CN115295466A - Silicon wafer taking device and method - Google Patents

Abstract

The invention discloses a silicon wafer removal device and a wafer removal method. The wafer removal device comprises a device main body, a lifting link mechanism, an alignment mechanism and a suction cup module arranged on the device main body. The positioning mechanism is connected with the suction cup module, and the positioning mechanism can drive the suction cup module to move in the X direction, the Y direction and the R direction; the suction cup module includes a fixed bracket, a lateral moving component, a longitudinal moving component and a suction cup component, and the vertical moving component Connected with the fixed bracket, the lateral movement component is fixed on the fixed bracket, and the lateral movement component is connected with the suction cup component. The invention can automatically realize the fetching of the silicon wafers on the carrier, improve the fetching efficiency of the silicon wafers, and save the labor cost.

Description

Device and method for taking silicon wafers

technical field

The invention relates to the field of solar cells, more specifically, a device and method for taking silicon wafers.

Background technique

Solar cells are divided into crystalline silicon and amorphous silicon, and crystalline silicon cells can be divided into monocrystalline cells and polycrystalline cells. Silicon wafers are the carrier of solar cells, and the quality of silicon wafers directly determines the conversion efficiency of solar cells.

In the production process of solar cells, it is necessary to take silicon wafers to conveying devices such as conveyor belts and transport them to different processes for processing. In the prior art, the removal of the silicon wafers from the carrier is generally done manually, but the manual removal efficiency is low and the labor cost is high.

Contents of the invention

The object of the present invention is to provide a device and a method for taking silicon wafers, which can automatically realize the taking of silicon wafers on the carrier, improve the efficiency of taking silicon wafers, and save labor costs.

Its technical scheme is as follows:

In one embodiment, the present invention discloses a device for taking silicon wafers, which includes a main body of the device, a lifting link mechanism, an alignment mechanism, and a suction cup module arranged on the main body of the device, a lifting link mechanism, an alignment mechanism, and a suction cup The modules are connected, and the alignment mechanism can drive the suction cup module to move in the X direction, Y direction and R direction; the suction cup module includes a fixed bracket, a horizontal movement component, a vertical movement component and a suction cup component, and the vertical movement component is connected with the fixed bracket , the lateral moving assembly is fixed on the fixed bracket, and the lateral moving assembly is connected with the suction cup assembly.

Further, there are a plurality of suction cup modules, and the plurality of suction cup modules are all connected to the alignment mechanism, and the plurality of suction cup modules are arranged along the transverse direction of the device main body.

Further, the lift linkage mechanism includes a lift fixing plate, a lift drive assembly, two lift ball screw assemblies and a connecting rod assembly, the lift drive assembly is connected with the two lift ball screw assemblies, and the lift ball screw assembly It is connected with the connecting rod assembly, the connecting rod assembly is connected with the lifting fixed plate, and the suction cup module is fixed on the lifting fixed plate.

Further, the lifting drive assembly includes a lifting fixed bracket, a servo motor, a driving wheel, two driven wheels, two guide wheels and a transmission belt, the servo motor is fixed on the lifting fixed frame, the servo motor is connected with the driving wheel, and the driving wheel passes through The transmission belt is connected with the two driven wheels, and the two guide wheels are respectively connected with the transmission belt, and the two guide wheels are respectively located between the driving wheel and the two driven wheels.

Further, the lifting guide rails are respectively provided on opposite sides of the lifting fixing frame, the two lifting ball screw assemblies are respectively connected with the lifting guide rails on both sides, and the two driven wheels are respectively connected with the two lifting ball screw assemblies.

Further, the alignment mechanism includes an alignment platform, and the alignment platform is provided with an X-axis alignment assembly, a Y-axis alignment assembly and a plurality of R-axis alignment assemblies, an X-axis alignment assembly, and a Y-axis alignment assembly. They are respectively connected with the R-axis alignment components, and multiple R-axis alignment components are connected with the lifting linkage mechanism.

