the driving member 20, and the driving member 20 is fixed to the mounting plate by bolts.
In some embodiments, the second mounting portion 12 is a rotation shaft hole, the axial direction of the rotation shaft hole is parallel to the axial direction of the transmission shaft of the driving component 20, the suction nozzle rod 41 is penetrated in the rotation shaft hole and is in clearance fit with the rotation shaft hole, so that the suction nozzle rod 41 can flexibly rotate under the constraint of the rotation shaft hole, and lubricating oil can be arranged in the rotation shaft hole, so that the friction force of rotation of the suction nozzle rod 41 is reduced, and the rotation precision is improved.
In some embodiments, the bracket 10 further has a fixing portion for fixing, through which the bracket 10 can be stably mounted on a designated device, as shown in fig. 2, the first mounting portion 11 of the bracket 10 is a mounting plate, a side edge of the mounting plate is connected to a vertical fixing plate, i.e. the fixing portion, and a lower end of the fixing plate is connected to a trapezoidal platform, on which a rotation shaft hole (i.e. the second mounting portion 12) is formed.
Illustratively, the entire stent 10 may be integrally formed and may be manufactured by casting or machining.
In some embodiments, the first magnetic component 30 and the second magnetic component 42 are both cylindrical, and the diameter of the first magnetic component 30 is 2-4 times that of the second magnetic component 42, so that the adsorbing spin column 40 is lighter in whole and easier to drive, and the first magnetic component 30 is larger in size and stronger in magnetism, so that the second magnetic component 42 can be driven more stably and more accurately.
Specifically, the first magnetic member 30 and the second magnetic member 42 may each employ a permanent magnet.
In some embodiments, the second magnetic component 42 has a central mating hole 421, and the nozzle bar 41 is inserted through the central mating hole 421 and is in interference fit with the central mating hole 421, so as to ensure that the second magnetic component 42 and the nozzle bar 41 are relatively fixed, and can rotate synchronously.
The second magnetic member 42 and the nozzle lever 41 may be fixedly connected in other manners as long as they can be ensured to rotate synchronously.
Specifically, the nozzle lever 41 includes a lever body 411 and a stopper ring 412 fixed to the lever body 411, the stopper ring 412 is coaxially disposed with the lever body 411, and the second magnetic member 42 is located on the upper side of the stopper ring 412. By providing the stopper ring 412, the adsorption spin column 40 can be prevented from slipping down from the rotation shaft hole of the bracket 10.
Wherein, the lever body 411 and the stop collar 412 may be integrally formed.
In some embodiments, referring to fig. 4, the second mounting portion 12 is a rotation shaft hole, the suction nozzle rod 41 is penetrating through the rotation shaft hole, the upper side of the rotation shaft hole is provided with a vacuum suction groove 121, the limiting ring 412 covers the notch of the vacuum suction groove 121, and the bottom wall and/or the side wall of the vacuum suction groove 121 is provided with a suction hole for communicating with a vacuum pumping device. The vacuumizing device can generate an adsorption force on the limiting ring 412 by vacuumizing the vacuum adsorption groove 121, when a workpiece is picked up, the pickup device moves downwards, and after the suction nozzle rod 41 contacts the workpiece, the suction nozzle rod can be jacked up, so that the limiting ring 412 is separated from the vacuum adsorption groove 121, and whether the workpiece is picked up or not can be judged by detecting the air pressure in the vacuum adsorption groove 121.
Further, in order to further secure sealability, a gasket for sealing engagement with the stopper ring 412 is provided around the vacuum adsorption groove 121, the gasket supporting the stopper ring 412. By providing the gasket, the tightness between the limit ring 412 and the vacuum adsorption groove 121 can be improved, so that when a workpiece is picked up, the air pressure in the vacuum adsorption groove 121 changes more obviously, and the detection device for judging whether the workpiece is picked up or not can detect more accurately.
