CN115280472B - 单晶硅基板中的施主浓度的控制方法 - Google Patents

单晶硅基板中的施主浓度的控制方法

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Publication number
CN115280472B
CN115280472B CN202180021156.6A CN202180021156A CN115280472B CN 115280472 B CN115280472 B CN 115280472B CN 202180021156 A CN202180021156 A CN 202180021156A CN 115280472 B CN115280472 B CN 115280472B
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CN
China
Prior art keywords
donor
single crystal
silicon substrate
crystal silicon
concentration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180021156.6A
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English (en)
Chinese (zh)
Other versions
CN115280472A (zh
Inventor
竹野博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of CN115280472A publication Critical patent/CN115280472A/zh
Application granted granted Critical
Publication of CN115280472B publication Critical patent/CN115280472B/zh
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/202—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials
    • H10P30/204—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group IV semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/208—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of electrically inactive species
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN202180021156.6A 2020-03-17 2021-02-08 单晶硅基板中的施主浓度的控制方法 Active CN115280472B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020046938 2020-03-17
JP2020-046938 2020-03-17
PCT/JP2021/004559 WO2021186944A1 (ja) 2020-03-17 2021-02-08 シリコン単結晶基板中のドナー濃度の制御方法

Publications (2)

Publication Number Publication Date
CN115280472A CN115280472A (zh) 2022-11-01
CN115280472B true CN115280472B (zh) 2025-07-25

Family

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CN202180021156.6A Active CN115280472B (zh) 2020-03-17 2021-02-08 单晶硅基板中的施主浓度的控制方法

Country Status (4)

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EP (1) EP4123686A4 (https=)
JP (1) JP7334849B2 (https=)
CN (1) CN115280472B (https=)
WO (1) WO2021186944A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4672899A1 (en) * 2023-10-17 2025-12-31 Fuji Electric Co., Ltd. METHOD FOR EVALUATING A SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07301592A (ja) * 1994-05-09 1995-11-14 Fujitsu Ltd 半導体装置の製造方法及び気体中の水素濃度測定方法
WO2013141221A1 (ja) * 2012-03-19 2013-09-26 富士電機株式会社 半導体装置の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3341378B2 (ja) * 1993-08-25 2002-11-05 富士通株式会社 シリコン結晶中の水素濃度測定方法及びシリコン結晶の製造方法
JP3684962B2 (ja) 1999-12-01 2005-08-17 富士電機デバイステクノロジー株式会社 半導体装置の製造方法
DE102005026408B3 (de) * 2005-06-08 2007-02-01 Infineon Technologies Ag Verfahren zur Herstellung einer Stoppzone in einem Halbleiterkörper und Halbleiterbauelement mit einer Stoppzone
JP5104314B2 (ja) * 2005-11-14 2012-12-19 富士電機株式会社 半導体装置およびその製造方法
US8766413B2 (en) * 2009-11-02 2014-07-01 Fuji Electric Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
EP2793266B1 (en) * 2011-12-15 2020-11-11 Fuji Electric Co., Ltd. Method for manufacturing a semiconductor device
JP6020553B2 (ja) * 2012-03-19 2016-11-02 富士電機株式会社 半導体装置の製造方法
DE102013216195B4 (de) * 2013-08-14 2015-10-29 Infineon Technologies Ag Verfahren zur Nachdotierung einer Halbleiterscheibe
DE102014116666B4 (de) * 2014-11-14 2022-04-21 Infineon Technologies Ag Ein Verfahren zum Bilden eines Halbleiterbauelements
DE102015114177A1 (de) * 2015-08-26 2017-03-02 Infineon Technologies Ag Halbleitervorrichtung, Siliziumwafer und Verfahren zum Herstellen eines Siliziumwafers
DE102017118975B4 (de) * 2017-08-18 2023-07-27 Infineon Technologies Ag Halbleitervorrichtung mit einem cz-halbleiterkörper und verfahren zum herstellen einer halbleitervorrichtung mit einem cz-halbleiterkörper
JP7006517B2 (ja) * 2018-06-12 2022-01-24 信越半導体株式会社 シリコン単結晶基板中の欠陥密度の制御方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07301592A (ja) * 1994-05-09 1995-11-14 Fujitsu Ltd 半導体装置の製造方法及び気体中の水素濃度測定方法
WO2013141221A1 (ja) * 2012-03-19 2013-09-26 富士電機株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
JPWO2021186944A1 (https=) 2021-09-23
WO2021186944A1 (ja) 2021-09-23
EP4123686A1 (en) 2023-01-25
JP7334849B2 (ja) 2023-08-29
CN115280472A (zh) 2022-11-01
EP4123686A4 (en) 2024-05-01

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