Further, the X-axis alignment assembly includes an X-axis driving motor, an X-axis ball screw assembly, an X-axis moving connecting plate and an X-axis moving guide rail, the X-axis driving motor is connected with the X-axis ball screw assembly, and the X-axis moves The connecting plate is connected with the X-axis ball screw assembly, the X-axis moving connecting plate is connected with the R-axis alignment assembly, and the R-axis alignment assembly is connected with the X-axis moving guide rail.

Further, the R-axis alignment assembly includes an R-axis fixing seat, an alignment guide rail, a UVW three-phase motor and a motor fixing plate, the R-axis fixing seat is connected with the X-axis alignment assembly or the Y-axis alignment assembly, and the R-axis is fixed The seat is connected with the alignment guide rail through the slider, the alignment guide rail is fixed on the motor fixing plate, and the UVW three-phase motor is fixed on the motor fixing plate.

Further, the lateral movement assembly includes a transverse movement drive cylinder, a transverse movement connection block, a transverse movement guide rail and a plurality of suction cup connection plates, the transverse movement drive cylinder is connected with the transverse movement connection block, and the transverse movement connection block is connected with a suction cup connection plate , a plurality of sucker connecting plates are respectively connected with the laterally moving guide rails, and the adjacent sucker connecting plates are respectively connected through moving guide plates, and guide grooves are provided on the moving guide plates, and the sucker connecting plates are connected to adjacent ones through moving guide plates and guide grooves. The suction cup connection plates are connected; the suction cup module includes a plurality of suction cup assemblies, and the plurality of suction cup assemblies are respectively connected with a plurality of suction cup connection plates, and the fixing bracket is provided with a plurality of limiting grooves, and the plurality of suction cup assemblies are located in the limiting grooves.

In another embodiment, the present invention discloses a method for taking silicon wafers, comprising the following steps:

Adjust the position of the suction cup module in the X direction, Y direction and R direction through the alignment mechanism according to the placement position of the silicon wafer on the carrier;

The lateral movement component and the vertical movement component of the suction cup module adjust the positions of the plurality of suction cup components of the suction cup module in the horizontal direction and the longitudinal direction respectively;

The lifting link mechanism drives the suction cup assembly to move downward, and the silicon wafer is sucked by the suction cup assembly.

Advantages or principles of the present invention are described below:

The present invention is provided with a lifting link mechanism, an alignment mechanism and a suction cup module on the main body of the device, and a suction cup assembly is provided on the suction cup module. The position of the suction cup assembly can be adjusted in the X direction, the Y direction and the R direction through the alignment mechanism, and the distance between the suction cup assemblies can also be adjusted by moving the assembly laterally. The invention can adjust the suction cup assembly according to the silicon wafer on the carrier plate, and can absorb the silicon wafer through the suction cup assembly, so as to realize the automatic taking of the silicon wafer, improve the taking efficiency of the silicon wafer, and save the labor cost.

Description of drawings

Fig. 1 is the structural representation of silicon chip taking device;

Fig. 2 is another schematic structural view of the silicon wafer taking device;

Fig. 3 is a structural schematic diagram of the sucker module;

Fig. 4 is the structural representation of lifting link mechanism;

Fig. 5 is a schematic structural view of the alignment mechanism;

Fig. 6 is another schematic structural view of the alignment mechanism;

Explanation of reference signs:

10. Device main body; 20. Lifting linkage mechanism; 30. Alignment mechanism; 40. Suction cup module; 50. Silicon wafer; 41. Fixed bracket; ; 420, laterally moving drive cylinder; 421, laterally moving connecting block; 422, laterally moving guide rail; 423, moving guide plate; 424, guiding groove; 425, sucker connecting plate; 21, lifting fixed plate; 22, lifting drive assembly; 23, lifting ball screw assembly; 24, connecting rod assembly; 25, lifting connecting frame; 220, servo motor; 221, driving wheel; 222, driven wheel; 223, Guide wheel; 224, transmission belt; 225, lifting guide rail; 31, alignment platform; 32, X-axis alignment assembly; 33, Y-axis alignment assembly; 34, R-axis alignment assembly; 320, X-axis drive motor; 321 , X-axis ball screw assembly; 322, X-axis moving connecting plate; 323, X-axis moving guide rail; 330, Y-axis driving motor; 331, Y-axis ball screw assembly; 332, Y-axis moving connecting plate; 333, Y Axis moving guide rail; 340, R-axis fixed seat; 341, alignment guide rail; 342, UVW three-phase motor; 343, motor fixing plate.