In some embodiments, the suction spin column 40 further includes a suction nozzle 43 provided at a lower end of the suction nozzle bar 41, and the suction nozzle 43 sucks the workpiece and moves to a designated position along with the suction nozzle bar 41. The suction nozzle lever 41 has a through hole at its center and a vacuum apparatus connected to the upper end thereof, and vacuum is applied to the suction nozzle 43 to suck the workpiece.
Specifically, the vacuum suction groove 121 is circular and surrounds the nozzle bar 41.
Referring to fig. 5, there is further provided a wafer pickup mechanism in this embodiment, the wafer pickup mechanism includes a mounting table 50, a horizontal moving assembly 60 disposed on the mounting table 50, a vertical moving assembly 70 disposed on the horizontal moving assembly 60, and a pickup device disposed on the vertical moving assembly 70, the pickup device being the pickup device of any one of the above embodiments, the horizontal moving assembly 60 being capable of driving the vertical moving assembly 70 to reciprocate in a horizontal direction, and the vertical moving assembly 70 being capable of driving the pickup device to reciprocate in a vertical direction.
The horizontal moving assembly 60 and the vertical moving assembly 70 are matched, so that the workpiece picked up by the pick-up device can be moved to a designated position, and the gesture of the workpiece is controlled by the pick-up device, so that the workpiece processing efficiency is improved.
Wherein, the horizontal moving assembly 60 and the vertical moving assembly 70 can both adopt screw transmission, or belt rotation, or linear motor transmission, and the guide rail can be arranged to improve the accuracy of the direction.
In some embodiments, the vertical movement assembly 70 is provided with a leaky crystal detection device 80, the leaky crystal detection device 80 being used to detect whether the pick-up device picks up a workpiece. When the workpiece is not detected, the next work is not performed, so that invalid operation is avoided to run for a long time, and the working efficiency is improved.
Wherein the pick-up device in the wafer pick-up mechanism is used for picking up wafers, i.e. the above-mentioned workpieces, i.e. wafers.
Other similar workpieces may be picked up by the pick-up device as well, as will be apparent to those skilled in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
For purposes of this disclosure, the terms "one embodiment," "some embodiments," "example," "a particular example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.
Claims (7)
1. A pickup device, comprising:
A bracket (10), the bracket (10) comprising a first mounting portion (11) and a second mounting portion (12);
A driving member (20), wherein the driving member (20) is provided to the first mounting portion (11);
A first magnetic member (30), the driving member (20) being in driving connection with the first magnetic member (30) to drive the first magnetic member (30) to rotate, and
The suction rotary column (40) is arranged on the second installation part (12) and can rotate around a central axis of the suction rotary column relative to the bracket (10), the suction rotary column (40) comprises a suction nozzle rod (41) and a second magnetic component (42) fixed on the suction nozzle rod (41), the suction nozzle rod (41) is used for picking up a workpiece, the second magnetic component (42) is positioned on one side of the first magnetic component (30) and is arranged at intervals with the first magnetic component (30), and the first magnetic component (30) drives the second magnetic component (42) to rotate around the central axis of the suction rotary column through a non-contact force magnetic coupling effect;
the second magnetic component (42) is provided with a central matching hole (421), and the suction nozzle rod (41) is penetrated through the central matching hole (421) and is in interference fit with the central matching hole (421);
The suction nozzle rod (41) comprises a rod body (411) and a limiting ring (412) fixed on the rod body (411), the limiting ring (412) and the rod body (411) are coaxially arranged, and the second magnetic component (42) is positioned on the upper side of the limiting ring (412);
the second installation part (12) is a rotary shaft hole, and the suction nozzle rod (41) penetrates through the rotary shaft hole;
The upper side of the rotary shaft hole is provided with a vacuum adsorption groove (121), the limiting ring (412) covers the notch of the vacuum adsorption groove (121), and the bottom wall and/or the side wall of the vacuum adsorption groove (121) are/is provided with a suction hole for communicating with a vacuum pumping device.
