CN115257127A - Hot-melting semi-automatic positioning and laminating method - Google Patents
Hot-melting semi-automatic positioning and laminating method Download PDFInfo
- Publication number
- CN115257127A CN115257127A CN202210953375.4A CN202210953375A CN115257127A CN 115257127 A CN115257127 A CN 115257127A CN 202210953375 A CN202210953375 A CN 202210953375A CN 115257127 A CN115257127 A CN 115257127A
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- Prior art keywords
- layer
- hot
- pressing
- pressing plate
- bonding
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Links
- 238000010030 laminating Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000002844 melting Methods 0.000 title claims abstract description 19
- 238000003825 pressing Methods 0.000 claims abstract description 43
- 230000008018 melting Effects 0.000 claims abstract description 13
- 239000012943 hotmelt Substances 0.000 claims description 4
- -1 polytetrafluoroethylene Polymers 0.000 claims description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 52
- 238000003475 lamination Methods 0.000 description 11
- 239000000047 product Substances 0.000 description 10
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 206010066054 Dysmorphism Diseases 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
A hot-melting semi-automatic positioning and pasting method belongs to the technical field of pasting of layered products. The method comprises the following steps: s1) debugging the pressing stroke of a pressing plate; s2) positioning and placing the upper attaching layer and the lower attaching layer on a positioning and placing table below the pressing plate; s3) pressing a start key, pressing a pressing plate downwards, lifting the upper laminating layer, and moving the laminating layer to a hot plate for hot melting; s4) lifting the upper laminating layer subjected to hot melting by using a pressing plate, separating the upper laminating layer from the hot plate, and moving the upper laminating layer 1 to a position vertically above the position of the upper laminating layer 1 in the step S2); s5) pressing a pressing plate downwards, and bonding the heated upper bonding layer and the heated lower bonding layer together to form a required bonded product; s6) taking away the attached product, and statically placing at normal temperature. The advantages are that: the method has the advantages of realizing accurate alignment of the laminating layers of different shapes and/or different materials, along with simple process, remarkable laminating effect, reduction of manufacturing difficulty and improvement of production efficiency.
Description
Technical Field
The invention belongs to the technical field of laminating of layered products, and particularly relates to a hot-melting semi-automatic positioning and laminating method.
Background
The special-shaped lamination in the market is mainly a process for laminating two laminating layers with different sizes or different materials, for example, the lamination of a foaming ground mat, a hidden tooth splicing ground mat and the lamination of a packing box lining belong to special-shaped lamination.
For example, chinese utility model patent publication No. CN216822705U discloses "a hidden concatenation ground mat", this ground mat just belongs to the dysmorphism laminating, and upper and lower two-layer laminating layer shape is different, and the concatenation that will influence the ground mat if the counterpoint is inaccurate when laminating. When the adhesive tape is attached, if manual alignment is adopted, the working efficiency is low, and the requirements on the technical level and the proficiency of operators are high. The hot melting lamination in the market mainly takes semi-finished product lamination as a main part, and the upper layer and the lower layer cannot be accurately positioned, so deep processing is required after lamination. The cost of deep processing is very high, for example, CNC numerically controlled machine tool is needed to engrave.
In view of the above-mentioned prior art, there is a need for a reasonable improvement of the existing positioning attachment method. The applicant has therefore made an advantageous design, in the context of which the solution to be described below is made.
Disclosure of Invention
The invention aims to provide a hot-melting semi-automatic positioning and bonding method, which can realize the accurate alignment of bonding layers of different shapes and/or different materials, has simple process and obvious bonding effect, reduces the manufacturing difficulty and improves the production efficiency.
The task of the invention is completed in such a way that the hot-melting semi-automatic positioning and pasting method comprises the following steps:
s1) debugging the pressing stroke of a pressing plate;
s2) positioning and placing the upper attaching layer and the lower attaching layer on a positioning and placing table below the pressing plate;
s3) pressing a start key, pressing a pressing plate downwards, lifting the upper laminating layer, and moving to a hot plate for hot melting;
s4) lifting the upper laminating layer subjected to hot melting by the pressing plate, separating the upper laminating layer from the hot plate, and moving the upper laminating layer to a position vertically above the position of the upper laminating layer in the step S2);
s5) pressing a pressing plate downwards, and bonding the heated upper bonding layer and the heated lower bonding layer together to form a required bonded product;
s6) taking away the attached product, and statically placing at normal temperature.
In a specific embodiment of the present invention, the pressing plate is a band needle or a suction cup.
In another specific embodiment of the present invention, in step S3), the hot plate is a heated teflon plate, and the temperature of the hot plate is controlled between 300 ℃ and 380 ℃.
In a further particular embodiment of the invention, the time from the lifting of the upper lamination layer from the hot plate to the application of the lower lamination layer in steps S4) and S5) is comprised between 0.5S and 0.8S.