Detailed ways

In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "middle", The orientation or positional relationship indicated by "inside" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, Constructed and operative in a particular orientation and therefore are not to be construed as limitations of the invention. In addition, the terms "first", "second", etc. are used for descriptive purposes only, and should not be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, a feature defined as "first", "second", etc. may expressly or implicitly include one or more of that feature. In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be directly connected, or indirectly connected through an intermediary, and it can be the internal communication of two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention based on specific situations.

The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

As shown in Fig. 1 and Fig. 2, the present invention discloses a device for taking silicon wafers in one embodiment, including a device main body 10, and a lifting linkage mechanism 20, an alignment mechanism 30 and a suction cup arranged on the device main body 10 Module 40. Wherein, the lifting link mechanism 20 is connected with the alignment mechanism 30 and the suction cup module 40 , and the alignment mechanism 30 can drive the suction cup module 40 to move in the X direction, the Y direction and the R direction. The lifting link mechanism 20 can drive the suction cup module 40 to move up and down.

Preferably, the silicon wafer taking device is connected with an external gantry, and the whole silicon wafer taking device is driven to move by the gantry. After the silicon wafer picking device absorbs the silicon wafer 50 through the sucker module 40 , it is driven by the gantry to move to the conveyor belt to transport the silicon wafer 50 .

In order to realize the taking of the silicon wafer 50, the sucker module 40 of the present embodiment includes a fixed support 41, a lateral movement assembly 42, a longitudinal movement assembly 43 and a suction cup assembly 44, the longitudinal movement assembly 43 is connected with the fixed support 41, and the transverse movement assembly 42 Fixed on the fixed bracket 41 , the lateral movement component 42 is connected with the sucker component 44 .

Preferably, there are four suction cup modules 40 in this embodiment, and the four suction cup modules 40 are all connected to the alignment mechanism 30 and the lifting linkage mechanism 20, and the four suction cup modules 40 are arranged along the lateral direction of the device main body 10 arrangement. Each suction cup module 40 includes six suction cup assemblies 44, and each suction cup assembly 44 is provided with two vacuum chucks, and each suction cup module 40 can simultaneously suck six silicon wafers 50 through six suction cup assemblies 44, each The silicon wafer 50 is picked up simultaneously by two vacuum chucks.

As shown in Figure 3, in order to realize the adjustment of the suction cup assembly 44 of each suction cup module 40 in the lateral direction, the lateral movement assembly 42 includes a lateral movement drive cylinder 420, a lateral movement connection block 421, a lateral movement guide rail 422 and six suction cup connections. Board 425. The laterally moving driving cylinder 420 is connected with the laterally moving connecting block 421 , the laterally moving connecting block 421 is connected with one of the sucker connecting plates 425 , and the six sucker connecting plates 425 are respectively connected with the laterally moving guide rails 422 . Adjacent sucker connecting plates 425 are connected by moving guide plates 423 respectively. Guide grooves 424 are provided on the moving guide plates 423 .

