CN115312480B - 一种用于igbt功率模块的dbc基板 - Google Patents
一种用于igbt功率模块的dbc基板 Download PDFInfo
- Publication number
- CN115312480B CN115312480B CN202211240557.3A CN202211240557A CN115312480B CN 115312480 B CN115312480 B CN 115312480B CN 202211240557 A CN202211240557 A CN 202211240557A CN 115312480 B CN115312480 B CN 115312480B
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- CN
- China
- Prior art keywords
- igbt power
- power module
- assembly
- air
- heat
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
- H10W70/24—Conductive package substrates serving as an interconnection, e.g. metal plates characterised by materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211240557.3A CN115312480B (zh) | 2022-10-11 | 2022-10-11 | 一种用于igbt功率模块的dbc基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211240557.3A CN115312480B (zh) | 2022-10-11 | 2022-10-11 | 一种用于igbt功率模块的dbc基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115312480A CN115312480A (zh) | 2022-11-08 |
| CN115312480B true CN115312480B (zh) | 2023-01-24 |
Family
ID=83868488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211240557.3A Active CN115312480B (zh) | 2022-10-11 | 2022-10-11 | 一种用于igbt功率模块的dbc基板 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115312480B (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119725270B (zh) * | 2025-02-21 | 2025-05-06 | 苏州中瑞宏芯半导体有限公司 | 一种持续稳定冷却运行的多芯片功率模块 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100426639C (zh) * | 2007-01-04 | 2008-10-15 | 冶金自动化研究设计院 | 一种高压集成门极换向晶闸管三电平变频功率柜 |
| JP4846638B2 (ja) * | 2007-03-26 | 2011-12-28 | 株式会社トプコン | 表面検査装置 |
| JP2011135643A (ja) * | 2009-12-22 | 2011-07-07 | Toshiba Mitsubishi-Electric Industrial System Corp | 電力変換装置 |
| CN201699569U (zh) * | 2010-04-22 | 2011-01-05 | 深圳市禾望电气有限公司 | 一种igbt功率模块系统 |
| WO2014057622A1 (ja) * | 2012-10-09 | 2014-04-17 | 富士電機株式会社 | 電力変換装置 |
| CN104393739A (zh) * | 2014-11-03 | 2015-03-04 | 浙江海得新能源有限公司 | 一种功率柜散热系统 |
| CN212485324U (zh) * | 2020-06-19 | 2021-02-05 | 南京晟芯半导体有限公司 | 一种SiC MOSFET模块陶瓷覆铜板结构 |
| CN214797400U (zh) * | 2021-04-16 | 2021-11-19 | 合肥中恒微半导体有限公司 | 一种高电流密度的igbt功率模块 |
| CN113793841B (zh) * | 2021-09-16 | 2023-07-28 | 合肥工业大学 | 平衡多芯片并联功率模块电流的dbc基板结构 |
| CN216216480U (zh) * | 2021-10-22 | 2022-04-05 | 株洲变流技术国家工程研究中心有限公司 | 一种风电变流器功率柜及风电变流器 |
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2022
- 2022-10-11 CN CN202211240557.3A patent/CN115312480B/zh active Active
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| Publication number | Publication date |
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| CN115312480A (zh) | 2022-11-08 |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
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| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20221108 Assignee: Anhui Xingtai Financial Leasing Co.,Ltd. Assignor: Hefei Zhongheng Micro Semiconductor Co.,Ltd. Contract record no.: X2024980005797 Denomination of invention: A DBC substrate for IGBT power modules Granted publication date: 20230124 License type: Exclusive License Record date: 20240517 |
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| EE01 | Entry into force of recordation of patent licensing contract | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A DBC substrate for IGBT power modules Granted publication date: 20230124 Pledgee: Anhui Xingtai Financial Leasing Co.,Ltd. Pledgor: Hefei Zhongheng Micro Semiconductor Co.,Ltd. Registration number: Y2024980017926 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20230124 Pledgee: Anhui Xingtai Financial Leasing Co.,Ltd. Pledgor: Hefei Zhongheng Micro Semiconductor Co.,Ltd. Registration number: Y2024980017926 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| EC01 | Cancellation of recordation of patent licensing contract | ||
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Anhui Xingtai Financial Leasing Co.,Ltd. Assignor: Hefei Zhongheng Micro Semiconductor Co.,Ltd. Contract record no.: X2024980005797 Date of cancellation: 20250827 |