The invention has the following beneficial effects after adopting the method:
the process is mainly used for laminating two laminating layers with different sizes and/or different materials, can accurately position the upper layer and the lower layer, is a finished product after lamination, is accurate in positioning, has no deviation, and is simple in process and remarkable in laminating effect;
secondly, the laminating method does not need glue, reduces the environmental protection requirement, has high laminating fastness and does not have the problem of degumming;
thirdly, the process is the last process, the process mode or the requirement on the previous process is looser, the forming process is more, and the mode with the most cost performance can be selected for operation;
fourthly, the staggered position of the binding surface has no viscosity, and the surface is smooth and beautiful.
Drawings
Fig. 1 is a schematic view of the upper and lower adhesive layers of the present invention positioned on a positioning table before being adhered.
FIG. 2 is a schematic view of the upper laminate being lifted by the platen and ready for heating prior to application in accordance with the present invention.
FIG. 3 is a schematic view showing the upper bonding layer being heated by moving the pressing plate to a hot plate before bonding according to the present invention.
FIG. 4 is a schematic view of the upper bonding layer of the present invention being bonded to the lower bonding layer after being heated.
FIG. 5 is a schematic view of the upper and lower adhesive layers of the present invention after being bonded and statically placed at room temperature.
In the figure: 1. the hot plate comprises an upper attaching layer, a lower attaching layer, a pressing plate, a positioning placing table and a hot plate, wherein the upper attaching layer is 2, the lower attaching layer is 3, the pressing plate is 4, and the hot plate is 5.
Detailed Description
The following detailed description is given by way of example with reference to the accompanying drawings, but the description of the example is not intended to limit the technical solution of the present invention, and any equivalent changes made in the inventive concept, which are merely formal and insubstantial, should be considered as the scope of the technical solution of the present invention.
In the following description, all the concepts related to the directions or orientations of up, down, left, right, front and rear are based on the positions shown in the corresponding drawings, and thus, should not be construed as particularly limiting the technical solution provided by the present invention.
Referring to fig. 1 to 5, the present invention relates to a hot-melt semi-automatic positioning and bonding method, which bonds two bonding layers of different shapes and/or materials together to form a desired bonded product, and the bonding process of the bonding method is described by taking an upper bonding layer 1 and a lower bonding layer 2 as an example in the drawings, and the specific steps are as follows:
s1) debugging the pressing stroke of a pressing plate 3;
s2) positioning and placing the upper attaching layer 1 and the lower attaching layer 2 on a positioning and placing table 4 below the pressing plate 3, as shown in figure 1;
s3) pressing a start key, pressing the pressing plate 2 downwards, lifting the upper laminating layer 1, and moving the laminating layer to the hot plate 5 for hot melting, wherein the hot melting is performed as shown in figures 2 and 3;
s4) lifting the upper laminating layer 1 subjected to hot melting by the pressing plate 3, separating the upper laminating layer 1 from the hot plate 5, and moving the upper laminating layer 1 to a position just above the position of the upper laminating layer 1 in the step S2);
s5) pressing the pressing plate 3 downwards to adhere the heated upper adhering layer 1 and the heated lower adhering layer 2 together to form a required adhering product, as shown in FIG. 4;
s6) taking away the attached product, and statically placing at normal temperature, as shown in figure 5.
In the step S1), the pressing stroke is adjusted according to the thickness of the required product. The pressing plate 3 is provided with a needle or a sucker, and can well lift the upper attaching layer, namely the upper attaching layer 1.
In the step S2), the upper attaching layer 1 and the lower attaching layer 2 are positioned and placed according to specific requirements, the upper attaching layer 1 and the lower attaching layer 2 are positioned by a tool, and the appearance of a product is limited.
In the step S3), the hot plate 5 is a heated polytetrafluoroethylene plate, which is also called as a Teflon plate, the temperature of the hot plate 5 is controlled between 300 ℃ and 380 ℃, the specific control temperature and the hot melting time of the upper adhesive layer 1 on the hot plate 5 depend on the material of the upper adhesive layer 1, the hot plate is adjusted to a proper temperature according to different materials for operation, for example, PE foaming materials are used, the temperature of the hot plate is 350 ℃, and the hot plate is adhered after being melted for 2 seconds. The temperature of the hot plate 5 is higher than the melting temperature of the material.
In the step S4), the press plate 3 moves to a position vertically above the upper attaching layer 1 in the step S2) when the upper attaching layer 1 is just positioned and placed, so that the upper attaching layer 1 is not dislocated with the lower attaching layer 2 when pressed downwards, and the positioning accuracy is ensured.
In the steps S4) and S5), the time from the lifting of the upper attaching layer 1 from the hot plate 5 to the attaching of the lower attaching layer 2 is between 0.5S and 0.8S, and the surface of the material is still in a molten state.
In step S6), the time for which the bonded product is allowed to stand at normal temperature is not limited at all, and is preferably 5 to 20 seconds. For example: the room temperature is 5 ℃ and the standing time is 5 seconds; the room temperature is in an environment of 40 ℃, and the standing time is 20 seconds.
The process only needs to cut the manufactured small pieces by using a processing mode with lower cost, such as a cutting die, before the lamination, and the small pieces are vertically aligned and placed on a positioning placing table of the equipment.