Preferably, in this embodiment, as shown in FIG. 3 , a first moving guide plate 423 is fixed on the first suction cup connecting plate 425 at the front, and a first moving guide plate 423 is provided with a The guide groove 424 and the second sucker connecting plate 425 adjacent to the first sucker connecting plate 425 are provided with screws etc., and the screws are placed in the guiding groove 424 of the first moving guide plate 423 . The second suction cup connecting plate 425 is fixed with a second moving guide plate 423, which is also provided with a guide groove 424 on the second moving guiding plate 423, and the third sucking cup connecting plate 425 is provided with screws etc. In the guide groove 424 on the second moving guide plate 423 . The third suction cup connecting plate 425 is fixed with a third mobile guide plate 423, the third mobile guide plate 423 is provided with a guide groove 424, and the screw on the fourth suction cup connecting plate 425 is fixed on the third mobile guide plate 425. In the guide groove 424 of the guide plate 423 . The fourth suction cup connecting plate 425 is fixed with a fourth mobile guide plate 423, the fourth mobile guide plate 423 is provided with a guide groove 424, the screw on the fifth suction cup connecting plate 425 is placed on the fourth mobile guide In the guide groove 424 of the plate 423 . The fifth mobile guide plate 423 is fixed on the sixth sucker connecting plate 425, and the fifth mobile guide plate 423 is provided with a guide groove 424, and the screw on the fifth sucker connecting plate 425 is placed on the fifth mobile guide plate. In the guide groove 424 of the plate 423 . A plurality of limiting grooves 427 are provided on the fixing bracket 41 , and the suction cup assembly 44 is located in the plurality of limiting grooves 427 .

After the lateral movement driving cylinder 420 is started, the lateral movement driving cylinder 420 drives the lateral movement connection block 421 to move, and the lateral movement connection block 421 drives the suction cup connection plate 425 connected to it to move, and the suction cup connection plate 425 drives other suction cups to connect through the moving guide plate 423. Plate 425 moves. During the movement, the suction cup connecting plate 425 drives the suction cup assembly 44 connected thereto to move, so as to achieve the purpose of adjusting the suction cup assembly 44 in the lateral direction. Since the guide groove 424 is provided on the moving guide plate 423, and the lengths of the plurality of limit grooves 427 are different, the movement of the suction cup assembly 44 is restricted by the limit groove 427 and the guide groove 424, thereby realizing the adjustment of the suction cup assembly 44 in the lateral direction purpose of spacing. The spacing between the silicon wafers 50 is relatively small, and the silicon wafers 50 can be sucked when the distance before the suction cup assembly 44 is small. 50 placed on the conveyor belt.

The longitudinal movement assembly 43 includes two longitudinal movement driving cylinders 431 , and the two longitudinal movement driving cylinders 431 are respectively connected with the fixed bracket 41 . After the two longitudinal moving driving cylinders 431 are activated, the fixed bracket 41 is driven to move up and down, and then the suction cup assembly 44 fixed on the fixed bracket 41 is driven to move up and down.

As shown in Figure 4, the lifting link mechanism 20 can simultaneously drive four sucker modules 40 to move up and down. The lifting link mechanism 20 of this embodiment includes a lifting fixing plate 21, a lifting drive assembly 22, and two lifting ball screw assemblies. 23 and two connecting rod assemblies 24. Wherein, the lifting drive assembly 22 is connected with two lifting ball screw assemblies 23, and the two lifting ball screw assemblies 23 are respectively connected with two connecting rod assemblies 24, and the two connecting rod assemblies 24 are respectively connected with the lifting fixed plate 21 , The suction cup module 40 is fixed on the lifting and fixing plate 21 .

Preferably, the lifting link assembly 24 of this embodiment further includes a lifting connecting frame 25 connected to the lifting fixing plate 21, a guide rail is arranged on the lifting connecting frame 25, and the alignment mechanism 30 is connected to the guiding rail through a slider. The longitudinal movement driving cylinder 431 is fixed on the lifting connecting frame 25 , and the connecting rod assembly 24 is connected with the lifting connecting frame 25 .