2. The pickup device according to claim 1, wherein the first mounting portion (11) is a mounting plate, and the mounting plate is provided with a transmission shaft hole (111), the driving member (20) is located at an upper side of the mounting plate, the first magnetic member (30) is located at a lower side of the mounting plate, and a transmission shaft of the driving member (20) passes through the transmission shaft hole (111) and is in transmission connection with the first magnetic member (30).
3. The pickup apparatus according to claim 1, wherein the second mounting portion (12) is a rotation shaft hole, and the nozzle lever (41) is provided to pass through the rotation shaft hole and is clearance-fitted with the rotation shaft hole.
4. The pickup apparatus according to claim 1, wherein the first magnetic member (30) and the second magnetic member (42) each have a cylindrical shape, and the diameter of the first magnetic member (30) is 2 to 4 times the diameter of the second magnetic member (42).
5. The pickup device according to claim 1, wherein a gasket for sealing engagement with the retainer ring (412) is provided around the vacuum suction groove (121), the gasket supporting the retainer ring (412).
6. A wafer pickup mechanism, comprising a mounting table (50), a horizontal moving assembly (60) provided on the mounting table (50), a vertical moving assembly (70) provided on the horizontal moving assembly (60), and a pickup device provided on the vertical moving assembly (70), the pickup device being the pickup device according to any one of claims 1 to 5;
The horizontal moving assembly (60) can drive the vertical moving assembly (70) to reciprocate in the horizontal direction, and the vertical moving assembly (70) can drive the pickup device to reciprocate in the vertical direction.
7. Wafer pickup mechanism according to claim 6, characterized in that the vertical movement assembly (70) is provided with a leaky crystal detection device (80), the leaky crystal detection device (80) being adapted to detect whether the pickup device picks up a workpiece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210975750.5A CN115339905B (en) | 2022-08-15 | 2022-08-15 | Pick-up device and wafer picking mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210975750.5A CN115339905B (en) | 2022-08-15 | 2022-08-15 | Pick-up device and wafer picking mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115339905A CN115339905A (en) | 2022-11-15 |
| CN115339905B true CN115339905B (en) | 2025-03-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210975750.5A Active CN115339905B (en) | 2022-08-15 | 2022-08-15 | Pick-up device and wafer picking mechanism |
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| CN (1) | CN115339905B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN219958955U (en) * | 2023-04-06 | 2023-11-03 | 苏州联讯仪器股份有限公司 | Automatic chip picking and placing mechanism |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103915368A (en) * | 2014-04-02 | 2014-07-09 | 华中科技大学 | Chip picking and placing device |
| CN214081425U (en) * | 2020-09-29 | 2021-08-31 | 武汉锐科光纤激光技术股份有限公司 | Chip suction device |
| CN217847894U (en) * | 2022-08-15 | 2022-11-18 | 恩纳基智能科技无锡有限公司 | Non-contact force-control transfer structure |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110137602A (en) * | 2010-06-17 | 2011-12-23 | 한미반도체 주식회사 | Bond head of die bonding device |
| CN208608181U (en) * | 2018-07-27 | 2019-03-15 | 广东阿达智能装备有限公司 | Wafer level inversion machine and its pick device |
| CN214732765U (en) * | 2021-01-29 | 2021-11-16 | 亚智科技股份有限公司 | Magnetic wheel transmission device |
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- 2022-08-15 CN CN202210975750.5A patent/CN115339905B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103915368A (en) * | 2014-04-02 | 2014-07-09 | 华中科技大学 | Chip picking and placing device |
| CN214081425U (en) * | 2020-09-29 | 2021-08-31 | 武汉锐科光纤激光技术股份有限公司 | Chip suction device |
| CN217847894U (en) * | 2022-08-15 | 2022-11-18 | 恩纳基智能科技无锡有限公司 | Non-contact force-control transfer structure |
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