Claims (4)
1. A hot melting semi-automatic positioning and pasting method is characterized by comprising the following steps:
s1) debugging the pressing stroke of a pressing plate (3);
s2) positioning and placing the upper attaching layer (1) and the lower attaching layer (2) on a positioning and placing table (4) below the pressing plate (3);
s3) pressing a start key, pressing down the pressing plate (2), lifting the upper laminating layer (1), and moving to a hot plate (5) for hot melting;
s4) lifting the upper laminating layer (1) subjected to hot melting by the pressing plate (3), separating the upper laminating layer from the hot plate (5), and moving the upper laminating layer (1) to a position just above the position of the upper laminating layer (1) in the step S2);
s5), pressing the pressing plate (3) downwards, and bonding the heated upper bonding layer (1) and the heated lower bonding layer (2) together to form a required bonded product;
s6) taking away the attached product, and statically placing at normal temperature.
2. The hot-melt semi-automatic positioning and bonding method according to claim 1, characterized in that: the pressing plate (3) is provided with a needle or a sucker.
3. The hot-melt semi-automatic positioning and bonding method according to claim 1, characterized in that: in the step S3), the hot plate (5) is a heated polytetrafluoroethylene plate, and the temperature of the hot plate (5) is controlled to be 300-380 ℃.
4. The hot-melt semi-automatic positioning and bonding method according to claim 1, characterized in that: in the steps S4) and S5), the time from the lifting of the upper bonding layer (1) from the hot plate (5) to the bonding of the lower bonding layer (2) is between 0.5S and 0.8S.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210953375.4A CN115257127A (en) | 2022-08-10 | 2022-08-10 | Hot-melting semi-automatic positioning and laminating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210953375.4A CN115257127A (en) | 2022-08-10 | 2022-08-10 | Hot-melting semi-automatic positioning and laminating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115257127A true CN115257127A (en) | 2022-11-01 |
Family
ID=83751939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210953375.4A Pending CN115257127A (en) | 2022-08-10 | 2022-08-10 | Hot-melting semi-automatic positioning and laminating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115257127A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206186355U (en) * | 2016-10-18 | 2017-05-24 | 群光电子(苏州)有限公司 | Keyboard hot melt and pad pasting integration equipment |
| CN108372664A (en) * | 2018-02-01 | 2018-08-07 | 杭州大江东城市设施管养有限公司 | Pipe hot melting butt-joint process and heat-melting butt-joint equipment |
| CN210477830U (en) * | 2019-07-30 | 2020-05-08 | 重庆瑞昌精密电子有限公司 | Keyboard hot melt pad pasting integration equipment |
| CN111169140A (en) * | 2020-03-02 | 2020-05-19 | 广州市利之叶科技有限公司 | Plate and rubber bonding equipment for anti-static rubber floor |
| CN212266718U (en) * | 2019-11-05 | 2021-01-01 | 深圳市鑫格美科技有限公司 | Automatic control device of unmanned hot melting machine |
| CN112996234A (en) * | 2021-04-23 | 2021-06-18 | 四川超声印制板有限公司 | Circuit board and circuit board copper foil pasting device |
| CN113291040A (en) * | 2021-04-29 | 2021-08-24 | 王兆华 | Application method of release paper hot melt adhesive film |
| CN216760849U (en) * | 2022-05-16 | 2022-06-17 | 歌尔股份有限公司 | Hot melting assembly equipment |
| CN114770954A (en) * | 2022-04-26 | 2022-07-22 | 深圳慧联达科技有限公司 | Hot-melting connecting structure for plastic part and sheet metal part and using method of hot-melting connecting structure |
-
2022
- 2022-08-10 CN CN202210953375.4A patent/CN115257127A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206186355U (en) * | 2016-10-18 | 2017-05-24 | 群光电子(苏州)有限公司 | Keyboard hot melt and pad pasting integration equipment |
| CN108372664A (en) * | 2018-02-01 | 2018-08-07 | 杭州大江东城市设施管养有限公司 | Pipe hot melting butt-joint process and heat-melting butt-joint equipment |
| CN210477830U (en) * | 2019-07-30 | 2020-05-08 | 重庆瑞昌精密电子有限公司 | Keyboard hot melt pad pasting integration equipment |
| CN212266718U (en) * | 2019-11-05 | 2021-01-01 | 深圳市鑫格美科技有限公司 | Automatic control device of unmanned hot melting machine |
| CN111169140A (en) * | 2020-03-02 | 2020-05-19 | 广州市利之叶科技有限公司 | Plate and rubber bonding equipment for anti-static rubber floor |
| CN112996234A (en) * | 2021-04-23 | 2021-06-18 | 四川超声印制板有限公司 | Circuit board and circuit board copper foil pasting device |
| CN113291040A (en) * | 2021-04-29 | 2021-08-24 | 王兆华 | Application method of release paper hot melt adhesive film |
| CN114770954A (en) * | 2022-04-26 | 2022-07-22 | 深圳慧联达科技有限公司 | Hot-melting connecting structure for plastic part and sheet metal part and using method of hot-melting connecting structure |
| CN216760849U (en) * | 2022-05-16 | 2022-06-17 | 歌尔股份有限公司 | Hot melting assembly equipment |
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