In order to realize lifting drive, the lifting drive assembly 22 includes a lifting fixed bracket, a servo motor 220 , a driving wheel 221 , two driven wheels 222 , two guide wheels 223 and a transmission belt 224 . Servo motor 220 is fixed on the lifting fixed frame, servo motor 220 links to each other with driving wheel 221, and driving wheel 221 links to each other with two driven wheels 222 through transmission belt 224, and two guide wheels 223 link to each other with transmission belt 224 respectively, and two guide wheels 223 respectively Located between the driving wheel 221 and the two driven wheels 222 . The two opposite sides of the lifting fixture are respectively provided with lifting guide rails 225, and the two lifting ball screw assemblies 23 are respectively connected with the lifting guide rails 225 on both sides, and the two driven wheels 222 are connected with the two lifting ball screw assemblies 23 respectively. connected.

After the servo motor 220 starts, it drives the driving wheel 221 to rotate. The driving wheel 221 drives the two driven wheels 222 to rotate through the transmission belt 224. The two driven wheels 222 drive the two lifting ball screws to rotate. During the rotation of the two lifting ball screws, they drive The two link assemblies 24 move up or down, and then drive the suction cup module 40 to move up or down.

As shown in Figures 5 and 6, the alignment mechanism 30 of this embodiment includes an alignment platform 31, on which an X-axis alignment assembly 32, a Y-axis alignment assembly 33 and a plurality of R-axis alignment assemblies are arranged. Component 34. Wherein, the X-axis alignment assembly 32 and the Y-axis alignment assembly 33 are respectively connected to the R-axis alignment assembly 34 , and a plurality of R-axis alignment assemblies 34 are connected to the lifting linkage mechanism 20 . Preferably, in this embodiment, there is one X-axis alignment assembly 32 , two Y-axis alignment assemblies 33 , and four R-axis alignment assemblies 34 . The X-axis alignment assembly 32 is connected to one R-axis alignment assembly 34, two Y-axis alignment assemblies 33 are respectively connected to two R-axis alignment assemblies 34, and one R-axis alignment assembly 34 is connected to the X-axis alignment assembly. The assembly 32 and the Y-axis alignment assembly 33 are not connected.

Further, the X-axis alignment assembly 32 includes an X-axis driving motor 320 , an X-axis ball screw assembly 321 , an X-axis moving connecting plate 322 and an X-axis moving guide rail 323 . The X-axis driving motor 320 is connected with the X-axis ball screw assembly 321, the X-axis moving connecting plate 322 is connected with the X-axis ball screw assembly 321, the X-axis moving connecting plate 322 is connected with the R-axis alignment assembly 34, and the R-axis alignment The component 34 is connected with the X-axis moving guide rail 323 .

The Y-axis alignment assembly 33 includes a Y-axis driving motor 330 , a Y-axis ball screw assembly 331 , a Y-axis moving connecting plate 332 and a Y-axis moving guide rail 333 . The Y-axis driving motor 330 is connected with the Y-axis ball screw assembly 331 , the Y-axis moving connecting plate 332 is connected with the R-axis alignment assembly 34 , and the R-axis alignment assembly 34 is connected with the Y-axis moving guide rail 333 .

The R-axis alignment assembly 34 includes an R-axis fixing seat 340, an alignment guide rail 341, a UVW three-phase motor 342, and a motor fixing plate 343. The R-axis fixing seat 340 is connected to the X-axis alignment assembly 32 or the Y-axis alignment assembly 33; Or the R-axis fixing seat 340 is directly connected with the X-axis moving guide rail 323 . The R-axis fixing seat 340 is connected to the alignment guide rail 341 through a slider, the alignment guide rail 341 is fixed on the motor fixing plate 343 , and the UVW three-phase motor 342 is fixed on the motor fixing plate 343 . The alignment guide rail 341 is perpendicular to the X-axis moving guide rail 323 or the Y-axis moving guide rail 333 .

In this embodiment, the alignment operation of the suction cup module 40 in the X-axis direction can be realized through the X-axis alignment component 32 , and the alignment operation of the suction cup module 40 in the Y-axis direction can be realized through the Y-axis alignment component 33 . The rotation of the sucker module 40 can be realized through the R-axis fixing seat 340 .

In this embodiment, a lifting linkage mechanism 20 , an alignment mechanism 30 , and a suction cup module 40 are provided on the device main body 10 , and a suction cup assembly 44 is provided on the suction cup module 40 . The position of the suction cup assembly 44 can be adjusted in the X direction, the Y direction and the R direction through the alignment mechanism 30 , and the distance between the suction cup assemblies 44 can also be adjusted through the lateral movement assembly 42 . In this embodiment, the suction cup assembly 44 can be adjusted according to the silicon wafer 50 on the carrier plate, and the silicon wafer 50 can be sucked by the suction cup assembly 44, so as to realize the automatic removal of the silicon wafer 50, improve the removal efficiency, and save labor costs. The device for picking up silicon wafers in this embodiment has an ingenious and reasonable structural design, a high degree of automation, and can greatly reduce labor costs.

In another embodiment, the present invention discloses a method for taking silicon wafers, comprising the following steps:

S1: Adjust the position of the chuck module 40 in the X direction, the Y direction and the R direction through the alignment mechanism 30 according to the placement position of the silicon wafer 50 on the carrier.

The silicon wafer picking device of this embodiment can be used in conjunction with an external vision acquisition system. After the silicon wafer 50 is prepared on the carrier plate, the carrier plate is photographed and positioned by the vision system, and the alignment mechanism 30 is based on the feedback of the photographed positioning. The information carries out the adjustment of suction cup module 40.

S2: The lateral movement assembly 42 and the vertical movement assembly 43 of the suction cup module 40 respectively adjust the positions of the plurality of suction cup assemblies 44 of the suction cup module 40 in the horizontal direction and the longitudinal direction.

After the position of the suction cup module 40 is adjusted by the alignment mechanism 30 , the position of the suction cup assembly 44 is further adjusted by the lateral movement assembly 42 and the longitudinal movement assembly 43 .

S3: The lifting link mechanism 20 drives the suction cup assembly 44 to move downward, and the silicon wafer 50 is sucked by the suction cup assembly 44 .

As shown in FIG. 2 , after the position of the suction cup assembly 44 on A1-1 is adjusted, the lifting linkage mechanism 20 drives the suction cup assembly 44 to move downward, and the suction cup assembly 44 on A1-1 is opened to suck the silicon wafer 50 . Then the positions of A1 - 2 , A1 - 3 , and A1 - 4 are adjusted again by the alignment mechanism 30 and the silicon wafers 50 are picked up respectively.

The four groups of suction cup assemblies 44 in this embodiment are all independently controlled by an independent vacuum circuit to pick and place the silicon wafer 50 . When the silicon wafer 50 is a half piece, the silicon wafer 50 can be taken and placed four times by four sets of suction cup assemblies 44 . When the silicon chip 50 is a whole chip, A1-1 and A1-2 can be operated synchronously, and A1-3 and A1-4 can be operated synchronously.

The embodiments of the present invention are not limited thereto. According to the above content of the present invention, using ordinary technical knowledge and conventional means in this field, without departing from the above-mentioned basic technical ideas of the present invention, the present invention can also make other various forms. Modifications, substitutions or combinations all fall within the protection scope of the present invention.

Claims (10)

1. A silicon wafer taking device is characterized by comprising a device main body, a lifting connecting rod mechanism, an alignment mechanism and a sucker module, wherein the lifting connecting rod mechanism, the alignment mechanism and the sucker module are arranged on the device main body; the sucking disc module includes fixed bolster, lateral shifting subassembly, longitudinal movement subassembly and sucking disc subassembly, and the longitudinal movement subassembly links to each other with the fixed bolster, and the lateral shifting subassembly is fixed in on the fixed bolster, and the lateral shifting subassembly links to each other with the sucking disc subassembly.

2. The silicon wafer taking apparatus as claimed in claim 1, wherein the number of the chuck modules is plural, and a plurality of the chuck modules are connected to the aligning mechanism, and the plurality of the chuck modules are arranged along a lateral direction of the apparatus main body.

3. The silicon wafer taking device as claimed in claim 1, wherein the lifting linkage mechanism comprises a lifting fixing plate, a lifting driving assembly, two lifting ball screw assemblies and a connecting rod assembly, the lifting driving assembly is connected with the two lifting ball screw assemblies, the lifting ball screw assemblies are connected with the connecting rod assembly, the connecting rod assembly is connected with the lifting fixing plate, and the sucker module is fixed on the lifting fixing plate.

4. The silicon wafer taking device according to claim 3, wherein the lifting driving assembly comprises a lifting fixing support, a servo motor, a driving wheel, two driven wheels, two guide wheels and a transmission belt, the servo motor is fixed on the lifting fixing support, the servo motor is connected with the driving wheel, the driving wheel is connected with the two driven wheels through the transmission belt, the two guide wheels are respectively connected with the transmission belt, and the two guide wheels are respectively positioned between the driving wheel and the two driven wheels.

5. The silicon wafer taking device according to claim 4, wherein the lifting fixing frame is provided with lifting guide rails on two opposite sides, the two lifting ball screw assemblies are respectively connected with the lifting guide rails on the two sides, and the two driven wheels are respectively connected with the two lifting ball screw assemblies.

6. The silicon wafer taking device according to any one of claims 1 to 5, wherein the alignment mechanism comprises an alignment platform, the alignment platform is provided with an X-axis alignment component, a Y-axis alignment component and a plurality of R-axis alignment components, the X-axis alignment component and the Y-axis alignment component are respectively connected with the R-axis alignment component, and the plurality of R-axis alignment components are connected with the lifting link mechanism.

7. The silicon wafer taking device according to claim 6, wherein the X-axis aligning assembly comprises an X-axis driving motor, an X-axis ball screw assembly, an X-axis moving connecting plate and an X-axis moving guide rail, the X-axis driving motor is connected with the X-axis ball screw assembly, the X-axis moving connecting plate is connected with the R-axis aligning assembly, and the R-axis aligning assembly is connected with the X-axis moving guide rail.

8. The silicon wafer taking device according to claim 6, wherein the R-axis alignment assembly comprises an R-axis fixing base, an alignment guide rail, a UVW three-phase motor and a motor fixing plate, the R-axis fixing base is connected with the X-axis alignment assembly or the Y-axis alignment assembly, the R-axis fixing base is connected with the alignment guide rail through a sliding block, the alignment guide rail is fixed on the motor fixing plate, and the UVW three-phase motor is fixed on the motor fixing plate.

9. The silicon wafer taking apparatus according to any one of claims 1 to 5, wherein the traverse assembly comprises a traverse driving cylinder, a traverse connecting block, a traverse guide rail, and a plurality of chuck connecting plates, the traverse driving cylinder is connected to the traverse connecting block, the traverse connecting block is connected to one chuck connecting plate, the plurality of chuck connecting plates are respectively connected to the traverse guide rail, adjacent chuck connecting plates are respectively connected to each other through a traverse guide plate, the traverse guide plate is provided with a guide groove, and the chuck connecting plate is connected to the adjacent chuck connecting plate through the traverse guide plate and the guide groove; the sucking disc module includes a plurality of sucking disc subassemblies, and a plurality of sucking disc subassemblies link to each other with a plurality of sucking disc connecting plates respectively, are equipped with a plurality of spacing grooves on the fixed bolster, and a plurality of sucking disc subassemblies are located the spacing inslot.

10. A silicon wafer taking method is characterized by comprising the following steps:

adjusting the position of the sucker module in the X direction, the Y direction and the R direction through the alignment mechanism according to the placement position of the silicon wafer on the support plate;

the transverse moving assembly and the longitudinal moving assembly of the sucker module respectively adjust the positions of the plurality of sucker assemblies of the sucker module in the transverse direction and the longitudinal direction;

the lifting connecting rod mechanism drives the sucker component to move downwards, and the silicon wafer is sucked through the sucker component.

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